CN213907263U

CN213907263U - Cooling device of printed circuit board

Info

Publication number: CN213907263U
Application number: CN202022900595.XU
Authority: CN
Inventors: 吴�民
Original assignee: Hangzhou Tianfeng Electronics Co ltd
Current assignee: Hangzhou Tianfeng Electronics Co ltd
Priority date: 2020-12-07
Filing date: 2020-12-07
Publication date: 2021-08-06
Anticipated expiration: 2030-12-07

Abstract

The utility model discloses a cooling device of printed circuit board aims at providing one kind and gives the cooling device of radiating printed circuit board of chip. The radiating fan is fixed at the top of the heat transfer block and arranged at the lower sides of the radiating pipes. The utility model has the advantages that: the radiating block absorbs heat and dispels the heat and gives the cooling tube heat dissipation to the heat transfer, the heat dissipation fan further dispels the heat, the coolant liquid accelerates the heat dissipation of conducting heat, the siphunculus transfers the coolant liquid into the accessory cavity, the accessory cavity lets the coolant liquid evenly flow in the cooling tube, the heat dissipation is even, the circulating pump accelerates the coolant liquid to flow, the battery makes heat dissipation fan and circulating pump continuous work, heat dissipation that can be continuous, such design has reached for the radiating effect of chip.

Description

Cooling device of printed circuit board

Technical Field

The utility model belongs to the technical field of the relevant technique of manufacturing class and specifically relates to a cooling device of printed circuit board.

Background

The Circuit Board can be called as a Printed Circuit Board or a Printed Circuit Board, and is named as a Printed Circuit Board (Printed Circuit Board) PCB (Flexible Printed Circuit Board) FPC (the FPC Circuit Board is also named as a Flexible Printed Circuit Board) which is a Flexible Printed Circuit Board with high reliability and excellent flexibility and is made of polyimide or polyester film as a base material.

Circuit boards are classified into three major categories, single-sided boards, double-sided boards, and multilayer circuit boards, according to the number of layers.

Multilayer board: and refers to a printed board having three or more conductive pattern layers laminated with an insulating material therebetween at intervals, and conductive patterns interconnected therebetween as required. The multilayer circuit board is a product of the development of electronic information technology in the directions of high speed, multifunction, large capacity, small volume, thinning and light weight.

Single panel: on the most basic PCB, the components are concentrated on one side and the conductors are concentrated on the other side. Such PCBs are called single-sided circuit boards because the conductors are present on only one side thereof. The single panel is generally simple to manufacture and low in cost, but has the disadvantage that the single panel cannot be applied to a complex product.

Double-sided board: is an extension of a single panel, and when a single layer wiring cannot meet the requirements of an electronic product, a double panel is used. Copper is coated on both sides of the circuit board, so that wires are arranged between the two layers, and the wires can be connected through the through holes to form required network connection.

The welding has multiple components and parts and chip on the circuit board, and there is the consumption electronic device all in different degree ground, and the intensity of generating heat changes along with the size of consumption, if not in time give off this heat, and equipment can continuously heat up, and the device will lose efficacy because of overheated, and electronic equipment's reliability will descend, consequently, carries out cooling treatment very important to the circuit board, but cooling device on the existing market mostly only uses the fan to cool off to whole machine ventilation, rarely has alone to special chip refrigerated device.

SUMMERY OF THE UTILITY MODEL

The utility model relates to an overcome among the prior art cooling device to the radiating not enough of chip, provide a cooling device for radiating printed circuit board of chip.

In order to achieve the above purpose, the utility model adopts the following technical scheme:

the utility model provides a printed circuit board's cooling device, includes heat transfer block, heat dissipation fan and a plurality of cooling tube, the cooling tube distribute from the front end to the rear end align to grid at the top of heat transfer block, the both ends and the heat transfer block of cooling tube are connected, the heat dissipation fan be fixed in the top of heat transfer block and arrange the downside of a plurality of cooling tubes in.

A plurality of cooling tubes of heat transfer piece top installation, heat dissipation fan of heat transfer piece top installation, the heat dissipation fan is at the downside of a plurality of cooling tubes, heat transfer piece bottom and the radiating chip contact of needs during the use, the heat of chip is absorbed to the heat transfer piece and the heat begins to dispel the heat, and the heat transfer piece gives the cooling tube heat dissipation to the heat transfer simultaneously, and the fan is through blowing further heat dissipation to the cooling tube.

As preferred, the inside main cavity room that is equipped with of lower extreme of heat transfer block, the main cavity room in be filled with the coolant liquid, the cooling tube be equipped with connecting pipe one and connecting pipe two, the one end of cooling tube is connected with the upper end of connecting pipe one, the other end of cooling tube be connected with the upper end of connecting pipe two, the lower extreme and the heat transfer block of connecting pipe one are connected, the lower extreme of connecting pipe two run through the top of heat transfer block until the main cavity room and with heat transfer block fixed connection. The cooling liquid is filled in main cavity room and the cooling tube, and the heat of heat transfer piece is passed through the cooling liquid and is given the cooling tube by connecting pipe one, and the cooling tube is by heat dissipation fan heat dissipation back, and inside coolant liquid is two flows back to main cavity room through the connecting pipe, and the cooling liquid accelerates the heat transfer heat dissipation.

Preferably, the heat transfer block is provided with a sub-chamber in the upper end, and the lower end of the first connecting pipe penetrates through the top of the heat transfer block to reach the sub-chamber and is fixedly connected with the heat transfer block. The coolant liquid in the main cavity flows to the auxiliary cavity, and flows through each connecting pipe I again through the auxiliary cavity, and the auxiliary cavity enables the coolant liquid to uniformly flow into the radiating pipe, so that the radiating is uniform.

Preferably, a through pipe is arranged between the main chamber and the auxiliary chamber, the lower end of the through pipe is communicated with the main chamber, and the upper end of the through pipe is communicated with the auxiliary chamber. The cooling liquid flows to the auxiliary chamber from the through pipe, and the through pipe plays a role in transferring the cooling liquid into the auxiliary chamber.

Preferably, a circulating pump is arranged in the through pipe, and the output end of the circulating pump is communicated with the auxiliary chamber. The circulating pump makes the interior coolant liquid of main cavity arrange into the accessory cavity constantly, flows back to the main cavity after connecting pipe one, cooling tube and connecting pipe two again in, and the circulating pump accelerates the coolant liquid to flow, and the heat dissipation is faster.

Preferably, the heat transfer block is provided with a battery, and the battery is electrically connected with the heat dissipation fan and the circulating pump respectively. The battery can make heat dissipation fan and circulating pump continue work, and the continuous heat dissipation is favorable to the chip heat dissipation, and the rethread switch control battery and the break-make of heat dissipation fan and circulating pump.

The utility model has the advantages that: the radiating block absorbs heat and dispels the heat and gives the cooling tube heat dissipation to the heat transfer, the heat dissipation fan further dispels the heat, the coolant liquid accelerates the heat dissipation of conducting heat, the siphunculus transfers the coolant liquid into the accessory cavity, the accessory cavity lets the coolant liquid evenly flow in the cooling tube, the heat dissipation is even, the circulating pump accelerates the coolant liquid to flow, the battery makes heat dissipation fan and circulating pump continuous work, heat dissipation that can be continuous, such design has reached for the radiating effect of chip.

Drawings

Fig. 1 is a schematic structural view of the present invention;

fig. 2 is a cross-sectional view at a-a of fig. 1.

In the figure: 1. the heat radiator comprises a heat transfer block, 2 heat radiating fans, 3 heat radiating pipes, 4 main cavities, 5 cooling liquid, 6 connecting pipes I, 7 connecting pipes II, 8 auxiliary cavities, 9 through pipes, 10 circulating pumps and 11 batteries.

Detailed Description

The invention is further described with reference to the accompanying drawings and the detailed description.

In the embodiment of fig. 1, a cooling device for a printed circuit board includes a heat transfer block 1, a heat dissipation fan 2 and a plurality of heat dissipation pipes 3, wherein the heat dissipation pipes 3 are uniformly arranged and distributed from the front end to the rear end of the top of the heat transfer block 1, two ends of the heat dissipation pipes 3 are connected to the heat transfer block 1, and the heat dissipation fan 2 is fixed to the top of the heat transfer block 1 and is disposed under the plurality of heat dissipation pipes 3. As shown in fig. 2, a main chamber 4 is arranged inside the lower end of the heat transfer block 1, a cooling liquid 5 is filled in the main chamber 4, the first connecting pipe 6 and the second connecting pipe 7 are arranged on the radiating pipe 3, one end of the radiating pipe 3 is connected with the upper end of the first connecting pipe 6, the other end of the radiating pipe 3 is connected with the upper end of the second connecting pipe 7, the lower end of the first connecting pipe 6 is connected with the heat transfer block 1, and the lower end of the second connecting pipe penetrates through the top of the heat transfer block 1 until the main chamber 4 and is fixedly connected with the heat transfer block 1. The upper end of the heat transfer block is internally provided with an auxiliary chamber 8, and the lower end of the first connecting pipe 6 penetrates through the top of the heat transfer block 1 to reach the auxiliary chamber 8 and is fixedly connected with the heat transfer block 1. Be equipped with siphunculus 9 between main cavity 4 and the accessory chamber 8, the lower extreme and the main cavity 4 intercommunication of siphunculus 9, the upper end and the accessory chamber 8 intercommunication of siphunculus 9. A circulating pump 10 is arranged in the through pipe 9, and the output end of the circulating pump 10 is communicated with the auxiliary chamber 8. The heat transfer block 1 is provided with a battery 11, and the battery 11 is electrically connected with the heat dissipation fan 2 and the circulating pump 10 respectively.

As shown in fig. 1, heat transfer block 1 is the square block shape, a plurality of cooling tubes 3 are installed at the top of heat transfer block 1, cooling tubes 3 are evenly distributed from front to back from the top of heat transfer block 1, cooling tubes 3 are spiral shapes, first connecting tube 6 and second connecting tube 7 are installed at the top end of heat transfer block 1, two ends of cooling tubes 3 are respectively installed on first connecting tube 6 and second connecting tube 7, and heat dissipation fan 2 is installed on the top surface of heat transfer block 1 and below a plurality of cooling tubes 3.

As shown in fig. 2, a main chamber 4 is arranged in the lower end of a heat transfer block 1, a sub-chamber 8 is arranged in the upper end of the main chamber 4, a through pipe 9 is arranged between the main chamber 4 and the sub-chamber 8 to be connected with each other, a circulating pump 10 is arranged in the through pipe 9, the main chamber 4, the through pipe 9, the sub-chamber 8, a first connecting pipe 6, a radiating pipe 3 and a second connecting pipe 7 are filled with cooling liquid 5, and the circulating pump 10 extracts the cooling liquid 5 from the main chamber 4 to press the cooling liquid into the sub-chamber 8 and then presses the cooling liquid into each cooling pipe to flow back into the main chamber 4.

Claims

1. The utility model provides a printed circuit board's cooling device, characterized by, includes heat transfer block (1), heat dissipation fan (2) and a plurality of cooling tube (3), cooling tube (3) at the top of heat transfer block (1) from front end to rear end align to grid distribution, the both ends and the heat transfer block (1) of cooling tube (3) are connected, heat dissipation fan (2) be fixed in the top of heat transfer block (1) and arrange the downside of a plurality of cooling tubes (3) in.

2. The cooling device for the printed circuit board as claimed in claim 1, wherein a main chamber (4) is arranged inside the lower end of the heat transfer block (1), the main chamber (4) is filled with cooling liquid (5), the heat dissipation pipe (3) is provided with a first connecting pipe (6) and a second connecting pipe (7), one end of the heat dissipation pipe (3) is connected with the upper end of the first connecting pipe (6), the other end of the heat dissipation pipe (3) is connected with the upper end of the second connecting pipe (7), the lower end of the first connecting pipe (6) is connected with the heat transfer block (1), and the lower end of the second connecting pipe (7) penetrates through the top of the heat transfer block (1) to the main chamber (4) and is fixedly connected with the heat transfer block (1).

3. A cooling device for a printed circuit board according to claim 2, wherein the heat transfer block (1) is provided with a sub-chamber (8) inside the upper end thereof, and the lower end of the first connecting pipe (6) penetrates through the top of the heat transfer block (1) to the sub-chamber (8) and is fixedly connected with the heat transfer block (1).

4. A cooling device for printed circuit board according to claim 3, characterized in that a through pipe (9) is provided between the main chamber (4) and the sub-chamber (8), the lower end of the through pipe (9) is connected to the main chamber (4), and the upper end of the through pipe (9) is connected to the sub-chamber (8).

5. A cooling device for PCB as claimed in claim 4, wherein said through pipe (9) is provided with a circulation pump (10) inside, and the output end of said circulation pump (10) is connected to the sub-chamber (8).

6. The cooling device for the printed circuit board as claimed in claim 5, wherein the heat transfer block (1) is provided with a battery (11), and the battery (11) is electrically connected with the heat dissipation fan (2) and the circulation pump (10), respectively.