CN115087320A - Totally-enclosed air-cooling heat dissipation structure - Google Patents

Abstract

The invention relates to a totally-enclosed air-cooled heat dissipation structure, which comprises a case shell and board cards assembled in the case shell, wherein a thermoelectric refrigerator is arranged on at least one of four surfaces of the case shell distributed around the board cards, which are in contact with the board cards; and the periphery of four surfaces of the case shell distributed around the board cards is provided with heat dissipation fins extending along the inserting direction of the board cards, the heat dissipation fins are matched with a cover plate fixed outside the case shell to form a closed cavity, the positions of a panel fixed at the front end of the case shell, which correspond to the heat dissipation fins, are provided with air inlet/outlet ports, and a fan fixed at the rear end of the case shell sends outside air into the closed cavity and enables the outside air to flow out of the air outlet at the panel or extracts the air flowing in from the air inlet at the panel. The invention combines the case shell provided with the thermoelectric refrigerator with air cooling heat dissipation, maintains the low temperature in the case through the thermoelectric refrigerator, simultaneously reduces the temperature of the case shell through air cooling, and the case shell and the air cooling heat dissipation can meet the heat dissipation requirement of the case in a matching way.

Description

Totally-enclosed air-cooling heat dissipation structure

Technical Field

The invention belongs to the field of heat dissipation of electronic components, and particularly relates to a totally-enclosed air-cooled heat dissipation structure.

Background

The existing air-cooled forced heat dissipation chassis generates heat loss when a board card normally works, and transfers heat to the surface of a chassis shell through heat conduction and relies on forced convection for heat dissipation. Along with the improvement of the integrated level of the board card, the heat consumption is higher and higher, the heat dissipation area of the shell of the chassis is not changed greatly due to the installation size of the chassis, the temperature rise of the board card device is improved accordingly, and the reliability of the device is reduced.

Disclosure of Invention

In order to solve the problems, the invention provides a totally-enclosed air-cooled heat dissipation structure with a novel structure, so that the low temperature in a case shell is kept through a thermoelectric refrigerator, the case shell is cooled through a fan, and the reliable heat dissipation effect is ensured.

The purpose of the invention and the technical problem to be solved are realized by adopting the following technical scheme. According to the totally-enclosed air-cooled heat dissipation structure provided by the invention, the totally-enclosed air-cooled heat dissipation structure comprises a case shell and board cards assembled in the case shell, wherein a thermoelectric refrigerator is arranged on at least one of four surfaces of the case shell distributed around the board cards, which are in contact with the board cards; and the periphery of four surfaces of the case shell distributed around the board cards is provided with heat dissipation fins extending along the inserting direction of the board cards, the heat dissipation fins are matched with a cover plate fixed outside the case shell to form a closed cavity, the positions of a panel fixed at the front end of the case shell, which correspond to the heat dissipation fins, are provided with air inlet/outlet ports, and a fan fixed at the rear end of the case shell sends outside air into the closed cavity and enables the outside air to flow out of the air outlet at the panel or extracts the air flowing in from the air inlet at the panel.

The purpose of the invention and the technical problem to be solved can be further realized by adopting the following technical measures.

In the totally-enclosed air-cooled heat dissipation structure, heat insulation plates for preventing heat exchange between the inside and the outside of the case are arranged in at least four surfaces of the case shell distributed around the board card, and the thermoelectric refrigerator penetrates through the heat insulation plates in the surface where the thermoelectric refrigerator is located.

In the totally-enclosed air-cooled heat dissipation structure, the fan can also supply air or draw air into the housing of the chassis, so that air flows between the adjacent board cards, and the panel is provided with the corresponding air opening.

According to the totally-enclosed air-cooling heat dissipation structure, the board card comprises the cold plate and the PCB fixed in the holding tank on one side of the cold plate through the rear cover, and the heat dissipation fins extending along the inserting direction of the board card are further arranged on the other side of the cold plate.

The totally-enclosed air-cooled heat dissipation structure comprises an outer cold plate with a containing groove on one side, and a radiating fin and an inner cold plate which are stacked in the containing groove, wherein the radiating fin comprises a heat insulation plate and a thermoelectric refrigerator fixed in a positioning groove of the heat insulation plate, the hot end of the thermoelectric refrigerator is attached to the outer cold plate, and the cold end of the thermoelectric refrigerator is attached to the inner cold plate.

In the totally-enclosed air-cooled heat dissipation structure, the casing of the chassis is of a sandwich structure consisting of an external casing, an internal casing and a heat insulation plate positioned between the external casing and the internal casing, the cold end of the thermoelectric refrigerator is attached to the internal casing, and the hot end of the thermoelectric refrigerator is attached to the external casing.

According to the totally-enclosed air-cooled heat dissipation structure, the shell of the machine case is matched with the four surfaces distributed around the board card at the butt joint position by adopting the three layers of stepped surfaces, so that the butt joint surfaces between adjacent external shells, between adjacent heat insulation boards and between adjacent internal shells are staggered in sequence.

In the totally-enclosed air-cooling heat dissipation structure, the shell of the machine case is provided with grooves around the outer sides of four surfaces distributed by the board cards, and the heat dissipation fins are distributed in the grooves.

In the totally-enclosed air-cooled heat dissipation structure, the groove is opened towards one side of the panel and one side of the fan, and the groove bottom of the groove is provided with the positioning protrusion which is used for being matched and fixed with the panel or the fan.

Compared with the prior art, the invention has obvious advantages and beneficial effects. By means of the technical scheme, the invention can achieve considerable technical progress and practicability, has wide industrial utilization value and at least has the following advantages:

the cabinet shell provided with the thermoelectric refrigerator is combined with air cooling heat dissipation, the thermoelectric refrigerator maintains low temperature in the cabinet, meanwhile, the temperature of the cabinet shell is reduced through air cooling, the cabinet shell and the air cooling meet the heat dissipation requirement of the cabinet, the temperature rise of the board card can be effectively controlled, and the heat dissipation reliability of the electronic equipment is effectively improved. The thermoelectric refrigeration heat dissipation device has small volume and light weight; no noise and reliable operation; the cooling speed is fast, the heat dissipation power consumption is changed by adjusting the current, and the operation is simple and convenient.

Drawings

Fig. 1 is a schematic view of a heat dissipation structure of a conventional chassis;

fig. 2 is a front view of the chassis heat dissipation structure of embodiment 1 with a panel removed;

fig. 3 is a schematic view of a heat dissipation part of a housing of a heat dissipation structure of a chassis in embodiment 1 of the present invention;

fig. 4 is a sectional view of a heat dissipating portion of a housing of a heat dissipating structure of a chassis in embodiment 1 of the present invention;

fig. 5 is a sectional view of a heat insulating part of a case heat dissipation structure of embodiment 1 of the present invention;

fig. 6 is an enlarged view of a butt joint of the case heat dissipation structure shells in embodiment 1 of the present invention;

fig. 7 is a schematic diagram illustrating a board card composition of a chassis heat dissipation structure in embodiment 2 of the present invention;

fig. 8 is a schematic diagram illustrating a cold plate composition of a heat dissipation structure of a chassis in embodiment 2 of the present invention;

fig. 9 is a cold plate sectional view of a heat dissipation structure of a chassis according to embodiment 2 of the present invention;

fig. 10 is a front view of a cold plate of the heat dissipation structure of the chassis according to embodiment 2 of the present invention;

fig. 11 is an exploded view of a board card of the heat dissipation structure of the chassis in embodiment 2 of the present invention;

fig. 12 is a schematic composition diagram of a chassis heat dissipation structure according to embodiment 3 of the present invention;

fig. 13 is a schematic view of a housing structure of a heat dissipation structure of a chassis in embodiment 3 of the present invention;

fig. 14 is a schematic view of a housing part of a heat dissipation structure of a chassis in embodiment 3 of the present invention;

fig. 15 is a sectional view of a housing part of a heat dissipation structure of a chassis according to embodiment 3 of the present invention;

fig. 16 is another partial sectional view of the housing of the heat dissipation structure of the chassis in embodiment 3 of the present invention;

fig. 17 is a sectional view of a heat dissipation structure of a chassis according to embodiment 3 of the present invention;

fig. 18 is a schematic view of a heat dissipation structure of a chassis according to embodiment 4 of the present invention;

fig. 19 is a schematic diagram of the board card composition in embodiment 4 of the present invention.

[ description of main element symbols ]

1, a case shell 11: upper case 12: lower casing

13: left housing 14: right housing 2: board card

21: rear cover 22: the PCB board 23: cold plate

231: outer cold plate 232: inner cold plate 2321: heat conduction boss

233: and (3) cooling fins: locking strip 4: pulling aid

5: panel 6: and (3) a heat insulation plate 7: inner casing

8: the thermoelectric refrigerator 81: cold end 82: hot end

9: the outer case 100: upper cover plate 101: lower cover plate

102: left cover plate 103: right cover plate 104: fan with cooling device

105: fan mounting plate 106: an air inlet 107: heat radiation fin

Detailed Description

To further illustrate the technical means and effects of the present invention adopted to achieve the predetermined objects, the following detailed description of the heat dissipation structure of a chassis according to the present invention, its specific implementation, structure, features and effects, with reference to the accompanying drawings and preferred embodiments, is provided below.

Referring to fig. 2-6, which are schematic structural diagrams of various parts of a chassis heat dissipation structure according to embodiment 1 of the present invention, the chassis heat dissipation structure includes a chassis housing 1 and board cards 2 mounted in the chassis housing 1, where the chassis housing 1 includes an upper housing 11, a lower housing 12, a left housing 13 and a right housing 14, the board cards 2 are arranged in the chassis housing 1 in the left-right direction, each board card 2 is in contact with the upper housing 11 and the lower housing 12, at least one of the upper housing 11 and the lower housing 12 is further provided with a plurality of thermoelectric refrigerators 8, a hot end 81 of each thermoelectric refrigerator 8 faces the inside of the chassis housing 1, and a cold end faces the outside of the chassis housing, thereby cooling the board cards 2 in the chassis housing 1.

In semiconductors, when any two different conductors are combined into a galvanic couple and direct current is applied, significant heat absorption or heat release occurs at the respective junctions of the couple. The thermoelectric refrigerator 8 of the present invention uses the characteristic of a couple, and the cold end 81 of the thermoelectric refrigerator 8 generates a heat absorption phenomenon and the hot end 82 generates a heat release phenomenon by a power supply on the cabinet housing 1.

In this embodiment, only the upper case 11 of the cabinet case 1 is provided with the thermoelectric refrigerator 8, and in other embodiments, not only one of the upper case 11 and the lower case 12 is provided with the thermoelectric refrigerator 8, but also at least one of the left case 13 and the right case 14 is provided with the thermoelectric refrigerator 8.

To prevent the heat given off at the hot side 82 of the thermoelectric cooler 8 from returning to the cabinet housing again, the cabinet housing 1 of the present invention further includes a heat shield 6. Specifically, chassis casing 1 is the sandwich structure who comprises outside casing 9, inside casing 7 and heat insulating board 6, wherein, heat insulating board 6 is located between inside casing 7 and the outside casing 9, thermoelectric refrigerator 8 is located the constant head tank 61 of seting up on heat insulating board 6, and its hot junction 81 and the laminating of outside casing 9, and the cold junction is laminated with inside casing 7, makes inside casing 7 maintain invariable low temperature, shifts the heat of integrated circuit board 2 to outside casing 9 and carries out the heat dissipation. The heat insulating plate 6 can prevent heat exchange between the inner and outer cases.

In this embodiment, only the upper case 11 is provided with the thermoelectric refrigerator 8 therein, i.e., the upper case 11 includes an outer case 9, an inner case 7, and a heat insulating plate 6, and the heat insulating plate 6 of the upper case 11 is provided with a positioning groove 61 in which the thermoelectric refrigerator 8 is located. The lower shell 12, the left shell 13 and the right shell 14 all comprise an outer shell 9, an inner shell 7 and a heat insulation board 6, and the heat insulation board 6 is not provided with a positioning groove 61 and does not have a thermoelectric refrigerator 8. However, in other embodiments, the thermo-electric cooler 8 may be disposed in the heat insulating plate 6 of the lower casing 12, the left casing 13, and the right casing 14, as needed.

In the embodiment, in order to enhance the heat insulation capability of the machine case shell 1 and avoid the heat exchange of the inner shell and the outer shell, the upper shell 11, the lower shell 12, the left shell 13 and the right shell 14 which form the machine case shell 1 adopt a three-step surface matching mode at the butt joint position, so that the butt joint surfaces of the outer shell 9 part, the heat insulation plate 6 part and the inner shell 7 part are sequentially staggered to form three steps, and the butt joint of different parts of the machine case shell 1 is more compact and reliable. Specifically, referring to fig. 6, the two ends of the upper casing 11 are respectively provided with a step structure 101, the step structure 101 is formed by a groove 1011 at the bottom of the outer casing 9, a staggered portion 1012 between the bottom of the outer casing 9 and the edge of the heat insulation plate 6, and a staggered portion 1013 between the heat insulation plate 6 and the edge of the inner casing, and in the upper casing 11, the extension length from the outer casing 9, the heat insulation plate 6 to the inner casing 7 in the left-right direction is gradually reduced, so that the step structures 101 for realizing the gradual butt joint with the left casing 13 and the right casing 14 are respectively formed at the left end and the right end of the upper casing 11. Correspondingly, the upper ends of the left shell 13 and the right shell 14 are provided with three gradually rising steps 102 formed by the inner shell 7 and the heat insulation plate 6 to the upper end surface of the outer shell 9, and the three steps 102 are in fit butt joint with the stepped structure 101 to realize tight butt joint of different shell parts.

Preferably, the casing 1 is provided with heat dissipating fins 107 around the periphery thereof, which are respectively distributed on the outer surfaces of the upper casing 11, the lower casing 12, the left casing 13 and the right casing 14 and extend along the front-rear direction (i.e. the board insertion direction) of the casing 1.

The housing of the chassis can realize heat conduction and heat dissipation through contact with the constant temperature panel. If place the chassis casing in constant temperature structure, through the contact, the chassis casing transmits high temperature to constant temperature structure, realizes the heat dissipation. Please refer to fig. 7-11, which are schematic diagrams illustrating structures of various parts of a board card of a chassis heat dissipation structure according to embodiment 2 of the present invention, where the board card 2 includes a cold plate 23 and a PCB 22 fixed in an accommodation groove 234 on one side of the cold plate 23 through a rear cover 21, the cold plate 23 includes an interlayer structure composed of an outer layer cold plate 231, an inner layer cold plate 232 and a heat sink, where the accommodation groove 2311 is disposed on one side of the outer layer cold plate 231, the heat sink 233 and the inner layer cold plate 232 are sequentially stacked in the accommodation groove 2311, and the heat sink 233 is pressed and positioned in the accommodation groove 2311 of the outer layer cold plate 231 by the inner layer cold plate 232. The heat sink 233 includes a heat insulating plate 6 and a plurality of thermoelectric coolers 8 disposed in the positioning grooves 61 on the heat insulating plate 6, the thermoelectric coolers 8 are uniformly distributed on the heat insulating plate 6 or distributed on the heat insulating plate 6 according to the arrangement of heat generating components on the PCB, and the hot end 81 of the thermoelectric cooler 8 is in contact with the outer cold plate 231, and the cold end 82 is in contact with the inner cold plate 232 to reduce the temperature of the PCB in contact with the inner cold plate 232.

In this embodiment, to prevent thermal conduction between the inner and outer cold plates, the outer edges of the insulation plate 6 protrude beyond the outer edges of the inner cold plate 232. Preferably, the outer edges of the heat insulation plate 6 and the inner cold plate 232 are in clearance fit with the walls of the receiving groove 2311, and the clearance between the outer edge of the inner cold plate 232 and the walls of the receiving groove is larger than the clearance between the outer edge of the heat insulation plate 6 and the walls of the receiving groove. The inner layer cold plate, the heat insulation plate and the outer layer cold plate are different in cross section area, so that the inner layer cold plate and the outer layer cold plate can be prevented from contacting, and the inner layer cold plate and the outer layer cold plate are isolated from the heat insulation plate by means of different areas.

In this embodiment, a plurality of heat conduction bosses 2321 for contacting with the heating element on the PCB are further disposed on the surface of the inner cold plate 232 facing the PCB, and the heat dissipation of the heating element can be enhanced by the heat conduction bosses 2321, so that the heat dissipation rate is increased.

In this embodiment, the outer cold plate 231 and the rear cover 21 are fixed by screws, and a positioning protrusion 2312 is formed on the groove wall of the accommodating groove 2311 of the outer cold plate 231 in an inward protruding manner, a screw hole is formed on the positioning protrusion 2312, and the outer cold plate 231 and the rear cover 21 are fixed by screws penetrating through the screw hole. Preferably, the side wall of the positioning protrusion 2312 located in the accommodating groove 2311 is of a circular arc structure, the inner-layer cold plate 232 and the heat insulation plate 6 located in the accommodating groove 2311 are both provided with an avoiding groove 2313 for avoiding the positioning protrusion 2312, and the avoiding groove 2313 and the positioning protrusion 2312 are matched to realize the positioning of the placement position and the placement direction of the inner-layer cold plate 232 and the heat insulation plate 6 in the outer-layer cold plate 231. There is a gap between the edge of the inner cold plate 232 and the locating protrusion 2312. Preferably, the number of the positioning protrusions 2312 is 6, which includes 4 protrusions distributed at four corners of the receiving groove 2311 and two protrusions located between two long sides of the receiving groove 2311, but is not limited thereto.

In other embodiments of the present invention, in order to keep the temperature inside the board 2 low and prevent the external high temperature from being transmitted from the rear cover to the board 2, the rear cover 21 further has a heat insulation function, for example, the rear cover 21 is made of a heat insulation material or a heat insulation board 6 is further provided inside the rear cover 21. Preferably, the rear cover 21 is a sandwich structure, which includes an outer rear cover, an inner rear cover and a heat insulation plate 21 sandwiched between the inner and outer rear covers.

This embodiment utilizes novel cold drawing structure and through reasonable thermal-insulated structural design, can effectively control the temperature rise of integrated circuit board, effectively improves the radiating reliability of electronic equipment. When the cold-end laminating of thermoelectric refrigerator is on the inlayer cold drawing, maintains low temperature, and thermoelectric refrigerator's hot junction laminating is on outer cold drawing, and according to thermoelectric refrigeration's principle, inlayer cold drawing maintains invariable low temperature, finally conducts the board card heat to the casing of the chassis on transferring to outer cold drawing.

And this embodiment can use alone, also can cooperate the shell structure of embodiment 1 to use to reach better radiating effect.

The combination of the embodiments 1 and 2 and the embodiments 1 and 2 of the invention can be matched with other heat dissipation structures to realize better temperature rise control effect.

Please refer to fig. 11-17, which are schematic diagrams of a chassis heat dissipation structure according to embodiment 3 of the present invention, in this embodiment, the chassis is a fully-enclosed forced air cooling chassis, in this embodiment, a front end of the chassis housing 1 is provided with a panel 5, a rear end of the chassis housing is provided with a rear fan 104, and outer sides of four upper, lower, left and right sides of the chassis housing 1 are provided with heat dissipation fins 107, the heat dissipation fins 107 extend along a front-rear direction of the chassis housing 1, outer sides of the 4 sides are further fixed with cover plates, the cover plates and the heat dissipation fins 107 cooperate to form an enclosed heat dissipation cavity for air to pass through, and the fan 104 can exhaust hot air in the heat dissipation cavity or deliver cold air to the heat dissipation cavity to enhance heat dissipation at the periphery of the chassis housing 1. In other embodiments of the present invention, the fan 104 is also communicated with the inside of the housing of the chassis, and the panel is provided with a corresponding air inlet.

In this embodiment, the cover plates include an upper cover plate 100 fixed to the outside of the upper case 11, a lower cover plate 101 fixed to the outside of the lower case 12, a left cover plate 103 fixed to the outside of the left case 13, and a right cover plate 104 fixed to the outside of the right case 14.

The panel 5 is provided with an air inlet 106 for external air to enter the heat dissipation cavity, that is, external cold air enters the heat dissipation cavity from the air inlet 106, and under the pumping action of the fan 104, the air in the heat dissipation cavity moves from the front end to the rear end of the heat dissipation shell along the heat dissipation fins and is finally discharged through the fan 104, thereby completing the heat dissipation work.

Preferably, there are a plurality of air inlets 106, and the front ends of the heat dissipation fins on the outer sides of the upper casing 11, the lower casing 12, the left casing 13, and the right casing 14 are all provided with corresponding through air inlets 106.

In this embodiment, the outer sides of the upper casing 11, the lower casing 12, the left casing 13 and the right casing 14 are all U-shaped structures, the heat dissipation fins 107 are distributed in the grooves of the U-shaped structures, the front and rear ends of the U-shaped grooves are respectively communicated with the air inlet 106 and the fan 104 to realize air inlet and air outlet, and the front and rear ends of the grooves are further provided with positioning protrusions 124 for realizing the fixation of the panel 5 or the fan 104. Two sides of the U-shaped structure of the upper shell 11 and the lower shell 12 are also folded outwards to form a folded edge 125 for fixing with the cover plate.

In this embodiment, the fan 104 is secured by the engagement of the fan mounting plate 105 with the rear end of the chassis housing 1.

In this embodiment, the chassis housing 1 is the chassis housing or the board having the thermoelectric heat sink in embodiment 1 is the board having the thermoelectric heat sink in embodiment 2, or the chassis housing 1 is the chassis housing having the thermoelectric heat sink in embodiment 1 and the board is the board having the thermoelectric heat sink in embodiment 2, that is, the chassis housing 1 and the board 2 in this embodiment are the structures in embodiment 1 or embodiment 2, and may also be a combination of embodiment 1 and embodiment 2.

The cardboard can not be established in the chassis casing in this embodiment, exclusive use also can use with other structure cooperations, and the direction is the axial around the definition chassis casing this moment, and the direction of fan convulsions or air supply is the axial promptly, goes up casing, lower casing, left casing, right casing and then follows circumferential distribution.

Please refer to fig. 18 and fig. 19, which are schematic diagrams of a heat dissipation structure of a chassis in embodiment 4 of the present invention, in this embodiment, the chassis is a forced air cooling chassis, in this embodiment, a heat dissipation fan 126 is installed at the bottom of the chassis housing 1, an air outlet/air inlet of the heat dissipation fan 126 is communicated with the lower housing 12 of the chassis housing 1, external air is sent into the chassis housing 1 from an opening at the lower housing 12 or air in the chassis housing is discharged from an opening at the lower housing 12, and a plurality of air outlet/air inlet holes 127 are evenly distributed on the upper housing 11 of the chassis housing 1, air in the chassis housing 1 is discharged from the air outlet holes 127 on the upper housing 11 or external cold air enters the chassis housing from the air inlet holes.

In this embodiment, the board cards 2 are arranged in the casing 1 in the left-right direction, so that wind passes through the adjacent board cards 2, and heat emitted by the board cards 2 is taken away.

In this embodiment, the board card 2 is the board card structure described in embodiment 2, that is, the board card 2 includes the cold plate 23 and the PCB 22 fixed in the receiving groove 234 on one side of the cold plate 23 through the rear cover 21, the cold plate 23 includes a sandwich structure composed of an outer cold plate 231, an inner cold plate 232 and a heat sink, wherein the receiving groove 2311 is provided on one side of the outer cold plate 231, the heat sink 233 and the inner cold plate 232 are sequentially stacked in the receiving groove 2311, and the heat sink 233 is pressed and positioned in the receiving groove 2311 of the outer cold plate 231 by the inner cold plate 232. The heat sink 233 includes a heat insulating plate 6 and a plurality of thermoelectric coolers 8 disposed in the positioning grooves 61 on the heat insulating plate 6, the plurality of thermoelectric coolers 8 are uniformly distributed on the heat insulating plate 6 or distributed on the heat insulating plate 6 according to the arrangement of heat generating components on the PCB, and a hot end 81 of the thermoelectric cooler 8 is in contact with the outer cold plate 231 and a cold end 82 is in contact with the inner cold plate 232 to reduce the temperature of the PCB in contact with the inner cold plate 232.

In this embodiment, the other side of the outer cold plate 231 is further provided with a heat dissipation fin 107 extending in the up-down direction, and the air sent into the chassis housing 1 by the heat dissipation fan 126 flows upwards along the heat dissipation fin outside the outer cold plate 231, and is finally discharged from the air outlet 127 on the upper housing 11, so as to achieve the purpose of heat dissipation.

In this embodiment, the housing case 1 may also be the structure in embodiment 1, that is, when the board insertion direction is defined as the axial direction, at least one of the four axial surfaces of the housing case 1 is provided with the thermoelectric cooling structure.

In this embodiment, heat dissipation fins are further disposed around the periphery of the chassis housing (i.e., around the four housings), and the heat dissipation fan 126 can provide power for air between the heat dissipation fins to enhance heat dissipation at the chassis housing.

This embodiment can also be combined with the chassis heat dissipation structure in embodiment 3, and at this time, the heat dissipation fan can simultaneously dissipate heat of the board card in the chassis housing and the chassis housing itself. This radiator fan can be to supplying air or convulsions in the heat dissipation cavity that comprises apron and radiating fin on the case casing promptly, through also can supplying air or convulsions to the quick-witted incasement, be equipped with the wind gap with the inside intercommunication of heat dissipation cavity and case casing on the panel.

The radiating fins in the embodiments of the invention can be processed and formed by methods such as machining, welding or section bar complementary processing. The fins may be rectangular, cylindrical, interrupted discontinuous rectangular or parabolic, etc.

Although the present invention has been described with reference to the preferred embodiments, it will be understood by those skilled in the art that various changes may be made and equivalents may be substituted for elements thereof without departing from the scope of the present invention.

Claims (10)

1. The utility model provides a totally closed forced air cooling heat radiation structure, its includes chassis housing and the integrated circuit board of assembly in chassis housing, its characterized in that: at least one of four surfaces of the case shell distributed around the board cards, which is in contact with each board card, is provided with a thermoelectric refrigerator; and the periphery of four surfaces of the case shell distributed around the board cards is provided with heat dissipation fins extending along the inserting direction of the board cards, the heat dissipation fins are matched with a cover plate fixed outside the case shell to form a closed cavity, the positions of a panel fixed at the front end of the case shell, which correspond to the heat dissipation fins, are provided with air inlet/outlet ports, and a fan fixed at the rear end of the case shell sends outside air into the closed cavity and enables the outside air to flow out of the air outlet at the panel or extracts the air flowing in from the air inlet at the panel.

2. The totally-enclosed air-cooled heat dissipation structure of claim 1, wherein: the shell of the case is at least provided with heat insulation plates for preventing heat exchange between the inside and the outside of the case in four surfaces distributed around the board cards, and the thermoelectric refrigerator penetrates through the heat insulation plates in the surface where the thermoelectric refrigerator is located.

3. The totally-enclosed air-cooled heat dissipation structure according to claim 1, characterized in that: the integrated circuit board includes the cold drawing and fixes the PCB board in cold drawing one side holding tank through the back lid.

4. A totally enclosed air-cooled heat dissipating structure according to claim 3, wherein: the cold drawing includes that one side is equipped with the outer cold drawing of holding tank and stacks fin and the inlayer cold drawing in this holding tank, the fin includes the heat insulating board and fixes the thermoelectric refrigeration ware in the heat insulating board constant head tank, and this thermoelectric refrigeration ware hot end is pasted on outer cold drawing, and the cold junction is pasted on inlayer cold drawing.

5. The totally-enclosed air-cooled heat dissipation structure of claim 4, wherein: the rear cover has a heat insulation function.

6. The totally-enclosed air-cooled heat dissipation structure of claim 2, wherein: the machine case shell is of a sandwich structure consisting of an outer shell, an inner shell and a heat insulation plate positioned between the outer shell and the inner shell; the cold end of the thermoelectric refrigerator is attached to the inner shell, and the hot end of the thermoelectric refrigerator is attached to the outer shell.

7. The totally-enclosed air-cooled heat dissipation structure according to claim 6, characterized in that: the four faces of the case shell distributed around the board card are matched at the butt joint position by adopting three layers of stepped faces, so that the butt joint faces between adjacent external shells, between adjacent heat insulation boards and between adjacent internal shells are staggered in sequence.

8. The totally-enclosed air-cooled heat dissipation structure of claim 1, wherein: the casing of the case all has a groove around four face outsides that the integrated circuit board distributes, the heat dissipation fin distributes in the groove.

9. The totally-enclosed air-cooled heat dissipation structure of claim 8, wherein: one side of the groove facing the panel and one side of the groove facing the fan are both opened, and a positioning bulge used for being matched and fixed with the panel or the fan is arranged at the groove bottom of the groove.

10. A totally enclosed air-cooled heat dissipating structure as claimed in any one of claims 1 to 2 and 6 to 9, wherein: the heat dissipation structure can remove the board card to be used independently as a device for keeping the internal constant temperature.

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