CN217985810U - Novel air cooling cold plate structure and air cooling machine case - Google Patents

Abstract

The utility model relates to a novel air-cooled cold plate structure and an air-cooled chassis, the novel air-cooled cold plate structure comprises an outer cold plate, an inner cold plate and a thermoelectric refrigerator, the hot end of the thermoelectric refrigerator is attached on the outer cold plate, and the cold end is attached on the inner cold plate; and heat dissipation fins for air cooling and heat dissipation are further arranged on one side of the outer-layer cold plate, which is opposite to the thermoelectric refrigerator. The utility model discloses the inside thermoelectric refrigeration ware that keeps low temperature through the forced air cooling of forced air cooling cold plate structure, the outside is realized through the forced air cooling, and thermoelectric refrigeration and air-cooled combination make the inside and outside homoenergetic of forced air cooling cold plate structure keep low temperature, satisfy the cooling demand of integrated board card, can effectively control the temperature rise of integrated board card, effectively improve the radiating reliability of electronic equipment.

Description

Novel air cooling cold plate structure and air cooling machine case

Technical Field

The utility model belongs to electronic components heat dissipation field, concretely relates to novel forced air cooling cold drawing structure.

Background

The main structure of the traditional forced air cooling case comprises a case shell, a board card, a locking strip, a pulling aid, a panel and the like. The main structure of the board card comprises a cold plate, a PCB (printed circuit board), a pulling aid, a rear cover and the like, and the cold plate is provided with heat dissipation fins to improve the heat dissipation capability of the cold plate. Along with the improvement of the integration level, the heat consumption of the board card is higher and higher, the change of the heat dissipation area of the board card is not large due to the size of the cold plate, the temperature of the board card device which transfers heat by the traditional cold plate is increased along with the increase of the heat dissipation area, and the reliability of the equipment is reduced.

Disclosure of Invention

In order to solve the problem, the utility model provides a novel forced air cooling cold drawing structure of novel structure makes it combine thermoelectric refrigeration heat dissipation and forced air cooling for can maintain low temperature through thermoelectric refrigeration ware in the integrated circuit board, the forced air cooling then takes away integrated circuit board outside high temperature, satisfies the heat dissipation demand of integrated circuit board.

The purpose of the utility model and the technical problem to be solved are realized by adopting the following technical scheme. According to the novel air-cooled cold plate structure provided by the utility model, the novel air-cooled cold plate structure comprises an outer cold plate, an inner cold plate and a plurality of thermoelectric refrigerators, wherein the hot ends of the thermoelectric refrigerators are attached to the outer cold plate, and the cold ends are attached to the inner cold plate; and heat dissipation fins for air cooling and heat dissipation are further arranged on one side of the outer-layer cold plate, which is opposite to the thermoelectric refrigerator.

The purpose of the utility model and the technical problem thereof can be further realized by adopting the following technical measures.

In the novel air cooling cold plate structure, a heat insulation plate for preventing heat exchange between the outer cold plate and the inner cold plate is further arranged between the outer cold plate and the inner cold plate, and a positioning groove matched with the thermoelectric refrigerator is formed in the heat insulation plate.

According to the novel air cooling cold plate structure, the PCB is also tightly attached to one side, back to the back, of the inner cold plate and the thermoelectric refrigerator, and the PCB is fixed to the inner cold plate through the rear cover.

According to the novel air cooling cold plate structure, the inner cold plate, the heat insulation plate and the PCB are all located in the accommodating groove in the outer cold plate, and the rear cover is fixed on the outer cold plate.

According to the novel air cooling cold plate structure, the outer edge of the heat insulation plate protrudes out of the outer edge of the inner layer cold plate, so that heat exchange between the inner layer cold plate and the outer layer cold plate is prevented.

In the novel air cooling cold plate structure, the number of the thermoelectric refrigerators is multiple, and the thermoelectric refrigerators are uniformly distributed on the heat insulation plate or are distributed at positions corresponding to the heating elements on the PCB.

In the novel air cooling cold plate structure, the inner layer cold plate is further provided with a plurality of heat conduction bosses for contacting with heating elements on the PCB for heat conduction.

In the novel air cooling cold plate structure, the rear cover has a heat resistance function.

In the novel air cooling cold plate structure, the rear cover is an interlayer structure consisting of the inner rear cover and the outer rear cover, and a heat insulation plate is arranged between the inner rear cover and the outer rear cover.

The purpose of the utility model and the technical problem thereof are solved and the following technical scheme is adopted. According to the utility model provides a forced air cooling chassis, it includes chassis body and the integrated circuit board of assembly in chassis body, the integrated circuit board includes the cold drawing, and this cold drawing includes outer cold drawing, inlayer cold drawing and fin, and this fin includes heat insulating board and thermoelectric refrigerator, and the heat insulating board is used for preventing the heat exchange between outer cold drawing and the inlayer cold drawing, and thermoelectric refrigerator hot junction pastes on outer cold drawing, and the cold junction pastes on the inlayer cold drawing; the fan is fixed on one side of the case shell, the air opening is formed in the other side of the case shell, cold air sent into the case shell by the fan flows along the gap between the board cards and is exhausted by the air opening, or the cold air entering from the air opening flows along the gap between the board cards and is extracted by the fan.

The purpose of the utility model and the technical problem thereof can be further realized by adopting the following technical measures.

In the forced air cooling case, the outer side of the outer-layer cold plate is also provided with the heat dissipation fins, and the extension direction of the heat dissipation fins is consistent with the flowing direction of cold air in the case shell.

In the forced air cooling case, the board card further comprises a PCB board fixedly attached to the inner-layer cold plate through the rear cover.

In the forced air cooling case, the inner-layer cold plate, the radiating fins and the PCB are all located in the accommodating groove in the outer-layer cold plate, and the rear cover is fixed on the outer-layer cold plate.

In the forced air cooling cabinet, the outer edge of the heat insulation plate protrudes out of the outer edge of the inner cold plate to prevent heat exchange between the inner cold plate and the outer cold plate.

In the forced air cooling chassis, the number of the thermoelectric refrigerators is multiple, and the thermoelectric refrigerators are uniformly distributed on the heat insulation plate or distributed at positions corresponding to the heating components on the PCB.

In the forced air cooling case, the inner-layer cold plate is further provided with a plurality of heat conduction bosses for contacting with heating elements on the PCB.

In the forced air cooling case, the rear cover can prevent the plate card from carrying out heat exchange inside and outside.

The forced air cooling cabinet is of an interlayer structure consisting of an inner rear cover and an outer rear cover, and a heat insulation plate is arranged between the inner rear cover and the outer rear cover.

In the forced air cooling case, the case shell is provided with the heat dissipation fins around the outer sides of the four sides of the board card, and the fan can also enable cold air to flow through the heat dissipation fins.

Compared with the prior art, the utility model obvious advantage and beneficial effect have. Borrow by above-mentioned technical scheme, the utility model discloses can reach considerable technological advancement and practicality to have the industrial wide use value, it has following advantage at least:

the utility model discloses the integrated circuit board is inside to keep the low temperature through thermoelectric refrigeration ware, and the high temperature in the integrated circuit board outside then realizes through the forced air cooling, and thermoelectric refrigeration and forced air cooling's combination make the integrated circuit board inside and outside homoenergetic keep the low temperature, satisfy the cooling demand of integrated circuit board, can effectively control the temperature rise of integrated circuit board, effectively improve the radiating reliability of electronic equipment.

The thermoelectric refrigeration heat dissipation device has small volume and light weight; no noise and reliable operation; the cooling speed is high, the heat dissipation power consumption is changed by adjusting the current, and the operation is simple and convenient.

Drawings

Fig. 1 is a schematic view of a heat dissipation structure of a conventional chassis;

fig. 2 is a front view of the heat dissipation structure of the chassis of embodiment 1 of the present invention with a panel removed;

fig. 3 is a schematic view of a heat dissipation part of a case heat dissipation structure of embodiment 1 of the present invention;

fig. 4 is a sectional view of a heat dissipating part of a housing of a heat dissipating structure of a chassis according to embodiment 1 of the present invention;

fig. 5 is a sectional view of a heat insulating part of a case heat dissipation structure casing according to embodiment 1 of the present invention;

fig. 6 is an enlarged view of the butt joint of the case heat dissipation structure housing in embodiment 1 of the present invention;

fig. 7 is a schematic view of the board card assembly of the chassis heat dissipation structure according to embodiment 2 of the present invention;

fig. 8 is a schematic diagram illustrating a cold plate of a heat dissipation structure of a case according to embodiment 2 of the present invention;

fig. 9 is a cold plate sectional view of a heat dissipation structure of a case according to embodiment 2 of the present invention;

fig. 10 is a front view of a cold plate of a heat dissipation structure of a case according to embodiment 2 of the present invention;

fig. 11 is an exploded view of a board card of a heat dissipation structure of a chassis according to embodiment 2 of the present invention;

fig. 12 is a schematic view of a heat dissipation structure of a chassis according to embodiment 3 of the present invention;

fig. 13 is a schematic view of a housing structure of a heat dissipation structure of a chassis according to embodiment 3 of the present invention;

fig. 14 is a schematic view of a housing part of a heat dissipation structure of a chassis according to embodiment 3 of the present invention;

fig. 15 is a sectional view of a housing of a heat dissipation structure of a chassis according to embodiment 3 of the present invention;

fig. 16 is another partial sectional view of the housing of the heat dissipation structure of the chassis according to embodiment 3 of the present invention;

fig. 17 is a sectional view of a heat dissipation structure of a chassis according to embodiment 3 of the present invention;

fig. 18 is a schematic view of a heat dissipation structure of a chassis according to embodiment 4 of the present invention;

fig. 19 is a schematic diagram of the board card assembly of embodiment 4 of the present invention;

fig. 20 is a schematic view of a heat dissipation structure of a chassis according to embodiment 5 of the present invention;

fig. 21 is a schematic view of the heat exchanger according to embodiment 5 of the present invention;

fig. 22 is a cross-sectional view of a heat exchanger according to embodiment 5 of the present invention.

[ description of main element symbols ]

1, a case shell 11: upper case 12: lower casing

13: left housing 14: the right housing 2: board card

21: rear cover 22: the PCB board 23: cold plate

231: outer cold plate 232: inner cold plate 2321: heat conduction boss

233: and (3) cooling fins: locking strip 4: pulling aid

5: panel 6: and (3) heat insulation plate 7: inner shell

8: thermoelectric refrigerator 81: cold end 82: hot end

9: the outer case 100: upper cover plate 101: lower cover plate

102: left cover plate 103: right cover plate 104: fan with cooling device

105: fan mounting plate 106: an air inlet 107: heat radiation fin

108: heat dissipation case 109: the upper plate 110: lower plate

111: left plate 112: the right plate 113: front plate

114: rear plate 115: inner cooling fan 116: external heat radiation fan

117: outer chamber cold air inlet 119: cold end heat exchange fin

120: heat dissipation plate 121: hot side heat exchange fin 123: partition plate

124: the limiting protrusion 125: turning edge 126: heat radiation fan

127: air outlet/air inlet 128: heat exchange cavity partition 129: inner heat exchange cavity

130: outer heat exchange cavity 131: partition plate 133: hollow cavity

2311: the accommodating groove 2312: positioning protrusion 2313: dodging groove

61: positioning groove 1011: groove 1012: first staggered section

1013: second staggered portion 134: supporting plate

Detailed Description

To further illustrate the technical means and effects of the present invention adopted to achieve the predetermined objects, the following detailed description will be given to the specific embodiments, structures, features and effects of the heat dissipation structure of the case according to the present invention with reference to the accompanying drawings and preferred embodiments.

Please refer to fig. 2-6, which are schematic structural diagrams of each part of the chassis heat dissipation structure of embodiment 1 of the present invention, the chassis heat dissipation structure includes a chassis housing 1 and board cards 2 assembled in the chassis housing 1, wherein the chassis housing 1 includes an upper housing 11, a lower housing 12, a left housing 13 and a right housing 14, the board cards 2 are arranged in the chassis housing 1 along the left and right direction, each board card 2 is in contact with the upper housing 11 and the lower housing 12, at least one of the upper housing 11 and the lower housing 12 is further provided with a plurality of thermoelectric refrigerators 8, a hot end 81 of the thermoelectric refrigerator 8 faces the inside of the chassis housing 1, and a cold end faces the outside of the chassis housing, thereby realizing cooling of the board cards 2 in the chassis housing 1.

In semiconductors, when any two different conductors form a galvanic couple and direct current is applied, significant heat absorption or heat release occurs at the respective junctions of the couple. The utility model discloses thermoelectric refrigerator 8 has just used this characteristics of galvanic couple, and through the power on the casing 1 of the case, this thermoelectric refrigerator 8's cold junction 81 produces endothermic phenomenon, and hot junction 82 produces exothermic phenomenon.

In this embodiment, only the upper case 11 of the cabinet case 1 is provided with the thermoelectric refrigerator 8, and in other embodiments, not only one of the upper case 11 and the lower case 12 is provided with the thermoelectric refrigerator 8, but also at least one of the left case 13 and the right case 14 is provided with the thermoelectric refrigerator 8.

In order to prevent the heat emitted from the hot end 82 of the thermoelectric refrigerator 8 from returning to the housing, the housing 1 of the present invention further comprises a heat insulation plate 6. Specifically, chassis casing 1 is the sandwich structure who comprises outside casing 9, inside casing 7 and heat insulating board 6, wherein, heat insulating board 6 is located between inside casing 7 and the outside casing 9, thermoelectric refrigerator 8 is located the constant head tank 61 of seting up on heat insulating board 6, and its hot junction 81 and the laminating of outside casing 9, and the cold junction is laminated with inside casing 7, makes inside casing 7 maintain invariable low temperature, shifts the heat of integrated circuit board 2 to outside casing 9 and carries out the heat dissipation. The heat insulating plate 6 can prevent heat exchange between the inner and outer cases.

In this embodiment, only the upper case 11 is provided with the thermoelectric refrigerator 8 therein, i.e., the upper case 11 includes an outer case 9, an inner case 7, and a heat insulating plate 6, and the heat insulating plate 6 of the upper case 11 is provided with a positioning groove 61 in which the thermoelectric refrigerator 8 is located. The lower shell 12, the left shell 13 and the right shell 14 all comprise an outer shell 9, an inner shell 7 and a heat insulation board 6, and the heat insulation board 6 is not provided with a positioning groove 61 and does not have a thermoelectric refrigerator 8. However, in other embodiments, the thermoelectric cooler 8 may be provided in the heat insulation plates 6 of the lower casing 12, the left casing 13, and the right casing 14, as needed.

In this embodiment, for the thermal-insulated ability of reinforcing computer case casing 1, avoid the heat exchange of inside and outside casing, the utility model discloses in the last casing 11 of component computer case casing 1, lower casing 12, left casing 13 and right casing 14, adopt the ladder face cooperation mode of three-layer step in the position of butt joint for the butt joint face of outside casing 9 part, heat insulating board 6 part and inside casing 7 part staggers in proper order, forms three-layer step, makes the butt joint of the different parts of computer case casing 1 inseparable more reliable. Specifically, referring to fig. 6, step structures 101 are disposed at both ends of the upper housing 11, the step structures 101 are formed by a groove 1011 at the bottom of the outer housing 9, a first staggered portion 1012 between the bottom of the outer housing 9 and the edge of the heat insulation plate 6, and a second staggered portion 1013 between the heat insulation plate 6 and the edge of the inner housing, and in the upper housing 11, the extending lengths from the outer housing 9, the heat insulation plate 6 to the inner housing 7 in the left-right direction are gradually reduced, so that step structures 101 for realizing gradual butt joint with the left housing 13 and the right housing 14 are respectively formed at the left and right ends of the upper housing 11. Correspondingly, the upper ends of the left shell 13 and the right shell 14 are provided with three gradually rising steps 102 formed by the inner shell 7 and the heat insulation plate 6 to the upper end surface of the outer shell 9, and the three steps 102 are in fit butt joint with the stepped structure 101 to realize tight butt joint of different shell parts.

Preferably, the casing 1 is provided with heat dissipating fins 107 around the periphery thereof, which are respectively distributed on the outer surfaces of the upper casing 11, the lower casing 12, the left casing 13 and the right casing 14 and extend along the front-rear direction (i.e. the board insertion direction) of the casing 1.

Please refer to fig. 7-11, which are schematic diagrams illustrating the structure of each part of the board card of the chassis heat dissipation structure according to embodiment 2 of the present invention, in which the board card 2 includes a cold plate 23 and a PCB 22 fixed in the accommodation groove on one side of the cold plate 23 through a rear cover 21, the cold plate 23 includes an interlayer structure composed of an outer cold plate 231, an inner cold plate 232 and a heat sink, wherein the accommodation groove 2311 is disposed on one side of the outer cold plate 231, the heat sink 233 and the inner cold plate 232 are sequentially stacked in the accommodation groove 2311, and the heat sink 233 is compressed and positioned in the accommodation groove 2311 of the outer cold plate 231 by the inner cold plate 232. The heat sink 233 includes a heat insulating plate 6 and a plurality of thermoelectric coolers 8 disposed in the positioning grooves 61 on the heat insulating plate 6, the thermoelectric coolers 8 are uniformly distributed on the heat insulating plate 6 or distributed on the heat insulating plate 6 according to the arrangement of heat generating components on the PCB, and the hot end 81 of the thermoelectric cooler 8 is in contact with the outer cold plate 231, and the cold end 82 is in contact with the inner cold plate 232 to reduce the temperature of the PCB in contact with the inner cold plate 232.

In this embodiment, to prevent thermal conduction between the inner and outer cold plates, the outer edges of the insulation plate 6 protrude beyond the outer edges of the inner cold plate 232. Preferably, the outer edges of the thermal shield 6 and the inner cold plate 232 are in clearance fit with the walls of the receiving groove 2311, and the clearance between the outer edge of the inner cold plate 232 and the walls of the receiving groove is greater than the clearance between the outer edge of the thermal shield 6 and the walls of the receiving groove. Namely the utility model discloses because the difference of sectional area between inlayer cold drawing, heat insulating board, the outer cold drawing violently, can avoid inlayer cold drawing and outer cold drawing contact, inlayer cold drawing and outer cold drawing rely on different areas and heat insulating board to realize that the heat is isolated.

In this embodiment, a plurality of heat conduction bosses 2321 for contacting with the heating element on the PCB are further disposed on the surface of the inner cold plate 232 facing the PCB, and the heat dissipation of the heating element can be enhanced by the heat conduction bosses 2321, so that the heat dissipation rate is increased.

In this embodiment, the outer cold plate 231 and the rear cover 21 are fixed by screws, and a positioning protrusion 2312 is formed on the groove wall of the accommodating groove 2311 of the outer cold plate 231 in an inward protruding manner, a screw hole is formed on the positioning protrusion 2312, and the outer cold plate 231 and the rear cover 21 are fixed by screws penetrating through the screw hole. Preferably, the side wall of the positioning protrusion 2312 located in the accommodating groove 2311 is of a circular arc structure, the inner-layer cold plate 232 and the heat insulation plate 6 located in the accommodating groove 2311 are both provided with an avoiding groove 2313 for avoiding the positioning protrusion 2312, and the avoiding groove 2313 and the positioning protrusion 2312 are matched to realize the positioning of the placement position and the placement direction of the inner-layer cold plate 232 and the heat insulation plate 6 in the outer-layer cold plate 231. There is a gap between the edge of the inner cold plate 232 and the locating protrusion 2312. Preferably, the number of the positioning protrusions 2312 is 6, which includes 4 protrusions distributed at four corners of the receiving groove 2311 and two protrusions located between two long sides of the receiving groove 2311, but is not limited thereto.

In other embodiments of the present invention, in order to keep the low temperature in the board card 2, the external high temperature is prevented from being transmitted to the board card 2 by the rear cover, the rear cover 21 further has a heat insulation function, and if the rear cover 21 is made of a heat insulation material or a heat insulation plate 6 is further provided in the rear cover 21. Preferably, the rear cover 21 is a sandwich structure, which includes an outer rear cover, an inner rear cover and a heat insulation plate 21 sandwiched between the inner and outer rear covers.

This embodiment utilizes novel cold drawing structure and through reasonable thermal-insulated structural design, can effectively control the temperature rise of integrated circuit board, effectively improves the radiating reliability of electronic equipment. When the cold-end laminating of thermoelectric refrigerator is on the inlayer cold drawing, maintains low temperature, and thermoelectric refrigerator's hot junction laminating is on outer cold drawing, and according to thermoelectric refrigeration's principle, inlayer cold drawing maintains invariable low temperature, finally conducts the board card heat to the casing of the chassis on transferring to outer cold drawing.

And this embodiment can use alone, also can cooperate the shell structure of embodiment 1 to use to reach better radiating effect.

The utility model discloses embodiment 1 and embodiment 2 and embodiment 1 and embodiment 2's combination all can cooperate with other heat radiation structure to realize better temperature rise control effect.

Please refer to fig. 11-17, it is the utility model discloses embodiment 3 machine case heat radiation structure's schematic diagram, in this embodiment, the machine case is totally enclosed forced air cooling machine case, in this embodiment, machine case casing 1 front end is equipped with panel 5, rear end installation rear fan 104, and all be equipped with heat dissipation fin 107 in the four sides outside about the upper and lower of this machine case casing 1, this heat dissipation fin 107 all extends along machine case casing 1 fore-and-aft direction, 4 above-mentioned outsides still are fixed with the apron, this apron forms the confined heat dissipation cavity that supplies gas to pass through with heat dissipation fin 107 cooperation, above-mentioned fan 104 can be with the hot-air escape in this heat dissipation cavity or to the interior cold air that carries of heat dissipation cavity to strengthen the heat dissipation of machine case casing 1 periphery. In other embodiments of the present invention, the fan 104 is also simultaneously communicated with the inside of the housing of the chassis, and the panel is provided with a corresponding air opening.

In this embodiment, the cover plates include an upper cover plate 100 fixed to the outside of the upper case 11, a lower cover plate 101 fixed to the outside of the lower case 12, a left cover plate 103 fixed to the outside of the left case 13, and a right cover plate 104 fixed to the outside of the right case 14.

The panel 5 is provided with an air inlet 106 for external air to enter the heat dissipation cavity, that is, external cold air enters the heat dissipation cavity from the air inlet 106, and under the pumping action of the fan 104, the air in the heat dissipation cavity moves from the front end to the rear end of the heat dissipation cavity along the heat dissipation fins and is finally discharged through the fan 104, thereby completing the heat dissipation work.

Preferably, there are a plurality of air inlets 106, and the front ends of the heat dissipation fins on the outer sides of the upper casing 11, the lower casing 12, the left casing 13, and the right casing 14 are all provided with corresponding through air inlets 106.

In this embodiment, the outer sides of the upper casing 11, the lower casing 12, the left casing 13 and the right casing 14 are all U-shaped structures, the heat dissipation fins 107 are distributed in the grooves of the U-shaped structures, the front and rear ends of the U-shaped grooves are respectively communicated with the air inlet 106 and the fan 104 to realize air inlet and air outlet, and the front and rear ends of the grooves are further provided with limiting protrusions 124 for fixing the panel 5 or the fan 104. Two sides of the U-shaped structure of the upper shell 11 and the lower shell 12 are also folded outwards to form a folded edge 125 for fixing with the cover plate.

In this embodiment, the fan 104 is secured by the engagement of the fan mounting plate 105 with the rear end of the chassis housing 1.

In this embodiment, the chassis housing 1 is a chassis housing or a board with a thermoelectric cooler in embodiment 1 is a board with a thermoelectric cooler in embodiment 2, or the chassis housing 1 is a chassis housing with a thermoelectric cooler in embodiment 1 and a board is a board with a thermoelectric cooler in embodiment 2, that is, the chassis housing 1 and the board 2 in this embodiment are the structures in embodiment 1 or embodiment 2, and may also be a combination of embodiment 1 and embodiment 2.

Please refer to fig. 18 and fig. 19, which are schematic diagrams of a heat dissipation structure of a chassis according to embodiment 4 of the present invention, in this embodiment, the chassis is a forced air cooling chassis, in this embodiment, a heat dissipation fan 126 is installed at the bottom of the chassis housing 1, an air outlet/air inlet of the heat dissipation fan 126 is communicated with the lower housing 12 of the chassis housing 1, external air is sent into the chassis housing 1 through an opening at the lower housing 12 or air in the chassis housing is discharged through an opening at the lower housing 12, a plurality of air outlets/air inlets 127 are uniformly distributed on the upper housing 11 of the chassis housing 1, and air in the chassis housing 1 is discharged through an air outlet on the upper housing 11 or external cold air enters the chassis housing through an air inlet.

In this embodiment, the board cards 2 are arranged in the chassis housing 1 in the left-right direction, so that wind passes between adjacent board cards 2, and heat emitted from the board cards 2 is taken away.

In this embodiment, the board card 2 is the board card structure described in embodiment 2, that is, the board card 2 includes the cold plate 23 and the PCB 22 fixed in the receiving groove on one side of the cold plate 23 through the rear cover 21, the cold plate 23 includes a sandwich structure composed of an outer layer cold plate 231, an inner layer cold plate 232 and a heat sink, wherein the receiving groove 2311 is arranged on one side of the outer layer cold plate 231, the heat sink 233 and the inner layer cold plate 232 are sequentially stacked in the receiving groove 2311, and the heat sink 233 is pressed and positioned in the receiving groove 2311 of the outer layer cold plate 231 by the inner layer cold plate 232. The heat sink 233 includes a heat insulating plate 6 and a plurality of thermoelectric coolers 8 disposed in the positioning grooves 61 on the heat insulating plate 6, the thermoelectric coolers 8 are uniformly distributed on the heat insulating plate 6 or distributed on the heat insulating plate 6 according to the arrangement of heat generating components on the PCB, and the hot end 81 of the thermoelectric cooler 8 is in contact with the outer cold plate 231, and the cold end 82 is in contact with the inner cold plate 232 to reduce the temperature of the PCB in contact with the inner cold plate 232.

In this embodiment, the other side of the outer cold plate 231 is further provided with a heat dissipation fin 107 extending in the up-down direction, and the air sent into the chassis housing 1 by the heat dissipation fan 126 flows upwards along the heat dissipation fin outside the outer cold plate 231, and is finally discharged from the air outlet 127 on the upper housing 11, so as to achieve the purpose of heat dissipation.

In this embodiment, the housing case 1 may also be the structure in embodiment 1, that is, when the board insertion direction is defined as the axial direction, at least one of the four axial surfaces of the housing case 1 is provided with the thermoelectric cooling structure.

In this embodiment, heat dissipation fins are further disposed around the periphery of the chassis housing distributed around the board card, that is, the outer sides (four front, rear, left and right housings), and the heat dissipation fan 126 can provide power for air among the heat dissipation fins to enhance heat dissipation at the chassis housing.

This embodiment can also be combined with the chassis heat dissipation structure in embodiment 3, and at this time, the heat dissipation fan can simultaneously dissipate heat of the board card in the chassis housing and the chassis housing itself. This radiator fan can be to supplying air or convulsions in the heat dissipation cavity that the shell of the chassis comprises apron and heat dissipation fin promptly, through also can supplying air or convulsions to quick-witted incasement, be equipped with the wind gap with the inside intercommunication of heat dissipation cavity and shell of the chassis on the panel.

Please refer to fig. 20-22, which are schematic diagrams of a chassis heat dissipation structure according to embodiment 5 of the present invention, in this embodiment, the chassis heat dissipation structure is an internal circulation forced air cooling chassis, the chassis heat dissipation structure includes a chassis housing 1 and a heat dissipation housing 108, an inner heat exchange cavity 129 and an outer heat exchange cavity 130 are formed in the heat dissipation housing 108, the inner heat exchange cavity 129 is a closed cavity, at least one side of the outer heat exchange cavity 130 is open, the chassis housing 1 is fixed in the inner heat exchange cavity 129, an inner heat dissipation fan 115 is disposed at the bottom of the chassis housing 1, and the inner heat dissipation fan 115 conveys air into the chassis housing 1.

The heat exchanger is arranged on one side of the case shell 1 and matched with the case shell 1 to divide the space in the inner heat exchange cavity 129 into an upper part and a lower part, and air in the upper space is sent into the case shell 1 by the inner cooling fan 115 after being subjected to heat exchange through the heat exchanger and then is discharged from an upper opening of the case shell 1.

In this embodiment, the gap between the adjacent boards 2 extends in the vertical direction, and the wind fed into the chassis housing 1 by the inner radiator fan 115 flows along the gap between the adjacent boards and is discharged from the top of the chassis housing. Preferably, the board cards 2 are arranged in the front-back direction or in the left-right direction.

The heat exchanger comprises a heat radiation plate 120 and a cold end heat exchange fin 119 and a hot end heat exchange fin 121 which are distributed on two sides of the heat radiation plate 120, the heat radiation plate 120 comprises a heat insulation plate 6 and a plurality of thermoelectric refrigerators 8 fixed on the heat insulation plate 6, the hot ends 81 of the thermoelectric refrigerators 8 are tightly attached to the hot end heat exchange fin 121, the cold ends 82 are tightly attached to the cold end heat exchange fin 119, the cold end heat exchange fin 119 of the heat exchanger is positioned in an inner heat exchange cavity 129, the hot end heat exchange fin 121 is positioned in an outer heat exchange cavity 130, one end of the hot end heat exchange fin 121 is communicated with the external space of the heat radiation shell 108, the other end of the hot end heat exchange fin is connected with an outer heat radiation fan 116, and external air is extracted through the outer heat radiation fan 116 to radiate heat to the hot end heat exchange fin 121.

In this embodiment, a heat exchange cavity partition plate 128 is further fixed at the lower end of the heat exchanger, and the heat exchange cavity partition plate 128 supports and fixes the heat exchanger in the heat dissipation housing 108, so as to ensure the space below the cold end heat exchange fins 119 and realize the partition of heat transmission between the inner heat exchange cavity 129 and the outer heat exchange cavity 130. In order to increase the space of the inner heat exchange cavity 129, it is preferable that the outer heat exchange cavity 130 is a space partitioned by a lower portion of one side of the heat dissipation housing 108, the lower portion of the one side of the heat dissipation housing 108 is open, the heat dissipation housing 108, the heat exchanger, the heat exchange cavity partition 128 fixed at the bottom of the heat exchanger near the heat dissipation plate 120, and the partition 123 fixed between the heat dissipation plate 120 and the heat dissipation housing 108 together form the U-shaped outer heat exchange cavity 130, and the outer heat exchange cavity 130 has an outer cavity cold air inlet 117 communicating with the outside.

In this embodiment, the heat dissipation housing 108 includes an upper plate 109, a lower plate 110, a left plate 111, a right plate 112, a front plate 113, and a rear plate 114, wherein a space is provided between a lower portion of the left plate 111 and the lower plate 110, the heat exchanger is located on the left side below the heat dissipation housing 108, a heat exchange chamber partition 128 below the heat dissipation housing 108 is fixed on the lower plate 110, a partition 123 is further fixed above the heat exchange chamber partition 128, the partition 123 is fixed on the heat dissipation plate 120 or at a position where the cold end heat exchange fins 119 are close to the heat dissipation plate 120, so that the partition 123, the left plate 111, the lower plate 110, the heat exchanger, and the heat exchange chamber partition 128 together enclose a U-shaped cavity, the hot end heat exchange fins 121 are located in the U-shaped cavity, and a position where the rear plate 114 corresponds to the U-shaped cavity is open to form the outer cavity cold air inlet 117. For dodging the outer heat exchange cavity 130, the utility model discloses the hole of dodging has been seted up to the front bezel left side lower extreme. Preferably, both the partition 123 and the heat exchange chamber partition 128 are made of a low heat transfer material.

In this embodiment, one end of the cold end heat exchange fin 119 contacts with the heat dissipation plate 120, and the other end contacts with the heat dissipation housing, so as to divide the space in the inner heat exchange cavity 129 into an upper part and a lower part, and after the upper air is cooled by the cold end heat exchange fin 119, the upper air enters the lower space, and then is sent into the housing 1 by the inner heat dissipation fan fixed at the bottom of the housing 1, and finally is discharged from the top of the housing 1 through the gap between the board cards, and takes away the heat between the board cards.

In this embodiment, the bottom of the cabinet housing 1 is supported and fixed on the lower plate 110 by the support plate 134, and the support plate 134 at the side of the bottom of the cabinet housing 1 far from the heat exchanger, the right housing 14 of the cabinet housing 1, and the partition plate 131 fixed between the upper housing 11 and the upper plate 109 of the cabinet housing 1 jointly form the wall body at the right side of the inner heat exchange cavity 129, so as to prevent the hot air exhausted from the upper part of the cabinet housing 1 from returning to the lower dead space without passing through the heat exchanger, thereby affecting the heat dissipation effect. The wall on the right side of the inner heat exchange chamber 129 cooperates with the part of the right side of the heat dissipation housing remote from the outer heat exchange chamber to form a cavity 133.

Preferably, the heat dissipation fins are further disposed on the outer side of the cold plate of the board card 2, but the invention is not limited thereto.

The board 2 in this embodiment may be the board 2 in embodiment 4 to enhance the heat dissipation effect, but is not limited thereto.

In the heat exchanger of the embodiment, the cold end of the thermoelectric refrigerator is attached to the cold end heat exchange fins to maintain low temperature, the hot end of the thermoelectric refrigerator is attached to the hot end heat exchange fins, the cold end heat exchange fins maintain constant low temperature according to the thermoelectric refrigeration principle, and hot air is converted into cold air after passing through the cold end heat exchange fins. The external hot end heat exchange fins are forced to cool by a fan. The outer heat dissipation fan 116 sucks in cold air through the outer cavity air inlet to take away heat at the hot end of the heat exchanger. The heat of the board card 2 is taken away by the air in the inner cooling fan 115, heat exchange is realized at the cold end of the heat exchanger, and the air is changed into cold air after passing through the heat exchanger to participate in circulation again.

The heat dissipation fins in the embodiments of the utility model can be processed and formed by machining, welding or section bar supplementing processing and other methods. The heat dissipating ribs may be rectangular, cylindrical, interrupted discontinuous rectangular or parabolic, etc.

The above description is only a preferred embodiment of the present invention, and the present invention is not limited to the above description, and although the present invention has been disclosed with the preferred embodiment, it is not limited to the present invention, and any skilled person in the art can make modifications or changes equivalent to the equivalent embodiment of the above embodiments without departing from the scope of the present invention, but all the modifications, changes and modifications of the above embodiments by the technical spirit of the present invention are within the scope of the present invention.

Claims (10)

1. The utility model provides a novel air-cooled cold plate structure which characterized in that: the device comprises an outer-layer cold plate, an inner-layer cold plate and a plurality of thermoelectric refrigerators, wherein the hot ends of the thermoelectric refrigerators are attached to the outer-layer cold plate, and the cold ends of the thermoelectric refrigerators are attached to the inner-layer cold plate; and heat dissipation fins for air cooling and heat dissipation are further arranged on one side of the outer-layer cold plate, which is opposite to the thermoelectric refrigerator.

2. The new air-cooled cold plate structure of claim 1, wherein: and a heat insulation plate for preventing heat exchange between the outer cold plate and the inner cold plate is also arranged between the outer cold plate and the inner cold plate, and a positioning groove matched with the thermoelectric refrigerator is arranged on the heat insulation plate.

3. The new air-cooled cold plate structure of claim 2, characterized in that: and a PCB is also tightly attached to one side of the inner cold plate, which is opposite to the thermoelectric refrigerator, and the PCB is fixed on the inner cold plate through a rear cover.

4. The novel air-cooled cold plate structure of claim 3, wherein: the inner layer cold plate, the thermal insulation plate and the PCB are all located in the accommodating groove in the outer layer cold plate, and the rear cover is fixed on the outer layer cold plate.

5. The new air-cooled cold plate structure of claim 2, characterized in that: the outer edge of the heat shield protrudes beyond the outer edge of the inner cold plate to prevent heat exchange between the inner and outer cold plates.

6. The novel air cooling cold plate structure of claim 3, wherein: the thermoelectric refrigerators are uniformly distributed on the heat insulation plate or distributed at the positions corresponding to the heating elements on the PCB.

7. The novel air-cooled cold plate structure of claim 6, wherein: and the inner-layer cold plate is also provided with a plurality of heat conduction bosses for contacting with heating elements on the PCB for heat conduction.

8. The novel air-cooled cold plate structure of claim 4, wherein: the rear cover has a heat-blocking function.

9. The new air-cooled cold plate structure of claim 8, wherein: the rear cover is of an interlayer structure consisting of an inner rear cover and an outer rear cover, and a heat insulation plate is arranged between the inner rear cover and the outer rear cover.

10. An air-cooled machine case which is characterized in that: the air cooling cold plate structure comprises a case shell and the air cooling cold plate structure assembled in the case shell, wherein the air cooling cold plate structure is the air cooling cold plate structure as claimed in any one of claims 1 to 9, a fan is fixed on one side of the case shell, an air port is formed in the other side of the case shell, and cold air sent into the case shell by the fan or cold air entering from the air port flows along gaps among the heat dissipation fins on the air cooling cold plate structure.

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