CN219165619U - Radio frequency generating device, radio frequency thawing device and refrigerator - Google Patents

Abstract

The application discloses a radio frequency generating device, radio frequency thawing device and refrigerator to at least to a certain extent solve the current technical problem that radio frequency generating device is out of line disordered. The installation shell of the radio frequency thawing device is provided with an installation cavity, and a strong current threading hole and a weak current threading hole which are communicated with the installation cavity and distributed at intervals, the power amplifier module is arranged in the installation cavity, the power amplifier module is electrically connected with a first weak current wire harness, the first weak current wire harness extends out of the installation shell through the weak current threading hole, the power module is arranged in the installation cavity and electrically connected with the power amplifier module through a second weak current wire harness, the power module is electrically connected with a strong current wire harness, the strong current wire harness extends out of the installation shell through the strong current threading hole, the projection of the strong current wire harness on the surface where the strong current threading hole and the weak current threading hole are arranged is not overlapped with the weak current wire harness, the strong current wire harness and the weak current wire harness are separated for wiring, wiring is convenient, product discharging risk is reduced, and safety and reliability of products are improved.

Description

Radio frequency generating device, radio frequency thawing device and refrigerator

Technical Field

The application belongs to the technical field of radio frequency generating devices, and particularly relates to a radio frequency generating device, a radio frequency thawing device and a refrigerator.

Background

The radio frequency thawing technology can make the thawed object be thawed evenly and quickly by penetrating food through low-frequency electromagnetic waves. Refrigerators equipped with radio frequency thawing devices applying radio frequency thawing technology are popular with consumers. The radio frequency generating device is an important component in the radio frequency thawing device and mainly comprises a power amplification module for generating radio frequency signals after power amplification and a power supply module for regulating voltage and supplying power to the power amplification module.

Each electronic module of the radio frequency generating device needs to be connected, and wire harnesses of the radio frequency generating device in the prior art are usually concentrated to be connected, so that on one hand, the wire harnesses are disordered, and on the other hand, strong-current wire harnesses and weak-current wire harnesses are connected together to be connected, interference exists, and electromagnetic shielding is affected.

Disclosure of Invention

In order to solve the technical problem that the outgoing lines of the existing radio frequency generating device are disordered, the application provides a radio frequency generating device, a radio frequency thawing device and a refrigerator.

The application adopts a technical scheme that: there is provided a radio frequency generating device comprising:

the installation shell is provided with an installation cavity, and strong current threading holes and weak current threading holes which are communicated with the installation cavity and distributed at intervals;

the power amplification module is arranged in the mounting cavity and is electrically connected with a first weak current wire harness, and the first weak current wire harness extends out of the mounting shell through the weak current threading hole;

The power module is arranged in the mounting cavity and is electrically connected with the power amplifier module through a second weak electric wire harness, the power module is electrically connected with a strong electric wire harness, and the strong electric wire harness extends out of the mounting shell through the strong electric wire threading hole;

the projection of the strong current wire harness on the surface where the strong current threading hole and the weak current threading hole are located is not overlapped with the projection of the first weak current wire harness and the second weak current wire harness on the surface where the strong current threading hole and the weak current threading hole are located.

According to the technical scheme, the radio frequency generation device provided by the application is provided with the strong current threading holes and the weak current threading holes which are distributed at intervals in the installation shell, and the projection of the strong current wire harness on the surface where the strong current threading holes and the weak current threading holes are located is not overlapped with the weak current wire harness, so that the strong current wire harness and the weak current wire harness are separated to be wired and not to be crossed, wiring is facilitated, the product discharge risk is reduced, the electromagnetic shielding reliability is improved, the safety and reliability of the product are improved, and the safety and reliability requirements of safety and regulation are met.

In some embodiments, the first weak current harness is connected to an end of the power amplifier module remote from the power module; the strong electric wire harness is connected to one side, far away from the power amplification board, of the power module.

In some embodiments, at least one of the strong current harness, the first weak current harness, and the second weak current harness is provided in a peripheral region of the power amplifier module and the power supply module.

In some embodiments, the strong current threading aperture and the weak current threading aperture are on the same side of the mounting housing; the weak current threading hole is closer to the power amplification plate than the strong current threading hole; the power panel is closer to the strong current threading hole than the power amplifier panel.

In some embodiments, the power amplification module comprises a power amplification board for generating a radio frequency signal after power amplification and a blowing component for radiating heat of the power amplification board, wherein the blowing component is arranged at a first end of the power amplification board;

the first weak current harness is positioned at the second end of the power amplification board; and/or the second weak current wire harness is wound on the outer side of the blowing assembly.

In some embodiments, the power amplifier module further includes a heat dissipation member disposed on the power amplifier board, where the heat dissipation member is provided with an air flow channel that is communicated with the air outlet of the air blowing component.

In some embodiments, the power amplifier board has a first surface and a second surface disposed opposite to each other; the power amplifier module further comprises a power amplifier shielding cover which is covered on the first surface of the power amplifier board; the heat dissipation piece is arranged on the second surface of the power amplification plate.

In some embodiments, the heat dissipation member is made of metal, and comprises a metal plate and a plurality of heat dissipation fins arranged on one surface of the metal plate at intervals, and gaps among the plurality of heat dissipation fins at intervals form the air flow channel;

the power amplifier shielding cover and the power amplifier board are both installed on the heat dissipation piece through the fixing piece.

In some embodiments, a surface of the metal plate, which is close to the power amplification plate, is provided with a blind avoidance hole for accommodating a conductor of the power amplification plate;

and/or at least two lugs are arranged on the metal plate, and fixing holes are formed in the lugs.

In some embodiments, the power module includes a power supply housing and a power strip disposed in the power supply housing, the power strip being electrically connected with the strong and the second weak electrical harnesses.

In some embodiments, the installation shell comprises a bottom plate and a top cover covered on the bottom plate, the bottom plate and the top cover enclose into an installation cavity, the power amplifier module and the power module are both connected to the bottom plate, and the strong current threading hole and the weak current threading hole are both arranged on the bottom plate.

In some embodiments, the mounting shell comprises a top cover, an inner cavity of the top cover forms the mounting cavity, the power amplifier module and the power module are both connected to the top cover, and the strong current threading hole and the weak current threading hole are both arranged on the top cover.

In some embodiments, the top cover is provided with two junction boxes, and the strong current threading hole and the weak current threading hole are respectively arranged on the two junction boxes.

The other technical scheme adopted by the application is as follows: there is provided a radio frequency thawing apparatus comprising: the radio frequency thawing assembly and the radio frequency generating device are arranged on the same side of the radio frequency thawing assembly; the radio frequency thawing assembly comprises:

a shielding cylinder provided with an opening end with an opening;

the shielding door is arranged at the opening end of the shielding cylinder body and is used for closing the opening;

the tuning plate is arranged in the shielding cylinder body and is electrically connected with the power amplification plate of the radio frequency generating device;

and the polar plate is arranged in the shielding cylinder body, is electrically connected with the tuning plate and is used for transmitting radio frequency signals.

The application adopts the following technical scheme: provided is a refrigerator, characterized by comprising:

a refrigerator main body;

in the radio frequency thawing device, the radio frequency thawing assembly is arranged in the refrigerator main body, and the radio frequency generating device is arranged in or outside the refrigerator main body.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are needed in the description of the embodiments will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present application, and other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

Fig. 1 shows a schematic block diagram of a radio frequency thawing device in an embodiment of the present application.

Fig. 2 shows a functional block diagram of a radio frequency thawing device in accordance with another embodiment of the present application.

Fig. 3 shows a functional block diagram of a radio frequency thawing device in accordance with another embodiment of the present application.

Fig. 4 is a schematic structural view of the rf generator in the partially cut-away state of the top cover according to the embodiment of the present application.

Fig. 5 is a schematic view showing an internal structure of a radio frequency generating device according to still another embodiment of the present application after the top cover is removed.

Fig. 6 is a schematic diagram of an internal structure of the rf generator after the top cover is removed according to an embodiment of the present application.

Fig. 7 is a schematic structural diagram of an rf generator according to another embodiment of the present application in a bottom view.

Fig. 8 shows a schematic structural diagram of a power amplifier module of a radio frequency generating device in an embodiment of the present application.

Fig. 9 shows an exploded view of the power amplifier module of fig. 8.

Fig. 10 shows a schematic structural diagram of a power module of the radio frequency generating device in the embodiment of the application.

Fig. 11 is a schematic structural diagram of a power module of a radio frequency generating device according to another embodiment of the present application.

Fig. 12 is a schematic view showing a structure of a refrigerator according to an embodiment of the present application.

Fig. 13 shows a partial enlarged view at a of fig. 12.

Fig. 14 is a view showing an assembled structure of a shield cylinder and a shield door in the refrigerator of fig. 12.

Fig. 15 is a diagram showing an installation structure of a radio frequency generating device in a refrigerator according to an embodiment of the present application.

Fig. 16 is a view showing an installation structure of a radio frequency generating device in a refrigerator according to another embodiment of the present application.

Reference numerals illustrate:

100-refrigerator; 10-a radio frequency generating device; 20-a refrigerator main body, 21-a mounting cavity, 22-a refrigerating assembly and 23-a U shell; 30-radio frequency thawing components, 31-shielding barrels, 31 a-opening ends, 31 c-air inlets of the shielding barrels, 31 d-air outlets of the shielding barrels, 31 e-tuning cavities, 31 f-thawing cavities and 32-shielding doors; 40-wind flow accelerator; 50-master control box.

11-mounting shell, 11 a-mounting cavity, 11 b-power amplification cavity, 11 c-power supply cavity, 11 d-heat dissipation hole, 11 m-strong current threading hole and 11 n-weak current threading hole; 111-a bottom plate; 112-top cover, 1122-baffle, 1125-junction box, 1126-cover plate; 113-separator.

12-power amplifier module, 121-power amplifier board, 121 a-first surface, 121 b-second surface, 121 c-first end, 121 d-second end, 1211-component; 122-heat sink, 122 a-air flow channel, 122 b-relief blind hole, 1221-sheet metal, 1221 a-mounting plane, 1222-fin, 1223-lug; 123-blowing components, 1231-blowing devices, 1231 a-blowing ports, 1232-air channels, 1233-air outlets, 1234-first openings, 1235-second openings; 124-power amplifier shielding cover, 1241-top plate, 1242-side plate; 127-fastener.

13-power module, 131-power panel, 132-power shell, 132 a-through hole, 133-heat conduction insulating glue; 16-a strong electric wire harness; 17-weak current harness, 171-first weak current harness; 172-a second weak current harness; 18-fixing piece.

Detailed Description

The following description of the embodiments of the present application will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are only some, but not all, of the embodiments of the present application. All other embodiments, which can be made by one of ordinary skill in the art without undue burden from the present disclosure, are within the scope of the present disclosure.

Furthermore, the present application may repeat reference numerals and/or letters in the various examples, which are for the purpose of brevity and clarity, and which do not in themselves indicate the relationship between the various embodiments and/or arrangements discussed. In addition, the present application provides examples of various specific processes and materials, but one of ordinary skill in the art may recognize the application of other processes and/or the use of other materials.

In the related art, the outgoing line of the radio frequency generating device has a messy technical problem. The embodiment of the application provides a radio frequency generating device, a radio frequency thawing device and a refrigerator, which at least can solve the technical problem that the current radio frequency generating device is out of line in disorder to a certain extent.

The present application is described below with reference to specific embodiments in conjunction with the accompanying drawings:

example 1:

the embodiment of the application provides a radio frequency generating device, as shown in fig. 4 and 5, which is a schematic structural diagram of the radio frequency generating device in a partially cut-away state of a top cover and a schematic internal structural diagram of the radio frequency generating device after the top cover is removed. The radio frequency generating device 10 includes a mounting case 11, a power amplification module 12 for generating a radio frequency signal amplified by power, and a power supply module 13 for supplying power to the power amplification module 12. The mounting shell 11 is provided with a mounting cavity 11a, the power amplifier module 12 and the power module 13 are both positioned in the mounting cavity 11a, and the power amplifier module 12 and the power module 13 are both connected with the mounting shell 11.

The power amplification board 121 generally includes a signal source and a power amplification circuit, which are electrically connected, where the signal source is used to generate an initial signal with a set frequency (e.g. 40.68 MHz), and the power amplification circuit is used to power amplify the initial signal, enhance the power of the initial signal, and output a radio frequency signal after power amplification. The power module 13 is internally provided with an ac/dc conversion circuit and a voltage regulating circuit, and is used for performing ac/dc conversion and voltage regulation, and supplying low-voltage dc power to the power amplifier module 12.

The power amplifying circuit can adopt primary amplification, secondary amplification, tertiary amplification or even more according to actual needs, and specific amplification stages and circuit structures of the amplifying circuits at all stages can refer to related publications in the prior art, so that the power amplifying circuit is not limited. The signal source and the power amplifying circuit may be both disposed on the same surface of the power amplifying board 121, or may be disposed on the first surface 121a and the second surface 121b, which is not limited in the specific arrangement manner. In some embodiments, the components 1211 (chips, inductors, capacitors, resistors, etc.) on the power amplification board 121 are located on the first surface 121a, that is, each component 1211 of the signal source and the power amplification circuit is mounted on the front surface of the power amplification board 121, the back surface of the power amplification board 121 is mainly a soldering leg, a soldering wire, etc. of a pin, and the second surface 121b of the power amplification board 121 contacts the heat dissipation element 122 for heat transfer.

In some embodiments, referring to fig. 1, 2 and 3, the power amplifying circuit adopts a second-stage amplification, including a first-stage driver and a second-stage power amplifying circuit, where the signal source, the first-stage driver and the second-stage power amplifying circuit are electrically connected in sequence, the first-stage driver and the second-stage power amplifying circuit amplify an initial signal sent by the signal source step by step, and the second-stage power amplifying circuit outputs the amplified signal. The specific circuit structures of the primary driver and the secondary power amplifying circuit can refer to related publications in the prior art, and the application is not limited.

In some embodiments, referring to fig. 2, the power amplification board 121 is further provided with a detection circuit, where the detection circuit, the signal source, and the power amplification circuit are provided on the same circuit board. In other embodiments, the detection circuit and the signal source and the power amplification circuit may be provided on different circuit boards. The detection circuit is used for detecting the output power of the radio frequency signal after power amplification and feeding back the output power to the control board. If the load connected to the power amplification board 121 is provided with a tuning board, the detection circuit is further used for detecting the reflected power reflected by the tuning module and feeding back to the control board.

The radio frequency generating device 10 is controlled by a control system (e.g. MCU controller) on a control board when in operation, the control board is electrically connected with the power module 13 and the power amplifier module 12, the control board is electrically connected with an external input device (display screen, operation panel, keyboard, etc.), receives an operation instruction sent by a user, and controls circuits in the power module 13 and the power amplifier module 12 to work. When the output power of the power amplifier module 12 needs to be regulated, the control board calculates a voltage regulation control instruction based on an internal algorithm and sends the voltage regulation control instruction to the power module 13, and the power module 13 regulates the voltage to change the output voltage of the power module 13. For the power amplification board 121 provided with the detection circuit, the control board is electrically connected with the detection circuit, the detection circuit detects the output power of the power amplification module 12 and feeds back to the control module, and the control module performs relevant control on the signal source, the power amplification circuit and the power supply module 13 through an internal algorithm.

In some embodiments, the functions of the control board are integrated on the device on which the rf generator 10 is mounted, such as a refrigerator in which the rf generator 10 is configured, and the functions of the control board may be integrated on a main control board of the refrigerator. In some embodiments, the control board is a circuit board which is separately arranged, the control board exists independently of the power module 13 and the power amplifier module 12 to form a control module, under the arrangement scheme, the installation positions of the power amplifier module 12, the power module 13 and the control module can be set according to actual needs, the power amplifier module 12 is arranged in the installation cavity 11a of the installation shell 11 and is fixedly connected with the installation shell 11, and the power module 13 and the control module can be selectively arranged in the installation shell 11 or on the equipment main body of the equipment carried by the radio frequency generating device 10. Taking a refrigerator with a radio frequency thawing device as an example, a radio frequency generating device 10 is arranged in the radio frequency thawing device, a mounting shell 11 with a built-in power amplifier module 12 can be selectively arranged inside or outside a refrigerator main body of the refrigerator, a power module 13 can be selectively arranged in the mounting shell 11, or positioned outside the mounting shell 11 and inside the refrigerator main body, and a control module can be selectively arranged in the mounting shell 11, or positioned outside the mounting shell 11 and inside the refrigerator main body.

In other embodiments, the control board and the power amplifier board 121 may be integrated on the same circuit board, as shown in fig. 3. In this embodiment, since the power amplifier module 12 generates a high-frequency signal, it is easy to interfere with the control system drawn on the same electronic control board, and thus, it is necessary to perform internal structural shielding according to the actual layout, that is, the shielding case only covers the relevant components 1211 of the power amplifier board 121 to perform electromagnetic shielding, and the structural design and installation of the shielding case are relatively complex and have high cost. Meanwhile, since the power amplifier board 121 needs to be designed by using a multi-layer board, and a PCB high-frequency board with higher cost must be adopted, and the material of the control board for the board is generally unlimited, integrating the control board and the power amplifier board 121 on the same circuit board can result in that the whole board needs to use the PCB high-frequency board, so that the overall cost of the radio frequency generating device 10 is increased. In addition, the heat source of the whole radio frequency generating device 10 is mainly in the power amplifier module 12, the control board and the power amplifier board 121 are drawn on the same circuit board, and the heat generated by the power amplifier board 121 causes the control system to be heated, so that the reliability of the whole radio frequency generating device 10 is affected.

In other embodiments, the control board is integrated with the power module 13 on the same circuit board, as shown in FIG. 2. In this embodiment, since the control board is integrated with the power module 13 and the same circuit board, the power amplifier board 121 and the control board are all independently arranged, and only the power amplifier board 121 adopts a PCB high-frequency board, the consumption of the PCB high-frequency board is minimum, and the independent control module only needs to adopt a common low-cost material, so that the cost is reduced. Meanwhile, the power amplification plate 121, the control plate and the power module 13 are all independently arranged, the power amplification module 12 does not need to carry out special shielding design on the shielding cover according to the internal layout of the circuit board, only a simple outer cover shielding power amplification plate 121 is needed to be designed, and the design complexity and cost are reduced. Meanwhile, as the power amplification plate 121, the control plate and the power module 13 are arranged independently, heat insulation is carried out through air in installation, heat radiation of the power amplification module 12 to the control module is greatly reduced, and reliability of the whole radio frequency generating device 10 is improved.

Referring to fig. 8 and 9, the power amplifier module 12 includes a power amplifier board 121, a heat dissipation member 122 and a blower assembly 123, wherein the power amplifier board 121 is used for generating a radio frequency signal after power amplification, the heat dissipation member 122 is disposed on the power amplifier board 121, and the heat dissipation member 122 is selectively connected and fixed with the power amplifier board 121 or only contacts with the power amplifier board 121. The heat sink 122 is provided with an air flow passage 122a, and heat of the heat sink 122 can be taken away when wind flows through the air flow passage 122 a. The air blowing component 123 is configured to blow air into the air flow channel 122a, dissipate heat of the power amplification board 121, the air blowing component 123 and the power amplification board 121 are sequentially disposed along the air flow direction, two ends of the power amplification board 121 in the air flow direction are respectively denoted as a first end 121c and a second end 121d, the air blowing component 123 is disposed at the first end 121c of the power amplification board 121, and the second end 121d of the power amplification board 121 can be used as an outlet end of the power amplification board 121.

The blower assembly 123 includes a blower 1231 and an air duct 1232, the blower 1231 is configured to generate a wind flow, and the air duct 1232 communicates the blower 1231 with the heat sink 122. Specifically, the air duct 1232 has a first opening 1234 and a second opening 1235 that are disposed opposite to each other, the first opening 1234 is communicated with the air blowing opening 1231a of the air blowing device 1231, the second opening 1235 is communicated with the air flow channel 122a of the heat dissipation member 122, and the air flow generated by the air blowing device 1231 enters the air flow channel 122a through the air duct 1232, so that the heat dissipation member 122 is dissipated by forced convection.

When in use, the heat dissipation element 122 is in contact with the power amplification plate 121, and the heat of the power amplification plate 121 is conducted to the heat dissipation element 122. The wind flow generated by the blowing device 1231 enters the airflow channel 122a through the air duct 1232, forced convection dissipates heat of the heat dissipation part 122, and the heat dissipation part 122 further dissipates heat of the power amplification plate 121, so that the temperature of the power amplification plate 121 is effectively reduced, and the safety and reliability of products are improved. Due to the arrangement of the air duct 1232 and the heat dissipation member 122 having the air flow channel 122a, the air flow generated by the air blowing device 1231 can all enter the air flow channel 122a, the air volume utilization rate is high, and the heat dissipation requirement of the power amplification plate 121 can be met with smaller power and flow.

Referring to fig. 9, in the power amplifier module 12 provided in the present application, the size of the second opening 1235 of the air duct 1232 in the width direction of the power amplifier board 121 is greater than the size of the first opening 1234 in the width direction of the power amplifier board 121. That is, the air duct 1232 adopts a flaring design, and along the flow direction of the wind flow, the size of the inner cavity of the air duct 1232 in the width direction of the power amplification plate 121 tends to increase, and specifically, linear increase, nonlinear increase or gradient increase can be adopted. To reduce wind resistance, in some embodiments, the projection of the air duct 1232 on the plane parallel to the power amplification plate 121 is trapezoidal, and the shapes of the first opening 1234 and the second opening 1235 are respectively adapted to the shape of the air blowing opening 1231a of the air blowing device 1231 and the inlet shape of the air flow channel 122a of the heat dissipation member 122.

Because the second opening 1235 of the air duct 1232 is larger than the first opening 1234 in the width direction of the power amplification plate 121, the air flow is increased in the width direction of the power amplification plate 121 in the process of flowing from the first opening 1234 to the second opening 1235 of the air duct 1232, and the air flow can be matched with a heat dissipation device, so that the air flow is blown across the whole width of the power amplification plate 121, and the heat dissipation efficiency is further improved. In addition, the air duct 1232 can also realize the adaptation of the shapes of the air blowing device 1231 and the opening 11g of the heat dissipation member 122, so that the requirement on the shape selection of the air blowing device 1231 is reduced. The blowing device 1231 may employ a fan, or the like capable of generating a wind flow, which is not limited in this application. In some embodiments, to further meet the miniaturization requirements of the device, the blower 1231 employs an axial flow fan.

The heat dissipation member 122 and the power amplification plate 121 conduct heat, and the heat dissipation member 122 is required to have good thermal conductivity, and metal and ceramic thermal conductivity, and the material and shape of the heat dissipation member 122 are not limited in this application. In some embodiments, the heat dissipation element 122 is made of metal, and may be aluminum, iron, or other metals or alloys thereof, and aluminum is preferred in view of light weight.

In order to satisfy the installation and heat dissipation of the power amplifier board 121, referring to fig. 8, the heat dissipation member 122 includes a metal plate 1221 and a plurality of heat dissipation fins 1222, the heat dissipation fins 1222 are distributed on one surface of the metal plate 1221, and the heat dissipation fins 1222 are spaced apart so that gaps between the heat dissipation fins 1222 form the air flow channel 122a, and the specific number and spacing of the heat dissipation fins 1222 are determined according to the heat dissipation requirement of the power amplifier board 121, which is not limited in this application. In certain embodiments, the metal plate 1221 is integrally formed with the heat dissipating fins 1222. The metal plate 1221 has a large mounting surface 1221a, the power amplification plate 121 is mounted on the mounting surface 1221a of the metal plate 1221 by the fastener 127, and the power amplification plate 121 is at least partially in contact with the metal plate 1221.

Because the metal is conductive, in order to ensure that the power amplification board 121 and the metal board 1221 are fully contacted as much as possible, referring to fig. 9, in some embodiments, a plurality of avoidance blind holes 122b are provided on the installation plane 1221a of the metal board 1221, the number and positions of the avoidance blind holes 122b completely correspond to the number and distribution of conductors (pins, soldering tin parts, wires, etc. of the components 1211) of the power amplification board 121, the size of the avoidance blind holes 122b is larger than that of the corresponding conductors on the power amplification board 121, so that the conductors extend into the avoidance blind holes 122b and are not contacted with the metal board 1221, thereby ensuring that the power amplification board 121 and the metal board 1221 are tightly attached, the contact area is larger, heat dissipation is facilitated, and the overall structure of the power amplification board 121 is more stable. The avoidance blind hole 122b is designed as a blind hole, so that the problem of leakage caused by contact between the conductor and water due to the design as the through hole 132a can be avoided.

The structural strength of the heat sink 122 is higher than that of the power amplification board 121, and thus the heat sink 122 simultaneously serves as a mounting base of the power amplification board 121. In some embodiments, at least two lugs 1223 are disposed on the metal plate 1221, where the lugs 1223 may be disposed on a bottom surface or a side surface of the metal plate 1221 according to actual needs, and fixing holes for installing the fasteners 127 are disposed in the lugs 1223, and the fixing holes may be light holes or threaded holes, and the fasteners 127 may be in a screw, rivet, pin shaft or other structure.

The power amplification board 121 is a circuit board structure, and has a first surface 121a and a second surface 121b that are disposed opposite to each other, hereinafter also referred to as a first surface 121a of the power amplification board 121 is a front surface, and a second surface 121b of the power amplification board 121 is a back surface. The power amplification board 121 generally includes a signal source and a power amplification circuit, which are electrically connected, where the signal source is used to generate an initial signal with a set frequency (e.g. 40.68 MHz), and the power amplification circuit is used to power amplify the initial signal, enhance the power of the initial signal, and output a radio frequency signal after power amplification. The power amplifying circuit can adopt primary amplification, secondary amplification, tertiary amplification or even more according to actual needs, and specific amplification stages and circuit structures of the amplifying circuits at all stages can refer to related publications in the prior art, so that the power amplifying circuit is not limited. The signal source and the power amplifying circuit may be both disposed on the same surface of the power amplifying board 121, or may be disposed on the first surface 121a and the second surface 121b, which is not limited in the specific arrangement manner. In some embodiments, the components 1211 (chips, inductors, capacitors, resistors, etc.) on the power amplification board 121 are located on the first surface 121a, that is, each component 1211 of the signal source and the power amplification circuit is mounted on the front surface of the power amplification board 121, the back surface of the power amplification board 121 is mainly a soldering leg, a soldering wire, etc. of a pin, and the second surface 121b of the power amplification board 121 contacts the heat dissipation element 122 for heat transfer.

Referring to fig. 10, in some embodiments, the power module 13 includes a power supply housing 132 and a power supply board 131 disposed in the power supply housing 132, the power supply housing 132 protecting the power supply board 131. In some embodiments, the power supply housing 132 is provided with a plurality of through holes 132a for heat dissipation of the power panel 131. Considering that there is a gap between the power supply housing 132 and the power supply board 131, the power supply board 131 and the power supply housing 132 conduct heat only through air, so that the heat dissipation effect is poor, and the service life of the power supply board 131 may be affected, as shown in fig. 11, in other embodiments, the power supply housing 132 is filled with a heat-conducting insulating glue 133, the heat-conducting insulating glue 133 is in contact with both the power supply board 131 and the power supply housing 132, and the heat-conducting insulating glue 133 wraps components on the power supply board 131.

Specifically, the heat-conducting insulating glue 133 is arranged in the power module 13, the heat-conducting insulating glue 133 is arranged between the power panel 131 and the power shell 132 of the power module 13, on one hand, water, insects and the like outside the power module 13 can be prevented from entering the power module 13 to erode components on the power panel 131, so that the waterproof and insect-preventing effects are achieved, and on the other hand, heat generated by the components on the power panel 131 can be conducted to the power shell 132 through the heat-conducting insulating glue 133, so that the heat dissipation effect of the power module 13 is improved. In addition, the heat conductive insulating adhesive 133 wraps the components on the power panel 131, so that the heat dissipation uniformity of the components can be improved. Thereby improving the reliability and safety of the power module 13 as a whole.

In some embodiments, in order to ensure the bonding degree of the heat-conducting insulating glue 133 with the power panel 131 and the power supply housing 132, poor contact is avoided, and the heat dissipation effect is affected, so that the glue filling mode is adopted, the through hole 132a arranged on the power supply module 13 can be used as a glue filling hole, glue filling is performed through the through hole 132a on the power supply module 13, the bonding degree of the heat-conducting insulating glue 133 with the power panel 131 and the power supply housing 132 is improved, and the heat dissipation effect of the power supply module 13 is ensured to a certain extent.

In order to further improve the heat dissipation effect of the power module 13, referring to fig. 4 and 7, in some embodiments, a plurality of heat dissipation holes 11d are formed on the side wall 1121 of the body 110 of the mounting case 11 at intervals, and when the internal power module 13 generates heat, the heat is dissipated outwards through air, so as to dissipate the heat of the power module 13. The heat dissipation holes 11d are formed on at least one side wall 1121 of the installation shell 11, in some embodiments, the heat dissipation holes 11d are formed on at least two opposite side walls 1121 of the installation shell 11, so as to form an air flow passing through the installation cavity 11a, thereby effectively improving the heat dissipation effect; or the side walls 1121 except the side wall 1121 facing the user are provided with the heat radiation holes 11d, thereby improving the heat radiation effect and the aesthetic property of the mounting shell 11.

Referring to fig. 6, in some embodiments, a power module 13 and a power amplifier module 12 are disposed in the installation cavity 11a of the radio frequency generating device 10, and the control module is external, or the control board is integrated with the power board 131 or the power amplifier board 121. The installation shell 11 is provided with two wire passing holes, namely a strong current threading hole 11m and a weak current threading hole 11n, wherein the strong current threading hole 11m and the weak current threading hole 11n are distributed at intervals and are communicated with the installation cavity 11 a. The power amplifier module 12 is provided with only the weak current harness 17, and is used for supplying power to the power amplifier board 121 and the blowing device 1231, outputting the radio frequency signal and the detection signal after power amplification, and receiving the control instruction of the control board. Referring to fig. 6, the power amplifier module 12 is disposed in the mounting cavity 11a, and the power module 13 is disposed in the mounting cavity 11a, that is, the power module 13 is closer to the strong current threading hole 11m than the power amplifier module 12. The strong current and the weak current are separated to form the wiring, so that the discharge risk of the radio frequency generating device 10 is reduced, the reliability of electromagnetic shielding is improved, the safety requirements are met, and the safety reliability of the radio frequency generating device 10 is improved. Since the power amplifier module 12 only needs low-voltage dc power when working, and the power module 13 needs to be connected with the mains supply with relatively high voltage, in the radio frequency generating device 10, only the power module 13 is connected with the strong electric wire harness 16, in order to shorten the length of the strong electric wire harness 16, in some embodiments, the power module 13 is closer to the strong electric wire through hole 11m than the power amplifier module 12, specifically, the power panel 131 is closer to the strong electric wire through hole 11m than the power amplifier panel 121, on one hand, the length of the strong electric wire harness 16 is shortened, and on the other hand, the power amplifier panel 121 is far from the high-voltage part, so that electromagnetic interference is reduced.

The strong current and weak current threading holes 11m and 11n may be located at different regions of the installation housing 11, and in some embodiments, referring to fig. 6, the strong current and weak current threading holes 11m and 11n are located at the same side of the installation housing 11, and the weak current threading holes 11n are closer to the power amplification board 121 than the strong current threading holes 11m, thereby making the lengths of the strong current and weak current harnesses 16 and 17 shorter. When the installation housing 11 includes the bottom plate 111 and the top cover 112, both the strong current threading hole 11m and the weak current threading hole 11n are provided on the bottom plate 111, as shown in fig. 6. Since the bottom plate 111 is covered by the top cover 112, the entire rf generator 10 is more waterproof when the strong current through holes 11m and the weak current through holes 11n are provided in the bottom plate 111. When the installation housing 11 includes only the top cover 112, the strong current threading hole 11m and the weak current threading hole 11n are both provided on the top cover 112, as shown in fig. 7, the strong current threading hole 11m and the weak current threading hole 11n may be both provided on the top wall 1124 or the side wall 1121 of the top cover 112, which is not limited in this application.

Since the top cover 112 is directly exposed, when the strong current threading hole 11m and the weak current threading hole 11n are both formed in the top cover 112, the waterproof requirements of the strong current threading hole 11m and the weak current threading hole 11n need to be considered, and the shapes and the sizes of the strong current threading hole 11m and the weak current threading hole 11n are matched with the cross-sectional shapes and the sizes of the corresponding strong current wire harness 16 and the weak current wire harness 17. Referring to fig. 7, in some embodiments, the top cover 112 is provided with two terminal boxes 1125, the two terminal boxes 1125 are fixedly connected and sealed with the top cover, and the wiring harness in the device and the wiring harness of the electronic module are wired in the terminal boxes 1125. The junction box 1125 and the top cover 112 may be separately disposed and fixedly connected by screws, and in some embodiments, the junction box 1125 and the top cover 112 may be provided as a unitary structure, for example, a countersink is disposed in the top cover 112 as the junction box 1125, and a cover plate 1126 is disposed on the opening of the junction box 1125 to close the junction box 1125, and the cover plate 1126 is flush with the surface of the top cover 112, as shown in fig. 16.

Referring to fig. 6, the power amplification board 121 is electrically connected to a first weak current harness 171 and a second weak current harness 172, wherein the first weak current harness 171 includes a harness output from the power amplification module 12 to an external electronic device, and is used for outputting a radio frequency signal and a detection signal after power amplification, or is also used for receiving a control instruction of a control board, and the first weak current harness 171 extends out of the mounting case 11 through the weak current threading hole 11 n. The second weak current harness 172 is used for electrically connecting the power module 13 with the power amplifier module 12 to supply power to the power amplifier module 12, and the second weak current harness 172 is located in the mounting cavity 11 a. The power module 13 is electrically connected to the strong electric wire harness 16 and the second weak electric wire harness 172, and the strong electric wire harness 16 extends out of the mounting case 11 through the strong electric wire threading hole 11m for accessing the commercial power.

In general, for convenience of wiring, the threading holes are all provided on the same surface, and in this embodiment, the strong current threading hole 11m and the weak current threading hole 11n are located on the same surface of the installation housing 11, for example, when the installation housing 11 includes the bottom plate 111 and the top cover 112, the strong current threading hole 11m and the weak current threading hole 11n are all provided on the bottom plate 111, and when the installation housing 11 includes only the top cover 112, the strong current threading hole 11m and the weak current threading hole 11n are all provided on the top wall of the top cover 112. The projections of the strong current harness 16 and the weak current harness 17 on the plane where the threading holes are provided do not overlap, specifically, the strong current harness 16 does not cross the first weak current harness 171 and the second weak current harness 172, and the strong current threading holes 11m and the weak current threading holes 11n are separated from each other, so that the strong current harness 16 is ensured to have a certain interval from the first weak current harness 171 and the second weak current harness 172, and the strong current harness and the weak current harness do not contact and cross each other.

Referring to fig. 6, in some embodiments, the outlet end of the power amplification board 121 of the power amplification module 12 is located at one end far away from the power module 13, the outlet end of the power board 131 of the power module 13 is located at one side far away from the power amplification board 121, and the outlet end of the power amplification board 121 is opposite to the outlet end of the power board 131, so that the distance between the strong electric wire harness 16 and the weak electric wire harness 17 is further increased, the wiring is convenient, the product discharge risk is reduced, the electromagnetic shielding reliability is increased, the safety and reliability of the product are improved, and the safety and reliability of the product are met according to safety requirements.

Referring to fig. 6, in some embodiments, at least one of the strong electric wire harness 16, the first weak electric wire harness 171, and the second weak electric wire harness 172 is disposed in the peripheral area of the power amplifier module 12 and the power module 13, that is, at least one of the strong electric wire harness 16, the first weak electric wire harness 171, and the second weak electric wire harness 172 does not pass through the gap between the power amplifier module 12 and the power module 13, and since both the power amplifier module 12 and the power module 13 generate heat during operation, the gap temperature between the power amplifier module 12 and the power module 13 is higher, and if the wire harness is disposed between the power amplifier module 12 and the power module 13, the service life of the wire harness is reduced. In some embodiments, the strong current harness 16, the first weak current harness 171, and the second weak current harness 172 are all wound from the periphery of the electronic module (the power amplifier module 12, the power module 13); in other embodiments, since the second weak current harness 172 connects the power amplification board 121 and the power supply board 131 at the same time, the second weak current harness 172 may be disposed between the power amplification module 12 and the power supply module 13 when the peripheral space wiring area is tensed. In other embodiments, the strong current harness 16 and/or the first weak current harness 171 may be disposed between the power amplifier module 12 and the power module 13, so that the gap between the power amplifier module 12 and the power module 13 is reasonably utilized, and when the harness is disposed between the power amplifier module 12 and the power module 13, the distance between the power amplifier module 12 and the power module 13 should be increased as much as possible.

Example 2:

based on the same inventive concept, the embodiment of the present application provides a radio frequency thawing apparatus, which includes a radio frequency thawing assembly 30 and the radio frequency generating device 10 of the above embodiment 1. The rf thawing assembly 30 is provided with a tuning plate and a polar plate, the tuning plate is electrically connected with a tuning inductor, and the tuning inductor is selectively arranged on the tuning plate or independent from the tuning plate. The tuning plate is electrically connected with the power amplification plate 121 of the radio frequency generating device 10, the tuning module is used for balancing the impedance of the load end so as to realize impedance matching, and the polar plate is electrically connected with the tuning plate and is used for transmitting radio frequency signals with set frequencies. The signal output by the power amplification module 12 is a radio frequency signal corresponding to the standard load after power amplification, and the tuning module is used for adjusting the impedance of the load end. The different unfreezed substances have different impedances, the impedance of the drawer is not the standard load impedance, the load impedance changes in the unfreezing process, the impedance matching is realized through the tuning module, the impedance matching is equivalent to the standard load, the control module controls the tuning module to perform the impedance matching, the tuning module outputs a signal to the polar plate, and the polar plate sends out a radio frequency signal, so that the food material unfreezing purpose is realized.

Referring to fig. 12, 13 and 14, the rf thawing assembly 30 further comprises a shield cylinder 31 and a shield door 32, the shield cylinder 31 being provided with an open end 31a with an opening, the shield door 32 being provided at the open end 31a of the shield cylinder 31 for closing the opening to form a closed shield cavity together with the shield cylinder 31. The tuning plate and the polar plate are arranged in the shielding cylinder 31, the shielding cylinder 31 can provide a mounting foundation for the tuning plate and the polar plate, the purpose of protecting the tuning plate and the polar plate can be achieved, radio frequency signals emitted by the polar plate can be shielded, and radio frequency signal leakage is avoided.

Referring to fig. 12, in some embodiments, a tuning cavity 31e and a thawing cavity 31f are provided in the shielding cylinder 31, the tuning plate and the polar plate are both provided in the tuning cavity 31e, the thawing cavity 31f is used for containing food to be thawed, and the polar plate radiates radio frequency energy into the thawing cavity 31f, thereby thawing the food in the thawing cavity 31 f. The tuning plate and the polar plate are placed separately from the food material, so that on one hand, pollution to the food material is avoided, and on the other hand, water melted after thawing the food material is prevented from contacting the tuning plate and the polar plate, and damage to the component 1211 is avoided.

Referring to fig. 13, in some embodiments, the shielding cylinder 31 is further provided with an air inlet 31c and an air outlet 31d that are in communication with the tuning cavity 31e, where the air inlet 31c and the air outlet 31d may be disposed on the same side wall 1121 of the shielding cylinder 31, or may be disposed on different side walls 1121, which is not limited in this application.

Example 3:

based on the same inventive concept, the present embodiment provides a refrigerator 100 including a refrigerator main body 20 and the radio frequency thawing apparatus of embodiment 2 described above. The radio frequency generating device 10 of the radio frequency thawing device is disposed inside or outside the refrigerator main body 20, and the specific structure thereof is described in the above embodiment 2, and will not be repeated here. The radio frequency thawing assembly 30 of the radio frequency thawing device is disposed in the refrigerator main body 20, specifically, the refrigerator main body 20 is provided with an installation cavity 21, the radio frequency thawing assembly 30 is disposed in the installation cavity 21, and the specific structure of the radio frequency thawing device is described in reference to embodiment 3 and will not be repeated here. The installation cavity 21 is located in one of a freezing chamber, a refrigerating chamber, and a temperature changing chamber of the refrigerator 100, which is not limited in this application. A refrigerating assembly 22 for refrigerating is provided in the refrigerator main body 20 for supplying cold to at least one of the freezing chamber, the refrigerating chamber, and the temperature changing compartment.

In some embodiments, the rf generating device 10 is disposed outside the refrigerator main body 20, and the rf generating device 10 may be disposed on the top, back or side of the refrigerator main body 20, which is not limited in this application. Referring to fig. 15, in some embodiments, the rf generating device 10 is located on the top surface of the refrigerator main body 20, the mounting case 11 of the rf generating device 10 is connected to the U-shaped case at the top of the refrigerator main body 20 through the fixing member 18, and when the mounting case 11 includes the base plate 111 and the top cover 112, both the electronic module and the top cover 112 are mounted on the base plate 111, and the base plate 111 is mounted on the top surface of the U-shaped case through the fixing member 18. Referring to fig. 16, in some embodiments, the mounting housing 11 includes only a top cover 112, the electronic module is mounted on the inner surface of the top wall 1124 of the top cover 112, and the top cover 112 is flip-off mounted to the top surface of the U-shaped housing by the fastener 18.

In some embodiments, referring to fig. 12 and 13, the shielding cylinder 31 of the rf thawing assembly 30 is further provided with an air inlet 31c and an air outlet 31d that are in communication with the tuning cavity 31e, and the air inlet 31c and the air outlet 31d may be disposed on the same side wall 1121 of the shielding cylinder 31 or may be disposed on different side walls 1121, which is not limited in this application. The side wall 1121 provided with the air inlet 31c and the air outlet 31d and the mounting cavity 21 have a gap a therebetween, so that the air circulation is formed between the air inlet 31c and the air outlet 31d and the gap a between the side wall 1121 provided with the air inlet 31c and the air outlet 31d and the mounting cavity 21, and the heat dissipation is performed on the tuning cavity 31 e.

In some embodiments, referring to fig. 12, the refrigerator 100 further includes a wind flow accelerator 40, and the wind flow accelerator 40 accelerates cool wind into the tuning cavity 31e through the gap a and the wind inlet 31c to accelerate air circulation, thereby improving heat dissipation efficiency.

In this application, unless expressly stated or limited otherwise, a first feature "above" or "below" a second feature may include both the first and second features being in direct contact, and may also include the first and second features not being in direct contact but being in contact with each other by way of additional features therebetween. Moreover, a first feature being "above," "over" and "on" a second feature includes the first feature being directly above and obliquely above the second feature, or simply indicating that the first feature is higher in level than the second feature. The first feature being "under", "below" and "beneath" the second feature includes the first feature being directly under and obliquely below the second feature, or simply means that the first feature is less level than the second feature.

In the description of the present application, it should be understood that the terms "center," "longitudinal," "transverse," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise" indicate or positional relationships are based on the positional relationships shown in the drawings, merely for convenience of description and to simplify the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and therefore should not be construed as limiting the present application.

It should be noted that all the directional indicators in the embodiments of the present application are only used to explain the relative positional relationship, movement conditions, etc. between the components in a specific posture, and if the specific posture is changed, the directional indicators are correspondingly changed.

In the present application, unless explicitly specified and limited otherwise, the terms "coupled," "secured," and the like are to be construed broadly, and for example, "secured" may be either permanently attached or removably attached, or integrally formed; can be mechanically or electrically connected; either directly or indirectly, through intermediaries, or both, may be in communication with each other or in interaction with each other, unless expressly defined otherwise. The specific meaning of the terms in this application will be understood by those of ordinary skill in the art as the case may be.

In addition, descriptions such as those related to "first," "second," and the like, are provided for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated in this application. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more features. In the description of the present application, the meaning of "a plurality" is two or more, unless explicitly defined otherwise.

In the description of the present specification, a description referring to terms "one embodiment," "some embodiments," "examples," "specific examples," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present application. In this specification, schematic representations of the above terms are not necessarily directed to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Further, one skilled in the art can engage and combine the different embodiments or examples described in this specification.

In addition, the technical solutions of the embodiments may be combined with each other, but it is necessary to base that the technical solutions can be realized by those skilled in the art, and when the technical solutions are contradictory or cannot be realized, the combination of the technical solutions should be regarded as not exist and not within the protection scope of the present application.

While embodiments of the present application have been shown and described, it will be understood by those of ordinary skill in the art that: many changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the application, the scope of which is defined by the claims and their equivalents.

Claims (15)

1. A radio frequency generating device, comprising:

the installation shell is provided with an installation cavity, and strong current threading holes and weak current threading holes which are communicated with the installation cavity and distributed at intervals;

the power amplification module is arranged in the mounting cavity and is electrically connected with a first weak current wire harness, and the first weak current wire harness extends out of the mounting shell through the weak current threading hole;

the power module is arranged in the mounting cavity and is electrically connected with the power amplifier module through a second weak electric wire harness, the power module is electrically connected with a strong electric wire harness, and the strong electric wire harness extends out of the mounting shell through the strong electric wire threading hole;

the projection of the strong current wire harness on the surface where the strong current threading hole and the weak current threading hole are located is not overlapped with the projection of the first weak current wire harness and the second weak current wire harness on the surface where the strong current threading hole and the weak current threading hole are located.

2. The radio frequency generating device according to claim 1, wherein: the first weak current harness is connected to one end, far away from the power module, of the power amplifier module; the strong current harness is connected to one side, far away from the power amplifier module, of the power module.

3. The radio frequency generating device according to claim 2, wherein: at least one of the strong current wire harness, the first weak current wire harness and the second weak current wire harness is arranged in peripheral areas of the power amplifier module and the power supply module.

4. The radio frequency generating device according to claim 2, wherein: the strong current threading hole and the weak current threading hole are positioned on the same side of the installation shell; the weak current threading hole is closer to the power amplifier module than the strong current threading hole; the power module is closer to the strong current threading hole than the power amplifier module.

5. The radio frequency generating device according to any of claims 1-4, wherein: the power amplification module comprises a power amplification plate for generating a radio frequency signal after power amplification and a blowing component for radiating the power amplification plate, and the blowing component is arranged at a first end of the power amplification plate;

the first weak current harness is positioned at the second end of the power amplification board; and/or the second weak current wire harness is wound on the outer side of the blowing assembly.

6. The radio frequency generating device according to claim 5, wherein: the power amplifier module further comprises a heat dissipation piece arranged on the power amplifier board, and the heat dissipation piece is provided with an air flow channel communicated with an air outlet of the air blowing component.

7. The radio frequency generating device according to claim 6, wherein: the power amplification plate is provided with a first surface and a second surface which are arranged in opposite directions; the power amplifier module further comprises a power amplifier shielding cover which is covered on the first surface of the power amplifier board; the heat dissipation piece is arranged on the second surface of the power amplification plate.

8. The radio frequency generating device according to claim 7, wherein: the heat dissipation piece is made of metal and comprises a metal plate and a plurality of heat dissipation fins which are arranged on one surface of the metal plate at intervals, and gaps among the plurality of heat dissipation fins which are arranged at intervals form the air flow channel;

the power amplifier shielding cover and the power amplifier board are both installed on the heat dissipation piece through the fixing piece.

9. The radio frequency generating device according to claim 8, wherein: the surface of the metal plate, which is close to the power amplification plate, is provided with a avoidance blind hole for accommodating a conductor of the power amplification plate;

and/or at least two lugs are arranged on the metal plate, and fixing holes are formed in the lugs.

10. The radio frequency generating device according to any of claims 1-4, wherein: the power module comprises a power supply shell and a power panel arranged in the power supply shell, and the power panel is electrically connected with the strong electric wire harness and the second weak electric wire harness.

11. The radio frequency generating device according to any of claims 1-4, wherein: the installation shell comprises a bottom plate and a top cover covered on the bottom plate, the bottom plate and the top cover enclose into an installation cavity, the power amplifier module and the power module are both connected to the bottom plate, and the strong current threading holes and the weak current threading holes are both arranged on the bottom plate.

12. The radio frequency generating device according to any of claims 1-4, wherein: the installation shell comprises a top cover, an inner cavity of the top cover forms an installation cavity, the power amplifier module and the power module are both connected to the top cover, and the strong current threading hole and the weak current threading hole are both arranged on the top cover.

13. The radio frequency generating device according to claim 12, wherein: the top cover is provided with two junction boxes, and the strong current threading holes and the weak current threading holes are respectively arranged on the two junction boxes.

14. A radio frequency thawing device, comprising: a radio frequency thawing assembly and a radio frequency generating device as defined in any one of claims 1-13; the radio frequency thawing assembly comprises:

a shielding cylinder provided with an opening end with an opening;

The shielding door is arranged at the opening end of the shielding cylinder body and is used for closing the opening;

the tuning plate is arranged in the shielding cylinder body and is electrically connected with the power amplification plate of the radio frequency generating device;

and the polar plate is arranged in the shielding cylinder body, is electrically connected with the tuning plate and is used for transmitting radio frequency signals.

15. A refrigerator, comprising:

a refrigerator main body;

the rf thawing device as defined in claim 14, wherein the rf thawing assembly is disposed inside the refrigerator body, and the rf generating device is disposed inside or outside the refrigerator body.

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