CN219612380U - Power amplifier module, radio frequency generating device, radio frequency thawing device and refrigerator - Google Patents

Abstract

The application discloses a power amplifier module, a radio frequency generating device, a radio frequency thawing device and a refrigerator, which at least can solve the technical problem that the existing power amplifier module body and the heat dissipation efficiency cannot be considered to a certain extent. The power amplification module comprises a power amplification plate, a heat radiation piece, a blowing device and an air duct, wherein the power amplification plate is used for generating radio frequency signals amplified by power, the heat radiation piece is arranged on the power amplification plate, the heat radiation piece is provided with an airflow channel, the blowing device is used for generating airflow, the air duct is provided with a first opening and a second opening which are oppositely arranged, the first opening is communicated with the blowing opening of the blowing device, the second opening is communicated with the airflow channel of the heat radiation piece, and the size of the second opening in the width direction of the power amplification plate is larger than that of the first opening. The power amplifier module, the radio frequency generating device, the radio frequency thawing device and the refrigerator provided by the application can be used for dissipating heat of the heat dissipation part by forced convection, and the heat dissipation part can be used for dissipating heat of the power amplifier board, so that the temperature of the power amplifier board is effectively reduced, and the safety and reliability of products are improved.

Description

Power amplifier module, radio frequency generating device, radio frequency thawing device and refrigerator

Technical Field

The application belongs to the technical field of refrigerators, and particularly relates to a power amplifier module, a radio frequency generating device, a radio frequency thawing device and a refrigerator.

Background

A power amplifying circuit (also called a power amplifier, a power amplifier board, a power amplifier module, etc.) is an amplifying circuit for outputting a relatively large power, and the power amplifying circuit is generally used as an output stage of a multi-stage amplifying circuit, and the output stage is required to be capable of driving a certain load. Power amplification circuits find application in many electronic devices, such as driving meters to deflect a pointer; driving a loudspeaker to make sound; the drive plate emits radio frequency signals, etc.

The radio frequency thawing device applying the radio frequency thawing technology is a common application object of the power amplifying circuit, and the radio frequency thawing technology penetrates food through low-frequency electromagnetic waves, so that the thawed object can be uniformly and rapidly thawed. Refrigerators equipped with radio frequency thawing devices are therefore popular with consumers.

The power amplification circuit has higher temperature during working and needs to radiate heat, and in the prior art, the power amplification circuit is directly blown by a large direct current fan to radiate heat forcedly. On one hand, the heat dissipation efficiency is low in a direct heat dissipation mode of the fan; on the other hand, the fan is larger, which is unfavorable for the application of small-sized equipment such as refrigerators and the like.

Disclosure of Invention

In order to solve the technical problem that the existing power amplification circuit heat dissipation structure is inconvenient to apply, the utility model provides a power amplification module, a radio frequency generating device, a radio frequency thawing device and a refrigerator.

The utility model adopts a technical scheme that: provided is a power amplifier module including:

the power amplification board is used for generating radio frequency signals after power amplification;

the heat dissipation piece is arranged on the power amplification plate and is provided with an airflow channel;

a blowing device for generating a wind flow;

the air duct is provided with a first opening and a second opening which are oppositely arranged, the first opening is communicated with the air blowing opening of the air blowing device, and the second opening is communicated with the air flow channel of the heat radiating piece.

According to the technical scheme, the power amplification module comprises a power amplification plate, a heat dissipation piece, a blowing device and an air duct, wherein the power amplification plate is used for generating a radio frequency signal amplified by power, the heat dissipation piece is in contact with the power amplification plate, and heat of the power amplification plate is conducted to the heat dissipation piece. The heat dissipation piece is provided with an airflow channel, air flow generated by the blowing device enters the airflow channel through the air channel, forced convection dissipates heat of the heat dissipation piece, and the heat dissipation piece further dissipates heat of the power amplification plate, so that the temperature of the power amplification plate is effectively reduced, and the safety and reliability of a product are improved. Because the air duct and the heat dissipation part with the air flow channel are arranged, the air flow generated by the air blowing device can completely enter the air flow channel, and compared with the heat dissipation mode of the direct blowing power amplification circuit of the fan in the prior art, the air quantity generated by the fan is only partially blown to the power amplification circuit.

In some embodiments, the second opening has a larger dimension in the width direction of the power amplification board than the first opening. The second opening of the air duct is larger than the first opening in the width direction of the power amplification plate, namely the air duct adopts a flaring design, and the air flow is increased in the width direction of the power amplification plate in the process of flowing from the first opening to the second opening of the air duct, so that the air duct can be matched with a heat dissipation device, and the air flow is ensured to blow through the whole width of the power amplification plate. Therefore, the small-size blowing device can also meet the heat dissipation requirement of the power amplification plate, so that the whole power amplification module is smaller in size and more suitable for miniaturized equipment.

In some embodiments, the heat dissipation member is made of metal, and comprises a metal plate and a plurality of heat dissipation fins arranged on one surface of the metal plate at intervals, and gaps among the plurality of heat dissipation fins at intervals form the air flow channel; the power amplification plate is connected to the metal plate and is in contact with the metal plate.

In some embodiments, a surface of the metal plate, which is close to the power amplification plate, is provided with a blind avoidance hole for accommodating a conductor of the power amplification plate; and/or at least two lugs are arranged on the metal plate, and fixing holes for installing fasteners are arranged in the lugs.

In some embodiments, the power amplification board has a first surface and a second surface that are disposed opposite to each other, and components are disposed on the first surface of the power amplification board; the heat dissipation piece is arranged on the second surface of the power amplification plate; the power amplifier module further comprises a power amplifier shielding cover which is covered on the first surface of the power amplifier board; the power amplifier shielding cover and the power amplifier board are both installed on the heat dissipation piece through the fixing piece.

In some embodiments, the power amplifier shielding cover is provided with a wind gap; the power amplifier module also comprises an airflow accelerating device arranged on the power amplifier shielding cover and used for blowing air to the inner cavity of the power amplifier shielding cover or exhausting hot air in the inner cavity of the power amplifier shielding cover.

In some embodiments, an air deflector is arranged in the power amplification shielding cover, the air deflector divides the area surrounded by the power amplification shielding cover and the first surface of the power amplification plate into a plurality of air guide channels, the air guide channels are communicated with the air flow port of the airflow accelerating device and the air port, and the components are located in the air guide channels.

In some embodiments, a vent is provided at a position of the power amplifier shielding cover opposite to the component.

In some embodiments, a window is provided on the power amplifier shielding cover; the power amplifier module further comprises a screen plate, the screen plate is located in the window, and the meshes of the screen plate form the air vent.

In some embodiments, a heat-conducting insulating glue is arranged in the power amplifier shielding cover, and the heat-conducting insulating glue is coated on the component and is in contact with the power amplifier shielding cover.

In some embodiments, the heat-conducting insulating glue comprises an insulating pouring sealant wrapping the component and a heat-conducting glue filled between the insulating pouring sealant and the power amplifier shielding cover.

The application adopts another technical scheme that: there is provided a radio frequency generating device comprising:

the installation shell is provided with an installation cavity;

the power amplifier module is arranged in the mounting cavity and is connected with the mounting shell;

and the power supply module is used for supplying power to the power amplifier module.

The application adopts another technical scheme that: there is provided a radio frequency thawing apparatus comprising: the radio frequency thawing assembly and the radio frequency generating device are arranged on the same side of the radio frequency thawing assembly; the radio frequency thawing assembly comprises:

a shielding cylinder provided with an opening end with an opening;

the shielding door is arranged at the opening end of the shielding cylinder body and is used for closing the opening;

The tuning plate is arranged in the shielding cylinder body and is electrically connected with the power amplification plate of the radio frequency generating device;

and the polar plate is arranged in the shielding cylinder body, is electrically connected with the tuning plate and is used for transmitting radio frequency signals.

The application adopts another technical scheme that: the refrigerator comprises a refrigerator main body and the power amplification module, wherein the power amplification module is arranged in the refrigerator main body; or the radio frequency generating device is arranged inside or outside the refrigerator main body; or the radio frequency thawing device is characterized in that the radio frequency thawing assembly is arranged in the refrigerator main body.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for the description of the embodiments will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present application, and other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

Fig. 1 shows a schematic structural diagram of a power amplifier module in an embodiment of the application.

Fig. 2 shows an exploded view of a power amplifier module in an embodiment of the application.

Fig. 3 is a schematic diagram of a power amplifier module according to another embodiment of the application.

Fig. 4 shows a schematic structural diagram of the power amplifier module of fig. 3 after the power amplifier shielding cover is hidden.

Fig. 5 is a schematic diagram of a power amplifier module according to another embodiment of the application.

Fig. 6 shows a full section of the power amplifier module of fig. 5 in an exploded state.

Fig. 7 shows a partial enlarged view at I of the power amplifier module of fig. 5.

Fig. 8 is a schematic diagram of a power amplifier module according to another embodiment of the application after explosion and partial cut-away of a power amplifier shield cover.

Fig. 9 is a schematic view showing a structure of a radio frequency generating device in a partially cut-away state of a top cover in an embodiment of the present application.

Fig. 10 shows a schematic structural view of the radio frequency generating device of fig. 9 with the top cover removed.

Fig. 11 is a schematic structural view of a radio frequency generating device according to another embodiment of the present application.

Fig. 12 is a schematic structural diagram of a power module of the radio frequency generating device according to an embodiment of the present application.

Fig. 13 is a schematic structural diagram of a power module of a radio frequency generating device according to another embodiment of the present application.

Fig. 14 shows a functional block diagram of a radio frequency thawing device in accordance with an embodiment of the present application.

Fig. 15 shows a functional block diagram of a radio frequency thawing device in accordance with another embodiment of the present application.

Fig. 16 shows a functional block diagram of a radio frequency thawing device in accordance with another embodiment of the present application.

Fig. 17 is a schematic view showing a structure of a refrigerator in an embodiment of the present application.

Fig. 18 shows a partial enlarged view at a of fig. 17.

Fig. 19 is a view showing an assembled structure of a shield cylinder and a shield door in the refrigerator of fig. 17.

Fig. 20 is a diagram showing an installation structure of a radio frequency generating device in a refrigerator according to an embodiment of the present application.

Fig. 21 is a view showing an installation structure of a radio frequency generating device in a refrigerator according to another embodiment of the present application.

Fig. 22 is a block diagram showing a structure of a refrigerator in another embodiment of the present application.

Fig. 23 is a block diagram showing a structure of a refrigerator in still another embodiment of the present application.

Reference numerals illustrate: 100-refrigerator; 10-a radio frequency generating device; 20-a refrigerator main body, 21-a mounting cavity, 22-a refrigerating assembly and 23-a U shell; 30-radio frequency thawing components, 31-shielding barrels, 31 a-opening ends, 31 c-air inlets of the shielding barrels, 31 d-air outlets of the shielding barrels, 31 e-tuning cavities, 31 f-thawing cavities and 32-shielding doors; 40-wind flow accelerator; 50-master control box.

11-mounting shells, 11 a-mounting cavities, 11 b-power amplification cavities, 11 c-power cavities, 11 d-heat dissipation holes, 11 i-hollowed holes, 11 j-drainage holes, 11 m-strong current threading holes and 11 n-weak current threading holes; 111-a bottom plate; 112-top cover, 1122-baffle 1125-junction box, 1126-cover plate; 113-separator.

12-power amplifier module, 121-power amplifier board, 121 a-first surface, 121 b-second surface, 121 c-first end, 121 d-second end, 1211-component; 122-heat sink, 122 a-air flow channel, 122 b-relief blind hole, 1221-sheet metal, 1221 a-mounting plane, 1222-fin, 1223-lug; 123-blowing components, 1231-blowing devices, 1231 a-blowing ports, 1232-air channels, 1233-air outlets, 1234-first openings, 1235-second openings; 124-power amplifier shielding cover, 124 a-air port, 124 b-air port, 124 c-window, 1241-top plate, 1242-side plate, 1243-screen, 1244-air deflector, 1244 a-air deflector flow path; 125-airflow accelerating device, 1251-airflow mouth; 126-heat conduction insulating glue, 1261-insulating pouring sealant and 1262-heat conduction glue in the power amplifier module; 127-fastener. 13-power module, 131-power panel, 132-power shell, 132 a-through hole, 133-heat conduction insulating glue in the power module; 18-fixing piece.

Detailed Description

The following description of the embodiments of the present application will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are only some, but not all embodiments of the application. All other embodiments, which can be made by those skilled in the art based on the embodiments of the application without making any inventive effort, are intended to be within the scope of the application.

Furthermore, the present application may repeat reference numerals and/or letters in the various examples, which are for the purpose of brevity and clarity, and which do not themselves indicate the relationship between the various embodiments and/or arrangements discussed. In addition, the present application provides examples of various specific processes and materials, but one of ordinary skill in the art will recognize the application of other processes and/or the use of other materials.

In the related art, the power amplification circuit directly blows and radiates heat through the fan, the air quantity utilization rate is low, in order to meet the heat radiation requirement of the power amplification circuit, only a fan with larger flow can be adopted, the equipment is large in size, and the technical problem of inconvenient use exists. The embodiment of the application provides a power amplifier module, a radio frequency generating device, a radio frequency thawing device and a refrigerator, which at least can solve the technical problem that the existing power amplifier module body and the heat dissipation efficiency cannot be considered to a certain extent.

The application is described below with reference to specific embodiments in conjunction with the accompanying drawings:

example 1:

an embodiment of the present application provides a power amplifier module 12, referring to fig. 1 and 2, an overall structure diagram and an exploded view of the power amplifier module 12 are shown. The power amplification module 12 includes a power amplification board 121, a heat dissipation member 122 and a blowing component 123, the power amplification board 121 is used for generating a radio frequency signal after power amplification, the heat dissipation member 122 is disposed on the power amplification board 121, and the heat dissipation member 122 and the power amplification board 121 can be selectively connected and fixed or only contacted. The heat sink 122 is provided with an air flow passage 122a, and heat of the heat sink 122 can be taken away when wind flows through the air flow passage 122 a. The air blowing component 123 is configured to blow air into the air flow channel 122a, dissipate heat of the power amplification board 121, the air blowing component 123 and the power amplification board 121 are sequentially disposed along the air flow direction, two ends of the power amplification board 121 in the air flow direction are respectively denoted as a first end 121c and a second end 121d, the air blowing component 123 is disposed at the first end 121c of the power amplification board 121, and the second end 121d of the power amplification board 121 can be used as an outlet end of the power amplification board 121.

Referring to fig. 2, in some embodiments, the blowing assembly 123 includes a blowing device 1231 and a duct 1232, the blowing device 1231 being configured to generate a flow of wind, and the duct 1232 communicating the blowing device 1231 with the heat sink 122. Specifically, the air duct 1232 has a first opening 1234 and a second opening 1235 that are disposed opposite to each other, the first opening 1234 is communicated with the air blowing opening 1231a of the air blowing device 1231, the second opening 1235 is communicated with the air flow channel 122a of the heat dissipation member 122, and the air flow generated by the air blowing device 1231 enters the air flow channel 122a through the air duct 1232, so that the heat dissipation member 122 is dissipated by forced convection.

When in use, the heat dissipation element 122 is in contact with the power amplification plate 121, and the heat of the power amplification plate 121 is conducted to the heat dissipation element 122. The wind flow generated by the blowing device 1231 enters the airflow channel 122a through the air duct 1232, forced convection dissipates heat of the heat dissipation part 122, and the heat dissipation part 122 further dissipates heat of the power amplification plate 121, so that the temperature of the power amplification plate 121 is effectively reduced, and the safety and reliability of products are improved. Due to the arrangement of the air duct 1232 and the heat dissipation member 122 having the air flow channel 122a, the air flow generated by the air blowing device 1231 can all enter the air flow channel 122a, the air volume utilization rate is high, and the heat dissipation requirement of the power amplification plate 121 can be met with smaller power and flow.

Referring to fig. 2, in some embodiments, the second opening 1235 of the air duct 1232 has a larger dimension in the width direction of the power amplification plate 121 than the first opening 1234. That is, the air duct 1232 adopts a flaring design, and along the flow direction of the wind flow, the size of the inner cavity of the air duct 1232 in the width direction of the power amplification plate 121 tends to increase, and specifically, linear increase, nonlinear increase or gradient increase can be adopted. To reduce wind resistance, in some embodiments, the projection of the air duct 1232 on the plane parallel to the power amplification plate 121 is trapezoidal, and the shapes of the first opening 1234 and the second opening 1235 are respectively adapted to the shape of the air blowing opening 1231a of the air blowing device 1231 and the inlet shape of the air flow channel 122a of the heat dissipation member 122.

Because the second opening 1235 of the air duct 1232 is larger than the first opening 1234 in the width direction of the power amplification plate 121, the air flow is increased in the width direction of the power amplification plate 121 in the process of flowing from the first opening 1234 to the second opening 1235 of the air duct 1232, and the air flow can be matched with a heat dissipation device, so that the air flow is blown across the whole width of the power amplification plate 121, and the heat dissipation efficiency is further improved. In addition, the air duct 1232 can also adapt the opening shapes of the blowing device 1231 and the heat dissipation member 122, so that the requirement on the shape selection of the blowing device 1231 is reduced. The blowing device 1231 may be a fan, or the like capable of generating a wind flow, and the present application is not limited thereto. In some embodiments, to further meet the miniaturization requirements of the device, the blower 1231 employs an axial flow fan.

The heat dissipation element 122 and the power amplification board 121 conduct heat, and the heat dissipation element 122 is required to have good heat conductivity, and the heat conductivity of metal and ceramic can be achieved, so that the material and shape of the heat dissipation element 122 are not limited. In some embodiments, the heat dissipation element 122 is made of metal, and may be aluminum, iron, or other metals or alloys thereof, and aluminum is preferred in view of light weight.

In order to satisfy the installation and heat dissipation of the power amplifier board 121, referring to fig. 2, the heat dissipation member 122 includes a metal plate 1221 and a plurality of heat dissipation fins 1222, the heat dissipation fins 1222 are distributed on one surface of the metal plate 1221, the heat dissipation fins 1222 are spaced apart such that gaps between the heat dissipation fins 1222 form the air flow channel 122a, and the specific number and spacing of the heat dissipation fins 1222 are determined according to the heat dissipation requirement of the power amplifier board 121, which is not limited by the present application. In certain embodiments, the metal plate 1221 is integrally formed with the heat dissipating fins 1222. The metal plate 1221 has a large mounting surface 1221a, the power amplification plate 121 is mounted on the mounting surface 1221a of the metal plate 1221 by the fastener 127, and the power amplification plate 121 is at least partially in contact with the metal plate 1221.

Because the metal is conductive, in order to ensure that the power amplification board 121 and the metal board 1221 are fully contacted as much as possible, referring to fig. 2, in some embodiments, a plurality of avoidance blind holes 122b are provided on the installation plane 1221a of the metal board 1221, the number and positions of the avoidance blind holes 122b completely correspond to the number and distribution of conductors (pins, soldering tin parts, wires, etc. of the components 1211) of the power amplification board 121, the size of the avoidance blind holes 122b is larger than that of the corresponding conductors on the power amplification board 121, so that the conductors extend into the avoidance blind holes 122b and are not contacted with the metal board 1221, thereby ensuring that the power amplification board 121 and the metal board 1221 are tightly attached, the contact area is larger, heat dissipation is facilitated, and the overall structure of the power amplification board 121 is more stable. The avoidance blind hole 122b is designed as a blind hole, so that the problem of leakage caused by contact between the conductor and water due to the design as a through hole can be avoided.

The structural strength of the heat sink 122 is higher than that of the power amplification board 121, and thus the heat sink 122 simultaneously serves as a mounting base of the power amplification board 121. In some embodiments, at least two lugs 1223 are disposed on the metal plate 1221, where the lugs 1223 may be disposed on a bottom surface or a side surface of the metal plate 1221 according to actual needs, and fixing holes for installing the fasteners 127 are disposed in the lugs 1223, and the fixing holes may be holes or threaded holes, and the fasteners 127 may be screws, rivets, pins, or other structures, which is not limited by the present application.

The power amplification board 121 is a circuit board structure, and has a first surface 121a and a second surface 121b that are disposed opposite to each other, hereinafter also referred to as a first surface 121a of the power amplification board 121 is a front surface, and a second surface 121b of the power amplification board 121 is a back surface. The power amplification board 121 generally includes a signal source and a power amplification circuit, which are electrically connected, where the signal source is used to generate an initial signal with a set frequency (e.g. 40.68 MHz), and the power amplification circuit is used to power amplify the initial signal, enhance the power of the initial signal, and output a radio frequency signal after power amplification. The power amplifying circuit can adopt primary amplification, secondary amplification, tertiary amplification or even more according to actual needs, and specific amplification stages and circuit structures of all stages of amplifying circuits can refer to relevant disclosures in the prior art, so that the application is not limited. The signal source and the power amplifying circuit may be selectively disposed on the same surface of the power amplifying board 121, or may be disposed on the first surface 121a and the second surface 121b, which is not limited by the specific arrangement mode of the present application. In some embodiments, the components 1211 (chips, inductors, capacitors, resistors, etc.) on the power amplification board 121 are located on the first surface 121a, that is, each component 1211 of the signal source and the power amplification circuit is mounted on the front surface of the power amplification board 121, the back surface of the power amplification board 121 is mainly a soldering leg, a soldering wire, etc. of a pin, and the second surface 121b of the power amplification board 121 contacts the heat dissipation element 122 for heat transfer.

In some embodiments, the mounting portion of the power amplification board 121 is further provided with other circuit boards, such as a power board 131 for supplying power to the power amplification board 121, a control board for controlling the power amplification board 121 to work, and so on, in order to avoid electromagnetic interference between the circuit boards, referring to fig. 1 and 2, the power amplification module 12 is further provided with a power amplification shielding cover 124, where the power amplification shielding cover 124 is made of a metal material, and covers the first surface 121a of the power amplification board 121 to electromagnetically shield the components 1211 on the power amplification board 121. In some embodiments, the power amplifier shielding cover 124 is only covered on the power amplifier board 121, and specifically, the power amplifier shielding cover 124 and the power amplifier board 121 are both installed on the heat dissipation element 122 through fastener 127. In other embodiments, the power amplifier shielding cover 124 may be further configured to cover the power amplifier board 121 and the heat dissipation member 122, or cover the power amplifier board 121, the heat dissipation member 122, the blower 1231, and the air duct 1232, which is not limited by the present application.

Since the power amplifier shielding cover 124 is covered on the first surface 121a of the power amplifier board 121, electromagnetic shielding is performed on the components 1211 on the power amplifier board 121, so as to prevent electromagnetic interference, but also prevent convection of air, so that heat accumulation on power devices (inductance, resistance, etc.) in the components 1211 is caused, and the temperature of peripheral components is increased. Referring to fig. 3 and 4, in some embodiments, the power amplifier shielding cover 124 is provided with an air port 124a, and the power amplifier module 12 further includes an air flow accelerating device 125, where the air flow accelerating device 125 is disposed on the power amplifier shielding cover 124, and blows air to the inner cavity of the power amplifier shielding cover 124 or draws hot air out of the inner cavity of the power amplifier shielding cover 124. By disposing the air flow accelerating device 125 on the power amplification shielding cover 124 and simultaneously providing the air port 124a on the power amplification shielding cover 124, the air flow accelerating device 125 can blow or exhaust air, and the air flow accelerating device 125 can adopt a blower, an exhaust fan, and the like.

When the airflow accelerating device 125 blows air, external cold air is blown into the power amplification shielding cover 124, and hot air in the power amplification shielding cover 124 is discharged from an air port 124a on the power amplification shielding cover 124; when the air flow accelerating device 125 performs air extraction, hot air in the power amplifier shielding cover 124 is extracted to the outside, and cold air from the outside enters the power amplifier shielding cover 124 through the air port 124a on the power amplifier shielding cover 124. That is, the hot air in the power amplifier shielding cover 124 can be replaced by cold air no matter the air flow accelerating device 125 blows air or draws air, so that the heat generated by the power device is blown to the outside of the power amplifier shielding cover 124, so as to realize heat dissipation and cooling of the power device of the power amplifier module 12. In addition, the air flow generated by the air flow accelerating device 125 can also blow away dust, insect corpses and the like in the power amplifier module 12, so as to avoid short circuit of the power amplifier board 121 caused by overlap bridging of the dust, the insect corpses and the like.

In some embodiments, when the airflow accelerating device 125 is configured to blow air to the inner cavity of the power amplification shielding cover 124, the airflow accelerating device 125 is mounted on the top plate 1241 of the power amplification shielding cover 124, and air openings 124a are spaced on the side plate 1242 of the power amplification shielding cover 124, so that the cold air drawn by the airflow accelerating device 125 directly acts on the power amplification plate 121, and then the hot air is blown out from the side plate 1242 of the power amplification shielding cover 124, so as to ensure the effect of heat dissipation and temperature reduction. The air ports 124a are arranged on the side plate 1242 of the power amplifier shielding cover 124 at intervals, so that the uniformity of air flow discharge can be improved, namely, the heat dissipation uniformity of the power amplifier module 12 is improved. In addition, the cold air sucked by the air flow accelerating device 125 directly acts on the power amplification plate 121, so that dust, insect corpses and the like in the power amplification module 12 can be better blown away.

In some embodiments, the power device on the power amplification board 121 is used as a main heating source, and is a main heat dissipation and cooling object of the power device in the power amplification module 12, so that in order to achieve faster heat dissipation and cooling of the power device, the position of the power device is set opposite to the air port 124a on the side plate 1242 of the power amplification shielding cover 124, so that heat generated by the power device is discharged from the air port 124a on the side plate 1242 of the power amplification shielding cover 124, and the heat dissipation and cooling effect of the power amplification module 12 is improved.

Referring to fig. 4, in some embodiments, in order to further improve the heat dissipation and cooling effect of the power amplifier module 12, an air deflector 1244 is disposed in the power amplifier shielding cover 124, the power amplifier shielding cover 124 and the area surrounded by the first surface 121a of the power amplifier board 121 are separated into a plurality of air guide channels 1244a by the air deflector 1244, and the air guide channels 1244a are communicated with the air flow openings 1251 and 124a of the air flow accelerating device 125, and the power devices are located in the air guide channels 1244 a. On the one hand, the air flow rate can be increased by arranging the air guide flow passage 1244a, so as to improve the replacement efficiency of cold air and hot air, and on the other hand, as described above, the power device in the power amplifier module 12 is a main heat dissipation and cooling object, so that the power device is arranged in the air guide flow passage 1244a, and the heat generated by the power device can be quickly blown to the outside. Thereby further improving the heat dissipation and cooling effects of the power amplifier module 12 as a whole.

In order to dissipate heat of the power device (such as inductance and resistance) in the component 1211, referring to fig. 5 and 6, in other embodiments, a vent 124b is provided on the power amplifier shielding cover 124 at a position opposite to the power device, and by providing the vent 124b on the power amplifier shielding cover 124, heat in the power amplifier shielding cover 124 can be exhausted to the outside through the vent 124b, so as to dissipate heat of the power device and reduce temperature. In addition, the power device is used as a main heating source and is a main heat dissipation and cooling object in the power amplifier module 12, so that the position of the power device is opposite to the air vent 124b on the power amplifier shielding cover 124 in order to realize faster heat dissipation and cooling of the power device. In some embodiments, in order to improve the heat dissipation and cooling effect of the power amplifier module 12, the top plate 1241 and the side plate 1242 of the power amplifier shielding cover 124 are provided with air vents 124b, so that more external cold air can perform convection with the hot air in the power amplifier shielding cover 124, and airflow is promoted to flow, thereby improving the heat dissipation and cooling effect of the power amplifier module 12.

Referring to fig. 5 and 7, in some embodiments, in order to prevent the electromagnetic leakage of the power amplifier module 12 from having a safety hazard and prevent the insect from invading to short-circuit the power amplifier board 121, the power amplifier module 12 further includes a mesh plate 1243, a window 124c is formed on the power amplifier shielding cover 124, the mesh plate 1243 is located in the window 124c of the power amplifier shielding cover 124, and the mesh holes of the mesh plate 1243 form the air vent 124b. So as to avoid electromagnetic leakage and insect invasion of the power amplifier module 12 while ensuring the heat dissipation and temperature reduction effects of the power amplifier module 12. In other embodiments, the air vent 124b and the air vent 124a may be formed on the power amplifier shielding cover 124 at the same time, and the airflow accelerating device 125 is provided to improve the heat dissipation effect of the power device.

Because the power amplifier shielding cover 124 is made of metal and is a good conductor of heat, in some embodiments, referring to fig. 8, a heat conducting insulating glue 126 is disposed inside the power amplifier shielding cover 124, the heat conducting insulating glue 126 is coated on the power device, and the power amplifier shielding cover 124 is covered on the first surface 121a of the power amplifier board 121 and is in contact with the heat conducting insulating glue 126. The heat conducting insulating glue 126 is coated on the power device to ensure the heat dissipation uniformity of the power device, thereby realizing the heat dissipation and temperature reduction of the power device. When the power device is filled, a mold is arranged outside the power device in advance, then the heat-conducting insulating glue 126 is filled in the mold, the power device is wrapped by the heat-conducting insulating glue 126, the mold can be disassembled after the heat-conducting insulating glue 126 is solidified, and the heat-conducting insulating glue 126 is filled between the power device after demolding and the power amplifier shielding cover 124 cover, so that the purpose of good heat dissipation is achieved.

In some embodiments, in order to avoid that after the heat-conducting insulating glue 126 is coated on the power device, because the heat-conducting insulating glue 126 may have uneven surface, the heat-conducting insulating glue is directly attached to the power amplifier shielding cover 124 cover, and poor contact may occur, which results in poor heat dissipation effect, so that the heat-conducting insulating glue 126 is set to include an insulating pouring sealant 1261 for wrapping an inductor and a heat-conducting glue 1262 filled between the insulating pouring sealant 1261 and the power amplifier shielding cover 124, and the insulating pouring sealant 1261 has heat-conducting property at the same time. On the one hand, the insulating pouring sealant 1261 is used for coating the power device so as to ensure the heat dissipation uniformity of the power device, and on the other hand, the insulating pouring sealant 1261 and the power amplifier shielding cover 124 are filled with the heat conduction adhesive 1262 so as to ensure that the heat conduction adhesive 1262 is better attached to the insulating pouring sealant 1261 and the power amplifier shielding cover 124, so that poor contact is reduced to a certain extent, and the heat dissipation and cooling effects are improved.

Example 2:

based on the same inventive concept, the embodiment of the present application provides a radio frequency generating device 10, which includes a mounting shell 11, a power amplification module 12 for generating a radio frequency signal after power amplification, and a power supply module 13 for supplying power to the power amplification module 12, where the power amplification module 12 specifically adopts the power amplification module 12 of the foregoing embodiment 1, and the specific structure is not described herein, and since the power amplification module 12 is provided with a blower 1231, in some embodiments, a damping pad, for example, a rubber pad or a silica gel pad, is disposed between the blower 1231 and the mounting shell 11, so as to realize damping of the blower 1231. The power module 13 is internally provided with an ac/dc conversion circuit and a voltage regulating circuit, and is used for performing ac/dc conversion and voltage regulation, and supplying low-voltage dc power to the power amplifier module 12.

Referring to fig. 12, in some embodiments, the power module 13 includes a power supply housing 132 and a power supply board 131 disposed in the power supply housing 132, the power supply housing 132 protecting the power supply board 131. In some embodiments, as shown in fig. 13, a plurality of through holes 132a are formed in the power supply housing 132 for heat dissipation of the power panel 131. Considering that there is a gap between the power supply housing 132 and the power supply board 131, the power supply board 131 and the power supply housing 132 conduct heat only through air, so that the heat dissipation effect is poor, and the service life of the power supply board 131 may be affected, as shown in fig. 13, in other embodiments, the power supply housing 132 is filled with a heat-conducting insulating glue 133, the heat-conducting insulating glue 133 is in contact with both the power supply board 131 and the power supply housing 132, and the heat-conducting insulating glue 133 is wrapped around a component 1211 on the power supply board 131.

Specifically, the heat-conducting insulating glue 133 is disposed in the power module 13, and the heat-conducting insulating glue 133 is disposed between the power panel 131 and the power shell 132 of the power module 13, so that on one hand, water, insects and the like outside the power module 13 can be prevented from entering the power module 13 to erode the components 1211 on the power panel 131, so as to achieve the waterproof and insect-preventing effects, and on the other hand, heat generated by the components 1211 on the power panel 131 can be conducted to the power shell 132 through the heat-conducting insulating glue 133, so that the heat dissipation effect of the power module 13 is improved. In addition, the heat conductive insulating paste 133 wraps the components 1211 on the power board 131, and heat dissipation uniformity of the components 1211 can be improved. Thereby improving the reliability and safety of the power module 13 as a whole.

In some embodiments, in order to ensure the bonding degree of the heat-conducting insulating glue 133 with the power panel 131 and the power supply housing 132, poor contact is avoided, and the heat dissipation effect is affected, so that the glue filling mode is adopted, the through hole 132a arranged on the power supply module 13 can be used as a glue filling hole, glue filling is performed through the through hole 132a on the power supply module 13, the bonding degree of the heat-conducting insulating glue 133 with the power panel 131 and the power supply housing 132 is improved, and the heat dissipation effect of the power supply module 13 is ensured to a certain extent.

The radio frequency generating device 10 is controlled by a control system (e.g. MCU controller) on a control board when in operation, the control board is electrically connected with the power module 13 and the power amplifier module 12, the control board is electrically connected with an external input device (display screen, operation panel, keyboard, etc.), receives an operation instruction sent by a user, and controls circuits in the power module 13 and the power amplifier module 12 to work. When the output power of the power amplifier module 12 needs to be regulated, the control board calculates a voltage regulation control instruction based on an internal algorithm and sends the voltage regulation control instruction to the power module 13, and the power module 13 regulates the voltage to change the output voltage of the power module 13. For the power amplification board 121 provided with the detection circuit, the control board is electrically connected with the detection circuit, the detection circuit detects the output power of the power amplification module 12 and feeds back to the control module, and the control module performs relevant control on the signal source, the power amplification circuit and the power supply module 13 through an internal algorithm.

In some embodiments, the functions of the control board are integrated on the device on which the rf generator 10 is mounted, such as a refrigerator in which the rf generator 10 is configured, and the functions of the control board may be integrated on a main control board of the refrigerator. In some embodiments, the control board is a circuit board which is separately arranged, the control board exists independently of the power module 13 and the power amplifier module 12 to form a control module, under the arrangement scheme, the installation positions of the power amplifier module 12, the power module 13 and the control module can be set according to actual needs, the power amplifier module 12 is arranged in the installation cavity 11a of the installation shell 11 and is fixedly connected with the installation shell 11, and the power module 13 and the control module can be selectively arranged in the installation shell 11 or on a device main body carried by the radio frequency generating device 10. Taking a refrigerator provided with a radio frequency thawing device as an example, a radio frequency generating device 10 is arranged in the radio frequency thawing device, a mounting shell 11 with a built-in power amplifier module 12 can be selectively arranged inside or outside a refrigerator main body of the refrigerator, a power module 13 can be selectively arranged in the mounting shell 11, or positioned outside the mounting shell 11 and inside the refrigerator main body, and a control module can be selectively arranged in the mounting shell 11, or positioned outside the mounting shell 11 and inside the refrigerator main body.

In other embodiments, the control board and the power amplifier board 121 may be integrated on the same circuit board, as shown in fig. 16. In this embodiment, since the power amplifier module 12 generates a high-frequency signal, it is easy to interfere with the control system drawn on the same electronic control board, and thus, it is necessary to perform internal structural shielding according to the actual layout, that is, the shielding case only covers the relevant components 1211 of the power amplifier board 121 to perform electromagnetic shielding, and the structural design and installation of the shielding case are relatively complex and have high cost. Meanwhile, since the power amplifier board 121 needs to be designed by using a multi-layer board, and a PCB high-frequency board with higher cost must be adopted, and the material of the control board for the board is generally unlimited, integrating the control board and the power amplifier board 121 on the same circuit board can result in that the whole board needs to use the PCB high-frequency board, so that the overall cost of the radio frequency generating device 10 is increased. In addition, the heat source of the whole radio frequency generating device 10 is mainly in the power amplifier module 12, the control board and the power amplifier board 121 are drawn on the same circuit board, and the heat generated by the power amplifier board 121 causes the control system to be heated, so that the reliability of the whole radio frequency generating device 10 is affected.

In other embodiments, the control board is integrated with the power module 13 on the same circuit board, as shown in fig. 15. In this embodiment, since the control board is integrated with the power module 13 and the same circuit board, the power amplifier board 121 and the control board are all independently arranged, and only the power amplifier board 121 adopts a PCB high-frequency board, the consumption of the PCB high-frequency board is minimum, and the independent control module only needs to adopt a common low-cost material, so that the cost is reduced. Meanwhile, the power amplification plate 121, the control plate and the power module 13 are all independently arranged, the power amplification module 12 does not need to carry out special shielding design on the shielding cover according to the internal layout of the circuit board, only a simple outer cover shielding power amplification plate 121 is needed to be designed, and the design complexity and cost are reduced. Meanwhile, as the power amplification plate 121, the control plate and the power module 13 are arranged independently, heat insulation is carried out through air in installation, heat radiation of the power amplification module 12 to the control module is greatly reduced, and reliability of the whole radio frequency generating device 10 is improved.

The installation shell 11 is of a hollow structure, the inner cavity is an installation cavity 11a for installing an electronic module (at least one of the power amplifier module 12, the power module 13 and the control module is referred to as a power amplifier module), the installation shell 11 can be of a split type structure or an integral type structure, and the application is not limited. Referring to fig. 9 and 10, in some embodiments, the mounting case 11 includes a base plate 111 and a top cover 112 covering the base plate 111, the base plate 111 and the top cover 112 enclose a mounting cavity 11a, and an electronic module disposed in the mounting cavity 11a is fixedly connected to the base plate 111. Referring to fig. 11, in other embodiments, the mounting case 11 includes only a top cover 112, the inner cavity of the top cover 112 forms a mounting cavity 11a, the electronic module disposed in the mounting cavity 11a is fixedly connected to the top cover 112, and the top cover 112 is inverted and connected to a device configured with the radio frequency generating device 10 to close the mounting cavity 11a. In other embodiments, the mounting housing 11 includes a bottom cover and a sealing plate that covers the bottom cover. In still other embodiments, the mounting housing 11 includes two snap covers with openings that snap together in opposition. The constitution of the mounting case 11 is not limited by the present application.

Referring to fig. 10, in some embodiments, the mounting shell 11 includes a top cover 112 and a bottom plate 111, where a plurality of hollow holes 11i are formed at an edge position of the bottom plate 111, and the shape of the hollow holes 11i may be any shape such as square, strip, circular, oval, etc., which is not limited by the present application. The plurality of hollowed holes 11i are arranged at intervals along the edge of the bottom plate 111, wherein the number of hollowed holes 11i is at least two, and the hollowed holes are respectively arranged at edge positions of the bottom plate 111 in different directions and are all located in an area surrounded by the surrounding edge 1112. The number of the hollowed holes 11i should satisfy that all the positions of the bottom plate 111 are provided, for example, when the bottom plate 111 is a rectangular plate, the number of the hollowed holes 11i should be at least four, so that at least one hollowed hole 11i is provided on four sides of the rectangle. The plurality of hollowed-out holes 11i are uniformly arranged at intervals on the edge of the bottom plate 111, so that a circle of hollowed-out area is formed at the edge position of the bottom plate 111, the structural strength of the edge of the bottom plate 111 is reduced, and the mounting surface with different concave-convex shapes can be better adapted when the bottom plate 111 is mounted.

The side wall of the top cover 112 covers at least part of the hollow hole 11i in the formed installation cavity 11a, so that the installation cavity 11a is communicated with the outside through the hollow hole 11i, that is, the hollow hole 11i can also serve as a drain hole 11j of the whole installation shell 11 to drain water entering the installation cavity 11 a. The electronic module installed in the installation cavity 11a is located in the area surrounded by the plurality of hollowed holes 11i, that is, the electronic module is farther away from the surrounding edge 1112 than the hollowed holes 11i, and the projection of the electronic module on the bottom plate 111 is not overlapped with the hollowed holes 11i, because the hollowed holes 11i penetrate through the bottom plate 111, when water enters the installation cavity 11a, water can be discharged from the hollowed holes 11i, that is, the hollowed holes 11i can be simultaneously used as drainage holes of the bottom plate 111, so that water entering the installation cavity 11a can be discharged through the hollowed holes 11i without contacting the electronic module, and the situation that the electronic module in the installation cavity 11a is in contact with water to cause electric leakage or short circuit is avoided.

In the case where more than two electronic modules are disposed in the mounting cavity 11a of the radio frequency generating device 10, in order to avoid the mutual influence of the plurality of electronic modules, referring to fig. 10, in some embodiments, a partition plate 113 is disposed in the inner cavity of the mounting shell 11, the partition plate 113 divides the mounting cavity 11a of the mounting shell 11 into two independent chambers, and the partition plate 113 may be integrally formed with the mounting shell 11 or fixedly connected with the mounting shell 11 by gluing, welding, or the like. When the mounting case 11 includes the bottom plate 111 and the top cover 112 covering the bottom plate 111, the partition 113 may alternatively be provided on the bottom plate 111 or the top cover 112, and in some embodiments, the partition 113 may also be provided on the bottom plate 111 or the top cover 112, respectively, and the two partitions 113 abut or overlap in the height direction. When the mounting case 11 includes only the top cover 112, the partition 113 is provided on the top cover 112.

Referring to fig. 10 and 11, in some embodiments, a power module 13 and a power amplifier module 12 are disposed in the installation cavity 11a of the radio frequency generating device 10, and the control module is external, or the control board is integrated with the power panel 131 or the power amplifier panel 121. The inner cavity of the installation shell 11 is divided into a power amplification cavity 11b and a power supply cavity 11c through a partition plate 113, the power supply module 13 and the power amplification module 12 are separately placed, the power amplification module 12 is arranged in the power amplification cavity 11b, and the power supply module 13 is arranged in the power supply cavity 11 c. Because the power amplifier module 12 is provided with the air blowing component 123, the power amplifier cavity 11b and the power amplifier cavity 11c are relatively airtight, the air flow blown by the air blowing component 123 only can be disturbed in the power amplifier cavity 11b, compared with the condition that the partition plate 113 is not arranged, the air flow flows in a smaller space, the wind noise is relatively smaller, the power amplifier module 13 is free to radiate heat, the power amplifier cavity 11c can be provided with no radiating holes 11d, so that the power amplifier cavity 11c becomes an airtight chamber, or compared with the power amplifier cavity 11b, the radiating holes 11d are reduced, and the water spraying risk of the power panel 131 is reduced.

The electronic module installed in the installation cavity 11a needs to be electrically connected with external electrical devices to realize power supply or signal transmission, so that a wire through hole is also required to be arranged on the installation shell 11, and the wire through hole is also a through hole 132a penetrating through the wall plate of the installation shell 11, and from the perspective of water resistance, the wire through hole should be as close to the edge of the installation shell 11 and far away from the electronic devices as possible. In some embodiments, the via holes are located in the area where the hollowed holes 11i are located, that is, the hollowed holes 11i and the via holes are all distributed at the same position of the mounting shell 11. When the electronic module is the power amplifier module 12 and/or the control module, since the power amplifier module 12 and the control module both use low-voltage direct current, only one wire passing hole can be arranged, and when the electronic module comprises the power module 13, since the power module 13 regulates the commercial power into low-voltage direct current for the power amplifier module 12 and the control module, two wire passing holes are required to be arranged, one wire passing hole is used for the strong current wire harness 16 to pass out, and the other wire passing hole is used for the weak current wire harness 17 to pass out.

Referring to fig. 16, in some embodiments, a power module 13 and a power amplifier module 12 are disposed in a mounting cavity 11a of the radio frequency generating device 10, and a control module is external, or a control board is integrated with a power board 131 or a power amplifier board 121. The installation shell 11 is provided with two wire passing holes, namely a strong current threading hole 11m and a weak current threading hole 11n, wherein the strong current threading hole 11m and the weak current threading hole 11n are distributed at intervals and are communicated with the installation cavity 11 a. Only a weak current harness is arranged on the power amplification module 12 and is used for supplying power to the power amplification plate 121 and the blowing device 1231, outputting radio frequency signals and detection signals after power amplification, and receiving control instructions of a control panel. Referring to fig. 16, the power amplifier module 12 is disposed in the mounting cavity 11a and far away from the strong electric threading hole 11m, and the power module 13 is disposed in the mounting cavity 11a and near the strong electric threading hole 11m, i.e. the power module 13 is closer to the strong electric threading hole 11m than the power amplifier module 12. The strong current and the weak current are separated to form the wiring, so that the discharge risk of the radio frequency generating device 10 is reduced, the reliability of electromagnetic shielding is improved, the safety requirements are met, and the safety reliability of the radio frequency generating device 10 is improved.

The strong current threading hole 11m and the weak current threading hole 11n may be located at different areas of the installation housing 11, and in some embodiments, referring to fig. 10, the strong current threading hole 11m and the weak current threading hole 11n are located at the same side of the installation housing 11, and the weak current threading hole 11n is closer to the power amplification board 121 than the strong current threading hole 11m, thereby making the lengths of the strong current harness 16 and the weak current harness 17 both shorter. When the installation housing 11 includes the bottom plate 111 and the top cover 112, both the strong current threading hole 11m and the weak current threading hole 11n are provided on the bottom plate 111, as shown in fig. 10. Since the bottom plate 111 is covered by the top cover 112, the entire rf generator 10 is more waterproof when the strong current through holes 11m and the weak current through holes 11n are provided in the bottom plate 111. When the installation case 11 includes only the top cover 112, the strong current threading hole 11m and the weak current threading hole 11n are both provided on the top cover 112, as shown in fig. 11, the strong current threading hole 11m and the weak current threading hole 11n may be both provided on the top wall 1124 or the side wall 1121 of the top cover 112, which is not limited by the present application.

Since the top cover 112 is directly exposed, when the strong current threading hole 11m and the weak current threading hole 11n are both formed in the top cover 112, the waterproof requirements of the strong current threading hole 11m and the weak current threading hole 11n need to be considered, and the shapes and the sizes of the strong current threading hole 11m and the weak current threading hole 11n are matched with the cross-sectional shapes and the sizes of the corresponding strong current wire harness 16 and the weak current wire harness 17. Referring to fig. 11 and 21, in some embodiments, the top cover 112 is provided with two terminal boxes 1125, the two terminal boxes 1125 are fixedly connected and sealed with the top cover, and the wiring harness in the device and the wiring harness of the electronic module are wired in the terminal boxes 1125. The junction box 1125 and the top cover 112 may be separately disposed and fixedly connected by screws, and in some embodiments, the junction box 1125 and the top cover 112 may be provided as a unitary structure, for example, a sink is disposed in the top cover 112 as the junction box 1125, and a cover plate 1126 is disposed over the opening of the junction box 1125 to close the junction box 1125, and the cover plate 1126 is flush with the surface of the top cover 112.

Since the electronic module generates heat during operation, in order to meet the heat dissipation requirement of the electronic module, referring to fig. 11, in some embodiments, a plurality of heat dissipation holes 11d are formed on the side wall of the body of the mounting shell 11 at intervals, and when the internal electronic module generates heat, the heat is dissipated outwards through air, so as to dissipate the heat of the electronic module. The heat dissipation holes 11d are formed on at least one side wall of the installation shell 11, and in some embodiments, the heat dissipation holes 11d are formed on at least two opposite side walls of the installation shell 11, so that air flow passing through the installation cavity 11a is formed, and the heat dissipation effect is effectively improved; or the heat radiation holes 11d are opened on the side walls except the side wall facing the user, thereby improving the beauty of the mounting case 11 while improving the heat radiation effect.

The side wall of the installation shell 11 is provided with the baffle 1122 used for shielding the radiating hole 11d in the direction parallel to the side wall, the baffle 1122 is arranged at a position corresponding to the radiating hole 11d, the projection of the baffle 1122 on the side wall of the installation shell 11 covers the radiating hole 11d, namely, the radiating hole 11d is completely covered by the baffle 1122 when seen from the direction perpendicular to the side wall, and the shielding effect of the baffle 1122 is utilized to effectively prevent water or dust and the like from directly entering the installation shell 11, so that the possibility of damaging the electronic module is reduced while the radiating effect is realized. For the mounting case 11 including the bottom plate 111 and the top cover 112, and the mounting case 11 provided with only the top cover 112, the heat radiation holes 11d are provided on the side wall of the top cover 112. The baffle 1122 may be integrally formed with the side wall to increase the strength of the overall structure, or may be fixedly attached to the side wall by means such as heat welding to facilitate control of the form thereof during the manufacturing process, thereby facilitating the production and assembly.

The baffle 1122 may be provided on the outer surface of the installation housing 11 or may be provided on the inner surface of the installation housing 11, and the baffle 1122 may be provided at an angle to the side wall 1121, and the baffle 1122 may be a straight plate, a bent plate (e.g., V-shaped plate, L-shaped plate, Y-shaped plate, W-shaped plate, etc.), or a bent plate (e.g., C-shaped plate, U-shaped plate, S-shaped plate, etc.), and the specific shape of the present application is not limited.

Example 3:

based on the same inventive concept, an embodiment of the present application provides a radio frequency thawing device, which includes a radio frequency thawing assembly 30 and the radio frequency generating device 10 of the above embodiment 2, wherein a tuning plate 33 and a polar plate 34 are disposed in the radio frequency thawing assembly 30, the tuning plate 33 is electrically connected with a tuning inductor, and the tuning inductor is selectively disposed on the tuning plate 33 or independent from the tuning plate 33. The tuning plate 33 is electrically connected with the power amplification plate 121 of the radio frequency generating device 10, the tuning module is used for balancing the impedance of the load end so as to realize impedance matching, and the polar plate 34 is electrically connected with the tuning plate 33 and is used for transmitting radio frequency signals with set frequencies. The signal output by the power amplification module 12 is a radio frequency signal corresponding to the standard load after power amplification, and the tuning module is used for adjusting the impedance of the load end. The different thawed materials have different impedances, the impedance of the drawer is not the standard load impedance, the load impedance changes in the thawing process, impedance matching is realized through the tuning module, the impedance matching is equivalent to the standard load, the control module controls the tuning module to perform impedance matching, the tuning module outputs a signal to the polar plate 34, and the polar plate 34 sends out a radio frequency signal, so that the thawing purpose of the food materials is realized.

Referring to fig. 17, 18 and 19, the rf thawing assembly 30 further comprises a shield cylinder 31 and a shield door 32, the shield cylinder 31 being provided with an open end 31a with an opening, the shield door 32 being provided at the open end 31a of the shield cylinder 31 for closing the opening to form a closed shield cavity together with the shield cylinder 31. The tuning plate 33 and the polar plate 34 are arranged in the shielding barrel 31, the shielding barrel 31 can provide a mounting foundation for the tuning plate 33 and the polar plate 34, the purpose of protecting the tuning plate 33 and the polar plate 34 can be achieved, radio frequency signals emitted by the polar plate 34 can be shielded, and radio frequency signal leakage is avoided.

Referring to fig. 17, in some embodiments, a tuning chamber 31e and a thawing chamber 31f are provided in the shield cylinder 31, the tuning plate 33 and the polar plate 34 are both provided in the tuning chamber 31e, the thawing chamber 31f is used for containing food to be thawed, and the polar plate 34 radiates radio frequency energy into the thawing chamber 31f, thereby thawing the food in the thawing chamber 31 f. The tuning plate 33 and the polar plate 34 are placed separately from the food material, so that pollution to the food material is avoided, and water melted after thawing the food material is prevented from contacting the tuning plate 33 and the polar plate 34 to damage the component 1211.

Referring to fig. 18, in some embodiments, the shielding cylinder 31 is further provided with an air inlet 31c and an air outlet 31d that are in communication with the tuning cavity 31e, where the air inlet 31c and the air outlet 31d may be disposed on the same side wall 1121 of the shielding cylinder 31, or may be disposed on different side walls 1121, which is not limited in this aspect of the application.

Example 4:

based on the same inventive concept, referring to fig. 23, an embodiment of the present application provides a refrigerator 100 including a refrigerator main body 20 and a radio frequency thawing device. The radio frequency thawing device includes the power amplifier module 12 of the above embodiment 1, where the power amplifier module 12 is disposed in the refrigerator main body 20, for example, in the main control box 50 of the refrigerator main body 20, and in the cabin of the refrigerator main body 20, the specific structure of the power amplifier module 12 is referred to embodiment 1, and will not be described herein.

The power module 13 and the control module of the radio frequency thawing device are disposed inside the refrigerator main body 20, for example, in the main control box 50 of the refrigerator main body 20, in the cabin of the refrigerator main body 20, and the control module may also be disposed on the same circuit board as the main control board of the refrigerator 100. The radio frequency thawing assembly 30 of the radio frequency thawing device is disposed in the refrigerator main body 20, specifically, the refrigerator main body 20 is provided with an installation cavity 21, the radio frequency thawing assembly 30 is disposed in the installation cavity 21, and the specific structure of the radio frequency thawing device is described in reference to embodiment 3 and will not be repeated here. The installation cavity 21 is located in one of the freezing chamber, the refrigerating chamber, and the temperature changing chamber of the refrigerator 100, and the present application is not limited.

Example 5:

based on the same inventive concept, referring to fig. 17, an embodiment of the present application provides a refrigerator 100 including a refrigerator main body 20 and a radio frequency thawing device. The radio frequency thawing device includes the radio frequency generating device 10 of the above embodiment 2, and the radio frequency generating device 10 is disposed inside or outside the refrigerator main body 20, and the specific structure thereof refers to the above embodiment 2 and is not described herein. The radio frequency thawing assembly 30 of the radio frequency thawing device is disposed in the refrigerator main body 20, specifically, the refrigerator main body 20 is provided with an installation cavity 21, the radio frequency thawing assembly 30 is disposed in the installation cavity 21, and the specific structure of the radio frequency thawing device is described in reference to embodiment 3 and will not be repeated here. The installation cavity 21 is located in one of the freezing chamber, the refrigerating chamber, and the temperature changing chamber of the refrigerator 100, and the present application is not limited. A refrigerating assembly 22 for refrigerating is provided in the refrigerator main body 20 for supplying cold to at least one of the freezing chamber, the refrigerating chamber, and the temperature changing compartment.

In some embodiments, the rf generating device 10 is disposed outside the refrigerator main body 20, and the rf generating device 10 may be disposed on the top, back or side of the refrigerator main body 20, which is not limited by the present application. Referring to fig. 20, in some embodiments, the rf generating device 10 is located at the top surface of the refrigerator main body 20, the mounting case 11 of the rf generating device 10 is connected to the U-shaped case 23 at the top of the refrigerator main body 20 through the fixing member 18, and when the mounting case 11 includes the base plate 111 and the top cover 112, both the electronic module and the top cover 112 are mounted on the base plate 111, and the base plate 111 is mounted at the top surface of the U-shaped case 23 through the fixing member 18. Referring to fig. 21, in some embodiments, the mounting housing 11 includes only a top cover 112, the electronic module is mounted on the inner surface of the top wall 1124 of the top cover 112, and the top cover 112 is flip-off mounted to the top surface of the U-shaped housing 23 by the fixing member 18.

Example 6:

based on the same inventive concept, referring to fig. 22, an embodiment of the present application provides a refrigerator 100 including a refrigerator main body 20 and the radio frequency thawing apparatus of embodiment 3 described above. The radio frequency thawing device is integrally provided inside the refrigerator main body 20. The specific structure of the rf thawing apparatus is described in embodiment 3, and will not be described here again.

Specifically, the refrigerator main body 20 is provided with an installation cavity 21, the radio frequency thawing device is disposed in the installation cavity 21, and the specific structure of the radio frequency thawing device is described in reference to embodiment 3, which is not repeated here. The installation cavity 21 is located in one of the freezing chamber, the refrigerating chamber, and the temperature changing chamber of the refrigerator 100, and the present application is not limited.

Example 7:

based on the same inventive concept, referring to fig. 17, an embodiment of the present application provides a refrigerator 100 including a refrigerator main body 20 and the radio frequency thawing apparatus of embodiment 3 described above. The radio frequency generating device 10 of the radio frequency thawing device is disposed inside or outside the refrigerator main body 20, and the specific structure thereof is described in the above embodiment 2, and will not be repeated here. The radio frequency thawing assembly 30 of the radio frequency thawing device is disposed in the refrigerator main body 20, specifically, the refrigerator main body 20 is provided with the mounting cavity 21, the radio frequency thawing assembly 30 is disposed in the mounting cavity 21, and the specific structure of the radio frequency thawing device is described in embodiment 3. The installation cavity 21 is located in one of the freezing chamber, the refrigerating chamber, and the temperature changing chamber of the refrigerator 100, and the present application is not limited. A refrigerating assembly 22 for refrigerating is provided in the refrigerator main body 20 for supplying cold to at least one of the freezing chamber, the refrigerating chamber, and the temperature changing compartment.

In some embodiments, the rf generating device 10 is disposed outside the refrigerator main body 20, and the rf generating device 10 may be disposed on the top, back or side of the refrigerator main body 20, which is not limited by the present application. Referring to fig. 20, in some embodiments, the rf generating device 10 is located at the top surface of the refrigerator main body 20, the mounting case 11 of the rf generating device 10 is connected to the U-shaped case at the top of the refrigerator main body 20 through the fixing member 18, and when the mounting case 11 includes the base plate 111 and the top cover 112, both the electronic module and the top cover 112 are mounted on the base plate 111, and the base plate 111 is mounted at the top surface of the U-shaped case through the fixing member 18. Referring to fig. 21, in some embodiments, the mounting housing 11 includes only a top cover 112, the electronic module is mounted on the inner surface of the top wall 1124 of the top cover 112, and the top cover 112 is flip-off mounted to the top surface of the U-shaped housing by the fastener 18.

In some embodiments, referring to fig. 18, the shielding cylinder 31 of the rf thawing assembly 30 is further provided with an air inlet 31c and an air outlet 31d that are in communication with the tuning cavity 31e, and the air inlet 31c and the air outlet 31d may be disposed on the same side wall 1121 of the shielding cylinder 31 or may be disposed on different side walls 1121, which is not limited in this aspect of the application. The side wall 1121 provided with the air inlet 31c and the air outlet 31d and the mounting cavity 21 have a gap a therebetween, so that the air circulation is formed between the air inlet 31c and the air outlet 31d and the gap a between the side wall 1121 provided with the air inlet 31c and the air outlet 31d and the mounting cavity 21, and the heat dissipation is performed on the tuning cavity 31 e. In some embodiments, referring to fig. 18, the refrigerator 100 further includes a wind flow accelerator 40, and the wind flow accelerator 40 accelerates cool wind into the tuning cavity 31e through the gap a and the wind inlet 31c to accelerate air circulation, thereby improving heat dissipation efficiency.

In the present application, unless expressly stated or limited otherwise, a first feature "above" or "below" a second feature may include both the first and second features being in direct contact, as well as the first and second features not being in direct contact but being in contact with each other through additional features therebetween. Moreover, a first feature being "above," "over" and "on" a second feature includes the first feature being directly above and obliquely above the second feature, or simply indicating that the first feature is higher in level than the second feature. The first feature being "under", "below" and "beneath" the second feature includes the first feature being directly under and obliquely below the second feature, or simply means that the first feature is less level than the second feature.

In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise" indicate orientations or positional relationships are based on the orientations or positional relationships shown in the drawings, are merely for convenience in describing the present application and simplify the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and therefore should not be construed as limiting the present application.

It should be noted that all the directional indicators in the embodiments of the present application are only used to explain the relative positional relationship, movement conditions, etc. between the components in a specific posture, and if the specific posture is changed, the directional indicators are correspondingly changed.

In the present application, unless specifically stated and limited otherwise, the terms "connected," "affixed," and the like are to be construed broadly, and for example, "affixed" may be a fixed connection, a removable connection, or an integral body; can be mechanically or electrically connected; either directly or indirectly, through intermediaries, or both, may be in communication with each other or in interaction with each other, unless expressly defined otherwise. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art according to the specific circumstances.

Furthermore, descriptions such as those referred to as "first," "second," and the like, are provided for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implying an order of magnitude of the indicated technical features in the present disclosure. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more features. In the description of the present application, the meaning of "a plurality" is two or more, unless explicitly defined otherwise.

In the description of the present specification, a description referring to terms "one embodiment," "some embodiments," "examples," "specific examples," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present application. In this specification, schematic representations of the above terms are not necessarily directed to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Further, one skilled in the art can engage and combine the different embodiments or examples described in this specification.

In addition, the technical solutions of the embodiments may be combined with each other, but it is necessary to base that the technical solutions can be realized by those skilled in the art, and when the technical solutions are contradictory or cannot be realized, the combination of the technical solutions should be considered to be absent and not within the scope of protection claimed in the present application.

While embodiments of the present application have been shown and described, it will be understood by those of ordinary skill in the art that: many changes, modifications, substitutions and variations may be made to the embodiments without departing from the spirit and principles of the application, the scope of which is defined by the claims and their equivalents.

Claims (14)

1. A power amplifier module, comprising:

the power amplification board is used for generating radio frequency signals after power amplification;

the heat dissipation piece is arranged on the power amplification plate and is provided with an airflow channel;

a blowing device for generating a wind flow;

the air duct is provided with a first opening and a second opening which are oppositely arranged, the first opening is communicated with the air blowing opening of the air blowing device, and the second opening is communicated with the air flow channel of the heat radiating piece.

2. The power amplifier module of claim 1, wherein: the second opening has a larger dimension than the first opening in the width direction of the power amplification board.

3. The power amplifier module of claim 1, wherein: the heat dissipation piece is made of metal and comprises a metal plate and a plurality of heat dissipation fins which are arranged on one surface of the metal plate at intervals, and gaps among the plurality of heat dissipation fins which are arranged at intervals form the air flow channel; the power amplification plate is connected to the metal plate and is in contact with the metal plate.

4. A power amplifier module as claimed in claim 3, characterized in that: the surface of the metal plate, which is close to the power amplification plate, is provided with a avoidance blind hole for accommodating a conductor of the power amplification plate;

and/or; the metal plate is provided with at least two lugs, and fixing holes for installing fasteners are formed in the lugs.

5. The power amplifier module of any one of claims 1-4, wherein: the power amplification board is provided with a first surface and a second surface which are arranged in a back-to-back mode, and components are arranged on the first surface of the power amplification board; the heat dissipation piece is arranged on the second surface of the power amplification plate;

the power amplifier module further comprises a power amplifier shielding cover which is covered on the first surface of the power amplifier board; the power amplifier shielding cover and the power amplifier board are both installed on the heat dissipation piece through the fixing piece.

6. The power amplifier module of claim 5, wherein: an air port is arranged on the power amplifier shielding cover; the power amplifier module also comprises an airflow accelerating device arranged on the power amplifier shielding cover and used for blowing air to the inner cavity of the power amplifier shielding cover or exhausting hot air in the inner cavity of the power amplifier shielding cover.

7. The power amplifier module of claim 6, wherein: the power amplifier shielding cover is internally provided with air deflectors, the air deflectors divide the area surrounded by the power amplifier shielding cover and the first surface of the power amplifier board into a plurality of air guide channels, the air guide channels are communicated with the air flow port of the airflow accelerating device and the air port, and the components are positioned in the air guide channels.

8. The power amplifier module of claim 5, wherein: and a vent is arranged at the position, opposite to the component, of the power amplifier shielding cover.

9. The power amplifier module of claim 8, wherein: a window is arranged on the power amplifier shielding cover; the power amplifier module further comprises a screen plate, the screen plate is located in the window, and the meshes of the screen plate form the air vent.

10. The power amplifier module of claim 5, wherein: and a heat conduction insulating glue is arranged in the power amplifier shielding cover, and the heat conduction insulating glue is coated on the component and is contacted with the power amplifier shielding cover.

11. The power amplifier module of claim 10, wherein: the heat conduction insulating glue comprises insulating pouring sealant for wrapping the components and parts and heat conduction glue filled between the insulating pouring sealant and the power amplifier shielding cover.

12. A radio frequency generating device, comprising:

the installation shell is provided with an installation cavity;

the power amplifier module of any one of claims 1-11 disposed in the mounting cavity and connected to the mounting housing;

and the power supply module is used for supplying power to the power amplifier module.

13. A radio frequency thawing device, comprising: a radio frequency thawing assembly and the radio frequency generating device of claim 12; the radio frequency thawing assembly comprises:

a shielding cylinder provided with an opening end with an opening;

the shielding door is arranged at the opening end of the shielding cylinder body and is used for closing the opening;

the tuning plate is arranged in the shielding cylinder body and is electrically connected with the power amplification plate of the radio frequency generating device;

and the polar plate is arranged in the shielding cylinder body, is electrically connected with the tuning plate and is used for transmitting radio frequency signals.

14. A refrigerator, comprising:

a refrigerator main body;

the power amplifier module of any one of claims 1-11, the power amplifier module being disposed inside the refrigerator body; or the radio frequency generating device according to claim 12, which is provided inside or outside the refrigerator main body; or the radio frequency thawing device as claimed in claim 13, wherein the radio frequency thawing assembly is provided inside the refrigerator body.