CN220457753U - Power amplifier module, radio frequency generating device radio frequency thawing device and refrigerator - Google Patents
Power amplifier module, radio frequency generating device radio frequency thawing device and refrigerator Download PDFInfo
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Abstract
The application discloses power amplifier module, radio frequency generating device, radio frequency thawing apparatus and refrigerator solves the technical problem that the radiating effect of components and parts of current power amplifier module is not good. The power amplifier module comprises a power amplifier board, a power amplifier shielding cover and a heat dissipation part, wherein the power amplifier board is provided with a first surface and a second surface which are oppositely arranged, the first surface of the power amplifier board is provided with a power device, the power amplifier shielding cover is covered on the first surface of the power amplifier board, a vent is arranged at the position, opposite to the power device, of the power amplifier shielding cover, and the heat dissipation part is arranged on the second surface of the power amplifier board. The application provides a power amplifier module, radio frequency generating device and refrigerator is through seting up the air vent on power amplifier shielding cover to and, install power device's surface on the power amplifier board that is on the back of the body mutually and set up the radiating piece to dispel the heat the cooling to power amplifier module simultaneously.
Description
Technical Field
The application belongs to the technical field of refrigerators, and particularly relates to a power amplifier module, a radio frequency generating device, a radio frequency thawing device and a refrigerator.
Background
A power amplifying circuit (also called a power amplifier, a power amplifier board, a power amplifier module, etc.) is an amplifying circuit for outputting a relatively large power, and the power amplifying circuit is generally used as an output stage of a multi-stage amplifying circuit, and the output stage is required to be capable of driving a certain load. Power amplification circuits find application in many electronic devices, such as driving meters to deflect a pointer; driving a loudspeaker to make sound; the drive plate emits radio frequency signals, etc. When the power amplification circuit is installed, the shielding cover is arranged on the power amplification circuit, so that electromagnetic interference to other electronic devices is avoided.
A radio frequency thawing device applying radio frequency thawing technology is a relatively common application object of a power amplifying circuit, the radio frequency thawing technology can make the thawed object be thawed evenly and quickly by penetrating food through low-frequency electromagnetic waves. Refrigerators equipped with radio frequency thawing devices are therefore popular with consumers.
The power amplification circuit has higher temperature during working and needs to radiate heat, and in the prior art, the power amplification circuit is directly blown by a large direct current fan to radiate heat forcedly. However, due to the blocking of the shielding case, convection of heat in the shielding case is blocked, heat accumulation of components (such as an inductor) in the shielding case is caused, and the temperature of peripheral components is increased.
Disclosure of Invention
In order to solve the technical problem that the heat dissipation effect of the components positioned in the shielding case in the current power amplifier module is poor, the application provides a power amplifier module, a radio frequency generating device, a radio frequency thawing device and a refrigerator.
One of the applications adopted in the application the technical proposal is as follows: there is provided a power amplifier module, which comprises a power amplifier module, comprising the following steps:
the power amplification board is provided with a first surface and a second surface which are oppositely arranged, and the first surface of the power amplification board is provided with components;
the power amplifier shielding cover is covered on the first surface of the power amplifier board, and a vent is arranged at the position, opposite to the component, of the power amplifier shielding cover;
and the heat dissipation piece is arranged on the second surface of the power amplification plate.
According to the technical scheme, the power amplifier module is provided with the vent on the power amplifier shielding cover, so that heat in the power amplifier shielding cover can be discharged to the outside through the vent, the vent is opposite to the position of the component of the power amplifier board, and the heat of the component can be directly dissipated through air, so that the technical problem that the radiating effect of the component inside the shielding cover is poor is solved.
In some embodiments, the top plate and the side plate of the power amplifier shielding cover are both provided with the air vents.
In some embodiments of the present utility model, in some embodiments, a window is arranged on the power amplifier shielding cover; the power amplifier module further comprises a screen plate, the screen plate is located in the window, and the meshes of the screen plate form the air vent.
In certain embodiments, the mesh is an electromagnetic shielding mesh.
In some embodiments, the component is an inductor.
In some embodiments, the power amplifier module further includes an airflow accelerating device disposed on the power amplifier shielding cover, where the airflow accelerating device blows air to or extracts hot air from the inner cavity of the power amplifier shielding cover.
In some embodiments, the heat sink is provided with an airflow channel; the power amplifier module further comprises an air duct and a blowing device for generating air flow, the air duct is provided with a first opening and a second opening which are oppositely arranged, the first opening is communicated with the blowing opening of the blowing device, the second opening is communicated with the air flow channel of the radiating piece to form an air outlet, and the size of the second opening in the width direction of the power amplifier board is larger than that of the first opening.
In some embodiments, the heat dissipation member is made of metal, and comprises a metal plate and a plurality of heat dissipation fins arranged on one surface of the metal plate at intervals, and gaps among the plurality of heat dissipation fins at intervals form the air flow channel; the power amplification plate is connected to the metal plate and is in contact with the metal plate.
The other technical scheme adopted by the application is as follows: there is provided a radio frequency generating device comprising:
the installation shell is provided with an installation cavity;
the power amplifier module is arranged in the mounting cavity and is connected with the mounting shell;
and the power module is arranged in the mounting cavity and connected with the mounting shell and is used for supplying power to the power amplification plate.
In some embodiments, the power module includes a power supply housing and a power strip disposed in the power supply housing, the power supply housing being connected with the mounting housing, the power strip being electrically connected with the power amplifier board.
The application adopts the following technical scheme: there is provided a radio frequency thawing apparatus comprising: the radio frequency thawing assembly and the radio frequency generating device are arranged on the same side of the radio frequency thawing assembly; the radio frequency thawing assembly comprises:
a shielding cylinder provided with an opening end with an opening;
the shielding door is arranged at the opening end of the shielding cylinder body and is used for closing the opening;
the tuning plate is arranged in the shielding cylinder body and is electrically connected with the power amplification plate of the radio frequency generating device;
and the polar plate is arranged in the shielding cylinder body, is electrically connected with the tuning plate and is used for transmitting radio frequency signals.
The application adopts a further technical scheme that: the refrigerator comprises a refrigerator main body and the radio frequency thawing device, wherein the radio frequency thawing assembly is arranged in the refrigerator main body, and the radio frequency generating device is arranged in or outside the refrigerator main body.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are needed in the description of the embodiments will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present application, and other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1 shows an overall structure diagram of a power amplifier module in an embodiment of the present application.
Fig. 2 shows a partial enlarged view at a of fig. 1.
Fig. 3 shows a full-section structure diagram of the power amplifier module of fig. 1 at a screen.
Fig. 4 shows an exploded view of a power amplifier module according to another embodiment of the present application.
Fig. 5 shows a schematic structural view of the rf generator in the embodiment of the present application when the top cover is partially cut away.
Fig. 6 shows a schematic structural view of the radio frequency generating device of fig. 5 after the top cover is removed.
Fig. 7 is a schematic view of a structure of a radio frequency generating device according to still another embodiment of the present application when a top cover is partially cut away.
Fig. 8 shows a schematic structural view of the radio frequency generating device of fig. 7 with the top cover removed.
Fig. 9 shows a schematic structural view of the radio frequency generating device of fig. 8 after being mounted on a device.
Fig. 10 is a schematic view of a structure of a radio frequency generating device according to still another embodiment of the present application when a top cover is partially cut away.
Fig. 11 shows a wiring structure diagram of a power amplifier module and a power module of a radio frequency generating device in an embodiment of the present application.
Fig. 12 is a schematic view of a radio frequency generating device according to an embodiment of the present application, when the top cover is partially cut away.
Fig. 13 is a schematic structural diagram of a radio frequency generating device according to an embodiment of the present application.
Fig. 14 shows a schematic structural view of the radio frequency generating device of fig. 13 in a reverse-discharge state.
Fig. 15 shows a schematic structural view of the radio frequency generating device of fig. 13 in a bottom view.
Fig. 16 shows a schematic structural diagram of a power module of the radio frequency generating device in the embodiment of the present application.
Fig. 17 is a schematic structural diagram of a power module of a radio frequency generating device according to another embodiment of the present application.
Fig. 18 shows a functional block diagram of a radio frequency thawing device in an embodiment of the present application.
Fig. 19 shows a functional block diagram of a radio frequency thawing device in another embodiment of the present application.
Fig. 20 shows a functional block diagram of a radio frequency thawing device in accordance with yet another embodiment of the present application.
Fig. 21 shows a schematic structural view of a refrigerator in an embodiment of the present application.
Fig. 22 shows a partial enlarged view at a of fig. 21.
Fig. 23 is a view showing an assembled structure of a shield cylinder and a shield door in the refrigerator of fig. 21.
Fig. 24 is a view showing an installation structure of the radio frequency generating device in the refrigerator of fig. 21.
Fig. 25 is a view showing an installation structure of a radio frequency generating device in a refrigerator according to still another embodiment of the present application.
Reference numerals illustrate:
100-refrigerator; 10-a radio frequency generating device; 20-a refrigerator main body, 21-a mounting cavity, 22-a refrigerating assembly and 23-a U shell; 30-radio frequency thawing components, 31-shielding barrels, 31 a-opening ends, 31 c-air inlets of the shielding barrels, 31 d-air outlets of the shielding barrels, 31 e-tuning cavities, 31 f-thawing cavities and 32-shielding doors; 40-wind flow accelerator.
11-mounting shell, 11 a-mounting cavity, 11 b-power amplification cavity, 11 c-power supply cavity, 11 d-heat dissipation hole, 11 e-heat dissipation hole, 11 f-air guide channel, 11 h-water blocking area, 11 i-hollowed hole, 11 j-water draining hole, 11 m-strong current threading hole and 11 n-weak current threading hole; 110-body, 111-bottom plate, 1111-water retaining structure, 1112-surrounding edge, 1113-boss and 1114-guide post; 112-top cap, 112 a-mounting port, 1121-side wall, 1122-baffle, 1123-shutter, 1124-top wall, 1125-junction box, 1126-cover plate; 113-a partition plate, 114-a heat conducting piece, 115-a coaming, 116-a mounting structure, 1161-a mounting hole, 118-a limiting structure and 1181-a limiting rib.
12-power amplifier module, 121-power amplifier board, 121 a-first surface, 121 b-second surface, 121 c-first end, 121 d-second end, 1211-component; 122-heat sink, 122 a-air flow channel, 122 b-relief blind hole, 1221-sheet metal, 1221 a-mounting plane, 1222-fin, 1223-lug; 123-blowing components, 1231-blowing devices, 1231 a-blowing ports, 1232-air channels, 1233-air outlets, 1234-first openings, 1235-second openings; 124-power amplifier shielding cover, 124 a-air port, 124 b-air port, 124 c-window, 1241-top plate, 1242-side plate, 1243-screen plate; 125-airflow accelerating means; 127-fastener.
13-power module, 131-power panel, 132-power shell, 132 a-through hole, 133-heat conduction insulating glue in the power module; 16-a strong electric wire harness; 17-weak current harness, 171-first weak current harness; 172-a second weak current harness; 18-fixing piece.
Detailed Description
The following description of the embodiments of the present application will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are only some, but not all, of the embodiments of the present application. All other embodiments, which can be made by one of ordinary skill in the art without undue burden from the present disclosure, are within the scope of the present disclosure.
Furthermore, the present application may repeat reference numerals and/or letters in the various examples, which are for the purpose of brevity and clarity, and which do not in themselves indicate the relationship between the various embodiments and/or arrangements discussed. In addition, the present application provides examples of various specific processes and materials, but one of ordinary skill in the art may recognize the application of other processes and/or the use of other materials.
In the related art, the power amplification shielding cover is covered on the power amplification board of the power amplification module, and electromagnetic shielding can be effectively performed by arranging the power amplification shielding cover on the surface of the power amplification board, on which the power devices are arranged, so that electromagnetic interference is prevented, but the heat dissipation of the power devices is also influenced, and the temperature of the power devices is overhigh, so that the service lives of the power devices and nearby components are influenced.
Therefore, the embodiment of the application provides a power amplifier module, a radio frequency generating device, a radio frequency thawing device and a refrigerator, which can at least solve the technical problem that the heat dissipation effect of a power device of the power amplifier module in the related art is poor to a certain extent. The present application is described below with reference to specific embodiments in conjunction with the accompanying drawings:
example 1:
An embodiment of the present application provides a power amplifier module, referring to fig. 1, which shows an overall structure diagram of the power amplifier module 12. The power amplifier module 12 includes a power amplifier board 121 for generating a radio frequency signal after power amplification, where the power amplifier board 121 is a circuit board structure, and has a first surface 121a and a second surface 121b that are disposed opposite to each other, hereinafter also referred to as a first surface 121a of the power amplifier board 121 is a front surface, and a second surface 121b of the power amplifier board 121 is a back surface. The power amplification board 121 generally includes a signal source and a power amplification circuit, which are electrically connected, where the signal source is used to generate an initial signal with a set frequency (e.g. 40.68 MHz), and the power amplification circuit is used to power amplify the initial signal, enhance the power of the initial signal, and output a radio frequency signal after power amplification. The signal source and the power amplifying circuit may be both disposed on the same surface of the power amplifying board 121, or may be disposed on different surfaces, and the specific arrangement mode is not limited in this application. In some embodiments, the components 1211 (chips, inductors, capacitors, resistors, etc.) on the power amplifier board 121 are located on the first surface 121a, that is, each component 1211 of the signal source and the power amplifier circuit is mounted on the front surface of the power amplifier board 121, the back of the power amplification plate 121 is mainly a welding leg, a welding wire and the like of a pin, and the second surface 121b of the power amplification plate 121 is in contact with the heat dissipation element 122 for heat transfer.
Referring to fig. 1 and 3, the power amplifier module 12 is provided with a power amplifier shielding cover 124, where the power amplifier shielding cover 124 is made of a metal material and covers the first surface 121a of the power amplifier board 121 to electromagnetically shield the components 1211 on the power amplifier board 121. In some embodiments, the power amplifier shielding cover 124 is only covered on the power amplifier board 121, and specifically, the power amplifier shielding cover 124 and the power amplifier board 121 are both installed on the heat dissipation element 122 through fastener 127.
Since the power amplifier shielding cover 124 is covered on the first surface 121a of the power amplifier board 121 to electromagnetically shield the component 1211 on the power amplifier board 121, electromagnetic interference is prevented, but convection of air is also prevented, heat accumulation on power devices (inductance, resistance, etc.) in the component 1211 is caused, and the temperature of peripheral components is increased, for example, the inductance, the temperature of the inductance itself is too high, which may cause breakage and explosion of an insulating layer of an enameled wire to cause short circuit of the inductance, so that the module cannot work, and meanwhile, the warpage at a bonding pad caused by heat conduction causes poor electrical connection. In order to dissipate heat of the component 1211 with relatively large heat generation capacity, for example, a power device (such as an inductor, a resistor, etc.), referring to fig. 2 and 3, a vent 124b is provided on the power amplifier shielding cover 124 at a position opposite to the power device, and by providing the vent 124b on the power amplifier shielding cover 124, heat in the power amplifier shielding cover 124 can be exhausted to the outside through the vent 124b, so as to dissipate heat and cool the power device. In addition, the power device is used as a main heating source and is a main heat dissipation and cooling object in the power amplifier module 12, so that the position of the power device is opposite to the air vent 124b on the power amplifier shielding cover 124 in order to realize faster heat dissipation and cooling of the power device.
In some embodiments, in order to improve the heat dissipation and cooling effect of the power amplifier module 12, the top plate 1241 and the side plate 1242 of the power amplifier shielding cover 124 are provided with air vents 124b, so that more external cold air can perform convection with the hot air in the power amplifier shielding cover 124, and airflow is promoted to flow, thereby improving the heat dissipation and cooling effect of the power amplifier module 12.
To increase the heat dissipation efficiency, the air vent 124b should be as large as possible, but after the air vent 124b is enlarged, insects may enter the power amplifier shield cover 124 from the air vent 124b, for which, referring to fig. 1, 2 and 3, in some embodiments, the power amplifier module 12 further includes a mesh plate 1243, where the power amplifier shield cover 124 is provided with a window 124c, the mesh plate 1243 is located in the window 124c of the power amplifier shield cover 124, and the mesh of the mesh plate 1243 forms the air vent 124b. So as to prevent insects from invading while ensuring the heat dissipation and temperature reduction effects of the power amplifier module 12. In order to prevent electromagnetic leakage of the power amplifier module 12 caused by the vent 124b, in some embodiments, an electromagnetic shielding net is selected as the mesh 1243, so as to prevent electromagnetic leakage and insect intrusion of the power amplifier module 12 while ensuring the heat dissipation and cooling effects of the power amplifier module 12.
Referring to fig. 4, in some embodiments, in order to further improve the heat dissipation efficiency of the components, the power amplifier module 12 is further provided with an airflow accelerator 125, where the airflow accelerator 125 is disposed on the power amplifier shielding cover 124, and blows air to the inner cavity of the power amplifier shielding cover 124 or draws hot air from the inner cavity of the power amplifier shielding cover 124. By disposing the air flow accelerating device 125 on the power amplification shielding cover 124 and simultaneously providing the air vent 124b on the power amplification shielding cover 124, the air flow accelerating device 125 can blow or exhaust air, and the air flow accelerating device 125 can adopt a blower, an exhaust fan, and the like.
When the airflow accelerating device 125 blows air, external cold air is blown into the power amplification shielding cover 124, and hot air in the power amplification shielding cover 124 is discharged from the air vent 124b on the power amplification shielding cover 124; when the air flow accelerating device 125 performs air extraction, hot air in the power amplifier shielding cover 124 is extracted to the outside, and cold air outside enters the power amplifier shielding cover 124 through the air vent 124b on the power amplifier shielding cover 124. That is, the hot air in the power amplifier shielding cover 124 can be replaced by cold air no matter the air flow accelerating device 125 blows air or draws air, so that the heat generated by the power device is blown to the outside of the power amplifier shielding cover 124, so as to realize heat dissipation and cooling of the power device of the power amplifier module 12. In addition, in the case of the optical fiber, the air flow generated by the air flow accelerating device 125 can also blow away dust, insect corpses and the like in the power amplifier module 12, so as to avoid short circuit of the power amplification plate 121 caused by overlap bridging of dust, insect corpses and the like.
In some embodiments, an additional air port may be further provided on the power amplifier shielding cover 124, for example, the airflow accelerating device 125 is disposed on the power amplifier shielding cover 124 at a position opposite to the rf power amplifier driving stage of the power amplifier board 121, and an air port is disposed on the power amplifier shielding cover 124 at a position near the power amplifier output end of the power amplifier board 121, so as to form air convection.
Referring to fig. 3 and 4, in some embodiments, the power amplifier module 12 further includes a heat dissipation element 122, where the heat dissipation element 122 is disposed on the power amplifier board 121, and the heat dissipation element 122 is selectively connected to and fixed to or only contacted with the power amplifier board 121, and heat of the power amplifier board 121 is mainly generated by LDMOS (laterally diffused metal oxide), and heat of the power amplifier board 121 is mainly dissipated by the heat dissipation element 122. The heat dissipation element 122 may adopt a heat dissipation structure such as a metal heat sink or a water cooling plate, which is not limited in this application.
Referring to fig. 3 and 4, the heat sink 122 is provided with an air flow passage 122a, and forced heat dissipation by air cooling can take away heat of the heat sink 122 when air flows through the air flow passage 122 a. The power amplifier module 12 further comprises a blowing component 123, the blowing component 123 is used for blowing air into the airflow channel 122a to radiate heat of the power amplifier board 121, the blowing component 123 and the power amplifier board 121 are sequentially arranged along the airflow flowing direction, the two ends of the power amplification plate 121 in the wind flow direction are respectively denoted as a first end 121c and a second end 121d, the air blowing component 123 is arranged at the first end 121c of the power amplification plate 121, and the second end 121d of the power amplification plate 121 can be used as an outlet end of the power amplification plate 121.
Referring to fig. 4, in some embodiments, the blowing assembly 123 includes a blowing device 1231 and a duct 1232, the blowing device 1231 being configured to generate a flow of wind, and the duct 1232 communicating the blowing device 1231 with the heat sink 122. Specifically, the air duct 1232 has a first opening 1234 and a second opening 1235 that are disposed opposite to each other, the first opening 1234 is communicated with the air blowing opening 1231a of the air blowing device 1231, the second opening 1235 is communicated with the air flow channel 122a of the heat dissipation member 122, and the air flow generated by the air blowing device 1231 enters the air flow channel 122a through the air duct 1232, so that the heat dissipation member 122 is dissipated by forced convection.
When in use, the heat dissipation element 122 is in contact with the power amplification plate 121, and the heat of the power amplification plate 121 is conducted to the heat dissipation element 122. The wind flow generated by the blowing device 1231 enters the airflow channel 122a through the air duct 1232, forced convection dissipates heat of the heat dissipation part 122, and the heat dissipation part 122 further dissipates heat of the power amplification plate 121, so that the temperature of the power amplification plate 121 is effectively reduced, and the safety and reliability of products are improved. Due to the arrangement of the air duct 1232 and the heat dissipation member 122 having the air flow channel 122a, the air flow generated by the air blowing device 1231 can all enter the air flow channel 122a, the air volume utilization rate is high, and the heat dissipation requirement of the power amplification plate 121 can be met with smaller power and flow.
Referring to fig. 4, in the power amplifier module 12 provided in the present application, the size of the second opening 1235 of the air duct 1232 in the width direction of the power amplifier board 121 is greater than the size of the first opening 1234 in the width direction of the power amplifier board 121. That is, the air duct 1232 adopts a flaring design, and along the flow direction of the wind flow, the size of the inner cavity of the air duct 1232 in the width direction of the power amplification plate 121 tends to increase, and specifically, linear increase, nonlinear increase or gradient increase can be adopted. To reduce wind resistance, in some embodiments, the projection of the air duct 1232 on the plane parallel to the power amplification plate 121 is trapezoidal, and the shapes of the first opening 1234 and the second opening 1235 are respectively adapted to the shape of the air blowing opening 1231a of the air blowing device 1231 and the inlet shape of the air flow channel 122a of the heat dissipation member 122.
The heat dissipation element 122 conducts heat with the power amplification board 121, and the heat dissipation element 122 is required to have good heat conductivity, and the heat conductivity of metal and ceramic can be achieved, so that the material and shape of the heat dissipation element 122 are not limited in the application. In some embodiments, the heat dissipation element 122 is made of metal, and may be aluminum, iron, or other metals or alloys thereof, and aluminum is preferred in view of light weight.
In order to satisfy the installation and heat dissipation of the power amplifier board 121, referring to fig. 3 and 4, the heat dissipation member 122 includes a metal plate 1221 and a plurality of heat dissipation fins 1222, the heat dissipation fins 1222 are distributed on one surface of the metal plate 1221, the heat dissipation fins 1222 are spaced apart such that gaps between the heat dissipation fins 1222 form an air flow channel 122a, and the specific number and spacing of the heat dissipation fins 1222 are determined according to the heat dissipation requirement of the power amplifier board 121. In certain embodiments, the metal plate 1221 is integrally formed with the heat dissipating fins 1222. The metal plate 1221 has a large mounting surface 1221a, the power amplification plate 121 is mounted on the mounting surface 1221a of the metal plate 1221 by the fastener 127, and the power amplification plate 121 is at least partially in contact with the metal plate 1221.
Because the metal is conductive, in order to ensure that the power amplification board 121 and the metal board 1221 are fully contacted as much as possible, referring to fig. 2, in some embodiments, a plurality of avoidance blind holes 122b are provided on the installation plane 1221a of the metal board 1221, the number and positions of the avoidance blind holes 122b completely correspond to the number and distribution of conductors (pins, soldering tin parts, wires, etc. of the components 1211) of the power amplification board 121, the size of the avoidance blind holes 122b is larger than that of the corresponding conductors on the power amplification board 121, so that the conductors extend into the avoidance blind holes 122b and are not contacted with the metal board 1221, thereby ensuring that the power amplification board 121 and the metal board 1221 are tightly attached, the contact area is larger, heat dissipation is facilitated, and the overall structure of the power amplification board 121 is more stable. The avoidance blind hole 122b is designed as a blind hole, so that the problem of leakage caused by contact between the conductor and water due to the design as a through hole can be avoided.
The structural strength of the heat sink 122 is higher than that of the power amplification board 121, and thus the heat sink 122 simultaneously serves as a mounting base of the power amplification board 121. Referring to fig. 4, in some embodiments, at least two lugs 1223 are disposed on the metal plate 1221, where the lugs 1223 may be disposed on a bottom surface or a side surface of the metal plate 1221 according to actual needs, and fixing holes for installing the fasteners 127 are disposed in the lugs 1223, and the fixing holes may be light holes or threaded holes, and the fasteners 127 may be in a structure of screws, rivets, pins, or the like, which is not limited in this application.
Example 2:
based on the same inventive concept, the embodiment of the present application provides a radio frequency generating device, referring to fig. 5 and 6, the radio frequency generating device 10 includes a mounting shell 11, a power amplification module 12 for generating a radio frequency signal after power amplification, and a power supply module 13 for supplying power to the power amplification module 12, where the power amplification module 12 specifically adopts the power amplification module 12 of the foregoing embodiment 1, and the specific structure is not described herein, and since the power amplification module 12 is provided with the blowing device 1231, in some embodiments, a shock pad, for example, a rubber pad or a silica gel pad is disposed between the blowing device 1231 and the mounting shell 11, so as to realize shock absorption of the blowing device 1231. The power module 13 is internally provided with an ac/dc conversion circuit and a voltage regulating circuit, and is used for performing ac/dc conversion and voltage regulation, and supplying low-voltage dc power to the power amplifier module 12.
In some embodiments, the power module 13 includes a power supply housing 132 and a power supply board 131 disposed in the power supply housing 132, where the power supply housing 132 protects the power supply board 131. In some embodiments, as shown in fig. 16, a plurality of through holes 132a are formed on the power supply housing 132 for heat dissipation of the power panel 131. Considering that there is a gap between the power supply housing 132 and the power supply board 131, the power supply board 131 and the power supply housing 132 conduct heat only through air, so that the heat dissipation effect is poor, and the service life of the power supply board 131 may be affected, as shown in fig. 17, in other embodiments, the power supply housing 132 is filled with a heat-conducting insulating glue 133, the heat-conducting insulating glue 133 is in contact with both the power supply board 131 and the power supply housing 132, and the heat-conducting insulating glue 133 wraps components on the power supply board 131.
Specifically, the heat-conducting insulating glue 133 is arranged in the power module 13, the heat-conducting insulating glue 133 is arranged between the power panel 131 and the power shell 132 of the power module 13, on one hand, water, insects and the like outside the power module 13 can be prevented from entering the power module 13 to erode components on the power panel 131, so that the waterproof and insect-preventing effects are achieved, and on the other hand, heat generated by the components on the power panel 131 can be conducted to the power shell 132 through the heat-conducting insulating glue 133, so that the heat dissipation effect of the power module 13 is improved. In addition, the heat conductive insulating adhesive 133 wraps the components on the power panel 131, so that the heat dissipation uniformity of the components can be improved. Thereby improving the reliability and safety of the power module 13 as a whole.
In some embodiments, in order to ensure the bonding degree of the heat-conducting insulating glue 133 with the power panel 131 and the power supply housing 132, the heat dissipation effect is prevented from being affected due to poor contact, and the glue filling mode is adopted, so that the through hole 132a arranged on the power module 13 can be used as a glue filling hole to fill glue through the through hole 132a on the power module 13, the bonding degree of the heat-conducting insulating glue 133 with the power panel 131 and the power supply housing 132 is improved, and the heat dissipation effect of the power module 13 is ensured to a certain extent.
The radio frequency generating device 10 is controlled by a control system (e.g. MCU controller) on a control board when in operation, the control board is electrically connected with the power module 13 and the power amplifier module 12, the control board is electrically connected with an external input device (display screen, operation panel, keyboard, etc.), receives an operation instruction sent by a user, and controls circuits in the power module 13 and the power amplifier module 12 to work. When the output power of the power amplifier module 12 needs to be regulated, the control board calculates a voltage regulation control instruction based on an internal algorithm and sends the voltage regulation control instruction to the power module 13, and the power module 13 regulates the voltage to change the output voltage of the power module 13. For the power amplification board 121 provided with the detection circuit, the control board is electrically connected with the detection circuit, the detection circuit detects the output power of the power amplification module 12 and feeds back to the control module, and the control module performs relevant control on the signal source, the power amplification circuit and the power supply module 13 through an internal algorithm.
In some embodiments, the functions of the control board are integrated on the device on which the rf generator 10 is mounted, such as a refrigerator in which the rf generator 10 is configured, and the functions of the control board may be integrated on a main control board of the refrigerator. Referring to fig. 18, in some embodiments, the control board is a separately provided circuit board, and the control board exists independently of the power module 13 and the power amplifier module 12 to form a control module, and in this arrangement, the power amplifier module 12, the power module 13 and the control module mounting positions can be set according to actual needs. In some embodiments, the control board is integrated with the power amplifier board 121 on the same circuit board, as shown in fig. 20. In other embodiments, the control board is integrated with the power module 13 on the same circuit board, as shown in fig. 19.
The installation shell 11 is of a hollow structure, the inner cavity is an installation cavity 11a for installing an electronic module (at least one of the power amplifier module 12, the power module 13 and the control module is referred to), the installation shell 11 can be of a split type structure or an integral type structure, and the installation shell is not limited in the application. Referring to fig. 5, 7, 10 and 12, in some embodiments, the mounting case 11 includes a base plate 111 and a top cover 112 covering the base plate 111, the base plate 111 and the top cover 112 enclose a mounting cavity 11a, and an electronic module disposed in the mounting cavity 11a is fixedly connected to the base plate 111. Referring to fig. 13, 14 and 15, in other embodiments, the mounting case 11 includes only the top cover 112, the inner cavity of the top cover 112 forms the mounting cavity 11a, the electronic module disposed in the mounting cavity 11a is fixedly connected to the top cover 112, and the top cover 112 is inverted and connected to a device configured with the radio frequency generating device 10 to close the mounting cavity 11a. In other embodiments, the mounting housing 11 includes a bottom cover and a sealing plate that covers the bottom cover. In still other embodiments, the mounting housing 11 includes two snap covers with openings that snap together in opposition. The constituent structure of the mounting case 11 is not limited in this application.
In order to improve the installation stability of the electronic module in the installation shell 11 and avoid connection failure in the process of collision and assembly collision in the transportation process, referring to fig. 7, 8 and 9, in some embodiments, a limiting structure 118 for limiting and fixing the electronic module is arranged on the installation shell 11, the limiting structure 118 may be a plate surface attached to the side wall of the electronic module, and the electronic module is clamped by two mutually parallel plate surfaces, so that a fixed limiting effect can be realized in one direction; or the limiting structure 118 may be cylindrical, and the limiting structure 118 is distributed on the outer sides of different side walls of the electronic module to enable the electronic module to abut; or limit structure 118 is the structure that the whole circle encircled to enclose to establish into the cell body with the electronic module shape adaptation, furthest plays fixed spacing effect to the electronic module, and limit structure 118's specific structural style is this application does not do the restriction.
Referring to fig. 9, in some embodiments, the limiting structure 118 includes at least two limiting ribs 1181, the limiting ribs 1181 protrude on the inner wall surface of the mounting shell 11, and the limiting ribs 1181 are arranged at intervals to form a limiting area for limiting the electronic module, and the limiting ribs 1181 are attached to the side wall of the electronic module when the electronic module is mounted, so as to limit and fix the electronic module.
In some embodiments, the limiting area may be provided with one for individually fixing the power amplifier module 12, the power module 13 or the control module, or each electronic module is closely arranged side by side, so that the power amplifier module 12 and/or the power module 13 can be limited and fixed from one direction through at least two limiting ribs 1181. In other embodiments, each electronic module is limited and fixed by different limiting areas, and at least 2n limiting ribs 1181 for forming the limiting areas are provided, where n is the number of electronic modules. Taking the power amplifier module 12 and the power module 13 as examples, at least 4 limiting ribs 1181 are arranged in the installation shell 11, wherein more than two limiting ribs 1181 form a limiting area matched with the power amplifier module 12 according to the model of the power amplifier module 12, and more than two limiting ribs 1181 form a limiting area matched with the power module 13.
Referring to fig. 8 and 9, in some embodiments, the cross section of the limiting rib 1181 may be L-shaped, the L-shaped limiting rib 1181 is disposed at a bent corner of the electronic module, the inner sides of the L-shaped limiting ribs 1181 are respectively attached to two mutually perpendicular sidewalls 1121 of the electronic module, and when the two sets of limiting ribs 1181 are disposed, the two sets of limiting ribs 1181 are disposed at diagonal positions of the electronic module, so as to achieve a fixed limiting effect on the electronic module in four directions. And when further setting up more spacing muscle 1181, if the spacing muscle 1181 of L type in every spacing district is provided with four, with its setting in electronic module four corners department, can all realize fixed and spacing effect to electronic module in four directions, and be convenient for fix a position when the installation.
The electronic module and the mounting shell 11 are connected and fixed through the fixing piece 18, and the fixing piece 18 can adopt structures such as screws, rivets, pin shafts, buckles and the like. The mounting shell 11 is provided with a mounting hole 1161, the fixing piece 18 is mounted in the mounting hole 1161, and the fixing piece 18 and the mounting hole 1161 can be connected in a threaded mode, an interference fit mode, a clamping mode and the like. Referring to fig. 8 and 9, a mounting structure 116 is disposed on an inner wall of the mounting shell 11, the mounting structure 116 may be a column or a boss 1113, a mounting hole 1161 is disposed in the mounting structure 116, and the mounting structure 116 is disposed outside the limiting structure 118, so that the electronic module is as close to the limiting structure 118 as possible. The mounting structure 116 has a height greater than the limiting structure 118, so that the limiting structure 118 only limits the layout of the electronic module, thereby facilitating the disassembly and assembly of the electronic device.
When the mounting shell 11 comprises a top cover 112 and a bottom plate 111, the mounting structure 116 and the limiting structure 118 are both arranged on the bottom plate 111; when the mounting shell 11 includes only the top cover 112, both the mounting structure 116 and the limiting structure 118 are disposed on the top wall 1124 of the top cover 112. Referring to fig. 9, in some embodiments, the mounting structure 116 is connected to the limiting structure 118, and since the mounting structure 116 and the limiting structure 118 are both protruding from the inner surface of the mounting shell 11, the mounting structure 116 is connected to the limiting structure 118, so that the mounting structure 116 and the limiting structure 118 can be mutually reinforced, and the mounting stability of the electronic module is further improved.
Referring to fig. 9, in some embodiments, the mounting shell 11 includes a top cover 112 and a bottom plate 111, a boss 1113 adapted to the power module 13 is disposed on the bottom plate 111 where the power module 13 is located, and the power module 13 is disposed on the boss 1113, so that the top of the mounted power module 13 can be attached to the top cover 112, on one hand, the mounting of the power module 13 is more stable, and on the other hand, when the top cover 112 is made of metal, the top of the power module 13 contacts with the top cover 112, and heat dissipation can be performed through the top cover 112. Referring to fig. 9, in some embodiments, the limiting structure 118 and the mounting structure 116 are both connected to the outer side of the boss 1113 to form a whole, so that the power module 13 is fixed in an omnibearing manner after the power module 13 is mounted, the fixing and limiting effect on the power module 13 is effectively improved, and the limiting structure 118 and the mounting structure 116 are both connected to the outer side of the boss 1113, so that the structural strength is improved.
Referring to fig. 7, in some embodiments, the mounting shell 11 includes a top cover 112 and a bottom plate 111, a surrounding edge 1112 is disposed at an edge of the bottom plate 111, the surrounding edge 1112 is disposed along an outer contour edge of the bottom plate 111, the surrounding edge 1112 protrudes upward to be higher than an inner wall surface of the bottom plate 111, the surrounding edge 1112 may be a ring of rib plate which is independently disposed, and is fixedly connected with the bottom plate 111 by bonding, welding, etc., and the surrounding edge 1112 may also be integrally formed with the bottom plate 111, for example, by injection molding, or stamping. The edge position of the bottom plate 111 near the surrounding edge 1112 is provided with a plurality of hollowed holes 11i, and the shape of the hollowed holes 11i can be any shape such as square, strip, round, oval and the like, which is not limited in this application. The hollowed-out holes 11i are arranged close to the surrounding edge 1112, and the hollowed-out holes 11i are arranged at intervals along the edge of the bottom plate 111, wherein the number of the hollowed-out holes 11i is at least two, and the hollowed-out holes 11i are respectively arranged at edge positions of the bottom plate 111 in different directions and are all located in the area surrounded by the surrounding edge 1112.
The accommodating space of the installation cavity 11a is mainly located in the top cover 112, the top cover 112 comprises a top wall 1124 and a side wall 1121 circumferentially arranged at the edge of the top wall 1124, the side wall 1121 of the top cover 112 is perpendicular to the top wall 1124 and encloses the accommodating space on the bottom surface of the top wall 1124, and the installation cavity 11a is sealed when the top cover 112 is buckled with the bottom plate 111. When the top cover 112 is fastened to the bottom plate 111, the side wall 1121 of the top cover 112 may be covered outside the peripheral edge 1112 or embedded inside the peripheral edge 1112. The side wall 1121 of the top cover 112 covers at least part of the hollow hole 11i in the formed installation cavity 11a, so that the installation cavity 11a communicates with the outside through the hollow hole 11i, and since the peripheral edge 1112 protrudes upward above the inner wall surface of the bottom plate 111, the peripheral edge 1112 and the side wall 1121 of the top cover 112 have a certain height of overlapping area in the height direction, and the peripheral edge 1112 and the side wall 1121 of the top cover 112 overlap everywhere in the circumferential direction along the bottom plate 111, so that the peripheral edge 1112 shields the installation gap between the top cover 112 and the bottom plate 111.
The number of the hollowed holes 11i should satisfy that all the positions of the bottom plate 111 are provided, for example, when the bottom plate 111 is a rectangular plate, the number of the hollowed holes 11i should be at least four, so that at least one hollowed hole 11i is provided on four sides of the rectangle. The plurality of hollowed-out holes 11i are uniformly arranged at intervals on the edge of the bottom plate 111, so that a circle of hollowed-out area is formed at the inner side position close to the surrounding edge 1112, the structural strength of the edge of the bottom plate 111 is reduced, and the mounting surface with different concave-convex shapes can be better adapted when the bottom plate 111 is mounted.
Because the bottom plate 111 has a certain area, the uneven surface is easy to occur in the production and manufacturing process, and the surrounding edge 1112 is arranged, so that on one hand, the surrounding edge 1112 can reinforce the edge of the bottom plate 111, and the deformation of the edge of the bottom plate 111 is reduced; on the other hand, the surrounding edge 1112 overlaps the side wall 1121 of the top cover 112, and the surrounding edge 1112 can cover the installation gap between the top cover 112 and the bottom plate 111, prevent external foreign matters from entering the installation cavity 11a, and has a certain water blocking function. By arranging the hollowed-out holes 11i, on one hand, the hollowed-out holes 11i are arranged at the part of the bottom plate 111 close to the surrounding edge 1112, so that the strength of the edge of the bottom plate 111 can be reduced, and the mounting shell 11 can be better adapted to mounting surfaces with different concave-convex shapes when being connected with equipment and is attached to the equipment main body; on the other hand, the arrangement of the hollowed-out holes 11i can release the internal stress of the bottom plate 111 to a certain extent, and reduce the stress deformation of the bottom plate 111.
The electronic module installed in the installation cavity 11a is located in the area surrounded by the plurality of hollowed holes 11i, that is, the electronic module is farther away from the surrounding edge 1112 than the hollowed holes 11i, and the projection of the electronic module on the bottom plate 111 is not overlapped with the hollowed holes 11i, because the hollowed holes 11i penetrate through the bottom plate 111, when water enters the installation cavity 11a, water can be discharged from the hollowed holes 11i, that is, the hollowed holes 11i can be simultaneously used as the water discharging holes 11j of the bottom plate 111, so that the water entering the installation cavity 11a is discharged through the hollowed holes 11i without contacting the electronic module, and the situation that the electronic module in the installation cavity 11a is in contact with the water for electric leakage or short circuit is avoided.
Referring to fig. 10, in some embodiments, a circle of water retaining structures 1111 is disposed on the bottom plate 111 in the area surrounded by the hollowed holes 11i, and the height of the water retaining structures 1111 is not less than the height of the surrounding edge 1112. The water retaining structure 1111 may be a ring of rib plates independently arranged, and fixedly connected with the bottom plate 111 by bonding, welding, etc., and the surrounding edge 1112 may be integrally formed with the bottom plate 111, for example, by injection molding, or by stamping. In some embodiments, the middle portion of the bottom plate 111 may be partially protruded to form a retaining wall above other portions of the bottom plate 111, and the retaining wall forms the water retaining structure 1111. The specific implementation of the water retaining structure 1111 is not limited in this application.
The water blocking structure 1111 is surrounded by a circle along the circumference of the bottom plate 111 to form a water blocking area 11h, and the electronic devices are all installed in the water blocking area 11 h. The water retaining structure 1111 and the surrounding edge 1112 form a circular area, and the hollow holes 11i are all arranged between the water retaining structure 1111 and the surrounding edge 1112. When the top cover 112 is embedded inside the surrounding edge 1112, the contact area between the top cover 112 and the bottom plate 111 is located between the water retaining structure 1111 and the surrounding edge 1112, and when water enters the installation cavity 11a, if the water is not discharged by the hollowed-out holes 11i and flows inwards, the water retaining structure 1111 can block the water, so that the water is blocked outside the water retaining area 11h and discharged through the hollowed-out holes 11i, and the waterproof effect of the installation shell 11 is further improved.
Since the power amplifier module 12, the power module 13, and the control module all generate heat during operation, it may occur that the temperature in the installation cavity 11a is significantly higher than the temperature outside the installation case 11 during cold weather, thereby generating condensed water on the inner wall of the top cover 112. To avoid condensation water dripping into the water stop zone 11h, in some embodiments, the top wall 1124 of the top cover 112 may be configured to arch centrally upward such that the resulting condensation water flows toward the edges of the top wall 1124 and onto the side walls 1121 of the top cover 112. Referring to fig. 10, in some embodiments, the projection of the side wall 1121 of the top cover 112 on the bottom plate 111 is located outside the water blocking area 11h, specifically outside the water blocking structure 1111, when water is present on the inner wall of the side wall 1121 of the top cover 112, the water flows down along the side wall 1121 of the top cover 112, flows between the water blocking structure 1111 and the surrounding edge 1112, and is discharged through the hollowed-out hole 11i, or flows outside the surrounding edge 1112.
Referring to fig. 10, in some embodiments, the side wall 1121 of the top cover 112 is located inside the peripheral edge 1112, and the outer wall of the side wall 1121 of the top cover 112 may contact the inner wall of the peripheral edge 1112, so as to improve the tightness of the top cover 112 after being fastened to the bottom plate 111, and further reduce the occurrence of water entering the installation shell 11. Further, the side wall 1121 of the top cover 112 contacts the peripheral edge 1112, so that the peripheral edge 1112 can be reinforced, and the structural strength of the mounting case 11 can be further improved.
In the case where more than two electronic modules are disposed in the mounting cavity 11a of the radio frequency generating device 10, in order to avoid the mutual influence of the plurality of electronic modules, referring to fig. 6, in some embodiments, a partition plate 113 is disposed in the inner cavity of the mounting shell 11, the partition plate 113 divides the mounting cavity 11a of the mounting shell 11 into two independent chambers, and the partition plate 113 may be integrally formed with the mounting shell 11 or fixedly connected with the mounting shell 11 by gluing, welding, or the like. When the mounting case 11 includes the bottom plate 111 and the top cover 112 covering the bottom plate 111, the partition 113 may alternatively be provided on the bottom plate 111 or the top cover 112, and in some embodiments, the partition 113 may also be provided on the bottom plate 111 or the top cover 112, respectively, and the two partitions 113 abut or overlap in the height direction. When the mounting case 11 includes only the top cover 112, the partition 113 is provided on the top cover 112.
Referring to fig. 6, in some embodiments, a power module 13 and a power amplifier module 12 are disposed in the installation cavity 11a of the radio frequency generating device 10, and the control module is external, or the control board is integrated with the power board 131 or the power amplifier board 121. The inner cavity of the installation shell 11 is divided into a power amplification cavity 11b and a power supply cavity 11c through a partition plate 113, the power supply module 13 and the power amplification module 12 are separately placed, the power amplification module 12 is arranged in the power amplification cavity 11b, and the power supply module 13 is arranged in the power supply cavity 11 c. Because the power amplifier module 12 is provided with the air blowing component 123, the power amplifier cavity 11b and the power amplifier cavity 11c are relatively airtight, the air flow blown by the air blowing component 123 only can be disturbed in the power amplifier cavity 11b, compared with the condition that the partition plate 113 is not arranged, the air flow flows in a smaller space, the wind noise is relatively smaller, the power amplifier module 13 is free to radiate heat, the power amplifier cavity 11c can be provided with no radiating holes 11d, so that the power amplifier cavity 11c becomes an airtight chamber, or compared with the power amplifier cavity 11b, the radiating holes 11d are reduced, and the water spraying risk of the power panel 131 is reduced.
The electronic module installed in the installation cavity 11a needs to be electrically connected with external electrical devices to realize power supply or signal transmission, so that a wire through hole is also required to be arranged on the installation shell 11, and the wire through hole is also a through hole 132a penetrating through the wall plate of the installation shell 11, and from the perspective of water resistance, the wire through hole should be as close to the edge of the installation shell 11 and far away from the electronic devices as possible. In some embodiments, the via hole is located in the area where the hollowed-out hole 11i is located, i.e. the hollowed holes 11i and the wire passing holes are distributed at the same position of the mounting shell 11. When the electronic module is the power amplifier module 12 and/or the control module, since the power amplifier module 12 and the control module both use low-voltage direct current, only one wire passing hole can be arranged, and when the electronic module comprises the power module 13, since the power module 13 regulates the commercial power into low-voltage direct current for the power amplifier module 12 and the control module, two wire passing holes are required to be arranged, one wire passing hole is used for the strong current wire harness 16 to pass out, and the other wire passing hole is used for the weak current wire harness 17 to pass out.
Referring to fig. 11 and 15, in some embodiments, the power module 13 and the power amplifier module 12 are disposed in the installation cavity 11a of the radio frequency generating device 10, and the control module is external, or the control board is integrated with the power panel 131 or the power amplifier panel 121. The installation shell 11 is provided with two wire passing holes, namely a strong current threading hole 11m and a weak current threading hole 11n, wherein the strong current threading hole 11m and the weak current threading hole 11n are distributed at intervals and are communicated with the installation cavity 11 a. Only the weak current harness 17 is arranged on the power amplifier module 12, which is used for supplying power to the power amplifier board 121 and the blowing device 1231, outputting the radio frequency signal and the detection signal after power amplification, and receiving the control instruction of the control panel. Referring to fig. 14, the power amplifier module 12 is disposed in the mounting cavity 11a and far away from the strong electric threading hole 11m, and the power module 13 is disposed in the mounting cavity 11a and near the strong electric threading hole 11m, i.e. the power module 13 is closer to the strong electric threading hole 11m than the power amplifier module 12. The strong and weak current separates the wiring, reduces the discharge risk of the radio frequency generating device 10, increases the reliability of electromagnetic shielding, meets the safety requirements and increases the safety and reliability of the radio frequency generating device 10.
The strong current threading hole 11m and the weak current threading hole 11n may be located at different areas of the installation housing 11, and in some embodiments, the strong current threading hole 11m and the weak current threading hole 11n are located at the same side of the installation housing 11, and the weak current threading hole 11n is closer to the power amplification board 121 than the strong current threading hole 11m, for convenience of wiring, thereby making the lengths of the strong current harness 16 and the weak current harness 17 both shorter. When the installation housing 11 includes the bottom plate 111 and the top cover 112, both the strong current threading hole 11m and the weak current threading hole 11n are provided on the bottom plate 111, as shown in fig. 11. Since the bottom plate 111 is covered by the top cover 112, the entire rf generator 10 is more waterproof when the strong current through holes 11m and the weak current through holes 11n are provided in the bottom plate 111. When the installation housing 11 includes only the top cover 112, the strong current threading hole 11m and the weak current threading hole 11n are both provided on the top cover 112, as shown in fig. 15, the strong current threading hole 11m and the weak current threading hole 11n may be both provided on the top wall 1124 or the side wall 1121 of the top cover 112, which is not limited in this application.
Since the top cover 112 is directly exposed, when the strong current threading hole 11m and the weak current threading hole 11n are both formed in the top cover 112, the waterproof requirements of the strong current threading hole 11m and the weak current threading hole 11n need to be considered, and the shapes and the sizes of the strong current threading hole 11m and the weak current threading hole 11n are matched with the cross-sectional shapes and the sizes of the corresponding strong current wire harness 16 and the weak current wire harness 17. Referring to fig. 15, in some embodiments, the top cover 112 is provided with two terminal boxes 1125, the two terminal boxes 1125 are fixedly connected and sealed with the top cover, and the wiring harness in the device and the wiring harness of the electronic module are wired in the terminal boxes 1125. The junction box 1125 and the top cover 112 may be separately disposed and fixedly connected by screws, and in some embodiments, the junction box 1125 and the top cover 112 may be provided as a unitary structure, for example, a countersink is disposed in the top cover 112 as the junction box 1125, and a cover plate 1126 is disposed on the opening of the junction box 1125 to close the junction box 1125, and the cover plate 1126 is flush with the surface of the top cover 112, as shown in fig. 13.
Referring to fig. 11, the outlet end of the power amplification board 121 of the power amplification module 12 is located at an end far away from the power module 13, and the power amplification board 121 is electrically connected with a first weak current harness 171 and a second weak current harness 172, wherein the first weak current harness 171 includes a harness output by the power amplification module 12 to external electronic equipment, and is used for outputting radio frequency signals and detection signals after power amplification, or is also used for receiving control instructions of a control board, and the first weak current harness 171 extends out of the mounting shell 11 through a weak current threading hole 11 n. The second weak current harness 172 is used for electrically connecting the power module 13 with the power amplifier module 12 to supply power to the power amplifier module 12, and the second weak current harness 172 is located in the mounting cavity 11 a. The outlet end of the power panel 131 of the power module 13 is located at a side far away from the power amplifier panel 121, the power module 13 is electrically connected with the strong electric wire harness 16 and the second weak electric wire harness 172, and the strong electric wire harness 16 extends out of the installation shell 11 through the strong electric wire threading hole 11m and is used for accessing the commercial power.
In the power amplifier module 12, the blower assembly 123 and the power amplifier board 121 are sequentially disposed along the airflow direction, so, in order to make the outlet end of the power amplifier board 121 be as far away from the outlet end of the power panel 131 as possible, referring to fig. 11, in some embodiments, the blower assembly 123 of the power amplifier module 12 is disposed closer to the outlet end of the power panel 131 than the power amplifier board 121. The two ends of the power amplification board 121 in the wind flow direction are respectively denoted as a first end 121c and a second end 121d, and then the first weak current harness 171 is located at the second end 121d of the power amplification board 121, and the blowing component 123 is located at the first end 121c of the power amplification board 121 and is close to the wire outlet end of the power panel 131, so that the blowing device 1231 and the wire outlet end of the power panel 131 are located at the same side, and the strong and weak current is separated.
Since the second weak current harness 172 is located in the installation cavity 11a, for convenience of wiring, and the second weak current harness 172 is brought as far away from the strong current harness 16 as possible, see figure 11, in some embodiments, the strong and weak power outlets of the power panel 131 are spaced apart, and the weak power outlets are closer to the power amplifier module 12 than the strong power outlets. The strong-current wire harness 16 is electrically connected with the strong-current wire outlet end of the power panel 131, the second weak-current wire harness 172 is electrically connected with the weak-current wire outlet end of the power panel 131, and the second weak-current wire harness 172 is wound on the outer side of the blowing component 123, so that no wire harness exists between the power module 13 and the power amplifier module 12, and wiring is facilitated. When the partition 113 is present between the power module 13 and the power amplifier module 12, the second weak current harness 172 is wound around the outside of the blower module 123 so as to avoid the partition 113 and avoid interference with the partition 113.
Since the electronic module may generate heat during operation, in order to meet the heat dissipation requirements of the electronic module, referring to fig. 12, in some embodiments, the side wall 1121 of the body 110 of the mounting case 11 is provided with a plurality of heat dissipation holes 11d which are spaced apart, and when the internal electronic module generates heat, the heat is dissipated outwards through air, thereby realizing the heat dissipation of the electronic module. The heat dissipation holes 11d are formed on at least one side wall 1121 of the installation shell 11, in some embodiments, the heat dissipation holes 11d are formed on at least two opposite side walls 1121 of the installation shell 11, so as to form an air flow passing through the installation cavity 11a, thereby effectively improving the heat dissipation effect; or the side walls 1121 except the side wall 1121 facing the user are provided with the heat radiation holes 11d, thereby improving the heat radiation effect and the aesthetic property of the mounting shell 11.
The side wall 1121 of the mounting case 11 is provided with a baffle 1122 for shielding the heat radiation hole 11d in a direction parallel to the side wall 1121, the baffle 1122 is provided at a position corresponding to the heat radiation hole 11d, and the projection of the baffle 1122 on the side wall 1121 of the mounting case 11 covers the heat radiation hole 11d, i.e., the heat radiation hole 11d is completely covered by the baffle 1122 as seen in a direction perpendicular to the side wall 1121 (as shown by an arrow a in fig. 13), and by the shielding effect of the baffle 1122, water, dust, or the like is effectively prevented from directly entering the mounting case 11, and the possibility of damaging the electronic module is reduced while the heat radiation effect is achieved. For the mounting case 11 including the bottom plate 111 and the top cover 112, and the mounting case 11 provided with only the top cover 112, the heat radiation holes 11d are provided on the side wall 1121 of the top cover 112. The baffle 1122 may be integrally formed with the side wall 1121 to increase the strength of the overall structure, or may be fixedly attached to the side wall 1121 by means such as heat welding to facilitate control of the form thereof during the manufacturing process, thereby facilitating the production and assembly.
To achieve waterproofing of the heat dissipation hole 11d, in some embodiments, referring to fig. 12, a shroud 115 for shielding the heat dissipation hole 11d is provided on the body 110 of the mounting case 11 at a position above the heat dissipation hole 11d, the shroud 115 extends outward to shield the heat dissipation hole 11d in a direction perpendicular to the side wall 1121, and a projection of the shroud 115 on the side wall 1121 has an overlapping area with the heat dissipation hole 11 d. When water is sputtered to the body 110 of the installation shell 11 from the top or in a direction which forms a certain angle with the side wall 1121, the heat dissipation holes 11d are shielded by the enclosing plate 115, so that the water is effectively prevented from entering the installation cavity 11a from the heat dissipation holes 11d shielded below the enclosing plate 115, and the waterproof effect of the installation shell 11 is improved. The coaming 115 and the body 110 of the installation shell 11 may be in an integral structure, so as to improve structural strength and stability of the whole structure, or the coaming 115 may be fixedly installed on a side wall or a top plate of the body 110, so that the shape thereof is convenient to control during the processing, thereby being convenient for production and assembly.
In some embodiments, the shroud 115 may be a horizontal plate surface inclined with respect to the side wall 1121, and the shroud 115 may be a bent plate surface, where an edge of the shroud 115 away from one side of the body 110 is bent downward, so that the shroud 115 shields the heat dissipation holes 11d laterally, and the shielding effect of the shroud 115 is further improved. In some embodiments, the heat dissipation holes 11d are completely shielded by the shroud 115, i.e., the corresponding projection of the shroud 115 on the sidewall 1121 completely covers the heat dissipation holes 11d, further enhancing the water blocking effect of the heat dissipation holes 11 d.
In some embodiments, the cross section of the shroud 115 is L-shaped, one end of the shroud 115 is disposed at the top of the side wall 1121 of the body 110, the top surface of the shroud 115 is flush with the top surface of the body 110, the other end of the shroud 115 extends downward and is parallel to the side wall 1121 of the body 110, so as to shield the heat dissipation holes 11d, and two sides of the shroud 115 are disposed at the edge of the heat dissipation holes 11d in a blocking manner, so that a groove structure for completely shielding the upper part of the heat dissipation holes 11d is formed; the bottom end of the shroud 115 may extend downward to completely shield the heat dissipation hole 11d, that is, the projection of the shroud 115 on the side wall 1121 of the body 110 covers the heat dissipation hole 11d, so as to shield the heat dissipation hole 11d at the side surface, and a gap is left between the bottom end of the shroud 115 and the bottom surface of the body 110 for air flow to pass through, so that the shielding effect of the heat dissipation hole 11d at the side surface is further improved, and water is prevented from entering; meanwhile, when the air flow enters through the radiating holes 11d, the air flow is firstly shielded by the coaming 115 and then passes through the radiating holes 11d to form a bent air flow, so that dust or water drops in the air flow are shielded, and the shielding effect on the radiating holes 11d is further improved. In other embodiments, the bottom of the shroud 115 may be formed in other forms, such as an angle formed between an extension of the shroud 115 and the side wall 1121 to form an inclined surface inclined inward or outward in the vertical direction, or the cross section of the shroud 115 may be circular arc, so long as the projection of the shroud 115 on the main body covers the heat dissipation hole 11 d.
In some embodiments, the shroud 115 may not be provided at a position where the heat radiation hole 11d is not provided; in other embodiments, a circle of coaming 115 may be disposed along the circumference of the body 110, so as to maximize the shielding effect of the coaming 115. The shroud 115 and the baffle 1122 may be alternatively arranged, and considering that the power amplifier board 121, the power panel 131, and other circuit board components 1211 are more, the baffle effect is limited only by arranging the baffle 1122 or the shroud 115, and in some embodiments, the side wall 1121 is provided with the baffle 1122 and the coaming 115, the coaming 115 is positioned outside the side wall 1121, and the baffle 1122 is positioned inside the side wall 1121 or inside the side wall 1121, so that the water retaining effect of the heat dissipation holes 11d is further improved.
Example 3:
based on the same inventive concept, the embodiment of the present application provides a radio frequency thawing apparatus, which includes a radio frequency thawing assembly 30 and the radio frequency generating device 10 of the above embodiment 2. Referring to fig. 18, 19 and 20, a tuning plate and pole plate are provided in the rf thawing assembly 30, the tuning plate is electrically connected with a tuning inductor, and the tuning inductor can be selectively arranged on the tuning plate or independent from the tuning plate. The tuning plate is electrically connected with the power amplification plate 121 of the radio frequency generating device 10, the tuning module is used for balancing the impedance of the load end so as to realize impedance matching, and the polar plate is electrically connected with the tuning plate and is used for transmitting radio frequency signals with set frequencies. The signal output by the power amplification module 12 is a radio frequency signal subjected to power amplification corresponding to a standard load, the tuning module is used for adjusting the impedance of the load end. The different unfreezed substances have different impedances, the impedance of the drawer is not the standard load impedance, the load impedance changes in the unfreezing process, the impedance matching is realized through the tuning module, the impedance matching is equivalent to the standard load, the control module controls the tuning module to perform the impedance matching, the tuning module outputs a signal to the polar plate, and the polar plate sends out a radio frequency signal, so that the food material unfreezing purpose is realized.
Referring to fig. 23, the rf thawing assembly 30 further comprises a shield cylinder 31 having an open end 31a with an opening, and a shield door 32 provided at the open end 31a of the shield cylinder 31 for closing the opening to form a closed shield cavity with the shield cylinder 31. The tuning plate and the polar plate are arranged in the shielding cylinder 31, the shielding cylinder 31 can provide a mounting foundation for the tuning plate and the polar plate, the purpose of protecting the tuning plate and the polar plate can be achieved, radio frequency signals emitted by the polar plate can be shielded, and radio frequency signal leakage is avoided.
Referring to fig. 21, in some embodiments, a tuning cavity 31e and a thawing cavity 31f are provided in the shield cylinder 31, the tuning plate and the pole plate are both provided in the tuning cavity 31e, the thawing cavity 31f is used for containing food to be thawed, and the pole plate radiates radio frequency energy into the thawing cavity 31f, thereby thawing the food in the thawing cavity 31 f. The tuning plate and the polar plate are placed separately from the food material, so that on one hand, pollution to the food material is avoided, and on the other hand, water melted after thawing the food material is prevented from contacting the tuning plate and the polar plate, and damage to the component 1211 is avoided.
Referring to fig. 22, in some embodiments, the shielding cylinder 31 is further provided with an air inlet 31c and an air outlet 31d that are in communication with the tuning cavity 31e, where the air inlet 31c and the air outlet 31d may be disposed on the same side wall 1121 of the shielding cylinder 31, or may be disposed on different side walls 1121, which is not limited in this application.
Example 4:
based on the same inventive concept, an embodiment of the present application provides a refrigerator, as shown in fig. 21, the refrigerator 100 includes a refrigerator main body 20 and the radio frequency thawing apparatus of the above embodiment 3, and a refrigeration unit 22 for refrigerating is disposed in the refrigerator main body 20, for providing cold to at least one of the freezing chamber, the refrigerating chamber, and the temperature-varying compartment. The radio frequency generating device 10 of the radio frequency thawing device is disposed inside or outside the refrigerator main body 20, and the specific structure thereof is described in the above embodiment 3, and will not be repeated here. The radio frequency thawing assembly 30 of the radio frequency thawing device is disposed in the refrigerator main body 20, specifically, the refrigerator main body 20 is provided with an installation cavity 21, the radio frequency thawing assembly 30 is disposed in the installation cavity 21, and the specific structure of the radio frequency thawing device is described in reference to embodiment 3 and will not be repeated here. The installation cavity 21 is located in one of a freezing chamber, a refrigerating chamber, and a temperature changing chamber of the refrigerator 100, which is not limited in this application.
In some embodiments, the rf generating device 10 is disposed outside the refrigerator main body 20, and the rf generating device 10 may be disposed on the top, back or side of the refrigerator main body 20, which is not limited in this application. Referring to fig. 24, in some embodiments, the rf generating device 10 is located on the top surface of the refrigerator main body 20, the mounting case 11 of the rf generating device 10 is connected to the U-shaped case 23 of the top of the refrigerator main body 20 through the fixing member 18, and when the mounting case 11 includes the base plate 111 and the top cover 112, both the electronic module and the top cover 112 are mounted on the base plate 111, and the base plate 111 is mounted on the top surface of the U-shaped case 23 through the fixing member 18. Referring to fig. 25, in some embodiments, the mounting housing 11 includes only a top cover 112, the electronic module is mounted on an inner surface of a top wall 1124 of the top cover 112, and the top cover 112 is flip-off mounted to a top surface of the U-shaped housing 23 by the fixing member 18.
In some embodiments, referring to fig. 22, the shielding cylinder 31 of the rf thawing assembly 30 is further provided with an air inlet 31c and an air outlet 31d that are in communication with the tuning cavity 31e, and the air inlet 31c and the air outlet 31d may be disposed on the same side wall 1121 of the shielding cylinder 31 or may be disposed on different side walls 1121, which is not limited in this application. The side wall 1121 provided with the air inlet 31c and the air outlet 31d and the mounting cavity 21 have a gap a therebetween, so that the air circulation is formed between the air inlet 31c and the air outlet 31d and the gap a between the side wall 1121 provided with the air inlet 31c and the air outlet 31d and the mounting cavity 21, and the heat dissipation is performed on the tuning cavity 31 e.
In some embodiments, referring to fig. 22, the refrigerator 100 further includes a wind flow accelerator 40, and the wind flow accelerator 40 accelerates cool wind into the tuning cavity 31e through the gap a and the wind inlet 31c to accelerate air circulation, thereby improving heat dissipation efficiency.
In this application, unless expressly stated or limited otherwise, a first feature "above" or "below" a second feature may include both the first and second features being in direct contact, and may also include the first and second features not being in direct contact but being in contact with each other by way of additional features therebetween. Moreover, a first feature being "above," "over" and "on" a second feature includes the first feature being directly above and obliquely above the second feature, or simply indicating that the first feature is higher in level than the second feature. The first feature being "under", "below" and "beneath" the second feature includes the first feature being directly under and obliquely below the second feature, or simply means that the first feature is less level than the second feature.
In the description of the present application, it should be understood that the terms "center," "longitudinal," "transverse," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise" indicate or positional relationships are based on the positional relationships shown in the drawings, merely for convenience of description and to simplify the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and therefore should not be construed as limiting the present application.
It should be noted that all the directional indicators in the embodiments of the present application are only used to explain the relative positional relationship, movement conditions, etc. between the components in a specific posture, and if the specific posture is changed, the directional indicators are correspondingly changed.
In the present application, unless explicitly specified and limited otherwise, the terms "coupled," "secured," and the like are to be construed broadly, and for example, "secured" may be either permanently attached or removably attached, or integrally formed; can be mechanically or electrically connected; either directly or indirectly, through intermediaries, or both, may be in communication with each other or in interaction with each other, unless expressly defined otherwise. The specific meaning of the terms in this application will be understood by those of ordinary skill in the art as the case may be.
In addition, descriptions such as those related to "first," "second," and the like, are provided for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated in this application. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more features. In the description of the present application, the meaning of "a plurality" is two or more, unless explicitly defined otherwise.
In the description of the present specification, a description referring to terms "one embodiment," "some embodiments," "examples," "specific examples," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present application. In this specification, schematic representations of the above terms are not necessarily directed to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Further, one skilled in the art can engage and combine the different embodiments or examples described in this specification.
In addition, the technical solutions of the embodiments may be combined with each other, but it is necessary to base that the technical solutions can be realized by those skilled in the art, and when the technical solutions are contradictory or cannot be realized, the combination of the technical solutions should be regarded as not exist and not within the protection scope of the present application.
While embodiments of the present application have been shown and described, it will be understood by those of ordinary skill in the art that: many changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the application, the scope of which is defined by the claims and their equivalents.
Claims (12)
1. A power amplifier module, comprising:
the power amplification board is provided with a first surface and a second surface which are oppositely arranged, and the first surface of the power amplification board is provided with components;
the power amplifier shielding cover is covered on the first surface of the power amplifier board, and a vent is arranged at the position, opposite to the component, of the power amplifier shielding cover;
and the heat dissipation piece is arranged on the second surface of the power amplification plate.
2. The power amplifier module of claim 1, wherein: and the top plate and the side plate of the power amplifier shielding cover are respectively provided with the air vents.
3. The power amplifier module of claim 2, wherein: a window is arranged on the power amplifier shielding cover; the power amplifier module further comprises a screen plate, the screen plate is located in the window, and the meshes of the screen plate form the air vent.
4. A power amplifier module as claimed in claim 3, characterized in that: the screen plate is an electromagnetic shielding screen.
5. The power amplifier module of claim 1, wherein: the component is an inductor.
6. The power amplifier module of any one of claims 1-5, wherein: the power amplifier module further comprises an airflow accelerating device arranged on the power amplifier shielding cover, and the airflow accelerating device blows air to the inner cavity of the power amplifier shielding cover or extracts hot air from the inner cavity of the power amplifier shielding cover.
7. The power amplifier module of any one of claims 1-5, wherein: the heat dissipation piece is provided with an airflow channel; the power amplifier module further comprises:
a blowing device for generating a wind flow;
the air duct is provided with a first opening and a second opening which are oppositely arranged, the first opening is communicated with a blowing opening of the blowing device, the second opening is communicated with an airflow channel of the radiating piece to form an air outlet, and the size of the second opening in the width direction of the power amplification plate is larger than that of the first opening.
8. The power amplifier module of claim 7, wherein: the heat dissipation piece is made of metal and comprises a metal plate and a plurality of heat dissipation fins which are arranged on one surface of the metal plate at intervals, and gaps among the plurality of heat dissipation fins which are arranged at intervals form the air flow channel; the power amplification plate is connected to the metal plate and is in contact with the metal plate.
9. A radio frequency generating device, comprising:
the installation shell is provided with an installation cavity;
the power amplifier module of any one of claims 1-8 disposed in the mounting cavity and connected to the mounting housing;
and the power module is arranged in the mounting cavity and connected with the mounting shell and is used for supplying power to the power amplification plate.
10. The radio frequency generating device according to claim 9, wherein: the power module comprises a power supply shell and a power panel arranged in the power supply shell, wherein the power supply shell is connected with the mounting shell, and the power panel is electrically connected with the power amplifier panel.
11. A radio frequency thawing device, comprising: a radio frequency thawing assembly and a radio frequency generating device as defined in any one of claims 9-10; the radio frequency thawing assembly comprises:
A shielding cylinder provided with an opening end with an opening;
the shielding door is arranged at the opening end of the shielding cylinder body and is used for closing the opening;
the tuning plate is arranged in the shielding cylinder body and is electrically connected with the power amplification plate of the radio frequency generating device;
and the polar plate is arranged in the shielding cylinder body, is electrically connected with the tuning plate and is used for transmitting radio frequency signals.
12. A refrigerator, comprising:
a refrigerator main body;
the rf thawing device as defined in claim 11, wherein the rf thawing assembly is disposed inside the refrigerator body, and the rf generating device is disposed inside or outside the refrigerator body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223373710.8U CN220457753U (en) | 2022-12-15 | 2022-12-15 | Power amplifier module, radio frequency generating device radio frequency thawing device and refrigerator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223373710.8U CN220457753U (en) | 2022-12-15 | 2022-12-15 | Power amplifier module, radio frequency generating device radio frequency thawing device and refrigerator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220457753U true CN220457753U (en) | 2024-02-06 |
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ID=89730394
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202223373710.8U Active CN220457753U (en) | 2022-12-15 | 2022-12-15 | Power amplifier module, radio frequency generating device radio frequency thawing device and refrigerator |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220457753U (en) |
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2022
- 2022-12-15 CN CN202223373710.8U patent/CN220457753U/en active Active
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