CN219515184U - Radio frequency generating device, radio frequency thawing device and refrigerator - Google Patents

Abstract

The application discloses a radio frequency generating device, a radio frequency thawing device and a refrigerator, which solve the technical problems of complex structure and high cost when the heat dissipation problem is solved in the prior art. The radio frequency generating device comprises a mounting shell provided with a mounting cavity; the power amplification module is arranged in the mounting cavity, is connected with the mounting shell and is used for generating radio frequency signals after power amplification, and the power amplification module comprises a power amplification plate and a blowing device for forcedly radiating the power amplification plate; and one end of the heat conducting piece is in heat conducting connection with the power module, and the other end of the heat conducting piece is positioned on the airflow path of the blowing device. Through setting up the heat conduction spare can realize carrying out radiating effect to two modules simultaneously through single blast apparatus, improves the radiating effect to power amplifier module and power module.

Description

Radio frequency generating device, radio frequency thawing device and refrigerator

Technical Field

The application belongs to the technical field of radio frequency, and particularly relates to a radio frequency generating device, a radio frequency thawing device and a refrigerator.

Background

The radio frequency thawing technology can make the thawed object be thawed evenly and quickly by penetrating food through low-frequency electromagnetic waves. Refrigerators equipped with radio frequency thawing devices applying radio frequency thawing technology are popular with consumers. The radio frequency generating device is an important component in the radio frequency thawing device and mainly comprises a power amplification module for generating radio frequency signals after power amplification and a power supply module for regulating voltage and supplying power to the power amplification module.

In the radio frequency generating device of the refrigerator, heat is generated when the power module and the radio frequency module work, and in the related technology, different heat radiating components are often needed to radiate heat, so that the structure is complex and the cost is high.

Disclosure of Invention

In order to solve the technical problems of complex structure and high cost when the heat dissipation problem is solved at present, the utility model provides the radio frequency generating device, and the heat conduction piece is arranged to enable the blowing device to simultaneously dissipate heat of an electronic module in the radio frequency generating device.

The utility model adopts a technical scheme that: there is provided a radio frequency generating device comprising:

the installation shell is provided with an installation cavity;

the power amplification module is arranged in the mounting cavity and connected with the mounting shell, and comprises a power amplification plate for generating radio frequency signals after power amplification and a blowing device for forcedly radiating the power amplification plate;

the power module is arranged in the mounting cavity and connected with the mounting shell and is used for supplying power to the power amplifier module;

and one end of the heat conducting piece is in heat conducting connection with the power supply module, and the other end of the heat conducting piece is positioned on the airflow path of the blowing device.

According to the technical scheme, the radio frequency generating device is provided with the heat conducting piece, the heat conducting piece is in heat conducting connection with the power module and is located on the airflow path of the blowing device, airflow generated by the blowing device can be used for forcedly radiating heat, and then the power module is radiated, and the blowing device can forcedly radiate heat to the power amplification plate at the same time, so that the effect of radiating heat to the two modules through a single blowing device can be achieved through the heat conducting piece, and the radiating effect of the power amplification module and the power module is improved.

In some embodiments, the heat conducting member is provided in the mounting cavity and connected with the mounting case;

or the installation shell is provided with a heat dissipation opening communicated with the installation cavity, and the heat conduction piece is fixed on the installation shell and is positioned in the heat dissipation opening;

or the installation shell is made of metal, and the part of the installation shell, which is contacted with the heat dissipation piece and the power module, forms the heat conduction piece.

In some embodiments, a partition board is arranged in the installation shell, the installation cavity is divided into a power amplification cavity and a power supply cavity by the partition board, the power amplification module is arranged in the power amplification cavity, and the power supply module is arranged in the power supply cavity.

In some embodiments, the mounting shell comprises a bottom plate and a top cover covered on the bottom plate, the bottom plate and the top cover enclose the mounting cavity, and the partition board, the power amplifier module and the power module are all connected to the bottom plate;

or, the installation shell comprises a top cover, the inner cavity of the top cover forms the installation cavity, and the power amplifier module and the power module are both connected to the top cover through the partition plates.

In some embodiments, the power amplifier module further includes a heat dissipation member located on an airflow path of the blower device, and the heat conduction member and the power amplifier board are respectively in contact with two surfaces opposite to the heat dissipation member.

In some embodiments, the heat sink is provided with an air flow channel through which the air flow of the blower device flows.

In some embodiments, the power amplification module further comprises an air duct with a first opening and a second opening, wherein the first opening and the air outlet of the air blowing device are oppositely arranged, and the second opening is communicated with the air flow channel of the heat dissipation piece; the second opening has a larger dimension than the first opening in the width direction of the power amplification board.

In some embodiments, the heat dissipation member is made of metal, and comprises a metal plate and a plurality of heat dissipation fins arranged on one surface of the metal plate at intervals, and gaps among the plurality of heat dissipation fins at intervals form the air flow channel; the heat conducting piece is in contact with the radiating fins.

In some embodiments, the power amplifier module further includes a power amplifier shielding cover covered on the power amplifier board, where the power amplifier shielding cover and the metal plate are located on two opposite surfaces of the power amplifier board.

In some embodiments, the projections of the power amplifier module and the power supply module on the plane of the heat conducting piece are all located on the heat conducting piece, and the surfaces of the heat conducting piece opposite to the power amplifier module and the power supply module are in contact with the power amplifier module and the power supply module; the heat conducting piece is a metal sheet.

In some embodiments, the power module includes a power supply housing and a power strip disposed in the power supply housing for supplying power.

In some embodiments, the power supply housing is filled with a heat-conducting insulating glue, the heat-conducting insulating glue is in contact with both the power supply board and the power supply housing, and the heat-conducting insulating glue wraps components on the power supply board.

The application adopts another technical scheme that: there is provided a radio frequency thawing apparatus comprising: the radio frequency thawing assembly and the radio frequency generating device are arranged on the same side of the radio frequency thawing assembly; the radio frequency thawing assembly comprises:

a shielding cylinder provided with an opening end with an opening;

the shielding door is arranged at the opening end of the shielding cylinder body and is used for closing the opening;

the tuning plate is arranged in the shielding cylinder body and is electrically connected with the power amplification plate of the radio frequency generating device;

and the polar plate is arranged in the shielding cylinder body, is electrically connected with the tuning plate and is used for transmitting radio frequency signals.

The application adopts another technical scheme that: the refrigerator comprises a refrigerator main body and the radio frequency generating device, wherein the radio frequency generating device is arranged inside or outside the refrigerator main body; in the radio frequency thawing device, the radio frequency thawing assembly is arranged in the refrigerator main body.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for the description of the embodiments will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present application, and other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

Fig. 1 is a schematic view showing a structure of a radio frequency generating device in a partially cut-away state of a top cover according to an embodiment of the present application.

Fig. 2 shows a schematic structural view of the radio frequency generating device of fig. 1 with the top cover removed.

Fig. 3 shows a schematic structural diagram of the radio frequency generating device in fig. 2 at another view angle.

Fig. 4 shows a schematic structural diagram of the radio frequency generating device of fig. 3 in an exploded state of the power module.

Fig. 5 shows a bottom view of a radio frequency generating device according to a further embodiment of the application.

Fig. 6 shows a schematic structural view of the radio frequency generating device of fig. 5 after being mounted on a device.

Fig. 7 is a schematic structural diagram of a power amplifier module of a radio frequency generating device according to an embodiment of the present application.

Fig. 8 shows an exploded view of the power amplifier module of fig. 7.

Fig. 9 is a schematic structural diagram of a power module of a radio frequency generating device according to an embodiment of the present application.

Fig. 10 is a schematic structural diagram of a power module of a radio frequency generating device according to another embodiment of the present application.

Fig. 11 shows a functional block diagram of a radio frequency thawing device in accordance with an embodiment of the present application.

Fig. 12 shows a functional block diagram of a radio frequency thawing device in accordance with another embodiment of the present application.

Fig. 13 shows a functional block diagram of a radio frequency thawing device in accordance with a further embodiment of the present application.

Fig. 14 is a schematic view showing a structure of a refrigerator in an embodiment of the present application.

Fig. 15 shows a partial enlarged view at a of fig. 14.

Fig. 16 is a view showing an assembled structure of a shield cylinder and a shield door in the refrigerator of fig. 14.

Reference numerals illustrate:

100-refrigerator; 10-a radio frequency generating device; 20-a refrigerator main body, 21-a mounting cavity, 22-a refrigerating assembly and 23-a U shell; 30-radio frequency thawing components, 31-shielding barrels, 31 a-opening ends, 31 c-air inlets of the shielding barrels, 31 d-air outlets of the shielding barrels, 31 e-tuning cavities, 31 f-thawing cavities and 32-shielding doors; 40-wind flow accelerator.

11-mounting shell, 11 a-mounting cavity, 11 b-power amplification cavity, 11 c-power supply cavity, 11 e-heat dissipation port, 11 i-hollowed-out hole and 11 j-drain hole; 111-a bottom plate; 112-top cap; 113-separator, 114-heat conducting member.

12-power amplifier module, 121-power amplifier board, 121 a-first surface, 121 b-second surface, 121 c-first end, 121 d-second end, 1211-component of power amplifier module; 122-heat sink, 122 a-air flow channel, 122 b-relief blind hole, 1221-sheet metal, 1221 a-mounting plane, 1222-fin, 1223-lug; 123-blowing components, 1231-blowing devices, 1231 a-blowing ports, 1232-air channels, 1233-air outlets, 1234-first openings, 1235-second openings; 124-power amplifier shielding cover, 1241-top plate, 1242-side plate; 127-fastener.

13-power module, 131-power panel, 132-power shell, 132 a-through hole, 133-heat conduction insulating glue in the power module, 1311-component of the power module; 18-fixing piece.

Detailed Description

The following description of the embodiments of the present application will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are only some, but not all embodiments of the application. All other embodiments, which can be made by those skilled in the art based on the embodiments of the application without making any inventive effort, are intended to be within the scope of the application.

Furthermore, the present application may repeat reference numerals and/or letters in the various examples, which are for the purpose of brevity and clarity, and which do not themselves indicate the relationship between the various embodiments and/or arrangements discussed. In addition, the present application provides examples of various specific processes and materials, but one of ordinary skill in the art will recognize the application of other processes and/or the use of other materials.

In the related art, in the radio frequency generating assembly of the refrigerator, heat is generated when the power module and the radio frequency module work, when the heat dissipation problem is solved, heat dissipation is usually carried out through different heat dissipation assemblies, and therefore the whole radio frequency generating assembly is complex in structure and high in cost.

The application is described below with reference to specific embodiments in conjunction with the accompanying drawings:

example 1:

the embodiment of the application provides a radio frequency generating device 10, and reference parts shown in fig. 1 and 2, which comprises a mounting shell 11, a power amplification module 12 for generating radio frequency signals after power amplification, and a power supply module 13 for supplying power to the power amplification module 12. At least one of the two electronic modules, i.e. the power amplifier module 12 and the power supply module 13, is provided with a blowing device for forced heat dissipation by means of the wind flow generated by the blowing device. In some embodiments, the blower device is disposed in the power amplification module, referring to fig. 2, the power amplification module 12 includes a power amplification board 121 for generating a radio frequency signal after power amplification, and a blower device 1231 for forcibly radiating heat from the power amplification board, where the blower device 1231 may employ a blower or a fan, and the present application is not limited thereto.

Referring to fig. 3, 4 and 6, the mounting case 11 is provided with a heat conductive member 114, one end of the heat conductive member 114 is thermally connected to the power module 13, and the other end is located on the air flow path of the blowing device 1231. The heat conducting member 114 is in heat conducting connection with the power module 13, specifically, the heat conducting member 114 may be in direct contact with the power module 13 for heat conduction, or may be indirectly in heat conduction through a heat conducting material such as a heat conducting glue or a heat conducting pad, or in some embodiments, the heat conducting member 114 may be disposed close to the power module 13 for heat exchange through air. The heat conducting piece 114 is located on the airflow path of the blowing device 1231, the airflow generated by the blowing device 1231 can be blown to the heat conducting piece 114, the heat conducting piece 114 can forcedly dissipate heat by utilizing the airflow generated by the blowing device 1231, and then the power module 13 is dissipated, and the blowing device 1231 forcedly dissipates heat to the power amplifier plate 121 at the same time, so that the effect of dissipating heat to two electronic modules at the same time through a single blowing device 1231 can be achieved through the arrangement of the heat conducting piece 114, and the heat dissipation effect to the power amplifier module 12 and the power module 13 is improved.

In some embodiments, the heat conducting member 114 may be disposed in the mounting cavity 11a, and the heat conducting member 114 is attached to the power amplifier module 12 and the power module 13 at the same time, so that a heat dissipation effect can be achieved, for example, a heat dissipation groove is formed on the inner wall of the mounting shell 11, and the heat conducting member 114 is embedded in the heat dissipation groove, so that heat is transferred to the mounting shell 11 while heat is conducted to the power amplifier module 12 and the power module 13. In other embodiments, referring to fig. 3 and 6, a heat dissipation opening 11e adapted to the heat conducting member 114 may be further formed in the mounting shell 11, and the heat conducting member 114 is embedded in the heat dissipation opening 11e to make the heat conducting member 114 directly contact with external air, so that heat is directly dissipated while conducting heat to the power amplifier module 12 and the power module 13, thereby improving the heat dissipation effect to the power amplifier module 12 and the power module 13, and facilitating the installation of the heat conducting member 114. In other embodiments, the wall plate of the installation shell 11 for installing the power amplifier module 12 and the power module 13 may be directly made of metal, the metal part is used as the heat conducting member 114, the power amplifier module 12 and the power module 13 are directly connected with the installation shell 11, the heat conduction and the heat dissipation of the power amplifier module 12 and the power module 13 are simultaneously realized through the installation shell 11, the heat conducting member 114 is not required to be designed separately, and the area of the metal part can be determined according to the actual situation, so as to save the cost.

In some embodiments, the heat conducting member 114 is a plate material with the areas of the power amplifying module 12 and the power supply module 13 being adapted, the surfaces of the power amplifying module 12 and the power supply module 13 facing to one side of the heat conducting member 114 are attached to the heat conducting member 114, the area of the heat conducting member 114 is not smaller than the sum of the areas of the positions of the power amplifying module 12 and the power supply module 13 attached to the heat conducting member 114, the projections of the power amplifying module 12 and the power supply module 13 on the plane of the heat conducting member 114 are located on the heat conducting member 114, that is, the heat conducting member 114 completely covers the power amplifying module 12 and the power supply module 13 of the heat conducting member 114 when seen from the direction perpendicular to the plane of the heat conducting member 114, so that heat of each position of the power amplifying module 12 and the power supply module 13 of the heat conducting member 114 can be transferred to the heat conducting member 114, and heat conduction efficiency of the heat conducting member 114 to the power amplifying module 12 and the power supply module 13 is effectively improved, and heat dissipation effect is improved.

In some embodiments, the heat conducting member 114 may be made of metal, and the heat conducting capability of the metal is utilized to improve the heat conducting effect on the power amplifier module 12 and the power module 13, specifically, may be made of aluminum, so that the cost is reduced while the heat conducting effect is improved, and similarly, when the heat conducting member 114 is the mounting shell 11 of the metal part, the metal may be made of aluminum; in other embodiments, the heat conducting member 114 may be made of other materials, such as a heat conducting silicon sheet, a graphite sheet, etc., which may be specifically determined according to the actual situation.

Referring to fig. 7 and 8, in some embodiments, the power amplifier module 12 is provided with a heat dissipation element 122, the power amplifier module 12 includes a power amplifier board 121, the heat dissipation element 122 and a blower assembly 123, the power amplifier board 121 is disposed on the heat dissipation element 122, the heat dissipation element 122 may be a metal heat dissipation element or a semiconductor heat dissipation element, the heat dissipation element 122 is located on an airflow path of the blower 1231, the airflow generated by the blower 1231 can be blown to the heat dissipation element 122, and the heat dissipation element 122 can forcedly dissipate heat by using the airflow generated by the blower 1231, so as to dissipate heat of the power amplifier board 121. The heat sink 122 is thermally coupled to the thermally conductive member 114.

The heat dissipation element 122 is disposed on the power amplification board 121, and the heat dissipation element 122 and the power amplification board 121 may be selectively connected and fixed or only contacted. The heat sink 122 is provided with an air flow passage 122a, and heat of the heat sink 122 can be taken away when wind flows through the air flow passage 122 a. The air blowing component 123 is configured to blow air into the air flow channel 122a, dissipate heat of the power amplification board 121, the air blowing component 123 and the power amplification board 121 are sequentially disposed along the air flow direction, two ends of the power amplification board 121 in the air flow direction are respectively denoted as a first end 121c and a second end 121d, the air blowing component 123 is disposed at the first end 121c of the power amplification board 121, and the second end 121d of the power amplification board 121 can be used as an outlet end of the power amplification board 121. The blower assembly 123 includes a blower 1231 and an air duct 1232, the blower 1231 is configured to generate a wind flow, and the air duct 1232 communicates the blower 1231 with the heat sink 122. Specifically, the air duct 1232 has a first opening 1234 and a second opening 1235 that are disposed opposite to each other, the first opening 1234 is communicated with the air blowing opening 1231a of the air blowing device 1231, the second opening 1235 is communicated with the air flow channel 122a of the heat dissipation member 122, and the air flow generated by the air blowing device 1231 enters the air flow channel 122a through the air duct 1232, so that the heat dissipation member 122 is dissipated by forced convection.

When in use, the heat dissipation element 122 is in contact with the power amplification plate 121, and the heat of the power amplification plate 121 is conducted to the heat dissipation element 122. The wind flow generated by the blowing device 1231 enters the airflow channel 122a through the air duct 1232, forced convection dissipates heat of the heat dissipation part 122, and the heat dissipation part 122 further dissipates heat of the power amplification plate 121, so that the temperature of the power amplification plate 121 is effectively reduced, and the safety and reliability of products are improved. Due to the arrangement of the air duct 1232 and the heat dissipation member 122 having the air flow channel 122a, the air flow generated by the air blowing device 1231 can all enter the air flow channel 122a, the air volume utilization rate is high, and the heat dissipation requirement of the power amplification plate 121 can be met with smaller power and flow.

Referring to fig. 8, in the power amplifier module 12 provided by the present application, the dimension of the second opening 1235 of the air duct 1232 in the width direction of the power amplifier board 121 is greater than the dimension of the first opening 1234 in the width direction of the power amplifier board 121. That is, the air duct 1232 adopts a flaring design, and along the flow direction of the wind flow, the size of the inner cavity of the air duct 1232 in the width direction of the power amplification plate 121 tends to increase, and specifically, linear increase, nonlinear increase or gradient increase can be adopted. To reduce wind resistance, in some embodiments, the projection of the air duct 1232 on the plane parallel to the power amplification plate 121 is trapezoidal, and the shapes of the first opening 1234 and the second opening 1235 are respectively adapted to the shape of the air blowing opening 1231a of the air blowing device 1231 and the inlet shape of the air flow channel 122a of the heat dissipation member 122.

Because the second opening 1235 of the air duct 1232 is larger than the first opening 1234 in the width direction of the power amplification plate 121, the air flow is increased in the width direction of the power amplification plate 121 in the process of flowing from the first opening 1234 to the second opening 1235 of the air duct 1232, and the air flow can be matched with a heat dissipation device, so that the air flow is blown across the whole width of the power amplification plate 121, and the heat dissipation efficiency is further improved. In addition, the air duct 1232 can also realize the adaptation of the shapes of the air blowing device 1231 and the opening 11g of the heat dissipation member 122, so that the requirement on the shape selection of the air blowing device 1231 is reduced. The blowing device 1231 may be a fan, or the like capable of generating a wind flow, and the present application is not limited thereto. In some embodiments, to further meet the miniaturization requirements of the device, the blower 1231 employs an axial flow fan. In some embodiments, a shock pad is provided between the blowing device 1231 and the mounting case 11, for example, a rubber pad or a silicone pad is used to achieve shock absorption of the blowing device 1231.

The heat dissipation element 122 and the power amplification board 121 conduct heat, and the heat dissipation element 122 is required to have good heat conductivity, and the heat conductivity of metal and ceramic can be achieved, so that the material and shape of the heat dissipation element 122 are not limited. In some embodiments, the heat dissipation element 122 is made of metal, and may be aluminum, iron, or other metals or alloys thereof, and aluminum is preferred in view of light weight.

In order to satisfy the installation and heat dissipation of the power amplification plate 121, referring to fig. 8, the heat dissipation member 122 includes a metal plate 1221 and a plurality of heat dissipation fins 1222, the heat dissipation fins 1222 are distributed on one surface of the metal plate 1221, the heat dissipation fins 1222 are spaced apart such that gaps between the heat dissipation fins 1222 form an air flow channel 122a, a lower end of the air flow channel 122a is open, and when the lower end of the heat dissipation member 122 faces the heat conduction member 114, air flow in the air flow channel 122a can blow from the open lower end to the heat conduction member 114, thereby forcibly dissipating heat from the heat conduction member 114. The specific number and spacing of the heat radiating fins 1222 are determined according to the heat radiating requirement of the power amplifier board 121, and the present application is not limited. In certain embodiments, the metal plate 1221 is integrally formed with the heat dissipating fins 1222. The metal plate 1221 has a large mounting surface 1221a, the power amplification plate 121 is mounted on the mounting surface 1221a of the metal plate 1221 by the fastener 127, and the power amplification plate 121 is at least partially in contact with the metal plate 1221.

Because the metal is conductive, in order to ensure that the power amplification board 121 and the metal board 1221 are fully contacted as much as possible, referring to fig. 8, in some embodiments, a plurality of avoidance blind holes 122b are provided on the installation plane 1221a of the metal board 1221, the number and positions of the avoidance blind holes 122b completely correspond to the number and distribution of conductors (pins, soldering tin parts, wires, etc. of the components 1211) of the power amplification board 121, the size of the avoidance blind holes 122b is larger than that of the corresponding conductors on the power amplification board 121, so that the conductors extend into the avoidance blind holes 122b and are not contacted with the metal board 1221, thereby ensuring that the power amplification board 121 and the metal board 1221 are tightly attached, the contact area is larger, heat dissipation is facilitated, and the overall structure of the power amplification board 121 is more stable. The avoidance blind hole 122b is designed as a blind hole, so that the problem of leakage caused by contact between the conductor and water due to the design as the through hole 132a can be avoided.

The structural strength of the heat sink 122 is higher than that of the power amplification board 121, and thus the heat sink 122 simultaneously serves as a mounting base of the power amplification board 121. In some embodiments, at least two lugs 1223 are disposed on the metal plate 1221, where the lugs 1223 may be disposed on a bottom surface or a side surface of the metal plate 1221 according to actual needs, and fixing holes for installing the fasteners 127 are disposed in the lugs 1223, and the fixing holes may be holes or threaded holes, and the fasteners 127 may be screws, rivets, pins, or other structures, which is not limited by the present application.

The power amplification board 121 is a circuit board structure, and has a first surface 121a and a second surface 121b that are disposed opposite to each other, hereinafter also referred to as a first surface 121a of the power amplification board 121 is a front surface, and a second surface 121b of the power amplification board 121 is a back surface. The power amplification board 121 generally includes a signal source and a power amplification circuit, which are electrically connected, where the signal source is used to generate an initial signal with a set frequency (e.g. 40.68 MHz), and the power amplification circuit is used to power amplify the initial signal, enhance the power of the initial signal, and output a radio frequency signal after power amplification. The power amplifying circuit can adopt primary amplification, secondary amplification, tertiary amplification or even more according to actual needs, and specific amplification stages and circuit structures of all stages of amplifying circuits can refer to relevant disclosures in the prior art, so that the application is not limited. The signal source and the power amplifying circuit may be selectively disposed on the same surface of the power amplifying board 121, or may be disposed on the first surface 121a and the second surface 121b, which is not limited by the specific arrangement mode of the present application. In some embodiments, the components 1211 (chips, inductors, capacitors, resistors, etc.) on the power amplification board 121 are located on the first surface 121a, that is, each component 1211 of the signal source and the power amplification circuit is mounted on the front surface of the power amplification board 121, the back surface of the power amplification board 121 is mainly a soldering leg, a soldering wire, etc. of a pin, and the second surface 121b of the power amplification board 121 contacts the heat dissipation element 122 for heat transfer.

In some embodiments, the power amplifying circuit adopts a second-stage amplification, including a first-stage driver and a second-stage power amplifying circuit, the signal source, the first-stage driver and the second-stage power amplifying circuit are electrically connected in sequence, the first-stage driver and the second-stage power amplifying circuit amplify the initial signal sent by the signal source step by step, and the second-stage power amplifying circuit outputs the amplified signal. The specific circuit structures of the primary driver and the secondary power amplifying circuit can be referred to related disclosures in the prior art, and the application is not limited.

In some embodiments, the power amplification board 121 is further provided with a detection circuit, and the detection circuit, the signal source and the power amplification circuit are disposed on the same circuit board. In other embodiments, the detection circuit and the signal source and the power amplification circuit may be provided on different circuit boards. The detection circuit is used for detecting the output power of the radio frequency signal after power amplification and feeding back the output power to the control board. If the load connected to the power amplification board 121 is provided with a tuning board, the detection circuit is further used for detecting the reflected power reflected by the tuning module and feeding back to the control board.

In order to avoid electromagnetic interference between the power amplifier module 12 and the power module 13, referring to fig. 7 and 8, the power amplifier module 12 is further provided with a power amplifier shielding cover 124, where the power amplifier shielding cover 124 is made of a metal material and covers the first surface 121a of the power amplifier board 121 to electromagnetically shield the component 1211 on the power amplifier board 121. In some embodiments, the power amplifier shielding cover 124 is only covered on the power amplifier board 121, and specifically, the power amplifier shielding cover 124 and the power amplifier board 121 are both installed on the heat dissipation element 122 through fastener 127. In other embodiments, the power amplifier shielding cover 124 may be further configured to cover the power amplifier board 121 and the heat dissipation member 122, or cover the power amplifier board 121, the heat dissipation member 122, the blower 1231, and the air duct 1232, which is not limited by the present application.

The power module 13 is internally provided with an ac/dc conversion circuit and a voltage regulating circuit, and is used for performing ac/dc conversion and voltage regulation, and supplying low-voltage dc power to the power amplifier module 12. Referring to fig. 9, in some embodiments, the power module 13 includes a power supply housing 132 and a power supply board 131 disposed in the power supply housing 132, the power supply housing 132 protecting the power supply board 131. In some embodiments, the power supply housing 132 is provided with a plurality of through holes 132a for heat dissipation of the power panel 131. Considering that there is a gap between the power supply housing 132 and the power supply board 131, the power supply board 131 and the power supply housing 132 conduct heat only through air, so that the heat dissipation effect is poor, and the service life of the power supply board 131 may be affected, as shown in fig. 10, in other embodiments, the power supply housing 132 is filled with a heat-conducting insulating glue 133, the heat-conducting insulating glue 133 is in contact with both the power supply board 131 and the power supply housing 132, and the heat-conducting insulating glue 133 is wrapped around a component 1311 on the power supply board 131.

Specifically, the heat-conducting insulating glue 133 is arranged in the power module 13, the heat-conducting insulating glue 133 is arranged between the power panel 131 and the power shell 132 of the power module 13, on one hand, water, insects and the like outside the power module 13 can be prevented from entering the power module 13 to erode the components 1311 on the power panel 131, so that the waterproof and insect-preventing effects are achieved, and on the other hand, heat generated by the components 1311 on the power panel 131 can be conducted to the power shell 132 through the heat-conducting insulating glue 133, so that the heat dissipation effect of the power module 13 is improved. In addition, the heat conductive insulating paste 133 wraps the component 1311 on the power board 131, and heat dissipation uniformity of the component 1211 can be improved. Thereby improving the reliability and safety of the power module 13 as a whole.

In some embodiments, in order to ensure the bonding degree of the heat-conducting insulating glue 133 with the power panel 131 and the power supply housing 132, poor contact is avoided, and the heat dissipation effect is affected, so that the glue filling mode is adopted, the through hole 132a arranged on the power supply module 13 can be used as a glue filling hole, glue filling is performed through the through hole 132a on the power supply module 13, the bonding degree of the heat-conducting insulating glue 133 with the power panel 131 and the power supply housing 132 is improved, and the heat dissipation effect of the power supply module 13 is ensured to a certain extent.

Referring to fig. 11, fig. 12 and fig. 13, when the radio frequency generating device 10 works, the radio frequency generating device is controlled by a control system (for example, an MCU controller) on a control board, the control board is electrically connected with the power module 13 and the power amplifier module 12, the control board is electrically connected with an external input device (a display screen, an operation panel, a keyboard, etc.), and receives an operation instruction sent by a user to control circuits in the power module 13 and the power amplifier module 12 to work. When the output power of the power amplifier module 12 needs to be regulated, the control board calculates a voltage regulation control instruction based on an internal algorithm and sends the voltage regulation control instruction to the power module 13, and the power module 13 regulates the voltage to change the output voltage of the power module 13. For the power amplification board 121 provided with the detection circuit, the control board is electrically connected with the detection circuit, the detection circuit detects the output power of the power amplification module 12 and feeds back to the control module, and the control module performs relevant control on the signal source, the power amplification circuit and the power supply module 13 through an internal algorithm.

In some embodiments, the functions of the control board are integrated on the device on which the rf generator 10 is mounted, such as a refrigerator in which the rf generator 10 is configured, and the functions of the control board may be integrated on a main control board of the refrigerator. In some embodiments, the control board is a circuit board which is separately arranged, the control board exists independently of the power module 13 and the power amplifier module 12 to form a control module, under the arrangement scheme, the installation positions of the power amplifier module 12, the power module 13 and the control module can be set according to actual needs, the power amplifier module 12 is arranged in the installation cavity 11a of the installation shell 11 and is fixedly connected with the installation shell 11, and the power module 13 and the control module can be selectively arranged in the installation shell 11 or on the equipment main body of the equipment carried by the radio frequency generating device 10. Taking a refrigerator provided with a radio frequency thawing device as an example, a radio frequency generating device 10 is arranged in the radio frequency thawing device, a mounting shell 11 with a built-in power amplifier module 12 can be selectively arranged inside or outside a refrigerator main body of the refrigerator, a power module 13 can be selectively arranged in the mounting shell 11, or positioned outside the mounting shell 11 and inside the refrigerator main body, and a control module can be selectively arranged in the mounting shell 11, or positioned outside the mounting shell 11 and inside the refrigerator main body.

In other embodiments, the control board and the power amplifier board 121 may be integrated on the same circuit board, as shown in fig. 13, in this embodiment, since the power amplifier module 12 generates a high-frequency signal, and is easy to interfere with the control system drawn on the same electronic control board, the shielding on the internal structure needs to be performed according to the actual layout, that is, the shielding cover only covers the relevant components 1211 of the power amplifier board 121 for electromagnetic shielding, and the shielding cover is relatively complex in structural design and installation and high in cost. Meanwhile, since the power amplifier board 121 needs to be designed by using a multi-layer board, and a PCB high-frequency board with higher cost must be adopted, and the material of the control board for the board is generally unlimited, integrating the control board and the power amplifier board 121 on the same circuit board can result in that the whole board needs to use the PCB high-frequency board, so that the overall cost of the radio frequency generating device 10 is increased. In addition, the heat source of the whole radio frequency generating device 10 is mainly in the power amplifier module 12, the control board and the power amplifier board 121 are drawn on the same circuit board, and the heat generated by the power amplifier board 121 causes the control system to be heated, so that the reliability of the whole radio frequency generating device 10 is affected.

In other embodiments, the control board is integrated with the power module 13 on the same circuit board, as shown in fig. 12. In this embodiment, since the control board is integrated with the power module 13 and the same circuit board, the power amplifier board 121, the control board and the power module 13 are all independently arranged, and only the power amplifier board 121 adopts a PCB high-frequency board, the usage amount of the board is minimum, and the independent control module only needs to adopt a common low-cost material, so that the cost is reduced. Meanwhile, the power amplification plate 121, the control plate and the power module 13 are all independently arranged, the power amplification module 12 does not need to carry out special shielding design on the shielding cover according to the internal layout of the circuit board, only a simple outer cover shielding power amplification plate 121 is needed to be designed, and the design complexity and cost are reduced. Meanwhile, as the power amplification plate 121, the control plate and the power module 13 are arranged independently, heat insulation is carried out through air in installation, heat radiation of the power amplification module 12 to the control module is greatly reduced, and reliability of the whole radio frequency generating device 10 is improved.

Referring to fig. 1 and 2, the installation housing 11 is of a hollow structure, an inner cavity is an installation cavity 11a for installing an electronic module (referring to at least one of a power amplifier module 12, a power module 13 and a control module), and the installation housing 11 may be of a split structure or an integral structure, which is not limited by the present application. Referring to fig. 1 and 2, in some embodiments, the mounting case 11 includes a base plate 111 and a top cover 112 covering the base plate 111, the base plate 111 and the top cover 112 enclose a mounting cavity 11a, and an electronic module disposed in the mounting cavity 11a is fixedly connected to the base plate 111. Referring to fig. 5 and 6, in other embodiments, the mounting case 11 includes only the top cover 112, the inner cavity of the top cover 112 forms the mounting cavity 11a, the electronic module disposed in the mounting cavity 11a is fixedly connected to the top cover 112, and the top cover 112 is inverted and connected to the device configured with the radio frequency generating device 10 to close the mounting cavity 11a. In other embodiments, the mounting housing 11 includes a bottom cover and a sealing plate that covers the bottom cover. In still other embodiments, the mounting housing 11 includes two snap covers with openings that snap together in opposition. The constitution of the mounting case 11 is not limited by the present application.

In the case where more than two electronic modules are disposed in the mounting cavity 11a of the radio frequency generating device 10, in order to avoid the mutual influence of the plurality of electronic modules, referring to fig. 2 and 5, in some embodiments, a partition plate 113 is disposed in the inner cavity of the mounting shell 11, where the partition plate 113 divides the mounting cavity 11a of the mounting shell 11 into two independent chambers, and the partition plate 113 may be integrally formed with the mounting shell 11 or fixedly connected with the mounting shell 11 by gluing, welding, or the like. When the mounting case 11 includes the bottom plate 111 and the top cover 112 covering the bottom plate 111, the partition 113 may alternatively be provided on the bottom plate 111 or the top cover 112, and in some embodiments, the partition 113 may also be provided on the bottom plate 111 or the top cover 112, respectively, and the two partitions 113 abut or overlap in the height direction. When the mounting case 11 includes only the top cover 112, the partition 113 is provided on the top cover 112 as shown in fig. 5.

Referring to fig. 11, in some embodiments, a power module 13 and a power amplifier module 12 are disposed in a mounting cavity 11a of the radio frequency generating device 10, and a control module is external, or a control board is integrated with a power board 131 or a power amplifier board 121. The inner cavity of the installation shell 11 is divided into a power amplification cavity 11b and a power supply cavity 11c through a partition plate 113, the power supply module 13 and the power amplification module 12 are separately placed, the power amplification module 12 is arranged in the power amplification cavity 11b, and the power supply module 13 is arranged in the power supply cavity 11 c. Through setting up baffle 113 and making the inner chamber of installation shell 11 separate into two relatively independent spaces, power amplifier chamber 11b and power supply chamber 11c set up separately, the air can not flow each other between power amplifier chamber 11b and power supply chamber 11c by baffle 113's blocking, can reduce the mutual interference of heat between power amplifier module 12 and power module 13. Since the air is blocked by the partition 113 and does not flow between the power amplifier chamber 11b and the power supply chamber 11c, the power supply module 13 cannot forcibly dissipate heat by means of the blowing component 123 of the power amplifier module 12, but since the mounting case 11 is provided with the heat conducting member 114, the heat conducting member 114 can forcibly dissipate heat by means of the blowing component 123 and dissipate heat to the power supply module 13, thereby ensuring the heat dissipation effect of the power supply module 13.

Because the power amplifier module 12 is provided with the air blowing component 123, the power amplifier cavity 11b and the power amplifier cavity 11c are relatively airtight, the air flow blown by the air blowing component 123 only can be disturbed in the power amplifier cavity 11b, compared with the condition that the partition plate 113 is not arranged, the air flow flows in a smaller space, the wind noise is relatively smaller, the power amplifier module 13 is free to radiate heat, and the power amplifier cavity 11c can be provided with no radiating holes 11d, so that the power amplifier cavity 11c becomes an airtight chamber, or the quantity of the radiating holes 11d is reduced compared with the power amplifier cavity 11b, and the water spraying risk of the power panel 131 is reduced.

Example 2:

based on the same inventive concept, the embodiment of the application provides a radio frequency thawing device, which comprises a radio frequency thawing assembly 30 and the radio frequency generating device 10 of the above embodiment 1, wherein a tuning plate and a polar plate are arranged in the radio frequency thawing assembly 30, the tuning plate is electrically connected with a tuning inductor, and the tuning inductor can be selectively arranged on the tuning plate or is mutually independent from the tuning plate. The tuning plate is electrically connected with the power amplification plate 121 of the radio frequency generating device 10, the tuning module is used for balancing the impedance of the load end so as to realize impedance matching, and the polar plate is electrically connected with the tuning plate and is used for transmitting radio frequency signals with set frequencies. The signal output by the power amplification module 12 is a radio frequency signal corresponding to the standard load after power amplification, and the tuning module is used for adjusting the impedance of the load end. The different unfreezed substances have different impedances, the impedance of the drawer is not the standard load impedance, the load impedance changes in the unfreezing process, the impedance matching is realized through the tuning module, the impedance matching is equivalent to the standard load, the control module controls the tuning module to perform the impedance matching, the tuning module outputs a signal to the polar plate, and the polar plate sends out a radio frequency signal, so that the food material unfreezing purpose is realized.

Referring to fig. 16, the rf thawing assembly 30 further comprises a shield cylinder 31 having an open end 31a with an opening, and a shield door 32 provided at the open end 31a of the shield cylinder 31 for closing the opening to form a closed shield cavity with the shield cylinder 31. The tuning plate and the polar plate are arranged in the shielding cylinder 31, the shielding cylinder 31 can provide a mounting foundation for the tuning plate and the polar plate, the purpose of protecting the tuning plate and the polar plate can be achieved, radio frequency signals emitted by the polar plate can be shielded, and radio frequency signal leakage is avoided.

Referring to fig. 14, in some embodiments, a tuning cavity 31e and a thawing cavity 31f are provided in the shield cylinder 31, the tuning plate and the polar plate are both provided in the tuning cavity 31e, the thawing cavity 31f is used for containing food to be thawed, and the polar plate radiates radio frequency energy into the thawing cavity 31f, thereby thawing the food in the thawing cavity 31 f. The tuning plate and the polar plate are placed separately from the food material, so that on one hand, pollution to the food material is avoided, and on the other hand, water melted after thawing the food material is prevented from contacting the tuning plate and the polar plate, and damage to the component 1211 is avoided.

Referring to fig. 15, in some embodiments, the shielding cylinder 31 is further provided with an air inlet 31c and an air outlet 31d that are in communication with the tuning cavity 31e, where the air inlet 31c and the air outlet 31d may be disposed on the same side wall 1121 of the shielding cylinder 31, or may be disposed on different side walls 1121, which is not limited in this aspect of the application.

Example 3:

based on the same inventive concept, referring to fig. 14, 15 and 16, an embodiment of the present application provides a refrigerator 100 including a refrigerator main body 20 and a radio frequency thawing apparatus. The radio frequency thawing device includes the radio frequency generating device 10 of the above embodiment 1, and the radio frequency generating device 10 is disposed inside or outside the refrigerator main body 20, and the specific structure thereof is referred to the above embodiment 1, and is not described herein. The radio frequency thawing assembly 30 of the radio frequency thawing device is disposed in the refrigerator main body 20, specifically, the refrigerator main body 20 is provided with an installation cavity 21, the radio frequency thawing assembly 30 is disposed in the installation cavity 21, and the specific structure of the radio frequency thawing device is described in embodiment 3 and will not be repeated here. The installation cavity 21 is located in one of the freezing chamber, the refrigerating chamber, and the temperature changing chamber of the refrigerator 100, and the present application is not limited. A refrigerating assembly 22 for refrigerating is provided in the refrigerator main body 20 for supplying cold to at least one of the freezing chamber, the refrigerating chamber, and the temperature changing compartment.

In some embodiments, the rf generating device 10 is disposed outside the refrigerator main body 20, and the rf generating device 10 may be disposed on the top, back or side of the refrigerator main body 20, which is not limited by the present application. Referring to fig. 4, in some embodiments, the rf generating device 10 is located on the top surface of the refrigerator main body 20, the mounting case 11 of the rf generating device 10 is connected to the U-shaped case at the top of the refrigerator main body 20 through the fixing member 18, and when the mounting case 11 includes the base plate 111 and the top cover 112, both the electronic module and the top cover 112 are mounted on the base plate 111, and the base plate 111 is mounted on the top surface of the U-shaped case through the fixing member 18. Referring to fig. 6, in some embodiments, the mounting housing 11 includes only a top cover 112, the electronic module is mounted on an inner surface of a top wall 1124 of the top cover 112, and the top cover 112 is flip-off mounted to a top surface of the U-shaped housing 23 by the fixing member 18.

In some embodiments, referring to fig. 15 and 16, the shielding cylinder 31 of the rf thawing assembly 30 is further provided with an air inlet 31c and an air outlet 31d that are in communication with the tuning cavity 31e, and the air inlet 31c and the air outlet 31d may be disposed on the same side wall 1121 of the shielding cylinder 31 or may be disposed on different side walls 1121, which is not limited in the present application. The side wall 1121 provided with the air inlet 31c and the air outlet 31d and the mounting cavity 21 have a gap a therebetween, so that the air circulation is formed between the air inlet 31c and the air outlet 31d and the gap a between the side wall 1121 provided with the air inlet 31c and the air outlet 31d and the mounting cavity 21, and the heat dissipation is performed on the tuning cavity 31 e. In some embodiments, the refrigerator 100 further includes a wind flow accelerator 40, and the wind flow accelerator 40 accelerates cool wind into the tuning cavity 31e through the gap a and the wind inlet 31c to accelerate air circulation, thereby improving heat dissipation efficiency.

In the present application, unless expressly stated or limited otherwise, a first feature "above" or "below" a second feature may include both the first and second features being in direct contact, as well as the first and second features not being in direct contact but being in contact with each other through additional features therebetween. Moreover, a first feature being "above," "over" and "on" a second feature includes the first feature being directly above and obliquely above the second feature, or simply indicating that the first feature is higher in level than the second feature. The first feature being "under", "below" and "beneath" the second feature includes the first feature being directly under and obliquely below the second feature, or simply means that the first feature is less level than the second feature.

In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise" indicate orientations or positional relationships are based on the orientations or positional relationships shown in the drawings, are merely for convenience in describing the present application and simplify the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and therefore should not be construed as limiting the present application.

It should be noted that all the directional indicators in the embodiments of the present application are only used to explain the relative positional relationship, movement conditions, etc. between the components in a specific posture, and if the specific posture is changed, the directional indicators are correspondingly changed.

In the present application, unless specifically stated and limited otherwise, the terms "connected," "affixed," and the like are to be construed broadly, and for example, "affixed" may be a fixed connection, a removable connection, or an integral body; can be mechanically or electrically connected; either directly or indirectly, through intermediaries, or both, may be in communication with each other or in interaction with each other, unless expressly defined otherwise. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art according to the specific circumstances.

Furthermore, descriptions such as those referred to as "first," "second," and the like, are provided for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implying an order of magnitude of the indicated technical features in the present disclosure. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more features. In the description of the present application, the meaning of "a plurality" is two or more, unless explicitly defined otherwise.

In the description of the present specification, a description referring to terms "one embodiment," "some embodiments," "examples," "specific examples," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present application. In this specification, schematic representations of the above terms are not necessarily directed to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Further, one skilled in the art can engage and combine the different embodiments or examples described in this specification.

In addition, the technical solutions of the embodiments may be combined with each other, but it is necessary to base that the technical solutions can be realized by those skilled in the art, and when the technical solutions are contradictory or cannot be realized, the combination of the technical solutions should be considered to be absent and not within the scope of protection claimed in the present application.

While embodiments of the present application have been shown and described, it will be understood by those of ordinary skill in the art that: many changes, modifications, substitutions and variations may be made to the embodiments without departing from the spirit and principles of the application, the scope of which is defined by the claims and their equivalents.

Claims (14)

1. A radio frequency generating device, comprising:

the installation shell is provided with an installation cavity;

the power amplification module is arranged in the mounting cavity and connected with the mounting shell, and comprises a power amplification plate for generating radio frequency signals after power amplification and a blowing device for forcedly radiating the power amplification plate;

the power module is arranged in the mounting cavity and connected with the mounting shell and is used for supplying power to the power amplifier module;

and one end of the heat conducting piece is in heat conducting connection with the power supply module, and the other end of the heat conducting piece is positioned on the airflow path of the blowing device.

2. The radio frequency generating device according to claim 1, wherein: the heat conducting piece is arranged in the mounting cavity and is connected with the mounting shell;

or the installation shell is provided with a heat dissipation opening communicated with the installation cavity, and the heat conduction piece is fixed on the installation shell and is positioned in the heat dissipation opening;

or the installation shell is made of metal, and the part of the installation shell, which is contacted with the power amplifier module and the power module, forms the heat conducting piece.

3. The radio frequency generating device according to claim 2, wherein: the power amplifier is characterized in that a partition plate is arranged in the mounting shell, the mounting cavity is divided into a power amplifier cavity and a power supply cavity by the partition plate, the power amplifier module is arranged in the power amplifier cavity, and the power supply module is arranged in the power supply cavity.

4. A radio frequency generating device according to claim 3, wherein: the installation shell comprises a bottom plate and a top cover covered on the bottom plate, the bottom plate and the top cover are surrounded to form the installation cavity, and the partition plate, the power amplifier module and the power supply module are all connected to the bottom plate;

or, the installation shell comprises a top cover, the inner cavity of the top cover forms the installation cavity, and the power amplifier module and the power module are both connected to the top cover through the partition plates.

5. The radio frequency generating device according to any of claims 1-4, wherein: the power amplifier module further comprises a heat dissipation piece positioned on the airflow path of the blowing device, and the heat conduction piece and the power amplifier board are respectively contacted with two surfaces of the heat dissipation piece, which are opposite to each other.

6. The radio frequency generating device according to claim 5, wherein: the heat dissipation piece is provided with an air flow channel for the air flow of the blowing device to circulate.

7. The radio frequency generating device according to claim 6, wherein: the power amplifier module further comprises an air duct with a first opening and a second opening which are oppositely arranged, the first opening is communicated with the air blowing opening of the air blowing device, and the second opening is communicated with the air flow channel of the heat radiating piece; the second opening has a larger dimension than the first opening in the width direction of the power amplification board.

8. The radio frequency generating device according to claim 6, wherein: the heat dissipation piece is made of metal and comprises a metal plate and a plurality of heat dissipation fins which are arranged on one surface of the metal plate at intervals, and gaps among the plurality of heat dissipation fins which are arranged at intervals form the air flow channel; the heat conducting piece is in contact with the radiating fins.

9. The radio frequency generating device according to claim 8, wherein: the power amplifier module further comprises a power amplifier shielding cover covered on the power amplifier board, and the power amplifier shielding cover and the metal plate are positioned on two opposite surfaces of the power amplifier board.

10. The radio frequency generating device according to any of claims 1-4, wherein: the projection of the power amplifier module and the power supply module on the plane of the heat conducting piece is positioned on the heat conducting piece, and the surfaces of the heat conducting piece, which are opposite to the power amplifier module and the power supply module, are contacted with the power amplifier module and the power supply module; the heat conducting piece is a metal sheet.

11. The radio frequency generating device according to any of claims 1-4, wherein: the power module comprises a power supply shell and a power panel which is arranged in the power supply shell and is used for supplying power.

12. The radio frequency generating device according to claim 11, wherein: the power supply shell is filled with heat conduction insulating glue, the heat conduction insulating glue is in contact with the power supply board and the power supply shell, and the heat conduction insulating glue wraps components on the power supply board.

13. A radio frequency thawing device, comprising: a radio frequency thawing assembly and a radio frequency generating device as defined in any one of claims 1-12; the radio frequency thawing assembly comprises:

a shielding cylinder provided with an opening end with an opening;

the shielding door is arranged at the opening end of the shielding cylinder body and is used for closing the opening;

the tuning plate is arranged in the shielding cylinder body and is electrically connected with the power amplification plate of the radio frequency generating device;

and the polar plate is arranged in the shielding cylinder body, is electrically connected with the tuning plate and is used for transmitting radio frequency signals.

14. A refrigerator, comprising:

a refrigerator main body;

the radio frequency generating device of any one of claims 1-12, disposed inside or outside the refrigerator body; or the radio frequency thawing device as claimed in claim 13, wherein the radio frequency thawing assembly is provided inside the refrigerator body.