CN210274948U

CN210274948U - PCB heat dissipation device applied to electronic field

Info

Publication number: CN210274948U
Application number: CN201920762457.4U
Authority: CN
Inventors: 黄丽娟
Original assignee: Shenzhen Ruigu Technology Co ltd
Current assignee: Shenzhen Ruigu Technology Co ltd
Priority date: 2019-05-25
Filing date: 2019-05-25
Publication date: 2020-04-07
Anticipated expiration: 2029-05-25

Abstract

The utility model discloses a be applied to PCB board heat abstractor in electron field, the power distribution box comprises a box body, fixedly connected with PCB body between the both sides of box inner wall, the bottom fixedly connected with motor case of box, the bottom fixedly connected with motor of motor incasement wall, the output shaft fixedly connected with bull stick of motor, the fixed surface of bull stick is connected with first gear, the both sides of first gear all mesh there is the second gear. This be applied to PCB board heat abstractor in electron field, the speed of heat transfer is faster, it is more convenient to use, the samming performance is better, and the output power of PCB board has been improved, the output shaft fixedly connected with bull stick of motor, the fixed surface of bull stick is connected with first gear, the both sides of first gear all mesh there is the second gear, and simple structure, make low in manufacturing cost, the life of PCB board has been improved, structural design is compacter, it is more convenient to install, be applicable to the heat dissipation work in multiple region.

Description

PCB heat dissipation device applied to electronic field

Technical Field

The utility model relates to a PCB board technical field specifically is a be applied to PCB board heat abstractor in electron field.

Background

The PCB can be divided into single-sided boards, double-sided boards, four-layer boards, six-layer boards and other multi-layer circuit boards according to the number of layers of the circuit boards. Single panel: on the most basic PCB, the components are concentrated on one side and the conductors are concentrated on the other side. Since the conductors are present on only one of the faces. Double-sided board: the circuit board has wiring on both sides, but wires on both sides are used, and appropriate circuit connections between the two sides are necessary. Such bridges between circuits are called vias. The via hole is a small hole filled or coated with metal on the PCB, and can be connected with the wires on both sides. Multilayer board: to increase the area over which wiring can be routed, more single or double sided wiring boards have been used for multilayer boards. A printed circuit board with two inner layers and two outer layers or two inner layers and two outer layers is made up through alternative arrangement of positioning system and insulating adhesive material, and interconnection of conducting patterns according to design requirement.

The existing PCB needs to be cooled when in use, but the traditional PCB cooling equipment has the disadvantages of slow heat transfer speed, poor temperature equalization performance, high power and high power consumption, so that the manufacturing cost is high, the service life of the PCB is shortened, and the heat dissipation device is inconvenient to install, suitable for cooling of equipment with large volume and poor in practicability because of large volume.

SUMMERY OF THE UTILITY MODEL

Technical problem to be solved

Not enough to prior art, the utility model provides a be applied to PCB board heat abstractor in electron field has solved the tradition and has given the slower problem of PCB board heat-dissipating equipment heat transfer rate.

(II) technical scheme

In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a be applied to PCB board heat abstractor in electron field, the power distribution box comprises a box body, fixedly connected with PCB body between the both sides of box inner wall, the bottom fixedly connected with motor case of box, the bottom fixedly connected with motor of motor incasement wall, the output shaft fixedly connected with bull stick of motor, the fixed surface of bull stick is connected with first gear, the both sides of first gear all mesh there is the second gear, fixedly connected with heat abstractor between the both sides of box inner wall.

Preferably, the heat dissipation device comprises a heat dissipation box, one side of the heat dissipation box is fixedly connected with a fan, the bottom of the heat dissipation box is fixedly connected with a heat dissipation element, the top of the heat dissipation element is fixedly connected with a capillary core module, the top of the capillary core module is provided with a conveying pipe, and refrigeration fins are fixedly connected between the top and the bottom of the inner wall of the heat dissipation box.

Preferably, the top fixedly connected with refrigeration case of box, the top fixedly connected with refrigerator of refrigeration case, one side intercommunication of refrigerator has the U type pipe, the one end of U type pipe runs through the refrigeration case and extends to the inside of refrigeration case.

Preferably, the bottom fixedly connected with circulating pump of refrigeration incasement wall, the delivery port intercommunication of circulating pump has the outlet pipe, the one end of outlet pipe runs through refrigeration case and box in proper order and extends to the inside of box, the inlet tube has been run through at the top of refrigeration case.

Preferably, the equal fixedly connected with base in both sides of bottom half, two fixedly connected with diaphragm between the relative one side of base, the top of diaphragm and the bottom fixed connection of motor case.

Preferably, the axle center of the second gear is fixedly connected with a rotating rod, and one end of the rotating rod is fixedly connected with a rotating fan.

(III) advantageous effects

The utility model provides a be applied to PCB board heat abstractor in electron field. The method has the following beneficial effects:

this be applied to PCB board heat abstractor in electron field, one side fixedly connected with fan through the heat dissipation case, the bottom fixedly connected with radiating element of heat dissipation case, radiating element's top fixedly connected with capillary core module, the top of capillary core module is provided with the conveyer pipe, fixedly connected with refrigeration fin between the top of heat dissipation incasement wall and the bottom, make the radiating effect of PCB board good, the speed of heat transfer is faster, it is more convenient to use, the samming performance is better, and the output of PCB board has been improved, the output shaft fixedly connected with bull stick of motor, the fixed surface of bull stick is connected with first gear, the both sides of first gear all mesh there is the second gear, and simple structure, make low in manufacturing cost, the life of PCB board has been improved, structural design is compacter, it is more convenient to install, and is applicable to the heat dissipation work in multiple region.

Drawings

FIG. 1 is a schematic structural view of the present invention;

fig. 2 is a schematic structural view of the heat dissipation device of the present invention.

In the figure: 1. a box body; 2. a PCB body; 3. a motor case; 4. a motor; 5. a rotating rod; 6. a first gear; 7. a second gear; 8. a heat sink; 81. a heat dissipation box; 82. a fan; 83. a heat dissipating element; 84. a capillary wick module; 85. a delivery pipe; 86. refrigerating fins; 9. a refrigeration case; 10. a refrigerator; 11. a U-shaped pipe; 12. a circulation pump; 13. a water inlet pipe; 14. a water outlet pipe; 15. rotating the rod; 16. rotating the fan; 17. a base; 18. a transverse plate.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

As shown in fig. 1-2, the utility model provides a technical solution: a PCB heat dissipation device applied to the electronic field comprises a box body 1, wherein heat dissipation holes are formed in the surface of the box body 1, heat inside the box body 1 is conveniently discharged out of the box body 1, a PCB body 2 is fixedly connected between two sides of the inner wall of the box body 1, a motor box 3 is fixedly connected to the bottom of the inner wall of the box body 1, a motor 4 is fixedly connected to the bottom of the inner wall of the motor box 3, a power line of the motor 4 is connected with an external power supply, a rotating rod 5 is fixedly connected to an output shaft of the motor 4, a first gear 6 is fixedly connected to the surface of the rotating rod 5, second gears 7 are meshed with two sides of the first gear 6, the diameter of the first gear 6 is larger than that of the second gears 7, and a heat dissipation device 8 is fixedly connected between two sides of the;

the heat dissipation device 8 comprises a heat dissipation box 81, one side of the heat dissipation box 81 is fixedly connected with a fan 82, the bottom of the heat dissipation box 81 is fixedly connected with a heat dissipation element 83, the top of the heat dissipation element 83 is fixedly connected with a capillary core module 84, the top of the capillary core module 84 is provided with a delivery pipe 85, and a refrigeration fin 86 is fixedly connected between the top and the bottom of the inner wall of the heat dissipation box 81;

the top of the box body 1 is fixedly connected with a refrigerating box 9, the top of the refrigerating box 9 is fixedly connected with a refrigerator 10, a power line of the refrigerator 10 is connected with an external power supply, one side of the refrigerator 10 is communicated with a U-shaped pipe 11, and one end of the U-shaped pipe 11 penetrates through the refrigerating box 9 and extends into the refrigerating box 9;

the bottom of the inner wall of the refrigeration box 9 is fixedly connected with a circulating pump 12, a power line of the circulating pump 12 is connected with an external power supply, a water outlet of the circulating pump 12 is communicated with a water outlet pipe 14, one end of the water outlet pipe 14 sequentially penetrates through the refrigeration box 9 and the box body 1 and extends to the interior of the box body 1, and a water inlet pipe 13 penetrates through the top of the refrigeration box 9;

the two sides of the bottom of the box body 1 are fixedly connected with bases 17, a transverse plate 18 is fixedly connected between the opposite sides of the two bases 17, and the top of the transverse plate 18 is fixedly connected with the bottom of the motor box 3;

the axle center department fixedly connected with dwang 15 of second gear 7, the one end fixedly connected with rotation fan 16 of dwang 15.

In conclusion, the PCB heat dissipation device applied to the electronic field is characterized in that the fan 82 is fixedly connected to one side of the heat dissipation box 81, the heat dissipation element 83 is fixedly connected to the bottom of the heat dissipation box 81, the capillary core module 84 is fixedly connected to the top of the heat dissipation element 83, the delivery pipe 85 is arranged at the top of the capillary core module 84, and the refrigeration fins 86 are fixedly connected between the top and the bottom of the inner wall of the heat dissipation box 81, so that the PCB has good heat dissipation effect, faster heat transfer speed, more convenient use and better temperature equalization performance, the output power of the PCB is improved, the output shaft of the motor 4 is fixedly connected with the rotating rod 5, the surface of the rotating rod 5 is fixedly connected with the first gear 6, the two sides of the first gear 6 are respectively engaged with the second gears 7, the structure is simple, the manufacturing cost is low, the service life of the PCB is prolonged, the structural design is more, the heat dissipation device is suitable for heat dissipation work of various areas.

It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides a be applied to PCB board heat abstractor in electron field, a serial communication port, including box (1), fixedly connected with PCB body (2) between the both sides of box (1) inner wall, bottom fixedly connected with motor case (3) of box (1), bottom fixedly connected with motor (4) of motor case (3) inner wall, the output shaft fixedly connected with bull stick (5) of motor (4), the fixed surface of bull stick (5) is connected with first gear (6), the both sides of first gear (6) all mesh there is second gear (7), fixedly connected with heat abstractor (8) between the both sides of box (1) inner wall.

2. The PCB heat dissipation device applied to the electronic field as claimed in claim 1, wherein: heat abstractor (8) are including heat dissipation case (81), one side fixedly connected with fan (82) of heat dissipation case (81), the bottom fixedly connected with radiating element (83) of heat dissipation case (81), the top fixedly connected with capillary core module (84) of radiating element (83), the top of capillary core module (84) is provided with conveyer pipe (85), fixedly connected with refrigeration fin (86) between the top of heat dissipation case (81) inner wall and the bottom.

3. The PCB heat dissipation device applied to the electronic field as claimed in claim 1, wherein: the refrigerator is characterized in that a refrigeration box (9) is fixedly connected to the top of the box body (1), a refrigerator (10) is fixedly connected to the top of the refrigeration box (9), one side of the refrigerator (10) is communicated with a U-shaped pipe (11), and one end of the U-shaped pipe (11) penetrates through the refrigeration box (9) and extends to the inside of the refrigeration box (9).

4. The PCB heat dissipation device applied to the electronic field as claimed in claim 3, wherein: the bottom fixedly connected with circulating pump (12) of refrigeration case (9) inner wall, the delivery port intercommunication of circulating pump (12) has outlet pipe (14), the one end of outlet pipe (14) runs through refrigeration case (9) and box (1) in proper order and extends to the inside of box (1), the top of refrigeration case (9) is run through and is had inlet tube (13).

5. The PCB heat dissipation device applied to the electronic field as claimed in claim 1, wherein: the all fixedly connected with base (17) of both sides of box (1) bottom, two fixedly connected with diaphragm (18) between the relative one side of base (17), the top of diaphragm (18) and the bottom fixed connection of motor case (3).

6. The PCB heat dissipation device applied to the electronic field as claimed in claim 1, wherein: the axle center department fixedly connected with dwang (15) of second gear (7), the one end fixedly connected with rotation fan (16) of dwang (15).