CN217985871U - Heat dissipation multilayer circuit board - Google Patents
Heat dissipation multilayer circuit board Download PDFInfo
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- CN217985871U CN217985871U CN202222179462.7U CN202222179462U CN217985871U CN 217985871 U CN217985871 U CN 217985871U CN 202222179462 U CN202222179462 U CN 202222179462U CN 217985871 U CN217985871 U CN 217985871U
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- circuit board
- multilayer circuit
- heat dissipation
- heat
- board body
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Abstract
The application relates to the technical field of circuit boards, and discloses a heat dissipation multilayer circuit board, which comprises a multilayer circuit board body and fixing groove bodies arranged on two sides of the multilayer circuit board body, wherein a heat dissipation aluminum block is connected to a heating part on the upper surface of the multilayer circuit board body, a through hole is formed in the outer surface of the heat dissipation aluminum block, a condenser pipe is fixedly connected to the inner wall of each fixing groove body, a heat conduction aluminum bar is connected to the heating part inside the multilayer circuit board body, the heat conduction aluminum bar penetrates through the fixing groove bodies and extends into an inner accommodating cavity of the condenser pipe, and one end, far away from the multilayer circuit board body, of the heat conduction aluminum bar is fixedly connected with a heat dissipation aluminum sheet; the heat transferred to the heat dissipation aluminum sheet can be absorbed through the matching of the heat conduction aluminum bar, the heat dissipation aluminum sheet and the cooling liquid, so that the heat dissipation effect on the multilayer circuit board body is improved.
Description
Technical Field
The application relates to the technical field of circuit boards, in particular to a heat dissipation multilayer circuit board.
Background
The circuit boards are classified into a single-sided board, a double-sided board and a multilayer circuit board according to the number of layers; the double-sided board is an extension of a single-sided board, and when single-layer wiring cannot meet the requirements of electronic products, the double-sided board needs to be used; the two sides are coated with copper wires, and the circuit between the two layers can be conducted through the guide holes to form the required network connection.
Multilayer circuit board can give off more heat in the use, if not in time dispel the heat to it, can influence multilayer circuit board's life, and the multilayer circuit board of most on the market at present simply dispels the heat through the radiating hole, and the radiating effect is not good enough.
SUMMERY OF THE UTILITY MODEL
The purpose of this application lies in: in order to improve the radiating effect to the multilayer circuit board body, this application provides a heat dissipation multilayer circuit board.
The technical scheme adopted by the application is as follows:
the utility model provides a heat dissipation multilayer circuit board, includes multilayer circuit board body and the fixed cell body of setting in multilayer circuit board body both sides, the upper surface of multilayer circuit board body position of generating heat is connected with heat dissipation aluminium piece, the through-hole has been seted up to the surface of heat dissipation aluminium piece, the inner wall fixedly connected with condenser pipe of fixed cell body, the inside position of generating heat of multilayer circuit board body is connected with the heat conduction aluminium bar, the heat conduction aluminium bar passes fixed cell body extends into in the inside appearance chamber of condenser pipe, the heat conduction aluminium bar is kept away from the one end fixedly connected with heat dissipation aluminum sheet of multilayer circuit board body.
Through adopting above-mentioned technical scheme, utilize the heat conduction aluminium bar can transmit the heat that multilayer circuit board body during operation produced to the radiating aluminum sheet on, and the intraduct coolant liquid of condensation this moment can be fast with the heat absorption that transmits on the radiating aluminum sheet to cool down the radiating aluminum sheet, so that the radiating aluminum sheet can continuously absorb the heat that multilayer circuit board body produced, thereby improves the radiating effect to multilayer circuit board body.
Optionally, the heat dissipation aluminium pig with the quantity of through-hole all is a plurality of, and a plurality of heat dissipation aluminium pig equidistance sets up the upper surface of multilayer circuit board body.
By adopting the technical scheme, the heat dissipation area of the heating part on the upper surface and the lower surface of the multilayer circuit board body can be increased by utilizing the plurality of heat dissipation aluminum blocks, and the through holes can ensure the air flow among the plurality of heat dissipation aluminum blocks.
Optionally, a filter screen is arranged at an opening of one side of the fixed groove body, which is far away from the heat-conducting aluminum bar, and the filter screen is 300-mesh in specification.
Through adopting above-mentioned technical scheme, utilize 300 meshes's filter screen can prevent that the dust in the outside air from entering into the inside of fixed cell body.
Optionally, the upper surface and the lower surface of the multilayer circuit board body are coated with an antistatic finish paint, and the thickness of the antistatic finish paint is 0.011mm-0.019mm.
By adopting the technical scheme, the thinner coating does not influence the use of the multilayer circuit board body, and can prevent the multilayer circuit board body from generating static electricity.
Optionally, the lower surface of the multilayer circuit board body is provided with a plurality of heat dissipation grooves.
By adopting the technical scheme, the heat dissipation area of the heating part on the upper surface and the lower surface of the multilayer circuit board body can be increased by utilizing the plurality of heat dissipation grooves.
In conclusion, due to the adoption of the technical scheme, the beneficial effects of the application are as follows:
1. on can transmitting the heat dissipation aluminum sheet with the heat that multilayer circuit board body during operation produced through the heat conduction aluminium bar, and the intraductal coolant liquid of condensation this moment can fall the heat absorption that transmits on the heat dissipation aluminum sheet fast to cool down the heat dissipation aluminum sheet, so that the heat dissipation aluminum sheet can continuously absorb the heat that multilayer circuit board body produced, thereby improve the radiating effect to multilayer circuit board body.
2. The heat dissipation area of the upper surface heating part and the lower surface heating part of the multilayer circuit board body can be increased by utilizing the plurality of heat dissipation aluminum blocks and the heat dissipation grooves, and the through holes can ensure the air flow among the plurality of heat dissipation aluminum blocks.
Drawings
FIG. 1 is a cross-sectional view of the present invention;
FIG. 2 is an enlarged view of the point A of FIG. 1;
fig. 3 is a perspective view of the multi-layer circuit board body of the present invention.
The mark in the figure is: 1-multilayer circuit board body, 2-radiating groove, 3-fixed groove body, 4-condenser pipe, 5-heat conducting aluminum bar, 6-radiating aluminum sheet, 7-filter screen, 8-radiating aluminum block, 9-through hole and 10-antistatic finish paint.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the embodiments of the present application, and it is obvious that the described embodiments are some embodiments of the present application, but not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
A heat dissipating multilayer circuit board according to an embodiment of the present application will be described in detail with reference to fig. 1 to 3.
The embodiment is as follows:
the embodiment of the application discloses heat dissipation multilayer circuit board. Referring to fig. 1 to 3, the upper surface and the lower surface of a multi-layer circuit board body 1 are coated with antistatic finish 10, and the thickness of the antistatic finish 10 is 0.011mm-0.019mm; the thinner anti-static finish 10 is coated, so that the use of the multilayer circuit board body 1 is not influenced, and the phenomenon of static electricity of the multilayer circuit board body 1 can be prevented.
Referring to fig. 1 and 2, the multilayer circuit board comprises a multilayer circuit board body 1 and fixed groove bodies 3 arranged on two sides of the multilayer circuit board body 1, wherein the inner wall of each fixed groove body 3 is fixedly connected with a condenser pipe 4, a heat-conducting aluminum bar 5 is connected to a heat-generating part inside the multilayer circuit board body 1, the heat-conducting aluminum bar 5 penetrates through the fixed groove bodies 3 and extends into an inner cavity of the condenser pipe 4, one end of the heat-conducting aluminum bar 5, which is far away from the multilayer circuit board body 1, is fixedly connected with a heat-radiating aluminum sheet 6, and heat generated during the operation of the multilayer circuit board body 1 can be transferred to the heat-radiating aluminum sheet 6 through the heat-conducting aluminum bar 5; the inside of condenser pipe 4 is provided with the coolant liquid, and the inside coolant liquid of condenser pipe 4 can be fast with the heat absorption that transmits on heat dissipation aluminum sheet 6 to cool down heat dissipation aluminum sheet 6, during the absorbed heat of coolant liquid can slowly transmit the air this moment, thereby improve the radiating effect to multilayer circuit board body 1.
Referring to fig. 1 and 2, a filter screen 7 is arranged at an opening of one side of the fixed tank body 3, which is far away from the heat-conducting aluminum bar 5, the filter screen 7 is 300-mesh in specification, and the filter screen 7 with 300-mesh can prevent dust in the outside air from entering the inside of the fixed tank body 3.
Referring to fig. 1-3, the upper surface of multilayer circuit board body 1 generates heat the position and is connected with heat dissipation aluminium pig 8, through-hole 9 has been seted up to heat dissipation aluminium pig 8's surface, the quantity of heat dissipation aluminium pig 8 and through-hole 9 all is a plurality of, and a plurality of heat dissipation aluminium pig 8 equidistance sets up the upper surface at multilayer circuit board body 1, a plurality of radiating groove 2 has been seted up to the lower surface of multilayer circuit board body 1, utilize a plurality of heat dissipation aluminium pig 8 and radiating groove 2 can increase the heat radiating area of the position that generates heat of the upper and lower surface of multilayer circuit board body 1, and through-hole 9 can guarantee the air flow between a plurality of heat dissipation aluminium pig 8.
The implementation principle of a heat dissipation multilayer circuit board of this application embodiment does:
insert external power source earlier when using multilayer circuit board body 1, multilayer circuit board body 1 under the operating condition can release more heat, and can transmit the heat that multilayer circuit board body 1 during operation produced to heat dissipation aluminum sheet 6 through heat conduction aluminium bar 5, and the coolant liquid of condenser pipe 4 inside can be fast with transmitting the heat absorption on the heat dissipation aluminum sheet 6 this moment, so that cool down heat dissipation aluminum sheet 6, so that heat dissipation aluminum sheet 6 can continuously absorb the heat that multilayer circuit board body 1 produced, outside air can pass the inside that filter screen 7 entered into fixed cell body 3 simultaneously, the absorptive heat of coolant liquid can slowly transmit in the air this moment, the radiating effect to multilayer circuit board body 1 has been improved through above structure.
On the other hand, the heat dissipation areas of the heat generating portions on the upper and lower surfaces of the multi-layer circuit board body 1 can be increased by using the plurality of heat dissipation aluminum blocks 8 and the heat dissipation grooves 2, and the air flow between the plurality of heat dissipation aluminum blocks 8 can be ensured by the through holes 9.
The above embodiments are only used to illustrate the technical solutions of the present application, and not to limit the same; although the present application has been described in detail with reference to the foregoing embodiments, it should be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions in the embodiments of the present application.
Claims (5)
1. The utility model provides a heat dissipation multilayer circuit board, includes multilayer circuit board body (1) and sets up fixed cell body (3) in multilayer circuit board body (1) both sides, its characterized in that: the utility model discloses a multilayer circuit board, including multilayer circuit board body (1), the upper surface of multilayer circuit board body (1) position that generates heat is connected with heat dissipation aluminium pig (8), through-hole (9) have been seted up to the surface of heat dissipation aluminium pig (8), the inner wall fixedly connected with condenser pipe (4) of fixed cell body (3), the inside position that generates heat of multilayer circuit board body (1) is connected with heat conduction aluminium bar (5), heat conduction aluminium bar (5) pass fixed cell body (3) extend into in the inside appearance chamber of condenser pipe (4), keep away from heat conduction aluminium bar (5) the one end fixedly connected with heat dissipation aluminum sheet (6) of multilayer circuit board body (1), the inside of condenser pipe (4) is provided with the coolant liquid.
2. The heat dissipating multilayer circuit board of claim 1, wherein: the heat dissipation aluminum block (8) with the quantity of through-hole (9) all is a plurality of, and a plurality of heat dissipation aluminum block (8) equidistance sets up the upper surface of multilayer circuit board body (1).
3. The heat dissipating multilayer circuit board of claim 1, wherein: a filter screen (7) is arranged at an opening of one side, away from the heat conduction aluminum bar (5), of the fixing groove body (3), and the specification of the filter screen (7) is 300 meshes.
4. The heat dissipating multilayer circuit board of claim 1, wherein: the anti-static circuit board is characterized in that the upper surface and the lower surface of the multilayer circuit board body (1) are coated with anti-static finish paint (10), and the thickness of the anti-static finish paint (10) is 0.011mm-0.019mm.
5. The heat dissipating multilayer circuit board of claim 1, wherein: a plurality of radiating grooves (2) are formed in the lower surface of the multilayer circuit board body (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222179462.7U CN217985871U (en) | 2022-08-18 | 2022-08-18 | Heat dissipation multilayer circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222179462.7U CN217985871U (en) | 2022-08-18 | 2022-08-18 | Heat dissipation multilayer circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217985871U true CN217985871U (en) | 2022-12-06 |
Family
ID=84260010
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202222179462.7U Active CN217985871U (en) | 2022-08-18 | 2022-08-18 | Heat dissipation multilayer circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN217985871U (en) |
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2022
- 2022-08-18 CN CN202222179462.7U patent/CN217985871U/en active Active
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