CN219938661U - Mounting shell, radio frequency generating device, radio frequency thawing device and refrigerator - Google Patents
Mounting shell, radio frequency generating device, radio frequency thawing device and refrigerator Download PDFInfo
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- CN219938661U CN219938661U CN202223373630.2U CN202223373630U CN219938661U CN 219938661 U CN219938661 U CN 219938661U CN 202223373630 U CN202223373630 U CN 202223373630U CN 219938661 U CN219938661 U CN 219938661U
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Abstract
The application discloses a mounting shell, a radio frequency generating device, a radio frequency thawing device and a refrigerator, which solve the technical problem that a shell in the prior art has the risk of short circuit of a circuit board after water inflow; the top cover is covered on the bottom plate, and an installation cavity which is used for accommodating the electronic module and is communicated with the hollowed-out hole is formed by surrounding the top cover and the bottom plate; along the week of bottom plate, top cap and surrounding edge all have the overlapping area in the direction of height to make surrounding edge shield the installation clearance of top cap and bottom plate in the horizontal direction, when outside emergence water intaking, the surrounding edge can shelter from water, improves the water-proof effects of installation shell, when water enters into the installation intracavity, because fretwork hole and installation intracavity intercommunication, therefore outside the water can discharge the installation chamber through the fretwork hole, thereby further reduce the condition that the electronic module of installation intracavity took place to intaking.
Description
Technical Field
The application belongs to the technical field of electric appliance shell structures, and particularly relates to a mounting shell, a radio frequency generating device, a radio frequency thawing device and a refrigerator.
Background
In a refrigerator with a radio frequency thawing function, a plurality of circuit boards are usually required to be arranged, and the circuit boards are usually arranged in a shell, and then the shell is fixedly connected with a refrigerator main body.
Because the circuit board can generate heat when working, the shell is usually provided with a heat dissipation hole for air circulation, and the heat dissipation is realized by means of the air. When the mounting surface is uneven, the housing is deformed to generate a gap. Water or other foreign matters easily enter the inside of the shell through the heat dissipation holes and the gaps, and the risk of short circuit caused by contact of the circuit board with the water or the foreign matters exists.
Disclosure of Invention
In order to solve the technical problem that the existing shell is short-circuited in a circuit board after water inflow, the utility model provides a mounting shell, a radio frequency generating device, a radio frequency thawing device and a refrigerator.
The utility model adopts a technical scheme that: there is provided a mounting case comprising:
the edge of the bottom plate is provided with a surrounding edge, the bottom plate is provided with more than two hollowed holes, and the more than two hollowed holes are distributed at intervals along the edge of the bottom plate and are all positioned in an area surrounded by the surrounding edge;
the top cover is covered on the bottom plate, and a mounting cavity which is used for accommodating the electronic module and is communicated with the hollowed-out hole is formed by surrounding the top cover and the bottom plate; along the periphery of bottom plate, the top cap with the surrounding edge all has the overlap region in the direction of height.
The surrounding edge and the side wall of the top cover have overlapping areas with a certain height, so that the surrounding edge shields the installation gap between the top cover and the bottom plate in the horizontal direction, when water enters from the outside, the surrounding edge can shield water, the waterproof effect of the installation shell is improved, the surrounding edge and the top cover are overlapped in the direction along the periphery of the bottom plate, and even if the bottom cover and the top cover deform, gaps are not generated at the butt joint position of the bottom cover and the top cover. When water enters the installation cavity, the hollow holes are communicated with the installation cavity, so that water can be discharged out of the installation cavity through the hollow holes, and the situation that the electronic module in the installation cavity is subjected to water inflow is further reduced.
In some embodiments, a water blocking structure is arranged on the bottom plate, the water blocking structure is located in an area surrounded by the surrounding edge, a water blocking area is surrounded by the water blocking structure, and the electronic modules are all located in the water blocking area; the hollowed-out hole is positioned between the water retaining structure and the surrounding edge.
In some embodiments, the base plate is provided with a mounting structure for mounting the electronic module, and the mounting structures are all located in the water blocking area.
In some embodiments, the mounting structure comprises more than two mounting posts arranged at intervals, wherein the mounting posts are provided with mounting holes, and the electronic module is mounted on the mounting posts through fixing pieces arranged in the mounting holes.
In some embodiments, a limiting structure is provided in the mounting housing, the limiting structure defining a limiting region for limiting the electronic module; the limiting structure is located on the inner side of the area surrounded by the mounting structure.
In some embodiments, a through heat dissipation hole is formed in the side wall of the top cover, and the projection of the side wall of the top cover on the bottom plate is located outside the water blocking area.
In some embodiments, a coaming is arranged on the mounting shell, the coaming is connected to the mounting shell and is positioned outside the mounting cavity, the connection part of the coaming and the mounting shell is positioned above the heat dissipation hole, and the projection of the coaming on the side wall has an overlapping area with the heat dissipation hole;
and/or a baffle corresponding to the heat dissipation hole is arranged on the side wall provided with the heat dissipation hole; and the projection of the baffle plate on the side wall covers the corresponding radiating hole.
In some embodiments, the top cover is located within the area surrounded by the peripheral edge; the top cover is in contact with the surrounding edge.
The application adopts another technical scheme that: there is provided a radio frequency generating device comprising:
the mounting shell;
The power amplification module is arranged in the mounting cavity and connected with the bottom plate and used for generating a radio frequency signal after power amplification;
the power module is arranged in the mounting cavity and connected with the bottom plate, and is used for supplying power to the power amplifier module;
the power amplifier module and the power module are far away from the surrounding edge compared with the hollowed-out hole, and the projection of the power amplifier module and the power module on the bottom plate is not overlapped with the hollowed-out hole.
In some embodiments, the power amplifier module includes:
the power amplification plate is provided with a first surface and a second surface which are arranged in a back-to-back manner;
the power amplifier shielding cover is covered on the first surface of the power amplifier board;
the radiating piece is arranged on the second surface of the power amplification plate and connected with the mounting shell, and the radiating piece is provided with an airflow channel;
the air blowing assembly is provided with an air outlet which is communicated with the air flow channel of the heat radiating piece.
In some embodiments, the blower assembly includes:
a blowing device for generating a wind flow;
the air duct is provided with a first opening and a second opening which are oppositely arranged, the first opening is communicated with a blowing opening of the blowing device, the second opening is communicated with an airflow channel of the radiating piece to form the air outlet, and the size of the second opening in the width direction of the power amplification plate is larger than that of the first opening.
In some embodiments, the power module includes a power housing and a power strip disposed in the power housing, the power housing being connected to the mounting housing.
The application adopts another technical scheme that: there is provided a radio frequency thawing apparatus comprising: the radio frequency thawing assembly and the radio frequency generating device; the radio frequency thawing assembly comprises:
a shielding cylinder provided with an opening end with an opening;
the shielding door is arranged at the opening end of the shielding cylinder body and is used for closing the opening;
the tuning plate is arranged in the shielding cylinder body and is electrically connected with the power amplification plate of the radio frequency generating device;
and the polar plate is arranged in the shielding cylinder body, is electrically connected with the tuning plate and is used for transmitting radio frequency signals.
The application adopts another technical scheme that: the refrigerator comprises a refrigerator main body and a radio frequency thawing device, wherein the radio frequency thawing assembly is arranged in the refrigerator main body, and the radio frequency generating device is arranged in or outside the refrigerator main body.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for the description of the embodiments will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present application, and other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1 is a schematic diagram of a structure of a radio frequency generating device in an embodiment of the present application when a top cover is partially cut away.
Fig. 2 shows a schematic structural view of the radio frequency generating device of fig. 1 with the top cover removed.
Fig. 3 is a schematic view of a radio frequency generating device according to another embodiment of the present application, when the top cover is partially cut away.
Fig. 4 shows a schematic structural view of the radio frequency generating device of fig. 3 after being mounted on a device.
Fig. 5 shows a schematic structural view of a radio frequency generating device according to still another embodiment of the present application when the top cover is partially cut away.
Fig. 6 is a schematic diagram showing an internal structure of the rf generator after the top cover is removed in an embodiment of the application.
Fig. 7 is a schematic structural diagram of an rf generator according to another embodiment of the application in a bottom view.
Fig. 8 is a schematic diagram of a radio frequency generating device according to an embodiment of the present application when a top cover is partially cut away.
Fig. 9 shows a schematic view of the structure of the mounting case in the radio frequency generating device of fig. 8.
Fig. 10 shows a second schematic structural view of the mounting case in the radio frequency generating device of fig. 8.
Fig. 11 shows a third schematic structural view of the mounting case in the radio frequency generating device of fig. 8.
Fig. 12 is a schematic structural diagram of a power amplifier module in a radio frequency generating device according to an embodiment of the present application.
Fig. 13 shows an exploded view of the power amplifier module of fig. 12.
Fig. 14 is a schematic structural diagram of a power module in a radio frequency generating device according to an embodiment of the present application.
Fig. 15 shows a schematic structural diagram of the power module of fig. 14 after glue filling.
Fig. 16 shows a functional block diagram of a radio frequency thawing device in accordance with an embodiment of the present application.
Fig. 17 shows a functional block diagram of a radio frequency thawing device in accordance with another embodiment of the present application.
Fig. 18 shows a functional block diagram of a radio frequency thawing device in accordance with another embodiment of the present application.
Fig. 19 is a schematic view showing a structure of a refrigerator in an embodiment of the present application.
Fig. 20 shows a partial enlarged view at a of fig. 19.
Fig. 21 is a view showing an assembled structure of a shield cylinder and a shield door in the refrigerator of fig. 19.
Reference numerals illustrate:
100-refrigerator; 10-a radio frequency generating device; 20-a refrigerator main body, 21-a mounting cavity, 22-a refrigerating assembly, 30-a radio frequency thawing assembly, 31-a shielding cylinder, 31 a-an opening end, 31 c-an air inlet of the shielding cylinder, 31 d-an air outlet of the shielding cylinder, 31 e-a tuning cavity, 31 f-a thawing cavity and 32-a shielding door; 40-wind flow accelerator.
11-mounting shell, 11 a-mounting cavity, 11 b-power amplification cavity, 11 c-power cavity, 11 d-heat dissipation hole, 11 e-heat dissipation hole, 11 f-air guide channel, 11 h-water blocking area, 11 i-hollowed hole, 11 m-strong current threading hole and 11 n-weak current threading hole; 110-a body, 111-a bottom plate, 1111-a water retaining structure, 1112-a surrounding edge, 112-a top cover, 1121-a side wall, 1122-a baffle plate and 1123-a shielding plate; 113-a baffle plate, 115-a coaming plate, 116-a mounting structure, 1161-a mounting hole, 118-a limiting structure and 1181-a limiting rib.
12-power amplifier module, 121-power amplifier board, 121 a-first surface, 121 b-second surface, 121 c-first end, 121 d-second end, 1211-component; 122-heat sink, 122 a-air flow channel, 122 b-relief blind hole, 1221-sheet metal, 1221 a-mounting plane, 1222-fin, 1223-lug; 123-blowing components, 1231-blowing devices, 1231 a-blowing ports, 1232-air channels, 1233-air outlets, 1234-first openings, 1235-second openings; 124-a power amplifier shielding cover; 127-fastener.
13-power module, 131-power panel, 132-power shell, 132 a-through hole, 133-heat conduction insulating glue in the power module; 16-a strong electric wire harness; 17-weak current harness, 171-first weak current harness; 172-a second weak current harness; 18-fixing piece; and a B-electronic module.
Detailed Description
The following description of the embodiments of the present application will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are only some, but not all embodiments of the application. All other embodiments, which can be made by those skilled in the art based on the embodiments of the application without making any inventive effort, are intended to be within the scope of the application.
Furthermore, the present application may repeat reference numerals and/or letters in the various examples, which are for the purpose of brevity and clarity, and which do not themselves indicate the relationship between the various embodiments and/or arrangements discussed. In addition, the present application provides examples of various specific processes and materials, but one of ordinary skill in the art will recognize the application of other processes and/or the use of other materials.
In the related art, the risk that the shell is damaged due to the short circuit of the internal electronic module caused by water inflow exists, and the embodiment of the application provides the mounting shell, the radio frequency generating device, the radio frequency thawing device and the refrigerator, so that the technical problems can be solved to a certain extent at least. The application is described below with reference to specific embodiments in conjunction with the accompanying drawings:
example 1:
the embodiment of the application provides a mounting shell which is applied to household appliances such as a refrigerator and the like, can be applied to industrial equipment, and meets the requirements of mounting, protecting and waterproofing an internal electronic module. As shown in fig. 1, the overall structure of the mounting case is that in which the electronic module B is mounted inside. The installation shell 11 is of a hollow structure, the inner cavity is an installation cavity 11a for installing the electronic module B (at least one of the power amplifier module 12, the power module 13 and the control module is referred to as a power amplifier module), the installation shell 11 can be of a split type structure or an integral type structure, and the application is not limited. In some embodiments, the mounting shell 11 includes a bottom plate 111 and a top cover 112 covering the bottom plate 111, the bottom plate 111 and the top cover 112 enclose a mounting cavity 11a, and the electronic module B disposed in the mounting cavity 11a is fixedly connected to the bottom plate 111. In other embodiments, the mounting housing 11 includes a bottom cover and a sealing plate that covers the bottom cover. In still other embodiments, the mounting housing 11 includes two snap covers with openings that snap together in opposition. The constitution of the mounting case 11 is not limited by the present application.
Referring to fig. 3 and 5, the mounting shell 11 includes a top cover 112 and a bottom plate 111, a surrounding edge 1112 is provided at an edge of the bottom plate 111, the surrounding edge 1112 is provided along an outer contour edge of the bottom plate 111, the surrounding edge 1112 protrudes upward to be higher than an inner wall surface of the bottom plate 111, the surrounding edge 1112 may be a ring of rib plate which is independently provided, and is fixedly connected with the bottom plate 111 by bonding, welding or the like, and the surrounding edge 1112 may also be integrally formed with the bottom plate 111, for example, by injection molding, or stamping. The bottom plate 111 is provided with a plurality of hollowed holes 11i near the edge of the surrounding edge 1112, and the hollowed holes 11i can be any shape such as square, strip, round, oval, etc., which is not limited by the application. The hollowed-out holes 11i are arranged close to the surrounding edge 1112, and the hollowed-out holes 11i are arranged at intervals along the edge of the bottom plate 111, wherein the number of the hollowed-out holes 11i is at least two, and the hollowed-out holes 11i are respectively arranged at edge positions of the bottom plate 111 in different directions and are all located in the area surrounded by the surrounding edge 1112.
The accommodating space of the installation cavity 11a is mainly located in the top cover 112, the top cover 112 comprises a top wall 1124 and a side wall 1121 circumferentially arranged at the edge of the top wall 1124, the side wall 1121 of the top cover 112 is perpendicular to the top wall 1124 and encloses the accommodating space on the bottom surface of the top wall 1124, and the installation cavity 11a is sealed when the top cover 112 is buckled with the bottom plate 111. When the top cover 112 is fastened to the bottom plate 111, the side wall 1121 of the top cover 112 may be covered outside the peripheral edge 1112 or embedded inside the peripheral edge 1112. The side wall 1121 of the top cover 112 covers at least part of the hollow hole 11i in the formed installation cavity 11a, so that the installation cavity 11a is communicated with the outside through the hollow hole 11i, and since the surrounding edge 1112 protrudes upward above the inner wall surface of the bottom plate 111, the surrounding edge 1112 and the side wall 1121 of the top cover 112 have a certain height overlapping area in the height direction, and the surrounding edge 1112 and the side wall 1121 of the top cover 112 overlap everywhere in the circumferential direction along the bottom plate 111, so that the surrounding edge 1112 covers the installation gap between the top cover 112 and the bottom plate 111.
The number of the hollowed holes 11i should satisfy that all the positions of the bottom plate 111 are provided, for example, when the bottom plate 111 is a rectangular plate, the number of the hollowed holes 11i should be at least four, so that at least one hollowed hole 11i is provided on four sides of the rectangle. The plurality of hollowed-out holes 11i are uniformly arranged at intervals on the edge of the bottom plate 111, so that a circle of hollowed-out area is formed at the inner side position close to the surrounding edge 1112, the structural strength of the edge of the bottom plate 111 is reduced, and the mounting surface with different concave-convex shapes can be better adapted when the bottom plate 111 is mounted.
Because the bottom plate 111 has a certain area, the uneven surface is easy to occur in the production and manufacturing process, and the surrounding edge 1112 is arranged, so that on one hand, the surrounding edge 1112 can reinforce the edge of the bottom plate 111, and the deformation of the edge of the bottom plate 111 is reduced; on the other hand, the surrounding edge 1112 overlaps the side wall 1121 of the top cover 112, and the surrounding edge 1112 can cover the installation gap between the top cover 112 and the bottom plate 111, prevent external foreign matters from entering the installation cavity 11a, and has a certain water blocking function. By arranging the hollowed-out holes 11i, on one hand, the hollowed-out holes 11i are arranged at the part of the bottom plate 111 close to the surrounding edge 1112, so that the strength of the edge of the bottom plate 111 can be reduced, and the mounting shell 11 can be better adapted to mounting surfaces with different concave-convex shapes when being connected with equipment and is attached to the equipment main body; on the other hand, the arrangement of the hollowed-out holes 11i can release the internal stress of the bottom plate 111 to a certain extent, and reduce the stress deformation of the bottom plate 111.
The electronic module B installed in the installation cavity 11a is located in an area surrounded by the plurality of hollowed holes 11i, that is, the electronic module B is farther from the surrounding edge 1112 than the hollowed holes 11i, and the projection of the electronic module B on the bottom plate 111 is not overlapped with the hollowed holes 11i, because the hollowed holes 11i penetrate through the bottom plate 111, when water enters the installation cavity 11a, the water can be discharged from the hollowed holes 11i, that is, the hollowed holes 11i can be used as drainage holes of the bottom plate 111 at the same time, so that the water entering the installation cavity 11a can be discharged through the hollowed holes 11i without contacting the electronic module B, and the situation that the electronic module B in the installation cavity 11a is in contact with the water and has leakage or short circuit is avoided.
Referring to fig. 5, in some embodiments, a circle of water retaining structures 1111 is disposed on the bottom plate 111 in the area surrounded by the hollowed holes 11i, and the height of the water retaining structures 1111 is not less than the height of the surrounding edge 1112. The water retaining structure 1111 may be a ring of rib plates independently arranged, and fixedly connected with the bottom plate 111 by bonding, welding, etc., and the surrounding edge 1112 may be integrally formed with the bottom plate 111, for example, by injection molding, or by stamping. In some embodiments, the middle portion of the bottom plate 111 may be partially protruded to form a retaining wall above other portions of the bottom plate 111, and the retaining wall forms the water retaining structure 1111. The specific implementation of the water retaining structure 1111 is not limiting in the present application.
The water blocking structure 1111 is surrounded by a circle along the circumference of the bottom plate 111 to form a water blocking area 11h, and the electronic devices are all installed in the water blocking area 11 h. The water retaining structure 1111 and the surrounding edge 1112 form a circular area, and the hollow holes 11i are all arranged between the water retaining structure 1111 and the surrounding edge 1112. When the top cover 112 is embedded inside the surrounding edge 1112, the contact area between the top cover 112 and the bottom plate 111 is located between the water retaining structure 1111 and the surrounding edge 1112, and when water enters the installation cavity 11a, if the water is not discharged by the hollowed-out holes 11i and flows inwards, the water retaining structure 1111 can block the water, so that the water is blocked outside the water retaining area 11h and discharged through the hollowed-out holes 11i, and the waterproof effect of the installation shell 11 is further improved.
Since the power amplifier module 12, the power module 13, and the control module all generate heat during operation, it may occur that the temperature in the installation cavity 11a is significantly higher than the temperature outside the installation case 11 during cold weather, thereby generating condensed water on the inner wall of the top cover 112. To avoid condensation water dripping into the water stop zone 11h, in some embodiments, the top wall 1124 of the top cover 112 may be configured to arch centrally upward such that the resulting condensation water flows toward the edges of the top wall 1124 and onto the side walls 1121 of the top cover 112. In some embodiments, the projection of the side wall 1121 of the top cover 112 on the bottom plate 111 is located outside the water blocking area 11h, specifically outside the water blocking structure 1111, when water is present on the inner wall of the side wall 1121 of the top cover 112, the water flows downward along the side wall 1121 of the top cover 112, flows between the water blocking structure 1111 and the surrounding edge 1112, and is discharged through the hollowed-out hole 11i, or flows outside the surrounding edge 1112.
Referring to fig. 5, in some embodiments, the side wall 1121 of the top cover 112 is located inside the peripheral edge 1112, and the outer wall of the side wall 1121 of the top cover 112 may contact the inner wall of the peripheral edge 1112, so as to improve the tightness of the top cover 112 after being fastened to the bottom plate 111, and further reduce the occurrence of water entering the installation shell 11. Further, the side wall 1121 of the top cover 112 contacts the peripheral edge 1112, so that the peripheral edge 1112 can be reinforced, and the structural strength of the mounting case 11 can be further improved.
In the case where more than two electronic modules B are disposed in the mounting cavity 11a of the mounting case 11, in order to avoid the mutual influence of the plurality of electronic modules B, referring to fig. 2, in some embodiments, a partition plate 113 is disposed in the inner cavity of the mounting case 11, the partition plate 113 divides the mounting cavity 11a of the mounting case 11 into two independent chambers, and the partition plate 113 may be integrally formed with the mounting case 11 or fixedly connected with the mounting case 11 by gluing, welding, or the like. When the mounting case 11 includes the bottom plate 111 and the top cover 112, the partition 113 may alternatively be provided on the bottom plate 111 or the top cover 112, and in some embodiments, the partition 113 may also be provided on the bottom plate 111 or the top cover 112, respectively, and the two partitions 113 abut or overlap in the height direction.
In some embodiments, the power module 13 and the power amplifier module 12 are disposed in the mounting cavity 11a of the mounting shell 11, the control module is external, or the control board is integrated with the power panel 131 or the power amplifier panel 121. The inner cavity of the installation shell 11 is divided into a power amplification cavity 11b and a power supply cavity 11c through a partition plate 113, the power supply module 13 and the power amplification module 12 are separately placed, the power amplification module 12 is arranged in the power amplification cavity 11b, and the power supply module 13 is arranged in the power supply cavity 11 c. Because the power amplifier module 12 is provided with the air blowing component 123, the power amplifier cavity 11b and the power amplifier cavity 11c are relatively airtight, the air flow blown by the air blowing component 123 only can be disturbed in the power amplifier cavity 11b, compared with the condition that the partition plate 113 is not arranged, the air flow flows in a smaller space, the wind noise is relatively smaller, the power amplifier module 13 is free to radiate heat, the power amplifier cavity 11c can be provided with no radiating holes 11d, so that the power amplifier cavity 11c becomes an airtight chamber, or compared with the power amplifier cavity 11b, the radiating holes 11d are reduced, and the water spraying risk of the power panel 131 is reduced.
Referring to fig. 16 and 17, the electronic module B mounted in the mounting cavity 11a needs to be electrically connected to an external electric device to achieve power supply or signal transmission, and thus a wire through hole is also required to be provided on the mounting shell 11, and the wire through hole is also a through hole 132a penetrating through a wall plate of the mounting shell 11, and from the perspective of water resistance, the wire through hole should be as close to the edge of the mounting shell 11 as possible and far away from the electronic device. In some embodiments, the via holes are located in the area where the hollowed holes 11i are located, that is, the hollowed holes 11i and the via holes are all distributed at the same position of the mounting shell 11. When the electronic module B is the power amplifier module 12 and/or the control module, since the power amplifier module 12 and the control module both use low-voltage direct current, only one wire passing hole can be provided, and when the electronic module B includes the power module 13, since the power module 13 regulates the commercial power into low-voltage direct current for the power amplifier module 12 and the control module, two wire passing holes need to be provided, one for passing through the strong current wire passing hole 11m, passing through the strong current wire harness 16, and the other for passing through the weak current wire passing hole 11n, and passing through the weak current wire harness 17, as shown in fig. 6.
Referring to fig. 4 and fig. 5, in order to improve the installation stability of the electronic module B in the installation shell 11 and avoid connection failure during the collision and installation impact in the transportation process, in some embodiments, a limiting structure 118 for limiting and fixing the electronic module B is provided on the installation shell 11, and the limiting structure 118 may be a plate surface attached to a side wall of the electronic module B, and the electronic module B is clamped by two mutually parallel plate surfaces, so that a fixed limiting effect can be realized in one direction; or the limiting structure 118 may be cylindrical, and the limiting structure 118 is distributed on the outer sides of different side walls of the electronic module B so as to be abutted by the electronic module B; or the limiting structure 118 is a whole circle surrounding structure so as to be surrounded into a groove body matched with the shape of the electronic module B, so that the electronic module B is fixed and limited to the maximum extent, and the specific structural form of the limiting structure 118 is not limited.
In some embodiments, the limiting structure 118 includes at least two limiting ribs 1181, the limiting ribs 1181 protrude on the inner wall surface of the mounting shell 11, and the limiting ribs 1181 are arranged at intervals to form a limiting area for limiting the electronic module B, and the limiting ribs 1181 are attached to the side wall of the electronic module B when the electronic module B is mounted, so as to limit and fix the electronic module B.
In some embodiments, the limiting area may be provided with one for individually fixing the power amplifier module 12, the power module 13 or the control module, or each electronic module B is closely arranged side by side, so that the electronic modules B are installed in the same limiting area, and the limiting and fixing functions can be achieved on the power amplifier module 12 and/or the power module 13 from one direction through at least two limiting ribs 1181. In other embodiments, each electronic module B is limited and fixed by different limiting areas, and at least 2n limiting ribs 1181 for forming the limiting areas are provided, where n is the number of the electronic modules B. Taking the power amplifier module 12 and the power module 13 as examples, at least 4 limiting ribs 1181 are arranged in the installation shell 11, wherein more than two limiting ribs 1181 form a limiting area matched with the power amplifier module 12 according to the model of the power amplifier module 12, and more than two limiting ribs 1181 form a limiting area matched with the power module 13.
In some embodiments, the cross section of the limiting rib 1181 may be L-shaped, the L-shaped limiting rib 1181 is disposed at a position where a bending angle of the electronic module B is located, and the inner sides of the L-shaped limiting ribs 1181 are respectively attached to two side walls 1121 perpendicular to each other of the electronic module B, where when the limiting ribs 1181 are provided with two groups, the two groups of limiting ribs 1181 are disposed at diagonal positions of the electronic module B, so as to achieve a fixed limiting effect on the electronic module B in four directions. And when further setting up more spacing muscle 1181, if the spacing muscle 1181 of L type in every spacing district is provided with four, with its setting in electronic module B four corners department, can all realize fixed and spacing effect to electronic module B in four directions, and be convenient for fix a position when the installation.
The electronic module B and the mounting shell 11 are connected and fixed by a fixing member 18, and the fixing member 18 can adopt a screw, a rivet, a pin shaft, a buckle and other structures. The mounting shell 11 is provided with a mounting hole 1161, the fixing piece 18 is mounted in the mounting hole 1161, and the fixing piece 18 and the mounting hole 1161 can be connected in a threaded mode, an interference fit mode, a clamping mode and the like. The inner wall of the mounting shell 11 is provided with a mounting structure 116, the mounting structure 116 can be a column or a boss 1113, a mounting hole 1161 is formed in the mounting structure 116, and the mounting structure 116 is arranged on the outer side of the limiting structure 118, so that the electronic module B is close to the limiting structure 118 as much as possible. The mounting structure 116 has a height greater than the limiting structure 118, so that the limiting structure 118 only limits the layout of the electronic module B, thereby facilitating the disassembly and assembly of the electronic device.
The mounting structure 116 and the limiting structure 118 are both disposed on the base 111. In some embodiments, the mounting structure 116 is connected to the limiting structure 118, and since the mounting structure 116 and the limiting structure 118 are protruding from the inner surface of the mounting shell 11, the mounting structure 116 is connected to the limiting structure 118, so that the mounting structure 116 and the limiting structure 118 are mutually reinforced, and the mounting stability of the electronic module B is further improved.
Referring to fig. 4, in some embodiments, the electronic module B inside the installation shell 11 is a power module 13, a boss 1113 adapted to the power module 13 is disposed at a position of the power module 13 on the base plate 111, and the power module 13 is disposed on the boss 1113, so that the top of the installed power module 13 can be attached to the top cover 112, on one hand, the installation of the power module 13 is more stable, and on the other hand, when the top cover 112 is made of metal, the top of the power module 13 contacts with the top cover 112, and heat dissipation can be performed through the top cover 112. In some embodiments, the limiting structure 118 and the mounting structure 116 are both connected to the outer side of the boss 1113 to form a whole, so that the power module 13 is fixed in all directions after the power module 13 is mounted, the fixing and limiting effect on the power module 13 is effectively improved, and the limiting structure 118 and the mounting structure 116 are both connected to the outer side of the boss 1113, so that the structural strength is improved.
Referring to fig. 8, 9, 10 and 11, since the electronic module B generates heat during operation, in order to meet the heat dissipation requirement of the electronic module B, in some embodiments, a plurality of heat dissipation holes 11d are formed on the side wall 1121 of the body 110 of the mounting case 11 at intervals, and when the internal electronic module B generates heat, the heat is dissipated outwards through air, so as to dissipate the heat of the electronic module B. The heat dissipation holes 11d are formed on at least one side wall 1121 of the installation shell 11, in some embodiments, the heat dissipation holes 11d are formed on at least two opposite side walls 1121 of the installation shell 11, so as to form an air flow passing through the installation cavity 11a, thereby effectively improving the heat dissipation effect; or the side walls 1121 except the side wall 1121 facing the user are provided with the heat radiation holes 11d, thereby improving the heat radiation effect and the aesthetic property of the mounting shell 11.
The side wall 1121 of the mounting case 11 is provided with a baffle 1122 for shielding the heat radiation hole 11d in a direction parallel to the side wall 1121, the baffle 1122 is provided at a position corresponding to the heat radiation hole 11d, and the projection of the baffle 1122 on the side wall 1121 of the mounting case 11 covers the heat radiation hole 11d, i.e., as seen from a direction perpendicular to the side wall 1121 (as shown by an arrow a in fig. 9), the heat radiation hole 11d is completely covered by the baffle 1122, by the shielding effect of the baffle 1122, thereby effectively preventing water or dust and the like from directly entering the mounting case 11, and reducing the possibility of damaging the electronic module B while achieving the heat radiation effect. For the mounting case 11 including the bottom plate 111 and the top cover 112, and the mounting case 11 provided with only the top cover 112, the heat radiation holes 11d are provided on the side wall 1121 of the top cover 112. The baffle 1122 may be integrally formed with the side wall 1121 to increase the strength of the overall structure, or may be fixedly attached to the side wall 1121 by means such as heat welding to facilitate control of the form thereof during the manufacturing process, thereby facilitating the production and assembly.
The baffle 1122 may be provided on the outer surface of the installation housing 11 or may be provided on the inner surface of the installation housing 11, and the baffle 1122 may be provided at an angle to the side wall 1121, and the baffle 1122 may be a straight plate, a bent plate (e.g., V-shaped plate, L-shaped plate, Y-shaped plate, W-shaped plate, etc.), or a bent plate (e.g., C-shaped plate, U-shaped plate, S-shaped plate, etc.), and the specific shape of the present application is not limited. The heat dissipation holes 11d are formed in the side wall 1121 of the mounting shell 11, so that the heat dissipation holes 11d are shielded by the baffles 1122 protruding from the surface of the side wall 1121, the number of the baffles 1122 is the same as that of the heat dissipation holes 11d, each baffle 1122 is respectively arranged on one side of the corresponding heat dissipation hole 11d, that is, the baffles 1122 and the heat dissipation holes 11d are sequentially arranged, an air guide channel 11f communicated with the heat dissipation holes 11d between the two baffles 1122 is formed between two adjacent baffles 1122, and the heat dissipation holes 11d serve as one opening of the air guide channel 11 f. The air guide channels 11f are curved or bent channels, or the openings at the two ends of the air guide channels 11f are distributed in a staggered manner, so that the heat dissipation holes 11d are shielded by the baffle 1122.
In some embodiments, the projection of the opening of the end of the air guide channel 11f far from the discrete thermal hole 11d on the side wall 1121 and the projection of the thermal hole 11d on the side wall 1121 have overlapping areas, that is, the projections of the openings of the two ends of the air guide channel 11f on the plane parallel to the side wall 1121 at least partially overlap. The projection of the baffle 1122 on the side wall 1121 covers the openings at both ends of the air guide passage 11f, thereby shielding the heat radiation holes 11d without changing the flow direction when the air enters the air guide passage 11f and leaves the air guide passage 11 f. In some embodiments, the cross section of the baffle 1122 is V-shaped, one side edge of the baffle 1122 is connected to one side of the corresponding heat dissipation hole 11d, the V-shaped baffles 1122 on both sides of the heat dissipation hole 11d form a V-shaped air guiding channel 11f, and the projection of the bent part of the V-shaped baffles 1122 on the side wall 1121 covers the opening of the end of the air guiding channel 11f away from the heat dissipation hole 11d and the corresponding heat dissipation hole 11d.
Referring to fig. 9, since the projections of the openings at both ends of the air guide channel 11f on the side wall 1121 are at least partially overlapped, and the baffle 1122 is disposed at one side edge of the heat dissipation hole 11d, for the heat dissipation hole 11d located in the middle, there are baffles 1122 on both sides, and only one side of one of the heat dissipation holes 11d located in the edge is provided with a baffle 1122, in order to ensure that the heat dissipation hole 11d can also form the air guide channel 11f and improve the waterproof effect, in some embodiments, the other side of the heat dissipation hole 11d located in the edge is provided with a baffle 1123 having the same shape as the baffle 1122, for example, the baffle 1122 has a V shape, and the baffle 1123 has a V shape accordingly.
In some embodiments, referring to fig. 10, the projection of the opening of the end of the air guiding channel 11f far away from the discrete thermal hole 11d on the side wall 1121 does not overlap with the projection of the thermal hole 11d on the side wall 1121, that is, the projections of the openings of the two ends of the air guiding channel 11f on the plane parallel to the side wall 1121 are distributed in a staggered manner. The projection of the baffle 1122 on the side wall 1121 covers only the heat dissipation hole 11d, and the opening of the air guide channel 11f at one end far from the discrete heat dissipation hole 11d is shielded by the remaining solid body of the side wall 1121. In some embodiments, the baffle 1122 is an L-shaped plate, one side edge of the L-shaped baffle 1122 is connected to one side of the corresponding heat dissipation hole 11d and is perpendicular to the side wall 1121 of the installation housing 11, the other end of the baffle 1122 and the side wall 1121 of the installation housing 11 form an opening of the air guide channel 11f, the plane of the opening is parallel to the side wall 1121 of the installation housing 11, and water enters the installation cavity 11a to contact the baffle 1122 from a relatively perpendicular angle, so that the blocking effect of the baffle 1122 on water entering the installation cavity 11a is improved. The bending plate with the angle is used for blocking water, so that the water blocking effect is improved.
In certain embodiments, the baffle 1122 is flush with the side wall 1121, with both the inner and outer surfaces of the side wall 1121 being planar. Referring to fig. 11, in some embodiments, a side wall 1121 of the installation shell 11 is provided with an installation opening 112a, the baffles 1122 are sequentially arranged in the installation opening 112a at intervals, so that heat dissipation holes 11d are formed between adjacent baffles 1122, channels formed between the baffles 1122 are air guide channels 11f, the baffles 1122 can be obliquely arranged and parallel to each other, so that the air guide channels 11f are parallel to each other, and projection of openings 11g on two sides of the air guide channels 11f on the side wall 1121 is staggered, namely, is blocked by the baffles 1122 and the side wall 1121 of the installation shell 11. In manufacturing, the inclined baffle 1122 may be provided in the mounting opening 112a to form the heat dissipation hole 11d, or the side wall 1121 of the mounting case 11 may be directly provided with a hole in an inclined direction to form the heat dissipation hole 11d, and the wall surface between the heat dissipation holes 11d is the baffle 1122, so that the whole structure is simpler and more convenient, and the cost is reduced. When the baffle 1122 is a linear inclined baffle 1122, the plurality of heat dissipation holes 11d may be formed in a shutter shape, or the baffle 1122 may be curved to form a curved air guide channel 11f, so long as the projections of the openings 11g on both sides of the air guide channel 11f on the side wall 1121 are offset, the baffle 1122 may shield the heat dissipation holes 11 d.
To achieve waterproofing of the heat dissipation hole 11d, referring to fig. 8, in some embodiments, a shroud 115 for shielding the heat dissipation hole 11d is provided on the body 110 of the mounting case 11 at a position above the heat dissipation hole 11d, the shroud 115 extends outward to shield the heat dissipation hole 11d in a direction perpendicular to the side wall 1121, and a projection of the shroud 115 on the side wall 1121 has an overlapping area with the heat dissipation hole 11 d. When water is sputtered to the body 110 of the installation shell 11 from the top or in a direction which forms a certain angle with the side wall 1121, the heat dissipation holes 11d are shielded by the enclosing plate 115, so that the water is effectively prevented from entering the installation cavity 11a from the heat dissipation holes 11d shielded below the enclosing plate 115, and the waterproof effect of the installation shell 11 is improved. The coaming 115 and the body 110 of the installation shell 11 may be in an integral structure, so as to improve structural strength and stability of the whole structure, or the coaming 115 may be fixedly installed on a side wall or a top plate of the body 110, so that the shape thereof is convenient to control during the processing, thereby being convenient for production and assembly.
In some embodiments, the shroud 115 may be a horizontal plate surface inclined with respect to the side wall 1121, and the shroud 115 may be a bent plate surface, where an edge of the shroud 115 away from one side of the body 110 is bent downward, so that the shroud 115 shields the heat dissipation holes 11d laterally, and the shielding effect of the shroud 115 is further improved. In some embodiments, the heat dissipation holes 11d are completely shielded by the shroud 115, i.e., the corresponding projection of the shroud 115 on the sidewall 1121 completely covers the heat dissipation holes 11d, further enhancing the water blocking effect of the heat dissipation holes 11 d.
In some embodiments, the cross section of the shroud 115 is L-shaped, one end of the shroud 115 is disposed at the top of the side wall 1121 of the body 110, the top surface of the shroud 115 is flush with the top surface of the body 110, the other end of the shroud 115 extends downward and is parallel to the side wall 1121 of the body 110, so as to shield the heat dissipation holes 11d, and two sides of the shroud 115 are disposed at the edge of the heat dissipation holes 11d in a blocking manner, so that a groove structure for completely shielding the upper part of the heat dissipation holes 11d is formed; the bottom end of the shroud 115 may extend downward to completely shield the heat dissipation hole 11d, that is, the projection of the shroud 115 on the side wall 1121 of the body 110 covers the heat dissipation hole 11d, so as to shield the heat dissipation hole 11d at the side surface, and a gap is left between the bottom end of the shroud 115 and the bottom surface of the body 110 for air flow to pass through, so that the shielding effect of the heat dissipation hole 11d at the side surface is further improved, and water is prevented from entering; meanwhile, when the air flow enters through the radiating holes 11d, the air flow is firstly shielded by the coaming 115 and then passes through the radiating holes 11d to form a bent air flow, so that dust or water drops in the air flow are shielded, and the shielding effect on the radiating holes 11d is further improved. In other embodiments, the bottom of the shroud 115 may be formed in other forms, such as an angle formed between an extension of the shroud 115 and the side wall 1121 to form an inclined surface inclined inward or outward in the vertical direction, or the cross section of the shroud 115 may be circular arc, so long as the projection of the shroud 115 on the main body covers the heat dissipation hole 11 d.
In some embodiments, the shroud 115 may not be provided at a position where the heat radiation hole 11d is not provided; in other embodiments, a circle of coaming 115 may be disposed along the circumference of the body 110, so as to maximize the shielding effect of the coaming 115. The shroud 115 and the baffle 1122 may be alternatively arranged, and considering that the power amplifier board 121, the power panel 131 and other circuit boards have more components 1211, the baffle 1122 or the shroud 115 is only limited in water blocking effect, in some embodiments, the baffle 1122 and the shroud 115 are simultaneously arranged on the side wall 1121, the shroud 115 is located outside the side wall 1121, and the baffle 1122 is located inside the side wall 1121 or inside the side wall 1121, so that the water blocking effect of the heat dissipation holes 11d is further improved.
Example 2:
based on the same inventive concept, an embodiment of the present application provides a radio frequency generating device, referring to fig. 1 and 2, a radio frequency generating device 10 includes a mounting case 11 of the above embodiment 1, a power amplifier module 12 for generating a radio frequency signal after power amplification, and a power module 13 for amplifying the radio frequency signal 12 after power amplification. The power amplifier module 12 includes a power amplifier board electrically connected to a power board of the power module 13. The power amplification board 121 generally includes a signal source and a power amplification circuit, which are electrically connected, where the signal source is used to generate an initial signal with a set frequency (e.g. 40.68 MHz), and the power amplification circuit is used to power amplify the initial signal, enhance the power of the initial signal, and output a radio frequency signal after power amplification. The power module 13 is internally provided with an ac/dc conversion circuit and a voltage regulating circuit, and is used for performing ac/dc conversion and voltage regulation to provide low-voltage dc power supply.
The power amplifying circuit can adopt primary amplification, secondary amplification and tertiary amplification or more according to actual needs, and the application is not limited. The signal source and the power amplifying circuit may be selectively disposed on the same surface of the power amplifying board 121, or may be disposed on the first surface 121a and the second surface 121b, which is not limited by the specific arrangement mode of the present application. In some embodiments, the components 1211 (chips, inductors, capacitors, resistors, etc.) on the power amplification board 121 are located on the first surface 121a, that is, each component 1211 of the signal source and the power amplification circuit is mounted on the front surface of the power amplification board 121, the back surface of the power amplification board 121 is mainly a soldering leg, a soldering wire, etc. of a pin, and the second surface 121b of the power amplification board 121 contacts the heat dissipation element 122 for heat transfer.
In some embodiments, referring to fig. 16, 17 and 18, the power amplifying circuit adopts a second-stage amplifying circuit, which includes a first-stage driver and a second-stage power amplifying circuit, the signal source, the first-stage driver and the second-stage power amplifying circuit are electrically connected in sequence, the first-stage driver and the second-stage power amplifying circuit amplify the initial signal sent by the signal source step by step, and the second-stage power amplifying circuit outputs the amplified signal. The specific circuit structures of the primary driver and the secondary power amplifying circuit can refer to related disclosures in the prior art, and the application is not limited. In some embodiments, the power amplification board 121 is further provided with a detection circuit, and the detection circuit, the signal source and the power amplification circuit are disposed on the same circuit board. In other embodiments, the detection circuit and the signal source and the power amplification circuit may be provided on different circuit boards. The detection circuit is used for detecting the output power of the radio frequency signal after power amplification and feeding back the output power to the control board. If the load connected to the power amplification board 121 is provided with a tuning board, the detection circuit is further used for detecting the reflected power reflected by the tuning module and feeding back to the control board.
The radio frequency generating device 10 is controlled by a control system (e.g. MCU controller) on a control board when in operation, the control board is electrically connected with the power module 13 and the power amplifier module 12, the control board is electrically connected with an external input device (display screen, operation panel, keyboard, etc.), receives an operation instruction sent by a user, and controls circuits in the power module 13 and the power amplifier module 12 to work. When the output power of the power amplifier module 12 needs to be regulated, the control board calculates a voltage regulation control instruction based on an internal algorithm and sends the voltage regulation control instruction to the power module 13, and the power module 13 regulates the voltage to change the output voltage of the power module 13. For the power amplification board 121 provided with the detection circuit, the control board is electrically connected with the detection circuit, the detection circuit detects the output power of the power amplification module 12 and feeds back to the control module, and the control module performs relevant control on the signal source, the power amplification circuit and the power supply module 13 through an internal algorithm.
In some embodiments, the functions of the control board are integrated on the device on which the rf generator 10 is mounted, such as a refrigerator in which the rf generator 10 is configured, and the functions of the control board may be integrated on a main control board of the refrigerator. In some embodiments, the control board is a circuit board which is separately arranged, the control board exists independently of the power module 13 and the power amplifier module 12 to form a control module, under the arrangement scheme, the installation positions of the power amplifier module 12, the power module 13 and the control module can be set according to actual needs, the power amplifier module 12 is arranged in the installation cavity 11a of the installation shell 11 and is fixedly connected with the installation shell 11, and the power module 13 and the control module can be selectively arranged in the installation shell 11 or on the equipment main body of the equipment carried by the radio frequency generating device 10. Taking a refrigerator provided with a radio frequency thawing device as an example, a radio frequency generating device 10 is arranged in the radio frequency thawing device, a mounting shell 11 with a built-in power amplifier module 12 can be selectively arranged inside or outside a refrigerator main body of the refrigerator, a power module 13 can be selectively arranged in the mounting shell 11, or positioned outside the mounting shell 11 and inside the refrigerator main body, and a control module can be selectively arranged in the mounting shell 11, or positioned outside the mounting shell 11 and inside the refrigerator main body.
In other embodiments, the control board and the power amplifier board 121 may be integrated on the same circuit board, as shown in fig. 18. In this embodiment, since the power amplifier module 12 generates a high-frequency signal, it is easy to interfere with the control system drawn on the same electronic control board, and thus, it is necessary to perform internal structural shielding according to the actual layout, that is, the shielding case only covers the relevant components 1211 of the power amplifier board 121 to perform electromagnetic shielding, and the structural design and installation of the shielding case are relatively complex and have high cost. Meanwhile, since the power amplifier board 121 needs to be designed by using a multi-layer board, and a PCB high-frequency board with higher cost must be adopted, and the material of the control board for the board is generally unlimited, integrating the control board and the power amplifier board 121 on the same circuit board can result in that the whole board needs to use the PCB high-frequency board, so that the overall cost of the radio frequency generating device 10 is increased. In addition, the heat source of the whole radio frequency generating device 10 is mainly in the power amplifier module 12, the control board and the power amplifier board 121 are drawn on the same circuit board, and the heat generated by the power amplifier board 121 causes the control system to be heated, so that the reliability of the whole radio frequency generating device 10 is affected.
In other embodiments, the control board is integrated with the power module 13 on the same circuit board, as shown in fig. 19. In this embodiment, since the control board is integrated with the power module 13 and the same circuit board, the power amplifier board 121 and the control board are all independently arranged, and only the power amplifier board 121 adopts a PCB high-frequency board, the consumption of the PCB high-frequency board is minimum, and the independent control module only needs to adopt a common low-cost material, so that the cost is reduced. Meanwhile, the power amplification plate 121, the control plate and the power module 13 are all independently arranged, the power amplification module 12 does not need to carry out special shielding design on the shielding cover according to the internal layout of the circuit board, only a simple outer cover shielding power amplification plate 121 is needed to be designed, and the design complexity and cost are reduced. Meanwhile, as the power amplification plate 121, the control plate and the power module 13 are arranged independently, heat insulation is carried out through air in installation, heat radiation of the power amplification module 12 to the control module is greatly reduced, and reliability of the whole radio frequency generating device 10 is improved.
Referring to fig. 12 and 13, the power amplifier module 12 includes a power amplifier board 121, a heat dissipation member 122 and a blower assembly 123, wherein the power amplifier board 121 is used for generating a radio frequency signal after power amplification, the heat dissipation member 122 is disposed on the power amplifier board 121, and the heat dissipation member 122 is selectively connected and fixed with the power amplifier board 121 or only contacts with the power amplifier board 121. The heat sink 122 is provided with an air flow passage 122a, and heat of the heat sink 122 can be taken away when wind flows through the air flow passage 122 a. The air blowing assembly 123 is configured to blow air into the air flow channel 122a to dissipate heat of the power amplification board 121, and the air blowing assembly 123 includes an air blowing device 1231 and an air duct 1232, wherein the air blowing device 1231 is configured to generate air flow, and the air duct 1232 is configured to communicate the air blowing device 1231 with the heat dissipation component 122. Specifically, the air duct 1232 has a first opening 1234 and a second opening 1235 that are disposed opposite to each other, the first opening 1234 is communicated with the air blowing opening 1231a of the air blowing device 1231, the second opening 1235 is communicated with the air flow channel 122a of the heat dissipation member 122, and the air flow generated by the air blowing device 1231 enters the air flow channel 122a through the air duct 1232, so that the heat dissipation member 122 is dissipated by forced convection.
When in use, the heat dissipation element 122 is in contact with the power amplification plate 121, and the heat of the power amplification plate 121 is conducted to the heat dissipation element 122. The wind flow generated by the blowing device 1231 enters the airflow channel 122a through the air duct 1232, forced convection dissipates heat of the heat dissipation part 122, and the heat dissipation part 122 further dissipates heat of the power amplification plate 121, so that the temperature of the power amplification plate 121 is effectively reduced, and the safety and reliability of products are improved. Due to the arrangement of the air duct 1232 and the heat dissipation member 122 having the air flow channel 122a, the air flow generated by the air blowing device 1231 can all enter the air flow channel 122a, the air volume utilization rate is high, and the heat dissipation requirement of the power amplification plate 121 can be met with smaller power and flow.
Referring to fig. 12 and 13, in the power amplification module 12 provided by the present application, the size of the second opening 1235 of the air duct 1232 in the width direction of the power amplification board 121 is larger than the size of the first opening 1234 in the width direction of the power amplification board 121. That is, the air duct 1232 adopts a flaring design, and along the flow direction of the wind flow, the size of the inner cavity of the air duct 1232 in the width direction of the power amplification plate 121 tends to increase, and specifically, linear increase, nonlinear increase or gradient increase can be adopted. To reduce wind resistance, in some embodiments, the projection of the air duct 1232 on the plane parallel to the power amplification plate 121 is trapezoidal, and the shapes of the first opening 1234 and the second opening 1235 are respectively adapted to the shape of the air blowing opening 1231a of the air blowing device 1231 and the inlet shape of the air flow channel 122a of the heat dissipation member 122.
Because the second opening 1235 of the air duct 1232 is larger than the first opening 1234 in the width direction of the power amplification plate 121, the air flow is increased in the width direction of the power amplification plate 121 in the process of flowing from the first opening 1234 to the second opening 1235 of the air duct 1232, and the air flow can be matched with a heat dissipation device, so that the air flow is blown across the whole width of the power amplification plate 121, and the heat dissipation efficiency is further improved. In addition, the air duct 1232 can also realize the adaptation of the shapes of the air blowing device 1231 and the opening 11g of the heat dissipation member 122, so that the requirement on the shape selection of the air blowing device 1231 is reduced. The blowing device 1231 may be a fan, or the like capable of generating a wind flow, and the present application is not limited thereto. In some embodiments, to further meet the miniaturization requirements of the device, the blower 1231 employs an axial flow fan.
The heat dissipation element 122 and the power amplification board 121 conduct heat, and the heat dissipation element 122 is required to have good heat conductivity, and the heat conductivity of metal and ceramic can be achieved, so that the material and shape of the heat dissipation element 122 are not limited. In some embodiments, the heat dissipation element 122 is made of metal, and may be aluminum, iron, or other metals or alloys thereof, and aluminum is preferred in view of light weight.
In order to satisfy the installation and heat dissipation of the power amplifier board 121, referring to fig. 12 and 13, the heat dissipation member 122 includes a metal plate 1221 and a plurality of heat dissipation fins 1222, the heat dissipation fins 1222 are distributed on one surface of the metal plate 1221, the heat dissipation fins 1222 are spaced apart such that gaps between the heat dissipation fins 1222 form an air flow channel 122a, and the specific number and spacing of the heat dissipation fins 1222 are determined according to the heat dissipation requirement of the power amplifier board 121, which is not limited by the present application. In certain embodiments, the metal plate 1221 is integrally formed with the heat dissipating fins 1222. The metal plate 1221 has a large mounting surface 1221a, the power amplification plate 121 is mounted on the mounting surface 1221a of the metal plate 1221 by the fastener 127, and the power amplification plate 121 is at least partially in contact with the metal plate 1221.
Because the metal is conductive, in order to ensure that the power amplification board 121 and the metal board 1221 are fully contacted as much as possible, referring to fig. 12 and 13, in some embodiments, a plurality of avoidance blind holes 122b are provided on the mounting plane 1221a of the metal board 1221, the number and positions of the avoidance blind holes 122b completely correspond to the number and distribution of conductors (pins, soldering tin parts, wires, etc. of the components 1211) of the power amplification board 121, and the size of the avoidance blind holes 122b is larger than that of the corresponding conductors on the power amplification board 121, so that the conductors extend into the avoidance blind holes 122b and are not contacted with the metal board 1221, thereby ensuring that the power amplification board 121 and the metal board 1221 are tightly attached, the contact area is larger, which is beneficial to heat dissipation, and the overall structure of the power amplification board 121 is more stable. The avoidance blind hole 122b is designed as a blind hole, so that the problem of leakage caused by contact between the conductor and water due to the design as the through hole 132a can be avoided.
The structural strength of the heat sink 122 is higher than that of the power amplification board 121, and thus the heat sink 122 simultaneously serves as a mounting base of the power amplification board 121. In some embodiments, at least two lugs 1223 are disposed on the metal plate 1221, where the lugs 1223 may be disposed on a bottom surface or a side surface of the metal plate 1221 according to actual needs, and fixing holes for installing the fasteners 127 are disposed in the lugs 1223, and the fixing holes may be holes or threaded holes, and the fasteners 127 may be screws, rivets, pins, or other structures, which is not limited by the present application.
The power amplification board 121 is a circuit board structure, and has a first surface 121a and a second surface 121b that are disposed opposite to each other, hereinafter also referred to as a first surface 121a of the power amplification board 121 is a front surface, and a second surface 121b of the power amplification board 121 is a back surface. The power amplification board 121 generally includes a signal source and a power amplification circuit, which are electrically connected, where the signal source is used to generate an initial signal with a set frequency (e.g. 40.68 MHz), and the power amplification circuit is used to power amplify the initial signal, enhance the power of the initial signal, and output a radio frequency signal after power amplification. The signal source and the power amplifying circuit may be selectively disposed on the same surface of the power amplifying board 121, or may be disposed on the first surface 121a and the second surface 121b, which is not limited by the specific arrangement mode of the present application. In some embodiments, the components 1211 (chips, inductors, capacitors, resistors, etc.) on the power amplification board 121 are located on the first surface 121a, that is, each component 1211 of the signal source and the power amplification circuit is mounted on the front surface of the power amplification board 121, the back surface of the power amplification board 121 is mainly a soldering leg, a soldering wire, etc. of a pin, and the second surface 121b of the power amplification board 121 contacts the heat dissipation element 122 for heat transfer.
Referring to fig. 12 and 13, the power amplifier module 12 is further provided with a power amplifier shielding cover 124, where the power amplifier shielding cover 124 is made of a metal material and covers the first surface 121a of the power amplifier board 121 to electromagnetically shield the component 1211 on the power amplifier board 121. In some embodiments, the power amplifier shielding cover 124 is only covered on the power amplifier board 121, and specifically, the power amplifier shielding cover 124 and the power amplifier board 121 are both installed on the heat dissipation element 122 through fastener 127. In other embodiments, the power amplifier shielding cover 124 may be further configured to cover the power amplifier board 121 and the heat dissipation member 122, or cover the power amplifier board 121, the heat dissipation member 122, the blower 1231, and the air duct 1232, which is not limited by the present application.
In some embodiments, referring to fig. 14, the power module 13 includes a power supply housing 132 and a power supply board 131 disposed in the power supply housing 132, the power supply housing 132 protecting the power supply board 131. Considering that there is a gap between the power supply housing 132 and the power supply board 131, the power supply board 131 and the power supply housing 132 conduct heat only through air, so that the heat dissipation effect is poor, and the service life of the power supply board 131 may be affected, in some embodiments, referring to fig. 15, the power supply housing 132 is filled with a heat-conducting insulating glue 133, the heat-conducting insulating glue 133 is in contact with both the power supply board 131 and the power supply housing 132, and the heat-conducting insulating glue 133 is wrapped around a component 1311 on the power supply board 131.
Specifically, the heat-conducting insulating glue 133 is arranged in the power module 13, the heat-conducting insulating glue 133 is arranged between the power panel 131 and the power shell 132 of the power module 13, the heat-conducting insulating glue 133 can completely fill the gap between the power panel 131 and the power shell 132, and can also only partially fill the gap, so that components with larger heat generation capacity on the power panel are wrapped. On the one hand, the heat conducting insulating glue 133 is filled to prevent water, insects and the like outside the power module 13 from entering the power module 13 to erode the components 1311 on the power panel 131 so as to play a waterproof and insect-proof effect, and on the other hand, the heat generated by the components 1311 on the power panel 131 can be conducted to the power shell 132 through the heat conducting insulating glue 133 so as to improve the heat dissipation effect of the power module 13. In addition, the heat conductive insulating paste 133 wraps the component 1311 on the power board 131, and heat dissipation uniformity of the component 1311 can be improved. Thereby improving the reliability and safety of the power module 13 as a whole.
The heat conductive insulating glue 133 may be filled between the power panel 131 and the power supply housing 132 in a flowing state, and in some embodiments, the heat conductive insulating glue 133 may be a soft glue and placed inside the power supply housing 132. In some embodiments, in order to ensure the adhesion degree of the heat conductive insulating glue 133 with the power panel 131 and the power supply housing 132, poor contact is avoided, and the heat dissipation effect is affected, so that a glue filling manner is adopted, and therefore, a through hole needs to be provided on the power supply housing 132 as a glue filling hole.
In some embodiments, the power supply housing 132 is provided with a plurality of through holes 132a for heat dissipation of the power supply board 131, and the through holes 132a can also be used as glue filling holes for glue filling through the through holes 132a on the power supply module 13, so that the bonding degree of the heat conducting insulating glue 133 with the power supply board 131 and the power supply housing 132 is improved, and the heat dissipation effect of the power supply module 13 is ensured to a certain extent. After the heat conductive insulating glue 133 is filled, the through hole 132a is blocked, so that the contact area between the heat conductive insulating glue 133 and the power supply housing 132 is increased. In order to improve the heat dissipation effect of the power module, the power housing 132 is made of metal.
In addition to providing heat dissipation by the heat conductive insulating glue 133, in some embodiments, the heat dissipation of the power module 13 may be achieved by a blower device disposed in the mounting shell 11, for example, the blower device is disposed in the mounting shell 11, and meanwhile, the heat dissipation hole 11d is disposed on the mounting shell 11, so that the heat dissipation hole 11d of the mounting shell 11 is located in the flow direction of the air flow generated by the blower device, thereby achieving the heat dissipation and cooling of the whole power module 13. In order to further improve the heat dissipation effect of the power module 13, in some embodiments, a plurality of heat dissipation holes 11d are formed on the side wall 1121 of the body 110 of the mounting shell 11 at intervals, and when the internal power module 13 generates heat, the heat is dissipated outwards through air, so as to achieve heat dissipation of the power module 13. The heat dissipation holes 11d are formed on at least one side wall 1121 of the installation shell 11, in some embodiments, the heat dissipation holes 11d are formed on at least two opposite side walls 1121 of the installation shell 11, so as to form an air flow passing through the installation cavity 11a, thereby effectively improving the heat dissipation effect; or the side walls 1121 except the side wall 1121 facing the user are provided with the heat radiation holes 11d, thereby improving the heat radiation effect and the aesthetic property of the mounting shell 11.
Referring to fig. 6 and 7, in some embodiments, the power module 13 and the power amplifier module 12 are disposed in the mounting cavity 11a of the mounting case 11, and the control module is external, or the control board is integrated with the power board 131 or the power amplifier board 121. The installation shell 11 is provided with two wire passing holes, namely a strong current threading hole 11m and a weak current threading hole 11n, wherein the strong current threading hole 11m and the weak current threading hole 11n are distributed at intervals and are communicated with the installation cavity 11 a. The power amplifier module 12 is provided with only the weak current harness 17, and is used for supplying power to the power amplifier board 121 and the blowing device 1231, outputting the radio frequency signal and the detection signal after power amplification, and receiving the control instruction of the control board. Referring to fig. 7, the power amplifier module 12 is disposed in the mounting cavity 11a and far away from the strong electric threading hole 11m, and the power module 13 is disposed in the mounting cavity 11a and near the strong electric threading hole 11m, i.e. the power module 13 is closer to the strong electric threading hole 11m than the power amplifier module 12. The strong current and the weak current are separated to form the wiring, so that the discharge risk of the radio frequency generating device 10 is reduced, the reliability of electromagnetic shielding is improved, the safety requirements are met, and the safety reliability of the radio frequency generating device 10 is improved.
Example 3:
based on the same inventive concept, referring to fig. 19, 20 and 21, an embodiment of the present application provides a radio frequency thawing apparatus, which includes a radio frequency thawing assembly 30 and the radio frequency generating device 10 of the above embodiment 2. The rf thawing assembly 30 is provided with a tuning plate and a polar plate, the tuning plate is electrically connected with a tuning inductor, and the tuning inductor is selectively arranged on the tuning plate or independent from the tuning plate. The tuning plate is electrically connected with the power amplification plate 121 of the radio frequency generating device 10, the tuning module is used for balancing the impedance of the load end so as to realize impedance matching, and the polar plate is electrically connected with the tuning plate and is used for transmitting radio frequency signals with set frequencies. The signal output by the power amplification module 12 is a radio frequency signal corresponding to the standard load after power amplification, and the tuning module is used for adjusting the impedance of the load end. The different unfreezed substances have different impedances, the impedance of the drawer is not the standard load impedance, the load impedance changes in the unfreezing process, the impedance matching is realized through the tuning module, the impedance matching is equivalent to the standard load, the control module controls the tuning module to perform the impedance matching, the tuning module outputs a signal to the polar plate, and the polar plate sends out a radio frequency signal, so that the food material unfreezing purpose is realized.
The rf thawing assembly 30 further comprises a shield cylinder 31 having an open end 31a with an opening and a shield door 32, the shield door 32 being provided at the open end 31a of the shield cylinder 31 for closing the opening to form a closed shield cavity with the shield cylinder 31. The tuning plate and the polar plate are arranged in the shielding cylinder 31, the shielding cylinder 31 can provide a mounting foundation for the tuning plate and the polar plate, the purpose of protecting the tuning plate and the polar plate can be achieved, radio frequency signals emitted by the polar plate can be shielded, and radio frequency signal leakage is avoided.
In some embodiments, a tuning cavity 31e and a thawing cavity 31f are provided in the shielding cylinder 31, the tuning plate and the polar plate are both provided in the tuning cavity 31e, the thawing cavity 31f is used for containing food to be thawed, and the polar plate radiates radio frequency energy into the thawing cavity 31f, so that the food in the thawing cavity 31f is thawed. The tuning plate and the polar plate are placed separately from the food material, so that on one hand, pollution to the food material is avoided, and on the other hand, water melted after thawing the food material is prevented from contacting the tuning plate and the polar plate, and damage to the component 1211 is avoided.
In some embodiments, the shielding cylinder 31 is further provided with an air inlet 31c and an air outlet 31d that are in communication with the tuning cavity 31e, and the air inlet 31c and the air outlet 31d may be disposed on the same side wall 1121 of the shielding cylinder 31, or may be disposed on different side walls 1121, which is not limited in this application.
Example 4:
based on the same inventive concept, referring to fig. 19, 20 and 21, an embodiment of the present application provides a refrigerator 100 including a refrigerator main body 20 and the radio frequency thawing apparatus of embodiment 3 described above. The radio frequency generating device 10 of the radio frequency thawing device is disposed inside or outside the refrigerator main body 20, and the specific structure thereof is described in the above embodiment 3, and will not be repeated here. The radio frequency thawing assembly 30 of the radio frequency thawing device is disposed in the refrigerator main body 20, specifically, the refrigerator main body 20 is provided with an installation cavity 21, the radio frequency thawing assembly 30 is disposed in the installation cavity 21, and the specific structure of the radio frequency thawing device is described in reference to embodiment 3 and will not be repeated here. The installation cavity 21 is located in one of the freezing chamber, the refrigerating chamber, and the temperature changing chamber of the refrigerator 100, and the present application is not limited.
In some embodiments, the rf generating device 10 is disposed outside the refrigerator main body 20, and the rf generating device 10 may be disposed on the top, back or side of the refrigerator main body 20, which is not limited by the present application. In some embodiments, the rf generating device 10 is located on the top surface of the refrigerator main body 20, the mounting case 11 of the rf generating device 10 is connected to the U-shaped case on the top of the refrigerator main body 20 through the fixing member 18, and when the mounting case 11 includes the bottom plate 111 and the top cover 112, both the electronic module and the top cover 112 are mounted on the bottom plate 111, and the bottom plate 111 is mounted on the top surface of the U-shaped case through the fixing member 18. In some embodiments, the mounting housing 11 includes only a top cover 112, the electronic module is mounted on an inner surface of the top wall 1124 of the top cover 112, and the top cover 112 is flip-off mounted to the top surface of the U-shaped housing by the fastener 18.
In some embodiments, the shielding cylinder 31 of the rf thawing assembly 30 is further provided with an air inlet 31c and an air outlet 31d that are in communication with the tuning cavity 31e, and the air inlet 31c and the air outlet 31d may be disposed on the same side wall 1121 of the shielding cylinder 31 or may be disposed on different side walls 1121, which is not limited in this disclosure. The side wall 1121 provided with the air inlet 31c and the air outlet 31d and the mounting cavity 21 have a gap a therebetween, so that the air circulation is formed between the air inlet 31c and the air outlet 31d and the gap a between the side wall 1121 provided with the air inlet 31c and the air outlet 31d and the mounting cavity 21, and the heat dissipation is performed on the tuning cavity 31 e.
In some embodiments, the refrigerator 100 further includes a wind flow accelerator 40, and the wind flow accelerator 40 accelerates cool wind into the tuning cavity 31e through the gap a and the wind inlet 31c to accelerate air circulation, thereby improving heat dissipation efficiency.
In the present application, unless expressly stated or limited otherwise, a first feature "above" or "below" a second feature may include both the first and second features being in direct contact, as well as the first and second features not being in direct contact but being in contact with each other through additional features therebetween. Moreover, a first feature being "above," "over" and "on" a second feature includes the first feature being directly above and obliquely above the second feature, or simply indicating that the first feature is higher in level than the second feature. The first feature being "under", "below" and "beneath" the second feature includes the first feature being directly under and obliquely below the second feature, or simply means that the first feature is less level than the second feature.
In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise" indicate orientations or positional relationships are based on the orientations or positional relationships shown in the drawings, are merely for convenience in describing the present application and simplify the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and therefore should not be construed as limiting the present application.
It should be noted that all the directional indicators in the embodiments of the present application are only used to explain the relative positional relationship, movement conditions, etc. between the components in a specific posture, and if the specific posture is changed, the directional indicators are correspondingly changed.
In the present application, unless specifically stated and limited otherwise, the terms "connected," "affixed," and the like are to be construed broadly, and for example, "affixed" may be a fixed connection, a removable connection, or an integral body; can be mechanically or electrically connected; either directly or indirectly, through intermediaries, or both, may be in communication with each other or in interaction with each other, unless expressly defined otherwise. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art according to the specific circumstances.
Furthermore, descriptions such as those referred to as "first," "second," and the like, are provided for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implying an order of magnitude of the indicated technical features in the present disclosure. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more features. In the description of the present application, the meaning of "a plurality" is two or more, unless explicitly defined otherwise.
In the description of the present specification, a description referring to terms "one embodiment," "some embodiments," "examples," "specific examples," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present application. In this specification, schematic representations of the above terms are not necessarily directed to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Further, one skilled in the art can engage and combine the different embodiments or examples described in this specification.
In addition, the technical solutions of the embodiments may be combined with each other, but it is necessary to base that the technical solutions can be realized by those skilled in the art, and when the technical solutions are contradictory or cannot be realized, the combination of the technical solutions should be considered to be absent and not within the scope of protection claimed in the present application.
While embodiments of the present application have been shown and described, it will be understood by those of ordinary skill in the art that: many changes, modifications, substitutions and variations may be made to the embodiments without departing from the spirit and principles of the application, the scope of which is defined by the claims and their equivalents.
Claims (14)
1. A mounting case, comprising:
the edge of the bottom plate is provided with a surrounding edge, the bottom plate is provided with more than two hollowed holes, and the more than two hollowed holes are distributed at intervals along the edge of the bottom plate and are all positioned in an area surrounded by the surrounding edge;
the top cover is covered on the bottom plate, and a mounting cavity which is used for accommodating the electronic module and is communicated with the hollowed-out hole is formed by surrounding the top cover and the bottom plate; along the periphery of bottom plate, the top cap with the surrounding edge all has the overlap region in the direction of height.
2. The mounting shell of claim 1, wherein: the base plate is provided with a water retaining structure, the water retaining structure is positioned in an area surrounded by the surrounding edge, the water retaining structure is surrounded by a water retaining area, and the electronic modules are all positioned in the water retaining area; the hollowed-out hole is positioned between the water retaining structure and the surrounding edge.
3. The mounting shell of claim 2, wherein: the base plate is provided with a mounting structure for mounting the electronic module, and the mounting structures are all located in the water blocking area.
4. A mounting shell according to claim 3, wherein: the mounting structure comprises more than two mounting columns arranged at intervals, mounting holes are formed in the mounting columns, and the electronic module is mounted on the mounting columns through fixing pieces arranged in the mounting holes.
5. A mounting shell according to claim 3, wherein: a limiting structure is arranged in the mounting shell, and the limiting structure defines a limiting area for limiting the electronic module; the limiting structure is located on the inner side of the area surrounded by the mounting structure.
6. The mounting shell of claim 2, wherein: the side wall of the top cover is provided with a through radiating hole, and the projection of the side wall of the top cover on the bottom plate is positioned outside the water retaining area.
7. The mounting shell of claim 6, wherein: the installation shell is provided with a coaming, the coaming is connected to the installation shell and is positioned outside the installation cavity, the joint of the coaming and the installation shell is positioned above the heat dissipation hole, and the projection of the coaming on the side wall is provided with an overlapping area with the heat dissipation hole;
and/or a baffle corresponding to the heat dissipation hole is arranged on the side wall provided with the heat dissipation hole; and the projection of the baffle plate on the side wall covers the corresponding radiating hole.
8. The mounting shell of any one of claims 1-7, wherein: the top cover is positioned in the area surrounded by the surrounding edge; the top cover is in contact with the surrounding edge.
9. A radio frequency generating device, comprising:
the mounting shell of any one of claims 1-8;
the power amplification module is arranged in the mounting cavity and connected with the bottom plate and used for generating a radio frequency signal after power amplification;
the power module is arranged in the mounting cavity and connected with the bottom plate, and is used for supplying power to the power amplifier module;
the power amplifier module and the power module are far away from the surrounding edge compared with the hollowed-out hole, and the projection of the power amplifier module and the power module on the bottom plate is not overlapped with the hollowed-out hole.
10. The radio frequency generating device according to claim 9, wherein: the power amplifier module comprises:
the power amplification plate is provided with a first surface and a second surface which are arranged in a back-to-back manner;
the power amplifier shielding cover is covered on the first surface of the power amplifier board;
the radiating piece is arranged on the second surface of the power amplification plate and connected with the mounting shell, and the radiating piece is provided with an airflow channel;
the air blowing assembly is provided with an air outlet which is communicated with the air flow channel of the heat radiating piece.
11. The radio frequency generating device according to claim 10, wherein: the air blowing assembly includes:
a blowing device for generating a wind flow;
the air duct is provided with a first opening and a second opening which are oppositely arranged, the first opening is communicated with a blowing opening of the blowing device, the second opening is communicated with an airflow channel of the radiating piece to form the air outlet, and the size of the second opening in the width direction of the power amplification plate is larger than that of the first opening.
12. The radio frequency generating device according to any of claims 9-11, wherein: the power module comprises a power supply shell and a power panel arranged in the power supply shell, and the power supply shell is connected with the mounting shell.
13. A radio frequency thawing device, comprising: a radio frequency thawing assembly and a radio frequency generating device as defined in any one of claims 9-12; the radio frequency thawing assembly comprises:
a shielding cylinder provided with an opening end with an opening;
the shielding door is arranged at the opening end of the shielding cylinder body and is used for closing the opening;
the tuning plate is arranged in the shielding cylinder body and is electrically connected with the power amplification plate of the radio frequency generating device;
and the polar plate is arranged in the shielding cylinder body, is electrically connected with the tuning plate and is used for transmitting radio frequency signals.
14. A refrigerator, comprising:
a refrigerator main body;
the rf thawing device as defined in claim 13, wherein the rf thawing assembly is disposed inside the refrigerator body, and the rf generating device is disposed inside or outside the refrigerator body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223373630.2U CN219938661U (en) | 2022-12-15 | 2022-12-15 | Mounting shell, radio frequency generating device, radio frequency thawing device and refrigerator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223373630.2U CN219938661U (en) | 2022-12-15 | 2022-12-15 | Mounting shell, radio frequency generating device, radio frequency thawing device and refrigerator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219938661U true CN219938661U (en) | 2023-10-31 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202223373630.2U Active CN219938661U (en) | 2022-12-15 | 2022-12-15 | Mounting shell, radio frequency generating device, radio frequency thawing device and refrigerator |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219938661U (en) |
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2022
- 2022-12-15 CN CN202223373630.2U patent/CN219938661U/en active Active
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