CN219390225U - Power module assembly, radio frequency generating device, radio frequency thawing device and refrigerator - Google Patents

Abstract

The application discloses power module subassembly, radio frequency generating device, radio frequency thawing apparatus and refrigerator solves the lower technical problem of power module radiating efficiency among the prior art. The power module assembly comprises a mounting shell, a mounting cavity and a power module, wherein the mounting cavity is formed in the power module assembly; the installation surface of the installation shell is provided with an opening, and a heat conducting sheet for sealing the opening is arranged on the installation surface of the installation shell and is in heat conducting connection with the power module. The utility model provides a power module subassembly through set up the conducting strip on the installation face of installation shell, when the installation shell is installed on carrying power module subassembly's equipment, the installation face of installation shell contacts with this equipment, because the conducting strip is connected with power module heat conduction, the conducting strip can be with the heat of power module production export to utilize this equipment to dispel the heat indirectly to power module, effectively improved power module's radiating effect.

Description

Power module assembly, radio frequency generating device, radio frequency thawing device and refrigerator

Technical Field

The application belongs to the technical field of power, and particularly relates to a power module assembly, a radio frequency generating device, a radio frequency thawing device and a refrigerator.

Background

The refrigerator is a common refrigeration device, and a power module is arranged in the refrigerator and is used for connecting with the mains supply and regulating the voltage of the mains supply to the voltage required by the electrical equipment in the refrigerator. The power module can produce heat during operation, in the correlation technique, often adopts to set up the thermovent on the power shell and dispel the heat, and radiating efficiency is lower, and the heat that power module produced can not influence power module's performance when discharging, damages power module even.

Disclosure of Invention

For solving the lower technical problem of present power module radiating efficiency, this application provides a power module subassembly, dispels the heat to power module through setting up the conducting strip that contacts with the refrigerator main part, improves radiating efficiency.

The application adopts a technical scheme that: there is provided a power module assembly comprising:

the installation shell is provided with an installation cavity;

the power supply module is arranged in the mounting cavity;

the installation shell is provided with an opening on the installation surface, and is provided with a heat conducting sheet for sealing the opening, and the heat conducting sheet is in heat conducting connection with the power module.

The utility model provides a power module subassembly through set up the conducting strip on the installation face of installation shell, when the installation shell is installed on carrying power module subassembly's equipment, the installation face of installation shell contacts with this equipment, because the conducting strip is connected with power module heat conduction, the conducting strip can be with the heat of power module production export to utilize this equipment to dispel the heat indirectly to power module, effectively improved power module's radiating effect.

In some embodiments, the mounting shell comprises a bottom plate and a top cover covered on the bottom plate, and the bottom plate and the top cover enclose the mounting cavity; the power module is connected to the bottom plate; the bottom plate is provided with the heat dissipation opening or is made of metal materials to form the heat conducting fin.

In certain embodiments, the thermally conductive sheet is a metal sheet or a thermally conductive pad.

In some embodiments, a heat-conducting adhesive is provided between a portion of the mounting case opposite to the location of the power module and/or the refrigerator main body.

In some embodiments, the power module includes a power housing and a power strip disposed in the power housing, the power housing being coupled to the mounting housing.

In some embodiments, the power supply housing is filled with a heat-conducting insulating glue, the heat-conducting insulating glue is in contact with both the power supply board and the power supply housing, and the heat-conducting insulating glue wraps components on the power supply board.

In some embodiments, the power module is provided with a through hole for heat dissipation and glue filling.

The application adopts a technical scheme that: there is provided a radio frequency generating device comprising:

The power module assembly described above;

the power amplification module is arranged in the mounting cavity, is powered by the power supply module and is used for generating radio frequency signals after power amplification.

In some embodiments, a partition board is arranged in the installation shell, the installation cavity is divided into a power amplification cavity and a power supply cavity by the partition board, the power amplification module is arranged in the power amplification cavity, and the power supply module is arranged in the power supply cavity.

The other technical scheme adopted by the application is as follows: there is provided a radio frequency thawing apparatus comprising: the radio frequency thawing assembly and the radio frequency generating device are arranged on the same side of the radio frequency thawing assembly; the radio frequency thawing assembly comprises:

a shielding cylinder provided with an opening end with an opening;

the shielding door is arranged at the opening end of the shielding cylinder body and is used for closing the opening;

the tuning plate is arranged in the shielding cylinder body and is electrically connected with the power amplification plate of the radio frequency generating device;

and the polar plate is arranged in the shielding cylinder body, is electrically connected with the tuning plate and is used for transmitting radio frequency signals.

The application adopts the following technical scheme: provided is a refrigerator including:

a refrigerator main body;

the radio frequency generating device is arranged inside or outside the refrigerator main body; in the radio frequency thawing device, the radio frequency thawing assembly is arranged in the refrigerator main body.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are needed in the description of the embodiments will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present application, and other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

Fig. 1 shows a schematic structural view of a power module assembly in a partially cut-away state of a top cover in an embodiment of the present application.

Fig. 2 shows an exploded view of the power module assembly of fig. 1 after installation on a device.

Fig. 3 shows a schematic diagram of the structure of a power module in the power module assembly of fig. 1.

Fig. 4 shows a schematic structural diagram of a power module of the power module assembly in another embodiment of the present application.

Fig. 5 shows a schematic structural view of the rf generator in the partially cut-away state of the top cover in the embodiment of the present application.

Fig. 6 shows a schematic structural view of the radio frequency generating device of fig. 5 after the top cover is removed.

Fig. 7 is a diagram showing an installation structure of a radio frequency generating device on a refrigerator in an embodiment of the present application.

Fig. 8 shows a schematic structural diagram of a power amplifier module of a radio frequency generating device in an embodiment of the present application.

Fig. 9 shows an exploded view of the power amplifier module of fig. 8.

Fig. 10 illustrates a functional block diagram of a radio frequency thawing device in an embodiment of the present application.

Fig. 11 shows a functional block diagram of a radio frequency thawing device in accordance with another embodiment of the present application.

Fig. 12 shows a functional block diagram of a radio frequency thawing device in accordance with a further embodiment of the present application.

Fig. 13 is a schematic view showing a structure of a refrigerator according to an embodiment of the present application.

Fig. 14 shows a partial enlarged view at a of fig. 13.

Fig. 15 is a view showing an assembled structure of a shield cylinder and a shield door in the refrigerator of fig. 13.

Fig. 16 is a block diagram showing a structure of a refrigerator in another embodiment of the present application.

Reference numerals illustrate:

100-refrigerator; 10-a radio frequency generating device; 10 b-a power module assembly; 20-a refrigerator main body, 21-a mounting cavity, 22-a refrigerating assembly and 23-a U shell; 30-radio frequency thawing components, 31-shielding barrels, 31 a-opening ends, 31 c-air inlets of the shielding barrels, 31 d-air outlets of the shielding barrels, 31 e-tuning cavities, 31 f-thawing cavities and 32-shielding doors; 40-wind flow accelerator; 50-master control box.

11-mounting shell, 11 a-mounting cavity, 11 b-power amplification cavity, 11 c-power cavity, 11 d-heat dissipation hole, 11 e-heat dissipation hole, 11 m-strong current threading hole and 11 n-weak current threading hole; 111-a bottom plate; 112-top cap, 1121-side wall; 113-a separator, 119-a thermally conductive sheet;

12-power amplifier module, 121-power amplifier board, 121 a-first surface, 121 b-second surface, 121 c-first end, 121 d-second end, 1211-component of power amplifier module; 122-heat sink, 122 a-air flow channel, 122 b-relief blind hole, 1221-sheet metal, 1221 a-mounting plane, 1222-fin, 1223-lug; 123-blowing components, 1231-blowing devices, 1231 a-blowing ports, 1232-air channels, 1233-air outlets, 1234-first openings, 1235-second openings; 124-a power amplifier shielding cover; 127-fastener. 13-power module, 131-power panel, 1311-components of power module, 132-power shell, 132 a-through hole, 133-heat conduction insulating glue in power module. 18-fixing piece.

Detailed Description

The following description of the embodiments of the present application will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are only some, but not all, of the embodiments of the present application. All other embodiments, which can be made by one of ordinary skill in the art without undue burden from the present disclosure, are within the scope of the present disclosure.

Furthermore, the present application may repeat reference numerals and/or letters in the various examples, which are for the purpose of brevity and clarity, and which do not in themselves indicate the relationship between the various embodiments and/or arrangements discussed. In addition, the present application provides examples of various specific processes and materials, but one of ordinary skill in the art may recognize the application of other processes and/or the use of other materials.

In the related art, in the radio frequency generating component of the refrigerator, the power module can generate heat during working, when the heat dissipation problem is solved, the heat dissipation port is often adopted for heat dissipation, or different heat dissipation components are adopted for heat dissipation, for example, the power amplifier module in the radio frequency generating component is often subjected to heat dissipation through the heat dissipation components, and the power module generally only dissipates heat along the tape, so that the temperature of the power module of the installation shell is higher, and the heat dissipation efficiency is lower. The embodiment of the application provides a power module assembly, which can solve the technical problem that the heat dissipation efficiency of the current power module is lower to a certain extent.

The present application is described below with reference to specific embodiments in conjunction with the accompanying drawings:

example 1:

the embodiment of the application provides a power module assembly, which is arranged on electric equipment, such as a radio frequency heating device, a refrigerator and the like. Taking the power module assembly as an example, the power module assembly is installed in a refrigerator with a radio frequency thawing function, and the power module assembly can be a main power supply of the refrigerator or a power supply of some electric equipment, for example, a refrigerator with a radio frequency thawing function, then the power module assembly can be a power module assembly for supplying power to the power amplifier module, and the specific function of the power module assembly is not limited in the application.

Fig. 1 and 2 are an overall block diagram and an exploded view of a power module assembly 10 b. The power module assembly 10b includes a mounting case 11 and a power module 13 provided in the mounting case 11, the mounting case 11 being provided with a mounting cavity 11a, the power module 13 being provided in the mounting cavity 11 a. An opening is formed in the mounting surface of the mounting shell 11, a heat conducting sheet 119 for sealing the opening is arranged, and the heat conducting sheet 119 is in heat conducting connection with the power module 13. The mounting surface is a surface of the mounting case 11 that contacts the device on which the power module assembly 10b is mounted, for example, the mounting case 11 is a box body of a cube, one of the surfaces of the box body of the cube is used for connection with the device on which the power module assembly 10b is disposed, and when the power module assembly 10b is mounted, the power module assembly 10b is normally brought into contact with the device, and the surface is the mounting surface of the mounting case 11.

According to the power module assembly 10b, the heat conducting fin 119 is arranged on the installation surface of the installation shell 11, when the installation shell 11 is installed on equipment for bearing the power module assembly 10b, the installation surface of the installation shell 11 is in contact with the equipment, and the heat conducting fin 119 can conduct out the heat generated by the power module 13 due to the heat conducting connection between the heat conducting fin 119 and the power module 13, so that the equipment is utilized to indirectly dissipate the heat of the power module 13, and the heat dissipation effect of the power module 13 is effectively improved.

As an embodiment, referring to fig. 2, specifically, a heat dissipation port 11e is formed in a position corresponding to the power module 13 on the mounting shell 11, the heat dissipation port 11e is disposed through and is communicated with the inside of the mounting cavity 11a, a metal sheet or a heat conduction pad is disposed in the heat dissipation port 11e as the heat conduction sheet 119, the heat conduction sheet 119 may be made of other materials, for example, a heat conduction silica gel sheet, a graphite sheet, etc., and the heat conduction sheet 119 may be made of an aluminum sheet, a copper sheet, a steel sheet, etc. The heat conducting fin 119 and the installation shell 11 fixed connection, the power module 13 install on the installation shell 11 with the position that the heat conducting fin 119 corresponds and with the heat conducting fin 119 contact, power module 13 can with the heat conducting fin 119 complete contact also can with the heat conducting fin 119 partial contact, perhaps carry out the heat conduction through other heat conduction parts, through the good heat conductivility of heat conducting fin 119, the heat transfer to the casing of equipment of power module 13, thereby realize the heat dissipation to power module 13, through the heat conduction mode of heat conducting fin 119 direct contact, direct with the heat leading-out when producing the heat, the radiating effect to power module 13 has effectively been improved.

In some embodiments, the shape and area of the heat dissipation opening 11e are adapted to the corresponding power module 13, and the projection of the power module 13 on the mounting shell 11 coincides with the heat conducting fin 119, so that the power module 13 is in full contact with the heat conducting fin 119, heat at each position of the power module 13 is transferred to the mounting shell 11, the whole mounting shell 11 is not required to be set to be metal, and manufacturing cost is saved. Since the heat radiation port 11e for mounting the heat conductive sheet 119 is provided on the mounting case 11, the material of the mounting case 11 in this embodiment is not limited, and plastic may be used for the mounting case 11 in view of weight reduction and cost.

In some embodiments, the mounting shell 11 is a closed shell, and the portion of the mounting surface of the mounting shell 11 is made of metal, and when the mounting shell 11 includes the bottom plate 111 and the top cover 112, the bottom plate 111 provides the mounting surface of the mounting shell 11; when the mounting case 11 includes a bottom cover and a closing plate, the bottom surface of the bottom cover serves as a mounting surface of the mounting case 11. That is, the heat conductive sheet 119 constitutes the mounting surface of the mounting case 11. The power module 13 is mounted on a metal portion, and heat is transferred to the metal portion of the mounting case 11 when the power module 13 is operated. Meanwhile, since the metal part of the installation shell 11 is located on the installation surface of the installation shell 11, when the installation shell 11 is installed on a metal part of an apparatus, the metal part of the installation shell 11 contacts with the metal part of the refrigerator main body, and can be installed on the metal inner shell or the metal outer shell of the refrigerator main body. Through the heat conduction mode of metal material direct contact, directly lead out the heat when producing the heat, effectively improved the radiating effect to power module 13.

In some embodiments, the mounting case 11 includes a top cover 112 and a bottom plate 111, the bottom plate 111 is used for being mounted on a metal component of the device, the power module 13 is mounted on the bottom plate 111, the top cover 112 is covered on the bottom plate 111 to form a mounting cavity 11a for accommodating the power module 13, wherein a part of the metal material is located on the bottom plate 111, i.e. the whole bottom plate 111 is set to be metal material, or a position on the bottom plate 111 corresponding to the power module 13 is set to be metal material, so as to achieve a heat conducting effect.

In some embodiments, referring to fig. 1, the bottom plate 111 may be integrally made of metal, and the entire bottom surface of the power module 13 is in contact with the bottom plate 111, so as to improve the heat conduction effect between the power module 13 and the installation shell 11, and the bottom plate 111 is in contact with a metal component of the device, thereby effectively improving the heat conduction effect between the installation shell 11 and the device. In order to further improve the heat dissipation effect of the power module 13.

In some embodiments, a heat-conducting adhesive may be disposed between a portion of the mounting case opposite to the power module 13 and the power module 13, and/or a heat-conducting adhesive may be disposed between a portion of the mounting case opposite to the power module 13 and the refrigerator main body, the power module 13 is tightly adhered to the mounting case 11 through the heat-conducting adhesive, and the mounting case 11 is tightly adhered to the refrigerator main body through the heat-conducting adhesive, so that a gap between the power module 13 and the mounting case 11 and a gap between the mounting case 11 and the refrigerator main body are filled, a contact area is increased, and a heat-conducting effect is further improved.

In some embodiments, referring to fig. 3, the power module 13 includes a power supply housing 132 and a power supply board 131 disposed in the power supply housing 132, the power supply housing 132 protecting the power supply board 131. In some embodiments, the power supply housing 132 is provided with a plurality of through holes 132a for heat dissipation of the power panel 131. Considering that there is a gap between the power supply housing 132 and the power supply board 131, the power supply board 131 and the power supply housing 132 conduct heat only through air, so that the heat dissipation effect is poor, and the service life of the power supply board 131 may be affected, in other embodiments, referring to fig. 4, the power supply housing 132 is filled with a heat-conducting insulating glue 133, the heat-conducting insulating glue 133 is in contact with both the power supply board 131 and the power supply housing 132, and the heat-conducting insulating glue 133 is wrapped around a component 1311 on the power supply board 131.

Specifically, the heat-conducting insulating glue 133 is arranged in the power module 13, the heat-conducting insulating glue 133 is arranged between the power panel 131 and the power shell 132 of the power module 13, on one hand, water, insects and the like outside the power module 13 can be prevented from entering the power module 13 to erode the components 1311 on the power panel 131, so that the waterproof and insect-preventing effects are achieved, and on the other hand, heat generated by the components 1311 on the power panel 131 can be conducted to the power shell 132 through the heat-conducting insulating glue 133, so that the heat dissipation effect of the power module 13 is improved. In addition, the heat conductive insulating paste 133 wraps the component 1311 on the power board 131, and heat dissipation uniformity of the component 1311 can be improved. Thereby improving the reliability and safety of the power module 13 as a whole.

In some embodiments, in order to ensure the bonding degree of the heat-conducting insulating glue 133 with the power panel 131 and the power supply housing 132, poor contact is avoided, and the heat dissipation effect is affected, so that the glue filling mode is adopted, the through hole 132a arranged on the power supply module 13 can be used as a glue filling hole, glue filling is performed through the through hole 132a on the power supply module 13, the bonding degree of the heat-conducting insulating glue 133 with the power panel 131 and the power supply housing 132 is improved, and the heat dissipation effect of the power supply module 13 is ensured to a certain extent.

Example 2:

based on the same inventive concept, the embodiment of the present application provides a radio frequency generating device 10, including the power module assembly of the embodiment 1 and the power amplifier module 12 for generating the radio frequency signal after power amplification, where the power amplifier module 12 includes a power amplifier board, and the power amplifier board is electrically connected with a power panel of the power module 13. The power amplification board 121 generally includes a signal source and a power amplification circuit, which are electrically connected, where the signal source is used to generate an initial signal with a set frequency (e.g. 40.68 MHz), and the power amplification circuit is used to power amplify the initial signal, enhance the power of the initial signal, and output a radio frequency signal after power amplification. The power module 13 is internally provided with an ac/dc conversion circuit and a voltage regulating circuit, and is used for performing ac/dc conversion and voltage regulation, and supplying low-voltage dc power to the power amplifier module 12.

Referring to fig. 10, 11 and 12, when the radio frequency generating device 10 works, the radio frequency generating device is controlled by a control system (for example, an MCU controller) on a control board, the control board is electrically connected with a power module 13 and a power amplifier module 12, the control board is electrically connected with an external input device (a display screen, an operation panel, a keyboard, etc.), and receives an operation instruction sent by a user to control circuits in the power module 13 and the power amplifier module 12 to work. When the output power of the power amplifier module 12 needs to be regulated, the control board calculates a voltage regulation control instruction based on an internal algorithm and sends the voltage regulation control instruction to the power module 13, and the power module 13 regulates the voltage to change the output voltage of the power module 13. For the power amplification board 121 provided with the detection circuit, the control board is electrically connected with the detection circuit, the detection circuit detects the output power of the power amplification module 12 and feeds back to the control module, and the control module performs relevant control on the signal source, the power amplification circuit and the power supply module 13 through an internal algorithm.

In some embodiments, the functions of the control board are integrated on the device on which the rf generator 10 is mounted, such as a refrigerator in which the rf generator 10 is configured, and the functions of the control board may be integrated on a main control board of the refrigerator. In some embodiments, the control board is a circuit board which is separately arranged, the control board exists independently of the power module 13 and the power amplifier module 12 to form a control module, under the arrangement scheme, the installation positions of the power amplifier module 12, the power module 13 and the control module can be set according to actual needs, the power amplifier module 12 is arranged in the installation cavity 11a of the installation shell 11 and is fixedly connected with the installation shell 11, and the power module 13 and the control module can be selectively arranged in the installation shell 11 or on the equipment main body of the equipment carried by the radio frequency generating device 10. Taking a refrigerator with a radio frequency thawing device as an example, a radio frequency generating device 10 is arranged in the radio frequency thawing device, a mounting shell 11 with a built-in power amplifier module 12 can be selectively arranged inside or outside a refrigerator main body of the refrigerator, a power module 13 can be selectively arranged in the mounting shell 11, or positioned outside the mounting shell 11 and inside the refrigerator main body, and a control module can be selectively arranged in the mounting shell 11, or positioned outside the mounting shell 11 and inside the refrigerator main body.

In other embodiments, the control board and the power amplifier board 121 may be integrated on the same circuit board, as shown in fig. 12. In this embodiment, since the power amplifier module 12 generates a high-frequency signal, it is easy to interfere with the control system drawn on the same electronic control board, and thus, it is necessary to perform internal structural shielding according to the actual layout, that is, the shielding case only covers the relevant components 1211 of the power amplifier board 121 to perform electromagnetic shielding, and the structural design and installation of the shielding case are relatively complex and have high cost. Meanwhile, since the power amplifier board 121 needs to be designed by using a multi-layer board, and a PCB high-frequency board with higher cost must be adopted, and the material of the control board for the board is generally unlimited, integrating the control board and the power amplifier board 121 on the same circuit board can result in that the whole board needs to use the PCB high-frequency board, so that the overall cost of the radio frequency generating device 10 is increased. In addition, the heat source of the whole radio frequency generating device 10 is mainly in the power amplifier module 12, the control board and the power amplifier board 121 are drawn on the same circuit board, and the heat generated by the power amplifier board 121 causes the control system to be heated, so that the reliability of the whole radio frequency generating device 10 is affected.

In other embodiments, the control board is integrated with the power module 13 on the same circuit board, as shown in FIG. 11. In this embodiment, since the control board is integrated with the power module 13 and the same circuit board, the power amplifier board 121 and the control board are all independently arranged, and only the power amplifier board 121 adopts a PCB high-frequency board, the consumption of the PCB high-frequency board is minimum, and the independent control module only needs to adopt a common low-cost material, so that the cost is reduced. Meanwhile, the power amplification plate 121, the control plate and the power module 13 are all independently arranged, the power amplification module 12 does not need to carry out special shielding design on the shielding cover according to the internal layout of the circuit board, only a simple outer cover shielding power amplification plate 121 is needed to be designed, and the design complexity and cost are reduced. Meanwhile, as the power amplification plate 121, the control plate and the power module 13 are arranged independently, heat insulation is carried out through air in installation, heat radiation of the power amplification module 12 to the control module is greatly reduced, and reliability of the whole radio frequency generating device 10 is improved.

Referring to fig. 6, in some embodiments, a power module 13 and a power amplifier module 12 are disposed in the installation cavity 11a of the radio frequency generating device 10, and the control module is external, or the control board is integrated with the power board 131 or the power amplifier board 121. The inner cavity of the installation shell 11 is divided into a power amplification cavity 11b and a power supply cavity 11c through a partition plate 113, the power supply module 13 and the power amplification module 12 are separately placed, the power amplification module 12 is arranged in the power amplification cavity 11b, and the power supply module 13 is arranged in the power supply cavity 11 c. Through setting up baffle 113 and making the inner chamber of installation shell 11 separate into two relatively independent spaces, power amplifier chamber 11b and power supply chamber 11c set up separately, the air can not flow each other between power amplifier chamber 11b and power supply chamber 11c by baffle 113's blocking, can reduce the mutual interference of heat between power amplifier module 12 and power module 13. Since air is blocked by the partition plate 113 not to flow between the power amplifier chamber 11b and the power supply chamber 11c, the power supply module 13 cannot forcibly dissipate heat by means of the blowing assembly 123 of the power amplifier module 12, but since the mounting case 11 is provided with the heat conductive sheet 119, the heat conductive sheet 119 can dissipate heat through the equipment mounted by the radio frequency generating device 10 and dissipate heat to the power supply module 13, thereby ensuring the heat dissipation effect of the power supply module 13.

Referring to fig. 8 and 9, the power amplifier module 12 includes a power amplifier board 121, a heat dissipation member 122 and a blower assembly 123, wherein the power amplifier board 121 is used for generating a radio frequency signal after power amplification, the heat dissipation member 122 is disposed on the power amplifier board 121, and the heat dissipation member 122 is selectively connected and fixed with the power amplifier board 121 or only contacts with the power amplifier board 121. The heat sink 122 is provided with an air flow passage 122a, and heat of the heat sink 122 can be taken away when wind flows through the air flow passage 122 a. The air blowing assembly 123 is configured to blow air into the air flow channel 122a to dissipate heat of the power amplification board 121, and the air blowing assembly 123 includes an air blowing device 1231 and an air duct 1232, wherein the air blowing device 1231 is configured to generate air flow, and the air duct 1232 is configured to communicate the air blowing device 1231 with the heat dissipation component 122. Specifically, the air duct 1232 has a first opening 1234 and a second opening 1235 that are disposed opposite to each other, the first opening 1234 is communicated with the air blowing opening 1231a of the air blowing device 1231, the second opening 1235 is communicated with the air flow channel 122a of the heat dissipation member 122, and the air flow generated by the air blowing device 1231 enters the air flow channel 122a through the air duct 1232, so that the heat dissipation member 122 is dissipated by forced convection.

When in use, the heat dissipation element 122 is in contact with the power amplification plate 121, and the heat of the power amplification plate 121 is conducted to the heat dissipation element 122. The wind flow generated by the blowing device 1231 enters the airflow channel 122a through the air duct 1232, forced convection dissipates heat of the heat dissipation part 122, and the heat dissipation part 122 further dissipates heat of the power amplification plate 121, so that the temperature of the power amplification plate 121 is effectively reduced, and the safety and reliability of products are improved. Due to the arrangement of the air duct 1232 and the heat dissipation member 122 having the air flow channel 122a, the air flow generated by the air blowing device 1231 can all enter the air flow channel 122a, the air volume utilization rate is high, and the heat dissipation requirement of the power amplification plate 121 can be met with smaller power and flow.

Referring to fig. 9, in the power amplifier module 12 provided in the present application, the size of the second opening 1235 of the air duct 1232 in the width direction of the power amplifier board 121 is greater than the size of the first opening 1234 in the width direction of the power amplifier board 121. That is, the air duct 1232 adopts a flaring design, and along the flow direction of the wind flow, the size of the inner cavity of the air duct 1232 in the width direction of the power amplification plate 121 tends to increase, and specifically, linear increase, nonlinear increase or gradient increase can be adopted. To reduce wind resistance, in some embodiments, the projection of the air duct 1232 on the plane parallel to the power amplification plate 121 is trapezoidal, and the shapes of the first opening 1234 and the second opening 1235 are respectively adapted to the shape of the air blowing opening 1231a of the air blowing device 1231 and the inlet shape of the air flow channel 122a of the heat dissipation member 122.

Because the second opening 1235 of the air duct 1232 is larger than the first opening 1234 in the width direction of the power amplification plate 121, the air flow is increased in the width direction of the power amplification plate 121 in the process of flowing from the first opening 1234 to the second opening 1235 of the air duct 1232, and the air flow can be matched with a heat dissipation device, so that the air flow is blown across the whole width of the power amplification plate 121, and the heat dissipation efficiency is further improved. In addition, the air duct 1232 can also realize the adaptation of the shapes of the air blowing device 1231 and the opening 11g of the heat dissipation member 122, so that the requirement on the shape selection of the air blowing device 1231 is reduced. The blowing device 1231 may employ a fan, or the like capable of generating a wind flow, which is not limited in this application. In some embodiments, to further meet the miniaturization requirements of the device, the blower 1231 employs an axial flow fan.

The heat dissipation member 122 and the power amplification plate 121 conduct heat, and the heat dissipation member 122 is required to have good thermal conductivity, and metal and ceramic thermal conductivity, and the material and shape of the heat dissipation member 122 are not limited in this application. In some embodiments, the heat dissipation element 122 is made of metal, and may be aluminum, iron, or other metals or alloys thereof, and aluminum is preferred in view of light weight.

In order to satisfy the installation and heat dissipation of the power amplifier board 121, referring to fig. 9, the heat dissipation member 122 includes a metal plate 1221 and a plurality of heat dissipation fins 1222, the heat dissipation fins 1222 are distributed on one surface of the metal plate 1221, and the heat dissipation fins 1222 are spaced apart so that gaps between the heat dissipation fins 1222 form the air flow channel 122a, and the specific number and spacing of the heat dissipation fins 1222 are determined according to the heat dissipation requirement of the power amplifier board 121, which is not limited in this application. In certain embodiments, the metal plate 1221 is integrally formed with the heat dissipating fins 1222. The metal plate 1221 has a large mounting surface 1221a, the power amplification plate 121 is mounted on the mounting surface 1221a of the metal plate 1221 by the fastener 127, and the power amplification plate 121 is at least partially in contact with the metal plate 1221.

Because the metal is conductive, in order to ensure that the power amplification board 121 and the metal board 1221 are fully contacted as much as possible, referring to fig. 9, in some embodiments, a plurality of avoidance blind holes 122b are provided on the installation plane 1221a of the metal board 1221, the number and positions of the avoidance blind holes 122b completely correspond to the number and distribution of conductors (pins, soldering tin parts, wires, etc. of the components 1211) of the power amplification board 121, the size of the avoidance blind holes 122b is larger than that of the corresponding conductors on the power amplification board 121, so that the conductors extend into the avoidance blind holes 122b and are not contacted with the metal board 1221, thereby ensuring that the power amplification board 121 and the metal board 1221 are tightly attached, the contact area is larger, heat dissipation is facilitated, and the overall structure of the power amplification board 121 is more stable. The avoidance blind hole 122b is designed as a blind hole, so that the problem of leakage caused by contact between the conductor and water due to the design as the through hole 132a can be avoided.

The structural strength of the heat sink 122 is higher than that of the power amplification board 121, and thus the heat sink 122 simultaneously serves as a mounting base of the power amplification board 121. In some embodiments, at least two lugs 1223 are disposed on the metal plate 1221, where the lugs 1223 may be disposed on a bottom surface or a side surface of the metal plate 1221 according to actual needs, and fixing holes for installing the fasteners 127 are disposed in the lugs 1223, and the fixing holes may be light holes or threaded holes, and the fasteners 127 may be in a screw, rivet, pin shaft or other structure.

The power amplification board 121 is a circuit board structure, referring to fig. 9, and has a first surface 121a and a second surface 121b disposed opposite to each other, hereinafter also referred to as a first surface 121a of the power amplification board 121 is a front surface, and a second surface 121b of the power amplification board 121 is a back surface. The power amplification board 121 generally includes a signal source and a power amplification circuit, which are electrically connected, where the signal source is used to generate an initial signal with a set frequency (e.g. 40.68 MHz), and the power amplification circuit is used to power amplify the initial signal, enhance the power of the initial signal, and output a radio frequency signal after power amplification. The power amplifying circuit can adopt primary amplification, secondary amplification, tertiary amplification or even more according to actual needs, and specific amplification stages and circuit structures of the amplifying circuits at all stages can refer to related publications in the prior art, so that the power amplifying circuit is not limited. The signal source and the power amplifying circuit may be both disposed on the same surface of the power amplifying board 121, or may be disposed on the first surface 121a and the second surface 121b, which is not limited in the specific arrangement manner. In some embodiments, the components 1211 (chips, inductors, capacitors, resistors, etc.) on the power amplification board 121 are located on the first surface 121a, that is, each component 1211 of the signal source and the power amplification circuit is mounted on the front surface of the power amplification board 121, the back surface of the power amplification board 121 is mainly a soldering leg, a soldering wire, etc. of a pin, and the second surface 121b of the power amplification board 121 contacts the heat dissipation element 122 for heat transfer.

In some embodiments, the power amplifying circuit adopts a second-stage amplifying circuit, which comprises a first-stage driver and a second-stage power amplifying circuit, the signal source, the first-stage driver and the second-stage power amplifying circuit are electrically connected in sequence, the first-stage driver and the second-stage power amplifying circuit amplify the initial signal sent by the signal source step by step, and the second-stage power amplifying circuit outputs the amplified signal. The specific circuit structures of the primary driver and the secondary power amplifying circuit can refer to related publications in the prior art, and the application is not limited.

In some embodiments, the power amplification board 121 is further provided with a detection circuit, and the detection circuit, the signal source and the power amplification circuit are disposed on the same circuit board. In other embodiments, the detection circuit and the signal source and the power amplification circuit may be provided on different circuit boards. The detection circuit is used for detecting the output power of the radio frequency signal after power amplification and feeding back the output power to the control board. If the load connected to the power amplification board 121 is provided with a tuning board, the detection circuit is further used for detecting the reflected power reflected by the tuning module and feeding back to the control board.

In some embodiments, the mounting portion of the power amplification board 121 is further provided with other circuit boards, such as a power board 131 for supplying power to the power amplification board 121, a control board for controlling the power amplification board 121 to work, and so on, in order to avoid electromagnetic interference between the circuit boards, referring to fig. 8 and 9, the power amplification module 12 is further provided with a power amplification shielding cover 124, where the power amplification shielding cover 124 is made of a metal material, and covers the first surface 121a of the power amplification board 121 to electromagnetically shield the components 1211 on the power amplification board 121. In some embodiments, the power amplifier shielding cover 124 is only covered on the power amplifier board 121, and specifically, the power amplifier shielding cover 124 and the power amplifier board 121 are both installed on the heat dissipation element 122 through fastener 127. In other embodiments, the power amplifier shielding cover 124 may be further configured to cover the power amplifier board 121 and the heat dissipation member 122, or cover the power amplifier board 121, the heat dissipation member 122, the blower 1231, and the air duct 1232, which is not limited in this application.

Example 3:

based on the same inventive concept, referring to fig. 13, 14 and 15, an embodiment of the present application provides a radio frequency thawing device, which includes a radio frequency thawing assembly 30 and the radio frequency generating device 10 of the foregoing embodiment 2, wherein a tuning plate and a polar plate are disposed in the radio frequency thawing assembly 30, the tuning plate is electrically connected with a tuning inductor, and the tuning inductor is selectively disposed on the tuning plate or is independent from the tuning plate. The tuning plate is electrically connected with the power amplification plate 121 of the radio frequency generating device 10, the tuning module is used for balancing the impedance of the load end so as to realize impedance matching, and the polar plate is electrically connected with the tuning plate and is used for transmitting radio frequency signals with set frequencies. The signal output by the power amplification module 12 is a radio frequency signal corresponding to the standard load after power amplification, and the tuning module is used for adjusting the impedance of the load end. The different unfreezed substances have different impedances, the impedance of the drawer is not the standard load impedance, the load impedance changes in the unfreezing process, the impedance matching is realized through the tuning module, the impedance matching is equivalent to the standard load, the control module controls the tuning module to perform the impedance matching, the tuning module outputs a signal to the polar plate, and the polar plate sends out a radio frequency signal, so that the food material unfreezing purpose is realized.

Referring to fig. 15, the rf thawing assembly 30 further includes a shield cylinder 31 having an open end 31a with an opening, and a shield door 32 provided at the open end 31a of the shield cylinder 31 for closing the opening to form a closed shield cavity with the shield cylinder 31. The tuning plate and the polar plate are arranged in the shielding cylinder 31, the shielding cylinder 31 can provide a mounting foundation for the tuning plate and the polar plate, the purpose of protecting the tuning plate and the polar plate can be achieved, radio frequency signals emitted by the polar plate can be shielded, and radio frequency signal leakage is avoided.

Referring to fig. 13 and 14, in some embodiments, a tuning cavity 31e and a thawing cavity 31f are provided in the shielding cylinder 31, the tuning plate and the polar plate are both provided in the tuning cavity 31e, the thawing cavity 31f is used for containing food to be thawed, and the polar plate radiates radio frequency energy into the thawing cavity 31f, thereby thawing the food in the thawing cavity 31 f. The tuning plate and the polar plate are placed separately from the food materials, so that the pollution to the food materials is avoided, and the contact of melted water after thawing of the food materials with the tuning plate and the polar plate and the damage to components are avoided.

Referring to fig. 13 and 14, in some embodiments, the shielding cylinder 31 is further provided with an air inlet 31c and an air outlet 31d that are in communication with the tuning cavity 31e, where the air inlet 31c and the air outlet 31d may be disposed on the same side wall 1121 of the shielding cylinder 31, or may be disposed on different side walls 1121, which is not limited in this application.

Example 4:

based on the same inventive concept, referring to fig. 16, an embodiment of the present application provides a refrigerator 100 including a refrigerator main body 20 and a radio frequency thawing device. The radio frequency thawing device includes the power module assembly 10b of the above embodiment 1, where the power module assembly 10b is disposed outside or inside the refrigerator main body 20, for example, in the main control box 50 of the refrigerator main body 20, in the cabin of the refrigerator main body 20, the power module assembly 10b is used as the main power source of the refrigerator, and the specific structure of the power module assembly 10b is not described herein again with reference to embodiment 1.

Example 5:

based on the same inventive concept, the present embodiment provides a refrigerator 100 including a refrigerator main body 20 and the radio frequency thawing apparatus of embodiment 3 described above. The radio frequency generating device 10 of the radio frequency thawing device is disposed inside or outside the refrigerator main body 20, and the specific structure thereof is described in the above embodiment 2, and will not be repeated here. Referring to fig. 13, a radio frequency thawing assembly 30 of the radio frequency thawing device is disposed in the refrigerator main body 20, specifically, the refrigerator main body 20 is provided with an installation cavity 21, the radio frequency thawing assembly 30 is disposed in the installation cavity 21, and the specific structure of the radio frequency thawing device is described in reference to embodiment 3, which is not repeated herein. The installation cavity 21 is located in one of a freezing chamber, a refrigerating chamber, and a temperature changing chamber of the refrigerator 100, which is not limited in this application. A refrigerating assembly 22 for refrigerating is provided in the refrigerator main body 20 for supplying cold to at least one of the freezing chamber, the refrigerating chamber, and the temperature changing compartment.

In some embodiments, referring to fig. 13, the rf generating device 10 is disposed outside the refrigerator main body 20, and the rf generating device 10 may be located on the top, back or side of the refrigerator main body 20, which is not limited in this application. In some embodiments, the rf generating device 10 is located on the top surface of the refrigerator main body 20, the mounting case 11 of the rf generating device 10 is connected to the U-shaped case on the top of the refrigerator main body 20 through the fixing member 18, and when the mounting case 11 includes the bottom plate 111 and the top cover 112, both the electronic module and the top cover 112 are mounted on the bottom plate 111, and the bottom plate 111 is mounted on the top surface of the U-shaped case through the fixing member 18.

In some embodiments, referring to fig. 13 and 14, the shielding cylinder 31 of the rf thawing assembly 30 is further provided with an air inlet 31c and an air outlet 31d that are in communication with the tuning cavity 31e, and the air inlet 31c and the air outlet 31d may be disposed on the same side wall 1121 of the shielding cylinder 31 or may be disposed on different side walls 1121, which is not limited in this application. The side wall 1121 provided with the air inlet 31c and the air outlet 31d and the mounting cavity 21 have a gap a therebetween, so that the air circulation is formed between the air inlet 31c and the air outlet 31d and the gap a between the side wall 1121 provided with the air inlet 31c and the air outlet 31d and the mounting cavity 21, and the heat dissipation is performed on the tuning cavity 31 e. In some embodiments, the refrigerator 100 further includes a wind flow accelerator 40, and the wind flow accelerator 40 accelerates cool wind into the tuning cavity 31e through the gap a and the wind inlet 31c to accelerate air circulation, thereby improving heat dissipation efficiency.

In this application, unless expressly stated or limited otherwise, a first feature "above" or "below" a second feature may include both the first and second features being in direct contact, and may also include the first and second features not being in direct contact but being in contact with each other by way of additional features therebetween. Moreover, a first feature being "above," "over" and "on" a second feature includes the first feature being directly above and obliquely above the second feature, or simply indicating that the first feature is higher in level than the second feature. The first feature being "under", "below" and "beneath" the second feature includes the first feature being directly under and obliquely below the second feature, or simply means that the first feature is less level than the second feature.

In the description of the present application, it should be understood that the terms "center," "longitudinal," "transverse," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise" indicate or positional relationships are based on the positional relationships shown in the drawings, merely for convenience of description and to simplify the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and therefore should not be construed as limiting the present application.

It should be noted that all the directional indicators in the embodiments of the present application are only used to explain the relative positional relationship, movement conditions, etc. between the components in a specific posture, and if the specific posture is changed, the directional indicators are correspondingly changed.

In the present application, unless explicitly specified and limited otherwise, the terms "coupled," "secured," and the like are to be construed broadly, and for example, "secured" may be either permanently attached or removably attached, or integrally formed; can be mechanically or electrically connected; either directly or indirectly, through intermediaries, or both, may be in communication with each other or in interaction with each other, unless expressly defined otherwise. The specific meaning of the terms in this application will be understood by those of ordinary skill in the art as the case may be.

In addition, descriptions such as those related to "first," "second," and the like, are provided for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated in this application. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more features. In the description of the present application, the meaning of "a plurality" is two or more, unless explicitly defined otherwise.

In the description of the present specification, a description referring to terms "one embodiment," "some embodiments," "examples," "specific examples," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present application. In this specification, schematic representations of the above terms are not necessarily directed to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Further, one skilled in the art can engage and combine the different embodiments or examples described in this specification.

In addition, the technical solutions of the embodiments may be combined with each other, but it is necessary to base that the technical solutions can be realized by those skilled in the art, and when the technical solutions are contradictory or cannot be realized, the combination of the technical solutions should be regarded as not exist and not within the protection scope of the present application.

While embodiments of the present application have been shown and described, it will be understood by those of ordinary skill in the art that: many changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the application, the scope of which is defined by the claims and their equivalents.

Claims (15)

1. A power module assembly, comprising:

the installation shell is provided with an installation cavity;

the power supply module is arranged in the mounting cavity;

the installation shell is provided with an opening on the installation surface, and is provided with a heat conducting sheet for sealing the opening, and the heat conducting sheet is in heat conducting connection with the power module.

2. The power module assembly of claim 1, wherein: the opening is a heat dissipation opening penetrating through the mounting shell, and the heat conducting fin is positioned in the heat dissipation opening; alternatively, the heat conductive sheet constitutes a mounting surface of the mounting case.

3. The power module assembly of claim 2, wherein: the mounting shell comprises a bottom plate and a top cover covered on the bottom plate, and the bottom plate and the top cover are encircled to form the mounting cavity; the power module is connected to the bottom plate; the bottom plate is provided with the heat dissipation opening or is made of metal materials to form the heat conducting fin.

4. The power module assembly of claim 2, wherein: the heat conducting sheet is a metal sheet or a heat conducting pad.

5. The power module assembly of any one of claims 1-4, wherein: and heat-conducting glue is arranged between the part, opposite to the power module, of the mounting shell and the power module and/or the refrigerator main body.

6. The power module assembly of any one of claims 1-4, wherein: the power module comprises a power shell and a power board arranged in the power shell, and the power shell is connected with the mounting shell.

7. The power module assembly of claim 6, wherein: the power supply shell is filled with heat conduction insulating glue, the heat conduction insulating glue is in contact with the power supply board and the power supply shell, and the heat conduction insulating glue wraps components on the power supply board.

8. The power module assembly of claim 7, wherein: and the power module is provided with a through hole for heat dissipation and glue filling.

9. A radio frequency generating device, comprising:

the power module assembly of any one of claims 1-8;

the power amplification module is arranged in the mounting cavity, is powered by the power supply module and is used for generating radio frequency signals after power amplification.

10. The radio frequency generating device according to claim 9, wherein: the power amplifier is characterized in that a partition plate is arranged in the mounting shell, the mounting cavity is divided into a power amplifier cavity and a power supply cavity by the partition plate, the power amplifier module is arranged in the power amplifier cavity, and the power supply module is arranged in the power supply cavity.

11. The radio frequency generating device according to claim 9 or 10, wherein: the power amplifier module comprises:

the power amplification plate is provided with a first surface and a second surface which are arranged in a back-to-back manner;

the power amplifier shielding cover is covered on the first surface of the power amplifier board;

the radiating piece is arranged on the second surface of the power amplification plate and connected with the mounting shell, and the radiating piece is provided with an airflow channel;

the air blowing assembly is provided with an air outlet which is communicated with the air flow channel of the heat radiating piece.

12. The radio frequency generating device according to claim 11, wherein: the air blowing assembly includes:

a blowing device for generating a wind flow;

the air duct is provided with a first opening and a second opening which are oppositely arranged, the first opening is communicated with a blowing opening of the blowing device, the second opening is communicated with an airflow channel of the radiating piece to form the air outlet, and the size of the second opening in the width direction of the power amplification plate is larger than that of the first opening.

13. The radio frequency generating device according to claim 11, wherein: the heat dissipation piece is made of metal and comprises a metal plate and a plurality of heat dissipation fins which are arranged on one surface of the metal plate at intervals, and gaps among the plurality of heat dissipation fins which are arranged at intervals form the air flow channel; the power amplification plate is connected to the metal plate and is in contact with the metal plate.

14. A radio frequency thawing device, comprising: a radio frequency thawing assembly and a radio frequency generating device as claimed in any one of claims 9-13; the radio frequency thawing assembly comprises:

a shielding cylinder provided with an opening end with an opening;

the shielding door is arranged at the opening end of the shielding cylinder body and is used for closing the opening;

the tuning plate is arranged in the shielding cylinder body and is electrically connected with the power amplification plate of the radio frequency generating device;

and the polar plate is arranged in the shielding cylinder body, is electrically connected with the tuning plate and is used for transmitting radio frequency signals.

15. A refrigerator, comprising:

a refrigerator main body;

the power module assembly of any one of claims 1-8, disposed inside or outside the refrigerator body; or the radio frequency generating device according to any one of claims 9 to 13, which is provided inside or outside the refrigerator main body; or the radio frequency thawing device as defined in claim 14, wherein the radio frequency thawing assembly is provided inside the refrigerator body.