CN220915631U - Electronic device and modularized structure thereof, and communication power supply - Google Patents

Abstract

The application discloses an electronic device and a modularized structure thereof as well as a communication power supply. The modularized structure comprises a heating element and a heat dissipation substrate, wherein the heating element is electrically connected with the PCB. The heat dissipation substrate comprises a metal layer and an insulating layer which are arranged in a laminated mode, the heating element is mounted on the heat dissipation substrate and located on one side, opposite to the metal layer, of the insulating layer, the heating element dissipates heat through the heat dissipation substrate, and the metal layer is configured to be mounted at any position of the PCB. The heat-generating element and the heat-radiating substrate are arranged into a modularized structure, the structure is simple, the volume is reduced, the arrangement of the internal space of the shell is facilitated to be optimized, the position of the heat-generating element can be flexibly adjusted according to requirements, the design of an internal air channel of an electronic device is facilitated, the heat-radiating capacity is improved, and the higher heat-radiating requirement is met.

Description

Electronic device and modularized structure thereof, and communication power supply

Technical Field

The present application relates to the field of communications technologies, and in particular, to an electronic device, a modular structure thereof, and a communication power supply.

Background

With the rapid development of 5G communication technology, the site capacity increases, but the space for installing the power supply device does not increase correspondingly, so the power supply device needs to be realized in a constant volume, but the capacity increases.

In order to meet the capacity expansion requirement of 5G equipment, a rectifier with larger capacity needs to be replaced, however, due to the smaller internal space of the rectifier, the existing heat dissipation structure is difficult to meet the heat dissipation requirement of the rectifier with higher capacity under the condition of not increasing the volume of the rectifier.

Disclosure of utility model

In view of the above, the present application provides an electronic device, a modular structure thereof, and a communication power supply.

The first aspect of the present application provides an electronic device comprising:

A housing having a receiving cavity;

the PCB is arranged on the shell and positioned in the accommodating cavity;

The modular structure comprises a heating element and a heat dissipation substrate, wherein the heating element is electrically connected with the PCB;

The heat dissipation substrate comprises a metal layer and an insulating layer which are arranged in a stacked mode, the heating element is mounted on the heat dissipation substrate and is located on one side, opposite to the metal layer, of the insulating layer, the heating element dissipates heat through the heat dissipation substrate, and the metal layer is configured to be mounted at any position of the PCB.

A second aspect of the application provides a modular structure of an electronic device, comprising:

The heating element is used for being electrically connected with the PCB;

The radiating substrate comprises a metal layer and an insulating layer which are arranged in a laminated mode, the heating element is arranged on the radiating substrate and is located on one side, opposite to the metal layer, of the insulating layer, the heating element radiates heat through the radiating substrate, and the metal layer is configured to be capable of being arranged at any position of the PCB.

A third aspect of the present application provides a communication power supply, including the electronic device described above.

According to the electronic device provided by the application, the heating element and the heat radiation substrate are arranged into a modularized structure, the structure is simple, the volume is reduced, the arrangement of the internal space of the shell is facilitated to be optimized, the position of the heating element can be flexibly adjusted according to the requirements, the design of an internal air channel of the electronic device is facilitated, the heat radiation capability is improved, and the higher heat radiation requirement is met.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for the description of the embodiments will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present application, and other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

Fig. 1 is a schematic view of a first view structure of an electronic device according to an embodiment of the present application.

Fig. 2 is a schematic structural view of the housing of the hidden portion of the electronic device shown in fig. 1.

Fig. 3 is a schematic view of a second view structure of an electronic device according to an embodiment of the present application.

Fig. 4 is a schematic structural diagram of a modular structure according to an embodiment of the present application.

Fig. 5 is a schematic structural diagram of a modification of the modular structure according to the embodiment of the present application.

Fig. 6 is a schematic structural diagram of a modular structure according to an embodiment of the present application mounted on a PCB board.

Fig. 7 is a schematic structural diagram of a heat dissipating substrate provided with a mounting portion according to an embodiment of the present application.

Reference numerals illustrate:

100. An electronic device; 10. a housing; 11. a receiving chamber; 12. a bottom plate; 13. a first sidewall; 14. a second sidewall; 15. an air inlet; 16. an air outlet; 20. a PCB board; 30. a modular structure; 31. a heating element; 32. a heat-dissipating substrate; 321. a metal layer; 322. an insulating layer; 33. a thermally conductive adhesive layer; 34. a mounting part; 40. a heat radiation fan.

Detailed Description

The following description of the embodiments of the present application will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are some, but not all embodiments of the application. All other embodiments, which can be made by those skilled in the art based on the embodiments of the application without making any inventive effort, are intended to be within the scope of the application.

It is to be understood that the terminology used in the description of the application herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. As used in this specification and the appended claims, the singular forms "a," "an," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise.

It should also be understood that the term "and/or" as used in the present specification and the appended claims refers to any and all possible combinations of one or more of the associated listed items, and includes such combinations.

It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the application.

With the rapid development of 5G communication technology, the site capacity increases, but the space for installing the power supply device does not increase correspondingly, so the power supply device needs to be realized in a constant volume, but the capacity increases.

In order to meet the capacity expansion requirement of 5G equipment, a rectifier with larger capacity needs to be replaced, however, due to the smaller internal space of the rectifier, the existing heat dissipation structure is difficult to meet the heat dissipation requirement of the rectifier with higher capacity under the condition of not increasing the volume of the rectifier. The heat dissipation structure in the prior art generally sets the side wall of the whole machine as a heat dissipation plate, is limited by structural limitation, and the MOS tube with high heat consumption is arranged on the two side walls, and two layers of heat conducting glue and one layer of ceramic substrate are arranged between the MOS tube and the side wall of the whole machine, so that the internal space of the rectifier is smaller, the arrangement of devices is limited, and the arrangement positions of the MOS tube are limited on the two sides, which is not beneficial to the design of an air duct, so that the existing heat dissipation scheme is difficult to meet the heat dissipation requirement of the rectifier with higher capacity.

Therefore, the embodiment of the application provides the electronic device, so that the position of the heating element can be flexibly adjusted according to the requirements, the design of an air duct in the electronic device is facilitated, the heat dissipation capacity is improved, and the higher heat dissipation requirement is met.

Referring to fig. 1-3, an electronic device 100 according to an embodiment of the present application includes a housing 10, a PCB board 20 and a modular structure 30, wherein the housing 10 has a receiving cavity 11, and the PCB board 20 is mounted on the housing 10 and located in the receiving cavity 11. The modular structure 30 includes a heat generating element 31 and a heat dissipating substrate 32, the heat generating element 31 being electrically connected to the PCB board 20. The heat dissipation substrate 32 includes a metal layer 321 and an insulating layer 322 that are stacked, the heating element 31 is mounted on the heat dissipation substrate 32 and located at a side of the insulating layer 322 opposite to the metal layer 321, the heating element 31 dissipates heat through the heat dissipation substrate 32, and the metal layer 321 is configured to be mounted at any position of the PCB board 20.

According to the electronic device 100 provided by the embodiment of the application, the heating element 31 and the heat dissipation substrate 32 are arranged into the modularized structure 30, and the heating element 31 can be mounted to any position of the PCB 20 through the metal layer 321, so that the heating element 31 does not need to be arranged on two side walls of the shell 10, the position can be flexibly adjusted, the modularized structure 30 is simple in structure, the production process is simplified, the volume is reduced, the arrangement of the internal space of the shell 10 is optimized, the position of the heating element 31 can be flexibly adjusted according to requirements, the design of an internal air channel of the electronic device 100 is facilitated, the heat dissipation capacity is improved, and the higher heat dissipation requirement is met.

Wherein, the PCB board (Printed Circuit Board) is named as a printed circuit board.

The name of the MOS transistor (Metal-Oxide-Semiconductor Field-Effect Transistor, MOSFET) is Metal-Oxide semiconductor field effect transistor, which is called Metal-Oxide semiconductor field effect transistor for short.

In some embodiments, as shown in fig. 5 and 6, the modular structure 30 further includes a thermally conductive adhesive layer 33, where the thermally conductive adhesive layer 33 is disposed on a side of the insulating layer 322 opposite to the metal layer 321, and the heating element 31 is mounted on the heat dissipating substrate 32 through the thermally conductive adhesive layer 33. In the present embodiment, the heat-generating element 31 and the heat-dissipating substrate 32 are connected by the heat-conducting adhesive layer 33, and the heat-conducting effect can be improved while the connection of the heat-generating element 31 and the heat-dissipating substrate 32 is stabilized.

During installation, the heating element 31 is adhered to the heat dissipation substrate 32 through the heat conduction adhesive layer 33, then dried and fixed into an integral modularized structure 30, and then the modularized structure 30 is installed on the PCB 20.

Illustratively, the thermally conductive adhesive layer 33 may employ a thermally conductive adhesive such as a silicone thermally conductive adhesive, an epoxy AB adhesive, a polyurethane thermally conductive adhesive, or the like.

Of course, the connection between the heating element 31 and the heat dissipating substrate 32 is not limited to the connection using the heat conductive adhesive layer 33, and as shown in fig. 4, the heating element 31 may be directly welded to the heat dissipating substrate 32 to achieve the connection between the heating element 31 and the heat dissipating substrate 32.

In some embodiments, the thickness of the housing 10 is 0.6mm-1.2mm. In this embodiment, since the heat dissipation is not required through the side wall of the housing 10, the heat dissipation substrate 32 in the modularized structure 30 is directly used for heat dissipation, so that the thickness of the housing 10 can be controlled to be thinner than that of the existing heat dissipation structure, and the thickness of the housing 10 is set within the range of 0.6mm-1.2mm without changing the volume of the device, so that the width direction of the internal space of the housing 10 is increased, a larger space is provided for the layout of the PCB 20, the PCB 20 with a larger area can be placed, and the arrangement optimization in the device is facilitated.

Illustratively, the thickness of the housing 10 may be 0.6mm, 0.7mm, 0.8mm, 0.9mm, 1mm, 1.1mm, 1.2mm, etc.

In some embodiments, the housing 10 is made from hot dip galvanized fingerprint resistant board. In the embodiment, the hot galvanizing fingerprint-resistant plate has good protective performance, fingerprint resistance and strong corrosion resistance. Of course, other materials having sufficient strength, less deformation and high corrosion resistance may be used for the housing 10.

In some embodiments, as shown in fig. 6 and 7, the metal layer 321 is provided with a mounting portion 34, the mounting portion 34 being used for soldering the modular structure 30 to any position of the PCB board 20. In this embodiment, the metal layer 321 may be welded to any position of the PCB 20 through the mounting portion 34, so as to facilitate installation, and the mounting portion 34 may be a brass pillar, or other structure capable of facilitating welding of the metal layer 321 to the PCB 20.

As shown in fig. 7, the metal layer 321 is provided with mounting portions 34 at the bottoms of both sides along the length direction to balance the stress on both sides and improve the connection stability between the metal layer 321 and the PCB 20.

In some embodiments, the number of modular structures 30 may be one, with one modular structure 30 being perpendicular to the PCB board 20. In this embodiment, a modularized structure 30 can be vertically installed at any position of the PCB 20 according to the design requirement of the air duct in the housing 10, so as to facilitate the layout in the electronic device 100, and enable the structure to be compact and improve the heat dissipation effect.

Of course, in other embodiments, the number of the modular structures 30 may be at least two, and at least two of the modular structures 30 are perpendicular to the PCB board 20 and spaced apart. At least two modularized structures 30 can be vertically arranged at any position of the PCB 20 and arranged at intervals according to the design requirement of the air channel in the shell 10, so that the layout in the electronic device 100 is facilitated, and the heat dissipation effect can be improved while the structure is compact. Illustratively, the number of modular structures 30 may also be two, three, four or even more.

As an embodiment, as shown in fig. 2, the housing 10 includes a bottom plate 12, and a first sidewall 13 and a second sidewall 14 perpendicular to the bottom plate 12 and disposed opposite to each other, the PCB board 20 is parallel to the bottom plate 12, the number of the modularized structures 30 is two, and the two modularized structures 30 are perpendicular to the PCB board 20 and are staggered in a first direction, where the first direction is an arrangement direction of the first sidewall 13 and the second sidewall 14.

In some embodiments, as shown in fig. 1-3, the housing 10 is further provided with an air inlet 15 and an air outlet 16 in communication with the accommodating cavity 11, and an air channel for air flow is formed between the inner wall of the housing 10 and the modular structure 30. Through the setting of modular structure 30, can adjust the mounted position according to the design demand in wind channel to realize the promotion of heat dissipation ability, satisfy higher heat dissipation demand.

In a specific application, the arrangement position of the modular structure 30 can be flexibly adjusted, so that the air duct design can be performed according to the simulated wind speed condition to optimize the layout, thereby realizing the improvement of heat dissipation capacity and meeting higher heat dissipation requirements.

As shown in fig. 2 and 3, the air inlet 15 and the air outlet 16 are respectively disposed on two opposite sidewalls of the housing 10 in a second direction, which is perpendicular to the first direction, so as to facilitate the design of the air duct.

In some embodiments, as shown in fig. 1 and 2, the electronic device 100 further includes a cooling fan 40, where the cooling fan 40 is used for guiding airflow into the accommodating cavity 11 from the air inlet 15 and outputting the airflow from the air outlet 16, and in this embodiment, the circulation of the airflow can be accelerated by the arrangement of the cooling fan 40, so that the cooling effect is improved. For example, the cooling fan 40 may be mounted to the air inlet 15 (as shown in fig. 1 and 2), or mounted to the air outlet 16, or the cooling fan 40 may be disposed at both the air inlet 15 and the air outlet 16.

In some embodiments, the heat dissipating substrate 32 further includes a circuit layer, where the metal layer 321, the insulating layer 322, and the circuit layer are sequentially stacked, and the heating element 31 is electrically connected to the circuit layer. In some usage scenarios, a circuit layer may also be disposed on the heat dissipating substrate 32, so that the heating element 31 is electrically connected to the circuit layer to implement a preset circuit function.

Illustratively, the heat dissipation substrate 32 may be a copper-clad open-pore aluminum substrate having good insulation properties and good heat dissipation properties, and a circuit layer, i.e., copper foil for wiring. In particular applications, the heat dissipating substrate 32 may be an aluminum substrate having a thermal conductivity of 2.0-2.5.

In some embodiments, the heating element 31 has pins extending to the PCB board 20, through which the heating element 31 is electrically connected with the PCB board 20. In this embodiment, the heating element 31 is soldered to a corresponding pad of the PCB 20 through an extended pin to achieve electrical connection.

In some embodiments, the electronic device 100 is a rectifier. In this embodiment, the modular structure 30 may be used for heat dissipation of the heating element 31 in the rectifier, and may also be used for heat dissipation of other high heat consumption electronic devices 100.

In some embodiments, the heating element 31 is a MOS transistor. In this embodiment, since the main heating element 31 in the rectifier is a MOS tube, the heat dissipation substrate 32 and the MOS tube are combined to form the modularized structure 30, which can facilitate the flexible adjustment of the position of the MOS tube according to the design requirement of the air duct, thereby improving the heat dissipation capability and meeting the higher heat dissipation requirement.

In some embodiments, the metal layer 321 is an aluminum plate or a copper plate. In the embodiment, the aluminum plate or the copper plate is adopted, so that the heat conduction effect is good, and the cost is low. When the metal layer 321 is an aluminum plate, the aluminum plate may be perforated and coated with copper to accelerate heat conduction.

In some embodiments, the insulating layer 322 is at least one of epoxy glass cloth, epoxy resin, polyolefin resin, polyimide resin glass cloth. In this embodiment, the insulating layer 322 is formed by using the above materials, and mainly has functions of adhesion, insulation and heat conduction.

Referring to fig. 4-6, an embodiment of the application further provides a modular structure 30 of an electronic device, which includes a heating element 31 and a heat dissipation substrate 32, wherein the heating element 31 is electrically connected to the PCB 20. The heat dissipation substrate 32 includes a metal layer 321 and an insulating layer 322 that are stacked, the heating element 31 is mounted on the heat dissipation substrate 32 and is located at a side of the insulating layer 322 opposite to the metal layer 321, the heating element 31 dissipates heat through the heat dissipation substrate 32, and the metal layer 321 is configured to be mountable to an arbitrary position of the PCB board 20.

The modularized structure 30 provided by the embodiment of the application is applied to electronic devices such as rectifiers, is simple in structure, and the modularized structure 30 can be mounted to any position of the PCB 20 of the electronic device 100 through the metal layer 321, so that the heating element 31 does not need to be arranged on two side walls of the shell 10 of the electronic device 100, the position can be flexibly adjusted, and through the arrangement of the modularized structure 30, the structure is simple, so that the position of the heating element 31 can be flexibly adjusted according to requirements, the design of an air duct in the electronic device 100 is facilitated, the heat dissipation capacity is improved, and the higher heat dissipation requirement is met. The structure and function of the modular structure 30 according to the embodiment of the present application are the same as those of the above embodiment, and specific reference may be made to the description of the above embodiment, which is not repeated.

The embodiment of the application also provides a communication power supply, which comprises the electronic device 100. In practice, the electronic device 100 is a rectifier, and the communication power supply may further include a battery and a communication power circuit. The structure and function of the electronic device 100 in the communication power supply according to the embodiment of the present application are the same as those of the above embodiment, and specific reference may be made to the description of the above embodiment, which is not repeated.

The above embodiments of the present application are merely for the purpose of description and do not represent the advantages or disadvantages of the embodiments. The present application is not limited to the above embodiments, and various equivalent modifications and substitutions can be easily made by those skilled in the art within the scope of the present application, and these modifications and substitutions are intended to be included in the scope of the present application. Therefore, the protection scope of the application is subject to the protection scope of the claims.

Claims (10)

1. An electronic device, comprising:

A housing having a receiving cavity;

the PCB is arranged on the shell and positioned in the accommodating cavity;

The modular structure comprises a heating element and a heat dissipation substrate, wherein the heating element is electrically connected with the PCB;

The heat dissipation substrate comprises a metal layer and an insulating layer which are arranged in a stacked mode, the heating element is mounted on the heat dissipation substrate and is located on one side, opposite to the metal layer, of the insulating layer, the heating element dissipates heat through the heat dissipation substrate, and the metal layer is configured to be mounted at any position of the PCB.

2. The electronic device of claim 1, wherein the modular structure further comprises:

And the heat conduction bonding layer is arranged on one side of the insulating layer, which is opposite to the metal layer, and the heating element is arranged on the heat dissipation substrate through the heat conduction bonding layer.

3. The electronic device of claim 1, wherein the thickness of the housing is 0.6mm to 1.2mm; and/or the shell is made of hot galvanizing fingerprint resistant plates.

4. The electronic device of claim 1, wherein the metal layer is provided with a mounting portion for soldering the modular structure to any location of the PCB board.

5. The electronic device of claim 1, wherein the number of modular structures is one, one of the modular structures being perpendicular to the PCB board; or alternatively

The number of the modularized structures is at least two, and at least two modularized structures are perpendicular to the PCB and are arranged at intervals.

6. The electronic device of claim 1, wherein the housing is further provided with an air inlet and an air outlet in communication with the receiving cavity, the electronic device further comprising a heat dissipating fan for directing an air flow from the air inlet into the receiving cavity and out of the air outlet, an air duct for circulating the air flow being formed between the inner wall of the housing and the modular structure.

7. The electronic device according to any one of claim 1 to 6, wherein,

The heat dissipation substrate further comprises a circuit layer, the metal layer, the insulating layer and the circuit layer are sequentially stacked, and the heating element is electrically connected with the circuit layer; and/or the number of the groups of groups,

The heating element is provided with pins extending to the PCB, and the heating element is electrically connected with the PCB through the pins.

8. The electronic device according to any one of claim 1 to 6, wherein,

The electronic device is a rectifier; and/or the number of the groups of groups,

The heating element is a MOS tube; and/or the number of the groups of groups,

The metal layer is an aluminum plate or a copper plate; and/or the number of the groups of groups,

The insulating layer is one of epoxy glass cloth, epoxy resin, polyolefin resin and polyimide resin glass cloth.

9. A modular structure of an electronic device, comprising:

The heating element is used for being electrically connected with the PCB;

The radiating substrate comprises a metal layer and an insulating layer which are arranged in a laminated mode, the heating element is arranged on the radiating substrate and is located on one side, opposite to the metal layer, of the insulating layer, the heating element radiates heat through the radiating substrate, and the metal layer is configured to be capable of being arranged at any position of the PCB.

10. A communication power supply comprising an electronic device as claimed in any one of claims 1-8.