CN211671039U - Computer conducting plate capable of radiating - Google Patents
Computer conducting plate capable of radiating Download PDFInfo
- Publication number
- CN211671039U CN211671039U CN202020381291.4U CN202020381291U CN211671039U CN 211671039 U CN211671039 U CN 211671039U CN 202020381291 U CN202020381291 U CN 202020381291U CN 211671039 U CN211671039 U CN 211671039U
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- China
- Prior art keywords
- heat
- plate
- computer
- conducting
- copper pipe
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- Expired - Fee Related
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- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model discloses a computer current-conducting plate capable of radiating heat, relating to the technical field of current-conducting plates, comprising a current-conducting plate, a radiating fin and a micro radiator, the conductive plate is formed by welding three pairs of split plates together, each split plate consists of a conductive film, a metal plate and a heat dissipation plate from top to bottom in sequence, two adjacent layers are formed by light curing adhesive, the contact firmness of the two adjacent layers is ensured, wherein the conductive film and the metal plate are responsible for performing electrostatic protection on the computer, and the heat conducting copper pipe is arranged in the heat dissipation plate and absorbs the heat on the front surface of the conductive plate through the heat absorbing sheet, the heat dissipation liquid in the heat conduction copper pipe is cooled after being heated and gasified through the heat dissipation fins and the micro radiator, and the liquefied heat dissipation liquid continuously circulates in the heat conduction copper pipe to flow, so that heat on the current conduction plate is dissipated in a circulating and reciprocating mode, and heat dissipation of a computer is completed.
Description
Technical Field
The utility model relates to a current conducting plate technical field specifically is a computer current conducting plate that can dispel the heat.
Background
Electrostatic discharge is a major factor in the damage of most electronic devices or electronic systems by excessive electrical stress. Such damage may result in a permanent damage to the semiconductor device and the computer system, which may affect the circuit function of the integrated circuit and cause the electronic product to malfunction.
In the prior art, the inner side of a computer shell can provide the function of electrostatic protection by additionally arranging a simply designed conducting plate, and the conducting plate is mostly formed by adopting a metal plate, so that the conducting plate can influence the heat dissipation effect inside a computer, and therefore, the computer conducting plate capable of dissipating heat is provided.
SUMMERY OF THE UTILITY MODEL
To the problem that exists among the prior art, the utility model aims to provide a can radiating computer current conducting plate, the bottom of this current conducting plate is provided with the heating panel, discharges the heat of current conducting plate from fin and miniature radiator through the inside heat conduction copper pipe of heating panel.
In order to achieve the above object, the utility model provides a following technical scheme: the heat dissipation plate comprises a current conduction plate, a heat dissipation plate and a micro heat dissipation device, wherein the current conduction plate is formed by welding three split plates together, the left side and the right side of each split plate are respectively provided with a threaded hole, the current conduction plate is fixed on the inner side of a computer shell through a fastening bolt to play a role in electrostatic protection, each split plate group consists of a conductive film, a metal plate and a heat dissipation plate from top to bottom, and two adjacent layers consist of light curing adhesive, so that the contact firmness of the two adjacent layers is ensured; the inside fixed mounting of heating panel has round heat conduction copper pipe, and the left side of heat conduction copper pipe passes from the inside of fin and miniature radiator respectively, wherein the bottom fixed mounting of fin is on the slide rail, the slide rail passes through bolt fixed mounting and is inboard at the computer casing, the spout that corresponds with the slide rail is seted up to the bottom of miniature radiator simultaneously, miniature radiator slidable mounting is on the slide rail, the intraductal radiating fluid of heat conduction copper cools down behind fin and miniature radiator after being heated the gasification, the radiating fluid after the liquefaction continues to circulate and flows in the heat conduction copper pipe, thereby the heat that the circulation is reciprocal distributes away on the current conducting plate.
As a further aspect of the present invention: the bottom of the miniature radiator is provided with an air hole, the air hole is arranged in a vortex range generated by the rotation of the fan, and the air hole is arranged close to one side of the computer shell.
As a further aspect of the present invention: and a filter screen is fixedly arranged on the air holes.
As a further aspect of the present invention: the heat-conducting copper pipe is fixedly provided with heat absorbing plates on two sides close to the side wall of the heat-radiating plate, and the heat absorbing plates are made of heat-conducting materials.
As a further aspect of the present invention: the metal plate may be a metal substrate, a semiconductor substrate, or a printed circuit board.
As a further aspect of the present invention: the heat dissipation liquid in the heat conduction copper pipe can be distilled water, and can also be ammonia, methanol or acetone.
Compared with the prior art, the beneficial effects of the utility model are that: the utility model discloses the current conducting plate that sets up has three component boards to constitute, and wherein every component board of group comprises conductive film, metal sheet and heating panel triplex respectively, and conductive film and metal sheet are responsible for carrying out electrostatic protection to the computer, are provided with the heat conduction copper pipe in the heating panel simultaneously, and the heat conduction copper pipe dispels the heat through fin and miniature radiator with the positive heat of current conducting plate through the absorber plate to reduce the inside heat of computer, reached the radiating effect.
Drawings
Fig. 1 is a top view of the present invention.
Fig. 2 is a schematic view of the unfolding structure of the present invention.
Fig. 3 is a schematic view of the heat dissipation plate structure of the present invention.
Fig. 4 is a top view of the heat sink of the present invention.
Fig. 5 is a top view of the micro heat sink of the present invention.
Fig. 6 is a side view of the heat dissipating plate of the present invention.
As shown in the figure: 1. the heat-absorbing plate comprises a conductive plate, 2 parts of plates, 3 parts of radiating fins, 4 parts of a micro radiator, 5 parts of a heat-conducting copper pipe, 6 parts of a conductive film, 7 parts of a metal plate, 8 parts of a heat-radiating plate, 9 parts of a fastening bolt, 10 parts of a sliding rail, 11 parts of a sliding groove, 12 parts of air holes, 13 parts of a filter screen, 14 parts of a heat-absorbing plate.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted", "provided", "sleeved/connected", "connected", and the like are to be understood in a broad sense, such as "connected", which may be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.
Referring to fig. 1 to 6, in an embodiment of the present invention, a computer conducting plate capable of dissipating heat includes a conducting plate 1, a heat dissipating fin 3 and a micro heat sink 4, where the conducting plate 1 is formed by welding three pairs of plates 2 together, and threaded holes are respectively formed on the left and right sides of each plate 2, the conducting plate 1 is fixed inside a computer housing through fastening bolts 9, so as to play a role of electrostatic protection, and each group of plates 2 is sequentially formed by a conducting film 6, a metal plate 7 and a heat dissipating plate 8 from top to bottom, and two adjacent layers are formed by light-cured adhesive, so as to ensure the firmness of contact between the two adjacent layers; the inside fixed mounting of heating panel 8 has round heat conduction copper pipe 5, and the left side of heat conduction copper pipe 5 passes from the inside of fin 3 and miniature radiator 4 respectively, wherein the bottom fixed mounting of fin 3 is on slide rail 10, slide rail 10 passes through bolt fixed mounting inboard at the computer case, the spout 11 that corresponds with slide rail 10 is seted up to the bottom of miniature radiator 4 simultaneously, miniature radiator 4 slidable mounting is on slide rail 10, the cooling liquid in the heat conduction copper pipe 5 cools down after being heated the gasification behind fin 3 and miniature radiator 4, the cooling liquid after the liquefaction continues to circulate and flows in heat conduction copper pipe 5, thereby the heat with on the current conducting plate 1 that circulates is reciprocal distributes away.
Wherein, the bottom of the miniature radiator 4 is provided with an air hole 12, the air hole 12 is arranged in the vortex range generated by the rotation of the fan, the air hole 12 is arranged near one side of the computer shell, and a filter screen 13 is fixedly arranged on the air hole 12, so that external dust is placed in the miniature radiator 4, and the working efficiency of the miniature radiator 4 is reduced.
The heat-conducting copper pipe 5 is fixedly provided with heat absorbing plates 14 at two sides close to the side wall of the heat-radiating plate 8, the heat absorbing plates 14 are made of heat-conducting materials, and the heat-radiating efficiency of the heat-conducting copper pipe 5 is improved through the heat absorbing plates 14.
Preferably, the metal plate 7 may be a metal substrate, a semiconductor substrate, or a printed circuit board.
According to a preferred embodiment of the present invention, the heat dissipation liquid in the heat conduction copper pipe 5 may be distilled water, or ammonia, methanol or acetone.
It should be noted that the working principle and the installation manner of the heat conducting copper pipe 5 both adopt the prior art, and are common general knowledge of those skilled in the art, and thus no further description is provided herein.
Although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments or portions thereof without departing from the spirit and scope of the invention, and the following claims are therefore to be read in this light of the appended claims.
Claims (6)
1. The utility model provides a computer current conducting plate that can dispel heat, includes current conducting plate (1), fin (3) and miniature radiator (4), its characterized in that: the current-conducting plate (1) is formed by welding three pairs of sub-plates (2) together, threaded holes are respectively formed in the left side and the right side of each sub-plate (2), the current-conducting plate (1) is fixed on the inner side of a computer shell through fastening bolts (9), each sub-plate (2) is sequentially formed by a current-conducting film (6), a metal plate (7) and a heat-radiating plate (8) from top to bottom, and two adjacent layers are formed by light-curing glue; the inside fixed mounting of heating panel (8) has round heat conduction copper pipe (5) to the left side of heat conduction copper pipe (5) passes from the inside of fin (3) and miniature radiator (4) respectively, wherein the bottom fixed mounting of fin (3) is on slide rail (10), slide rail (10) pass through bolt fixed mounting inboard at the computer casing, spout (11) that correspond with slide rail (10) are seted up to the bottom of miniature radiator (4) simultaneously, miniature radiator (4) slidable mounting is on slide rail (10).
2. A heat-dissipating conductive sheet for a computer as claimed in claim 1, wherein: the bottom of the miniature radiator (4) is provided with an air hole (12), the air hole (12) is arranged in the vortex range generated by the rotation of the fan, and the air hole (12) is arranged close to one side of the computer shell.
3. A heat-dissipating conductive sheet for a computer as claimed in claim 2, wherein: and a filter screen (13) is fixedly arranged on the air holes (12).
4. A heat-dissipating conductive sheet for a computer as claimed in claim 1, wherein: and heat absorbing plates (14) are fixedly mounted on two sides of the heat conducting copper pipe (5) close to the side wall of the heat radiating plate (8), and the heat absorbing plates (14) are made of heat conducting materials.
5. A heat-dissipating conductive sheet for a computer as claimed in claim 1, wherein: the metal plate (7) may be a metal substrate, a semiconductor substrate or a printed circuit board.
6. A heat-dissipating conductive sheet for a computer as claimed in claim 1, wherein: the heat-dissipating fluid in the heat-conducting copper pipe (5) can be distilled water, and can also be ammonia, methanol or acetone.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020381291.4U CN211671039U (en) | 2020-03-24 | 2020-03-24 | Computer conducting plate capable of radiating |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020381291.4U CN211671039U (en) | 2020-03-24 | 2020-03-24 | Computer conducting plate capable of radiating |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211671039U true CN211671039U (en) | 2020-10-13 |
Family
ID=72742758
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202020381291.4U Expired - Fee Related CN211671039U (en) | 2020-03-24 | 2020-03-24 | Computer conducting plate capable of radiating |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211671039U (en) |
-
2020
- 2020-03-24 CN CN202020381291.4U patent/CN211671039U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20201013 Termination date: 20210324 |
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| CF01 | Termination of patent right due to non-payment of annual fee |