CN219536660U - Power module assembly, radio frequency generating device, radio frequency thawing device and refrigerator - Google Patents

Abstract

The application discloses a power module assembly, a radio frequency generating device, a radio frequency thawing device and a refrigerator, and solves the technical problem that an existing power module is poor in installation stability. The power module assembly includes: the mounting shell comprises a bottom plate and a top cover covered on the bottom plate, and the top cover and the bottom plate are encircled to form a mounting cavity; the power module is arranged in the mounting cavity and is used for supplying power; and the elastic piece is arranged between the bottom plate and the power supply module so as to enable the power supply module to be in contact with the top cover. The elastic piece is arranged to enable the power module to be in contact with the top cover, the power module is fixed together by the elastic piece and the top cover, the installation stability is guaranteed, and the elastic piece can also play a role in damping the power module in the transportation process. And when the top cover is the metal material, because power module is contacted with the top cover all the time under the effect of elastic component, through the good heat conductivility of metal, with power module's heat transfer to outside to realize the heat dissipation to power module, effectively improved the radiating effect to power module.

Description

Power module assembly, radio frequency generating device, radio frequency thawing device and refrigerator

Technical Field

The utility model belongs to the technical field of power supplies, and particularly relates to a power supply module assembly, a radio frequency generating device, a radio frequency thawing device and a refrigerator.

Background

The refrigerator is a common refrigeration device, and a power module is arranged in the refrigerator and is used for connecting with the mains supply and regulating the voltage of the mains supply to the voltage required by the electrical equipment in the refrigerator.

The power module is installed in the shell, the shell is connected with the refrigerator main body, and in the processes of power module production, assembly or transportation and the like, the power module is easy to shake or fall off when knocked and installed and impacted due to the fact that the power module has a certain weight, and therefore the installation stability is poor.

Disclosure of Invention

The utility model provides a radio frequency generating device and a radio frequency thawing refrigerator, which aim to solve the technical problem of poor installation stability of a current power supply module.

The utility model adopts a technical scheme that: there is provided a power module assembly comprising:

the mounting shell comprises a bottom plate and a top cover covered on the bottom plate, and the top cover and the bottom plate are surrounded to form a mounting cavity;

the power module is arranged in the mounting cavity and used for supplying power;

the elastic piece is arranged between the bottom plate and the power supply module, and generates thrust pointing to the top cover for the power supply module so as to enable the power supply module to be in contact with the top cover.

The elastic piece is arranged to enable the power module to be in contact with the top cover, the power module is fixed together by the elastic piece and the top cover, the installation stability is guaranteed, and the elastic piece can also play a role in damping the power module in the transportation process. In addition, when the top cap is the metal material, because power module is contacted with the top cap all the time under the effect of elastic component, through the good heat conductivility of metal, with power module's heat transfer to outside to the realization has effectively improved power module's radiating effect to power module's heat dissipation.

In some embodiments, one of the base plate and the power module is provided with a guide post, and the other is provided with a guide hole, and the guide post can movably extend into the guide hole.

In some embodiments, the guide posts are provided on the base plate, and the guide holes are provided on the power module; the elastic piece is a spring, and the spring is sleeved on the guide post.

In some embodiments, the power module includes:

a power supply shell provided with a guide cylinder with the guide hole;

and the power panel is arranged in the power supply shell.

In some embodiments, at least a portion of the top cover that contacts the power module is made of metal.

In some embodiments, the top cover is provided with a heat dissipation port communicated with the mounting cavity, and the mounting shell further comprises a metal sheet, wherein the metal sheet is positioned in the heat dissipation port and is in contact with the power supply module; or, the top cover is made of metal.

In some embodiments, a blower device is disposed in the mounting case and/or in the power module, and a heat dissipation hole is disposed on the mounting case, and the heat dissipation hole is located in a flow direction of a wind flow generated by the blower device.

The application adopts another technical scheme that: there is provided a radio frequency generating device comprising:

the power module assembly described above;

and the power amplification module is arranged in the mounting cavity and connected with the mounting shell, and is powered by the power supply module and used for generating radio frequency signals amplified by power.

In some embodiments, the power amplifier module includes:

the power amplification plate is provided with a first surface and a second surface which are arranged in a back-to-back manner;

the power amplifier shielding cover is covered on the first surface of the power amplifier board;

the radiating piece is arranged on the second surface of the power amplification plate and connected with the mounting shell, and the radiating piece is provided with an airflow channel;

The air blowing assembly is provided with an air outlet which is communicated with the air flow channel of the heat radiating piece.

In some embodiments, the blower assembly includes:

a blowing device for generating a wind flow;

the air duct is provided with a first opening and a second opening which are oppositely arranged, the first opening is communicated with a blowing opening of the blowing device, the second opening is communicated with an airflow channel of the radiating piece to form the air outlet, and the size of the second opening in the width direction of the power amplification plate is larger than that of the first opening.

In some embodiments, the heat dissipation member is made of metal, and comprises a metal plate and a plurality of heat dissipation fins arranged on one surface of the metal plate at intervals, and gaps among the plurality of heat dissipation fins at intervals form the air flow channel; the power amplification plate is connected to the metal plate and is in contact with the metal plate.

The application adopts another technical scheme that: there is provided a radio frequency thawing apparatus comprising: the radio frequency thawing assembly and the radio frequency generating device are arranged on the same side of the radio frequency thawing assembly; the radio frequency thawing assembly comprises:

a shielding cylinder provided with an opening end with an opening;

the shielding door is arranged at the opening end of the shielding cylinder body and is used for closing the opening;

The tuning plate is arranged in the shielding cylinder and is electrically connected with the power amplifier module of the radio frequency generating device;

and the polar plate is arranged in the shielding cylinder body, is electrically connected with the tuning plate and is used for transmitting radio frequency signals.

In some embodiments, a tuning cavity and a thawing cavity for containing food to be thawed are provided in the shielding cylinder, and the tuning plate and the polar plate are both provided in the tuning cavity.

The application adopts a further technical scheme that: provided is a refrigerator including:

a refrigerator main body;

in the radio frequency thawing device, the radio frequency thawing assembly is arranged in the refrigerator main body, and the radio frequency generating device is arranged in or outside the refrigerator main body.

In some embodiments, the radio frequency generating device is disposed outside the refrigerator body and on a top surface, a back surface, or a side surface of the refrigerator body.

In some embodiments, the refrigerator body is provided with a mounting cavity, and the radio frequency thawing assembly is arranged in the mounting cavity;

the shielding barrel is also provided with an air inlet and an air outlet which are communicated with the inner cavity of the shielding barrel, the air inlet and the air outlet are arranged on the same or different side walls of the shielding barrel, and a gap is arranged between the side wall of the air inlet and the air outlet and the mounting cavity.

In some embodiments, the refrigerator further comprises a wind flow accelerator that accelerates cool wind through the gap and the air inlet into the interior cavity of the shield cylinder.

In some embodiments, the mounting cavity is located within one of a freezer compartment, a refrigerator compartment, and a temperature change compartment of the refrigerator.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for the description of the embodiments will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present application, and other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

Fig. 1 is a schematic view showing a structure of a power module assembly in a partially cut-away state of a top cover according to an embodiment of the present application.

Fig. 2 shows an assembly structure of a power module and a base plate in the power module assembly of fig. 1.

Fig. 3 shows an exploded view of a power module assembly in another embodiment of the application.

Fig. 4 is a schematic diagram of a power module in a power module assembly according to an embodiment of the application.

Fig. 5 is a schematic diagram showing a structure of a power module in a power module assembly according to another embodiment of the present application.

Fig. 6 is a schematic structural view of the rf generator in a partially cut-away state of the top cover according to the embodiment of the present application.

Fig. 7 shows a schematic structural view of the radio frequency generating device of fig. 6 with the top cover removed.

Fig. 8 shows an overall structure diagram of a power amplifier module in the radio frequency generating device of fig. 6.

Fig. 9 shows an exploded view of the power amplifier module of fig. 8.

Fig. 10 shows a functional block diagram of a radio frequency thawing device in accordance with an embodiment of the present application.

Fig. 11 shows a functional block diagram of a radio frequency thawing device in accordance with another embodiment of the present application.

Fig. 12 shows a functional block diagram of a radio frequency thawing device in accordance with a further embodiment of the present application.

Fig. 13 is a schematic view showing a structure of a refrigerator in an embodiment of the present application.

Fig. 14 shows a partial enlarged view at a of fig. 13.

Fig. 15 is a view showing an assembled structure of a shield cylinder and a shield door in the refrigerator of fig. 13.

Fig. 16 is a view showing an installation structure of the radio frequency generating device in the refrigerator of fig. 13.

Fig. 17 is a block diagram showing a structure of a refrigerator in another embodiment of the present application.

Reference numerals illustrate:

100-refrigerator; 10-a radio frequency generating device; 10 b-a power module assembly; 20-a refrigerator main body, 21-a mounting cavity, 30-a radio frequency thawing assembly, 31-a shielding cylinder, 31 a-an opening end, 31 c-an air inlet of the shielding cylinder, 31 d-an air outlet of the shielding cylinder, 31 e-a tuning cavity, 31 f-a thawing cavity and 32-a shielding door; 40-wind flow accelerator; 50-master control box.

11-mounting shell, 11 a-mounting cavity, 11 d-heat dissipation hole, 11 e-heat dissipation port, 110-body, 111-bottom plate, 1114-guide column; 112-top cover, 1121-side wall, 1122-baffle, 1124-top wall, 115-shroud, 119-sheet metal.

12-power amplifier module, 121-power amplifier board, 121 a-first surface, 121 b-second surface, 1211-component; 122-heat sink, 122 a-air flow channel, 122 b-relief blind hole, 1221-sheet metal, 1221 a-mounting plane, 1222-fin, 1223-lug; 123-blowing components, 1231-blowing devices, 1231 a-blowing ports, 1232-air channels, 1233-air outlets, 1234-first openings, 1235-second openings; 124-power amplifier shielding cover, 1241-top plate, 1242-side plate; 127-fastener.

13-power module, 131-power panel, 132-power shell, 132 a-through hole, 133-heat conduction insulating glue in the power module, 14-elastic piece; 151-guide cylinder, 151 a-guide hole, 18-fixing piece.

Detailed Description

The following description of the embodiments of the present application will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are only some, but not all embodiments of the application. All other embodiments, which can be made by those skilled in the art based on the embodiments of the application without making any inventive effort, are intended to be within the scope of the application.

Furthermore, the present application may repeat reference numerals and/or letters in the various examples, which are for the purpose of brevity and clarity, and which do not themselves indicate the relationship between the various embodiments and/or arrangements discussed. In addition, the present application provides examples of various specific processes and materials, but one of ordinary skill in the art will recognize the application of other processes and/or the use of other materials.

In the related art, the module in the radio frequency generating device is generally connected through a screw, and is fixed through a fixed structure arranged on the module, however, when the module knocks and installs the impact, the module easily shakes, so that the structure is damaged, and the stability is poor. The embodiment of the application provides a radio frequency generating device and a radio frequency thawing refrigerator, which can at least solve the technical problem of poor stability to a certain extent. The application is described below with reference to specific embodiments in conjunction with the accompanying drawings:

example 1:

the embodiment of the application provides a power module assembly, which is arranged on a refrigerator main body, wherein the power module assembly can be a main power supply of the refrigerator or a power supply of some electric equipment, such as a refrigerator with a radio frequency thawing function, and can be used for supplying power to a power amplifier module, and the specific functions of the power module assembly are not limited.

As shown in fig. 1, an overall block diagram of a power module assembly 10b is provided. The power module assembly 10b includes a mounting case 11 and a power module 13 provided in the mounting case 11, the mounting case 11 being provided with a mounting cavity 11a, the power module 13 being provided in the mounting cavity 11a and connected with the mounting case. Referring specifically to fig. 1 and 2, the mounting case 11 includes a top cover 112 and a bottom plate 111, the bottom plate 111 is for mounting on a metal part of the apparatus, the power module 13 is mounted on the bottom plate 111, and the top cover 112 is covered on the bottom plate 111 to form a mounting cavity 11a accommodating the power module 13. The inside of installation shell 11 is provided with the elastic component 14 that is used for driving power module 13 and top cap 112 laminating, elastic component 14 is located between power module 13 and bottom plate 111, the both ends of elastic component 14 respectively with power module 13 and bottom plate 111 butt, wherein, cover the back with bottom plate 111 at top cap 112, top cap 112 is pressed down power module 13, drive elastic component 14 compressed, thereby apply the elasticity that directs top cap 112 to power module 13, with power module 13 compress tightly on top cap 112, through elastic component 14 and top cap 112 centre gripping power module 13, thereby play fixed effect to power module 13, effectively improve the stability of power module 13, and power module 13 supports the internal surface of tight top cap 112 under the effect of elastic component 14, can carry out the heat conduction through the metal material of top cap 112.

Referring to fig. 2, in some embodiments, a guide post 1114 is vertically disposed on the base plate 111, and guide holes 151a corresponding to the positions and the number of the guide posts 1114 are formed in the power module 13, so that the guide posts 1114 extend into the guide holes 151a when the power module 13 is mounted on the base plate 111, so that the power module 13 slides in a vertical direction within a certain range; in other embodiments, the guiding post 1114 may be disposed on the power module 13, the guiding post 1114 is disposed at the bottom of the power module 13 along the vertical direction, the guiding hole 151a is formed on the bottom plate 111, the guiding post 1114 of the power module 13 is inserted into the guiding hole 151a during installation, the movable range of the power module 13 is limited by the guiding post 1114 and the guiding hole 151a, and the guiding effect is achieved, and the power module 13 is abutted against the top cover 112 under the action of the elastic member 14.

In some embodiments, the elastic member 14 may be a spring, the spring is sleeved on the guide post 1114, two ends of the spring are respectively abutted against the power module 13 and the bottom plate 111, and after the top cover 112 is covered on the bottom plate 111, the top rod drives the power module 13 to slide downwards to compress the spring, so that the spring abuts against the power module 13 and the top cover 112 through elasticity; the elastic member 14 may be in other forms, such as a rubber member. In some embodiments, the power module 13 is provided with a guide cylinder 151, and when the guide hole 151a is formed in the power module 13, the guide hole 151a is formed in the guide cylinder 151, and the spring is sleeved outside the guide cylinder 151.

Referring to fig. 3, in some embodiments, a heat dissipation opening 11e is formed at a position on the mounting shell 11 corresponding to the power module 13, the heat dissipation opening 11e is through and is thus communicated with the inside of the mounting cavity 11a, a metal sheet 119 is arranged in the heat dissipation opening 11e, the metal sheet 119 can be an aluminum sheet, a copper sheet, a steel sheet or the like, the metal sheet 119 is fixedly connected with the mounting shell 11, the power module 13 is mounted on the mounting shell 11 at a position corresponding to the metal sheet 119 and is in contact with the metal sheet 119, the power module 13 can be completely contacted with the metal sheet 119 or can be partially contacted with the metal sheet 119, or can be thermally conducted through other heat conducting components, the heat of the power module 13 is transferred to the outside through the excellent heat conducting property of the metal sheet 119, so that the heat dissipation of the power module 13 is realized, and the heat is directly conducted out when the heat is generated through the heat conducting mode of the metal sheet 119, thereby effectively improving the heat dissipation effect of the power module 13.

In some embodiments, the shape and area of the heat dissipation opening 11e are adapted to the corresponding power module 13, and the projection of the power module 13 on the mounting shell 11 coincides with the metal sheet 119, so that the power module 13 is in full contact with the metal sheet 119, and heat at each position of the power module 13 is transferred to the mounting shell 11, so that the whole mounting shell 11 is not required to be set to be metal, and manufacturing cost is saved. The heat radiation port 11e is located on a non-mounting surface of the mounting case 11, for example, the mounting case 11 is mounted on a refrigerator main body of the refrigerator, and the heat radiation port 11e is located on a side of the mounting case 11 away from the refrigerator main body, so that the metal sheet 119 can radiate heat by using the outside air. Since the mounting case 11 is provided with the heat radiation port 11e for mounting the metal sheet 119, the material of the mounting case 11 in this embodiment is not limited, and the mounting case 11 may be made of plastic in view of weight reduction and cost.

In some embodiments, the mounting shell 11 is a closed shell, and the portion of the mounting surface of the mounting shell 11 is made of metal, and when the mounting shell 11 includes the bottom plate 111 and the top cover 112, the bottom plate 111 provides the mounting surface of the mounting shell 11; when the mounting case 11 includes a bottom cover and a closing plate, the bottom surface of the bottom cover serves as a mounting surface of the mounting case 11. The power module 13 is mounted on a metal portion, and heat is transferred to the metal portion of the mounting case 11 when the power module 13 is operated. Through the heat conduction mode of metal material direct contact, directly lead out the heat when producing the heat, effectively improved the radiating effect to power module 13.

In some embodiments, the installation shell 11 may be integrally made of metal, and the entire side surface of the power module 13 is in contact with the metal side wall 1121 of the installation shell 11, so that the heat conduction effect between the power module 13 and the installation shell 11 is improved, and the metal side wall 1121 of one side of the installation shell 11 is in contact with the metal component of the equipment, so that the heat conduction effect between the installation shell 11 and the equipment is effectively improved; the installation shell 11 can set up the part as the metal material, for example sets up the part that corresponds with power module 13 as the metal module, and the projection of power module 13 on installation shell 11 overlaps with the metal material part to all transmit the heat of power module 13 each position to installation shell 11, need not to set up whole installation shell 11 as the metal, save manufacturing cost.

In order to further improve the heat dissipation effect of the power module 13, referring to fig. 1, in some embodiments, a plurality of heat dissipation holes 11d are formed on a side wall 1121 of the body 110 of the mounting case 11 at intervals, and when the internal power module 13 generates heat, the heat is dissipated outwards through air, so as to achieve heat dissipation of the power module 13. The heat dissipation holes 11d are formed on at least one side wall 1121 of the installation shell 11, in some embodiments, the heat dissipation holes 11d are formed on at least two opposite side walls 1121 of the installation shell 11, so as to form an air flow passing through the installation cavity 11a, thereby effectively improving the heat dissipation effect; or the side walls 1121 except the side wall 1121 facing the user are provided with the heat radiation holes 11d, thereby improving the heat radiation effect and the aesthetic property of the mounting shell 11.

The side wall 1121 of the mounting case 11 is provided with the baffle 1122 for shielding the heat radiation hole 11d in the direction parallel to the side wall 1121, the baffle 1122 is provided at a position corresponding to the heat radiation hole 11d, and the projection of the baffle 1122 on the side wall 1121 of the mounting case 11 covers the heat radiation hole 11d, i.e., the heat radiation hole 11d is completely covered by the baffle 1122 as seen in the direction perpendicular to the side wall 1121, and by the shielding effect of the baffle 1122, water or dust and the like are effectively prevented from directly entering the mounting case 11, and the possibility of damaging the power module 13 is reduced while the heat radiation effect is achieved. For the mounting case 11 including the bottom plate 111 and the top cover 112, and the mounting case 11 provided with only the top cover 112, the heat radiation holes 11d are provided on the side wall 1121 of the top cover 112. The baffle 1122 may be integrally formed with the side wall 1121 to increase the strength of the overall structure, or may be fixedly attached to the side wall 1121 by means such as heat welding to facilitate control of the form thereof during the manufacturing process, thereby facilitating the production and assembly.

The baffle 1122 may be provided on the outer surface of the installation housing 11 or may be provided on the inner surface of the installation housing 11, and the baffle 1122 may be provided at an angle to the side wall 1121, and the baffle 1122 may be a straight plate, a bent plate (e.g., V-shaped plate, L-shaped plate, Y-shaped plate, W-shaped plate, etc.), or a bent plate (e.g., C-shaped plate, U-shaped plate, S-shaped plate, etc.), and the specific shape of the present application is not limited. The heat dissipation holes 11d are formed in the side wall 1121 of the mounting shell 11, so that the heat dissipation holes 11d are shielded by the baffles 1122 protruding from the surface of the side wall 1121, the number of the baffles 1122 is the same as that of the heat dissipation holes 11d, each baffle 1122 is respectively arranged on one side of the corresponding heat dissipation hole 11d, that is, the baffles 1122 and the heat dissipation holes 11d are sequentially arranged, an air guide channel communicated with the heat dissipation holes 11d between the two baffles 1122 is formed between two adjacent baffles 1122, and the heat dissipation holes 11d serve as one opening of the air guide channel. The air guide channels are bent or bent channels, or openings at two ends of the air guide channels are distributed in a staggered manner, so that the heat dissipation holes 11d are shielded by the baffle 1122.

To achieve waterproofing of the heat dissipation hole 11d, in some embodiments, referring to fig. 1, a shroud 115 for shielding the heat dissipation hole 11d is provided on the body 110 of the mounting case 11 at a position above the heat dissipation hole 11d, the shroud 115 extends outward to shield the heat dissipation hole 11d in a direction perpendicular to the side wall 1121, and a projection of the shroud 115 on the side wall 1121 has an overlapping area with the heat dissipation hole 11 d. When water is sputtered to the body 110 of the installation shell 11 from the top or in a direction which forms a certain angle with the side wall 1121, the heat dissipation holes 11d are shielded by the enclosing plate 115, so that the water is effectively prevented from entering the installation cavity 11a from the heat dissipation holes 11d shielded below the enclosing plate 115, and the waterproof effect of the installation shell 11 is improved. The coaming 115 and the body 110 of the installation shell 11 may be in an integral structure, so as to improve structural strength and stability of the whole structure, or the coaming 115 may be fixedly installed on a side wall or a top plate of the body 110, so that the shape thereof is convenient to control during the processing, thereby being convenient for production and assembly.

In some embodiments, the shroud 115 may not be provided at a position where the heat radiation hole 11d is not provided; in other embodiments, a circle of coaming 115 may be disposed along the circumference of the body 110, so as to maximize the shielding effect of the coaming 115. The shroud 115 and the baffle 1122 may be alternatively arranged, and considering that the power amplifier board 121, the power panel 131 and other circuit boards have more components 1211, the baffle 1122 or the shroud 115 is only limited in water blocking effect, in some embodiments, the baffle 1122 and the shroud 115 are simultaneously arranged on the side wall 1121, the shroud 115 is located outside the side wall 1121, and the baffle 1122 is located inside the side wall 1121 or inside the side wall 1121, so that the water blocking effect of the heat dissipation holes 11d is further improved.

Referring to fig. 4, in some embodiments, the power module 13 includes a power supply housing 132 and a power supply board 131 disposed in the power supply housing 132, the power supply housing 132 protecting the power supply board 131. In some embodiments, the power supply housing 132 is provided with a plurality of through holes 132a for heat dissipation of the power panel 131. In some embodiments, the power supply housing 132 is provided with a guide cylinder 151, the guide hole 151a is formed on the guide cylinder 151, and the spring is sleeved outside the guide cylinder 151.

Considering that there is a gap between the power supply housing 132 and the power supply board 131, the power supply board 131 and the power supply housing 132 conduct heat only through air, so that the heat dissipation effect is poor, and the service life of the power supply board 131 may be affected, as shown in fig. 5, in other embodiments, the power supply housing 132 is filled with a heat-conducting insulating glue 133, the heat-conducting insulating glue 133 is in contact with both the power supply board 131 and the power supply housing 132, and the heat-conducting insulating glue 133 wraps components on the power supply board 131.

Specifically, the heat-conducting insulating glue 133 is arranged in the power module 13, the heat-conducting insulating glue 133 is arranged between the power panel 131 and the power shell 132 of the power module 13, on one hand, water, insects and the like outside the power module 13 can be prevented from entering the power module 13 to erode components on the power panel 131, so that the waterproof and insect-preventing effects are achieved, and on the other hand, heat generated by the components on the power panel 131 can be conducted to the power shell 132 through the heat-conducting insulating glue 133, so that the heat dissipation effect of the power module 13 is improved. In addition, the heat conductive insulating adhesive 133 wraps the components on the power panel 131, so that the heat dissipation uniformity of the components can be improved. Thereby improving the reliability and safety of the power module 13 as a whole.

In some embodiments, in order to ensure the bonding degree of the heat-conducting insulating glue 133 with the power panel 131 and the power supply housing 132, poor contact is avoided, and the heat dissipation effect is affected, so that the glue filling mode is adopted, the through hole 132a arranged on the power supply module 13 can be used as a glue filling hole, glue filling is performed through the through hole 132a on the power supply module 13, the bonding degree of the heat-conducting insulating glue 133 with the power panel 131 and the power supply housing 132 is improved, and the heat dissipation effect of the power supply module 13 is ensured to a certain extent.

Example 2:

based on the same inventive concept, an embodiment of the present application provides a radio frequency generating device 10, referring to fig. 6 and 7, including the power module assembly of the above embodiment 1 and a power amplifier module 12 for generating a radio frequency signal after power amplification, where the power amplifier module 12 includes a power amplifier board, and the power amplifier board is electrically connected with a power panel of the power module 13. The power amplification board 121 generally includes a signal source and a power amplification circuit, which are electrically connected, where the signal source is used to generate an initial signal with a set frequency (e.g. 40.68 MHz), and the power amplification circuit is used to power amplify the initial signal, enhance the power of the initial signal, and output a radio frequency signal after power amplification. The power module 13 is internally provided with an ac/dc conversion circuit and a voltage regulating circuit, and is used for performing ac/dc conversion and voltage regulation, and supplying low-voltage dc power to the power amplifier module 12.

The power amplifying circuit can adopt primary amplification, secondary amplification, tertiary amplification or even more according to actual needs, and specific amplification stages and circuit structures of all stages of amplifying circuits can refer to relevant disclosures in the prior art, so that the application is not limited. The signal source and the power amplifying circuit may be selectively disposed on the same surface of the power amplifying board 121, or may be disposed on the first surface 121a and the second surface 121b, which is not limited by the specific arrangement mode of the present application. In some embodiments, the components 1211 (chips, inductors, capacitors, resistors, etc.) on the power amplification board 121 are located on the first surface 121a, that is, each component 1211 of the signal source and the power amplification circuit is mounted on the front surface of the power amplification board 121, the back surface of the power amplification board 121 is mainly a soldering leg, a soldering wire, etc. of a pin, and the second surface 121b of the power amplification board 121 contacts the heat dissipation element 122 for heat transfer.

In some embodiments, referring to fig. 10, 11 and 12, the power amplifying circuit adopts a second-stage amplification, including a first-stage driver and a second-stage power amplifying circuit, where the signal source, the first-stage driver and the second-stage power amplifying circuit are electrically connected in sequence, the first-stage driver and the second-stage power amplifying circuit amplify an initial signal sent by the signal source step by step, and the second-stage power amplifying circuit outputs the amplified signal. The specific circuit structures of the primary driver and the secondary power amplifying circuit can refer to related disclosures in the prior art, and the application is not limited.

In some embodiments, referring to fig. 10, 11 and 12, the power amplification board 121 is further provided with a detection circuit, where the detection circuit, the signal source and the power amplification circuit are provided on the same circuit board. In other embodiments, the detection circuit and the signal source and the power amplification circuit may be provided on different circuit boards. The detection circuit is used for detecting the output power of the radio frequency signal after power amplification and feeding back the output power to the control board. If the load connected to the power amplification board 121 is provided with a tuning board, the detection circuit is further used for detecting the reflected power reflected by the tuning module and feeding back to the control board.

The radio frequency generating device 10 is controlled by a control system (e.g. MCU controller) on a control board when in operation, the control board is electrically connected with the power module 13 and the power amplifier module 12, the control board is electrically connected with an external input device (display screen, operation panel, keyboard, etc.), receives an operation instruction sent by a user, and controls circuits in the power module 13 and the power amplifier module 12 to work. When the output power of the power amplifier module 12 needs to be regulated, the control board calculates a voltage regulation control instruction based on an internal algorithm and sends the voltage regulation control instruction to the power module 13, and the power module 13 regulates the voltage to change the output voltage of the power module 13. For the power amplification board 121 provided with the detection circuit, the control board is electrically connected with the detection circuit, the detection circuit detects the output power of the power amplification module 12 and feeds back to the control module, and the control module performs relevant control on the signal source, the power amplification circuit and the power supply module 13 through an internal algorithm.

In some embodiments, the functions of the control board are integrated on the device on which the rf generator 10 is mounted, such as a refrigerator in which the rf generator 10 is configured, and the functions of the control board may be integrated on a main control board of the refrigerator. In some embodiments, the control board is a circuit board which is separately arranged, the control board exists independently of the power module 13 and the power amplifier module 12 to form a control module, under the arrangement scheme, the installation positions of the power amplifier module 12, the power module 13 and the control module can be set according to actual needs, the power amplifier module 12 is arranged in the installation cavity 11a of the installation shell 11 and is fixedly connected with the installation shell 11, and the power module 13 and the control module can be selectively arranged in the installation shell 11 or on a device main body carried by the radio frequency generating device 10. Taking a refrigerator provided with a radio frequency thawing device as an example, a radio frequency generating device 10 is arranged in the radio frequency thawing device, a mounting shell 11 with a built-in power amplifier module 12 can be selectively arranged inside or outside a refrigerator main body of the refrigerator, a power module 13 can be selectively arranged in the mounting shell 11, or positioned outside the mounting shell 11 and inside the refrigerator main body, and a control module can be selectively arranged in the mounting shell 11, or positioned outside the mounting shell 11 and inside the refrigerator main body.

In other embodiments, the control board and the power amplifier board 121 may be integrated on the same circuit board, as shown in fig. 12. In this embodiment, since the power amplifier module 12 generates a high-frequency signal, it is easy to interfere with the control system drawn on the same electronic control board, and thus, it is necessary to perform internal structural shielding according to the actual layout, that is, the shielding case only covers the relevant components 1211 of the power amplifier board 121 to perform electromagnetic shielding, and the structural design and installation of the shielding case are relatively complex and have high cost. Meanwhile, since the power amplifier board 121 needs to be designed by using a multi-layer board, and a PCB high-frequency board with higher cost must be adopted, and the material of the control board for the board is generally unlimited, integrating the control board and the power amplifier board 121 on the same circuit board can result in that the whole board needs to use the PCB high-frequency board, so that the overall cost of the radio frequency generating device 10 is increased. In addition, the heat source of the whole radio frequency generating device 10 is mainly in the power amplifier module 12, the control board and the power amplifier board 121 are drawn on the same circuit board, and the heat generated by the power amplifier board 121 causes the control system to be heated, so that the reliability of the whole radio frequency generating device 10 is affected.

In other embodiments, the control board is integrated with the power module 13 on the same circuit board, as shown in FIG. 11. In this embodiment, since the control board is integrated with the power module 13 and the same circuit board, the power amplifier board 121 and the control board are all independently arranged, and only the power amplifier board 121 adopts a PCB high-frequency board, the consumption of the PCB high-frequency board is minimum, and the independent control module only needs to adopt a common low-cost material, so that the cost is reduced. Meanwhile, the power amplification plate 121, the control plate and the power module 13 are all independently arranged, the power amplification module 12 does not need to carry out special shielding design on the shielding cover according to the internal layout of the circuit board, only a simple outer cover shielding power amplification plate 121 is needed to be designed, and the design complexity and cost are reduced. Meanwhile, as the power amplification plate 121, the control plate and the power module 13 are arranged independently, heat insulation is carried out through air in installation, heat radiation of the power amplification module 12 to the control module is greatly reduced, and reliability of the whole radio frequency generating device 10 is improved.

Referring to fig. 8 and 9, the power amplifier module 12 includes a power amplifier board 121, a heat dissipation member 122 and a blower assembly 123, wherein the power amplifier board 121 is used for generating a radio frequency signal after power amplification, the heat dissipation member 122 is disposed on the power amplifier board 121, and the heat dissipation member 122 is selectively connected and fixed with the power amplifier board 121 or only contacts with the power amplifier board 121. The heat sink 122 is provided with an air flow passage 122a, and heat of the heat sink 122 can be taken away when wind flows through the air flow passage 122 a. The air blowing component 123 is configured to blow air into the air flow channel 122a, dissipate heat of the power amplification board 121, the air blowing component 123 and the power amplification board 121 are sequentially disposed along the air flow direction, two ends of the power amplification board 121 in the air flow direction are respectively denoted as a first end 121c and a second end 121d, the air blowing component 123 is disposed at the first end 121c of the power amplification board 121, and the second end 121d of the power amplification board 121 can be used as an outlet end of the power amplification board 121.

Referring to fig. 9, in some embodiments, the blowing assembly 123 includes a blowing device 1231 and a duct 1232, the blowing device 1231 being configured to generate a flow of wind, and the duct 1232 communicating the blowing device 1231 with the heat sink 122. Specifically, the air duct 1232 has a first opening 1234 and a second opening 1235 that are disposed opposite to each other, the first opening 1234 is communicated with the air blowing opening 1231a of the air blowing device 1231, the second opening 1235 is communicated with the air flow channel 122a of the heat dissipation member 122, and the air flow generated by the air blowing device 1231 enters the air flow channel 122a through the air duct 1232, so that the heat dissipation member 122 is dissipated by forced convection.

When in use, the heat dissipation element 122 is in contact with the power amplification plate 121, and the heat of the power amplification plate 121 is conducted to the heat dissipation element 122. The wind flow generated by the blowing device 1231 enters the airflow channel 122a through the air duct 1232, forced convection dissipates heat of the heat dissipation part 122, and the heat dissipation part 122 further dissipates heat of the power amplification plate 121, so that the temperature of the power amplification plate 121 is effectively reduced, and the safety and reliability of products are improved. Due to the arrangement of the air duct 1232 and the heat dissipation member 122 having the air flow channel 122a, the air flow generated by the air blowing device 1231 can all enter the air flow channel 122a, the air volume utilization rate is high, and the heat dissipation requirement of the power amplification plate 121 can be met with smaller power and flow.

Referring to fig. 9, in the power amplifier module 12 provided by the present application, the dimension of the second opening 1235 of the air duct 1232 in the width direction of the power amplifier board 121 is greater than the dimension of the first opening 1234 in the width direction of the power amplifier board 121. That is, the air duct 1232 adopts a flaring design, and along the flow direction of the wind flow, the size of the inner cavity of the air duct 1232 in the width direction of the power amplification plate 121 tends to increase, and specifically, linear increase, nonlinear increase or gradient increase can be adopted. To reduce wind resistance, in some embodiments, the projection of the air duct 1232 on the plane parallel to the power amplification plate 121 is trapezoidal, and the shapes of the first opening 1234 and the second opening 1235 are respectively adapted to the shape of the air blowing opening 1231a of the air blowing device 1231 and the inlet shape of the air flow channel 122a of the heat dissipation member 122.

Because the second opening 1235 of the air duct 1232 is larger than the first opening 1234 in the width direction of the power amplification plate 121, the air flow is increased in the width direction of the power amplification plate 121 in the process of flowing from the first opening 1234 to the second opening 1235 of the air duct 1232, and the air flow can be matched with a heat dissipation device, so that the air flow is blown across the whole width of the power amplification plate 121, and the heat dissipation efficiency is further improved. In addition, the air duct 1232 can also realize the adaptation of the shapes of the air blowing device 1231 and the opening 11g of the heat dissipation member 122, so that the requirement on the shape selection of the air blowing device 1231 is reduced. The blowing device 1231 may be a fan, or the like capable of generating a wind flow, and the present application is not limited thereto. In some embodiments, to further meet the miniaturization requirements of the device, the blower 1231 employs an axial flow fan.

The heat dissipation element 122 and the power amplification board 121 conduct heat, and the heat dissipation element 122 is required to have good heat conductivity, and the heat conductivity of metal and ceramic can be achieved, so that the material and shape of the heat dissipation element 122 are not limited. In some embodiments, the heat dissipation element 122 is made of metal, and may be aluminum, iron, or other metals or alloys thereof, and aluminum is preferred in view of light weight.

In order to satisfy the installation and heat dissipation of the power amplifier board 121, referring to fig. 9, the heat dissipation member 122 includes a metal plate 1221 and a plurality of heat dissipation fins 1222, the heat dissipation fins 1222 are distributed on one surface of the metal plate 1221, the heat dissipation fins 1222 are spaced apart such that gaps between the heat dissipation fins 1222 form the air flow channel 122a, and the specific number and spacing of the heat dissipation fins 1222 are determined according to the heat dissipation requirement of the power amplifier board 121, which is not limited by the present application. In certain embodiments, the metal plate 1221 is integrally formed with the heat dissipating fins 1222. The metal plate 1221 has a large mounting surface 1221a, the power amplification plate 121 is mounted on the mounting surface 1221a of the metal plate 1221 by the fastener 127, and the power amplification plate 121 is at least partially in contact with the metal plate 1221.

Because the metal is conductive, in order to ensure that the power amplification board 121 and the metal board 1221 are fully contacted as much as possible, referring to fig. 9, in some embodiments, a plurality of avoidance blind holes 122b are provided on the installation plane 1221a of the metal board 1221, the number and positions of the avoidance blind holes 122b completely correspond to the number and distribution of conductors (pins, soldering tin parts, wires, etc. of the components 1211) of the power amplification board 121, the size of the avoidance blind holes 122b is larger than that of the corresponding conductors on the power amplification board 121, so that the conductors extend into the avoidance blind holes 122b and are not contacted with the metal board 1221, thereby ensuring that the power amplification board 121 and the metal board 1221 are tightly attached, the contact area is larger, heat dissipation is facilitated, and the overall structure of the power amplification board 121 is more stable. The avoidance blind hole 122b is designed as a blind hole, so that the problem of leakage caused by contact between the conductor and water due to the design as the through hole 132a can be avoided.

The structural strength of the heat sink 122 is higher than that of the power amplification board 121, and thus the heat sink 122 simultaneously serves as a mounting base of the power amplification board 121. In some embodiments, at least two lugs 1223 are disposed on the metal plate 1221, where the lugs 1223 may be disposed on a bottom surface or a side surface of the metal plate 1221 according to actual needs, and fixing holes for installing the fasteners 127 are disposed in the lugs 1223, and the fixing holes may be holes or threaded holes, and the fasteners 127 may be screws, rivets, pins, or other structures, which is not limited by the present application.

The power amplification board 121 is a circuit board structure, and has a first surface 121a and a second surface 121b that are disposed opposite to each other, hereinafter also referred to as a first surface 121a of the power amplification board 121 is a front surface, and a second surface 121b of the power amplification board 121 is a back surface. The power amplification board 121 generally includes a signal source and a power amplification circuit, which are electrically connected, where the signal source is used to generate an initial signal with a set frequency (e.g. 40.68 MHz), and the power amplification circuit is used to power amplify the initial signal, enhance the power of the initial signal, and output a radio frequency signal after power amplification. The power amplifying circuit can adopt primary amplification, secondary amplification, tertiary amplification or even more according to actual needs, and specific amplification stages and circuit structures of all stages of amplifying circuits can refer to relevant disclosures in the prior art, so that the application is not limited. The signal source and the power amplifying circuit may be selectively disposed on the same surface of the power amplifying board 121, or may be disposed on the first surface 121a and the second surface 121b, which is not limited by the specific arrangement mode of the present application. In some embodiments, the components 1211 (chips, inductors, capacitors, resistors, etc.) on the power amplification board 121 are located on the first surface 121a, that is, each component 1211 of the signal source and the power amplification circuit is mounted on the front surface of the power amplification board 121, the back surface of the power amplification board 121 is mainly a soldering leg, a soldering wire, etc. of a pin, and the second surface 121b of the power amplification board 121 contacts the heat dissipation element 122 for heat transfer.

Referring to fig. 8 and 9, the power amplifier module 12 is further provided with a power amplifier shielding cover 124, where the power amplifier shielding cover 124 is made of a metal material and covers the first surface 121a of the power amplifier board 121 to electromagnetically shield the component 1211 on the power amplifier board 121. In some embodiments, the power amplifier shielding cover 124 is only covered on the power amplifier board 121, and specifically, the power amplifier shielding cover 124 and the power amplifier board 121 are both installed on the heat dissipation element 122 through fastener 127. In other embodiments, the power amplifier shielding cover 124 may be further configured to cover the power amplifier board 121 and the heat dissipation member 122, or cover the power amplifier board 121, the heat dissipation member 122, the blower 1231, and the air duct 1232, which is not limited by the present application.

Example 3:

based on the same inventive concept, an embodiment of the present application provides a radio frequency thawing apparatus, which includes a radio frequency thawing assembly 30 and the radio frequency generating device 10 of the above embodiment 2. Referring to fig. 10, 11 and 12, a tuning plate and a polar plate are disposed in the rf thawing assembly 30, and the tuning plate is electrically connected to a tuning inductor, which is optionally disposed on the tuning plate or independent of the tuning plate. The tuning plate is electrically connected with the power amplification plate 121 of the radio frequency generating device 10, the tuning module is used for balancing the impedance of the load end so as to realize impedance matching, and the polar plate is electrically connected with the tuning plate and is used for transmitting radio frequency signals with set frequencies. The signal output by the power amplification module 12 is a radio frequency signal corresponding to the standard load after power amplification, and the tuning module is used for adjusting the impedance of the load end. The different unfreezed substances have different impedances, the impedance of the drawer is not the standard load impedance, the load impedance changes in the unfreezing process, the impedance matching is realized through the tuning module, the impedance matching is equivalent to the standard load, the control module controls the tuning module to perform the impedance matching, the tuning module outputs a signal to the polar plate, and the polar plate sends out a radio frequency signal, so that the food material unfreezing purpose is realized.

Referring to fig. 15, the rf thawing assembly 30 further includes a shield cylinder 31 having an open end 31a with an opening, and a shield door 32 provided at the open end 31a of the shield cylinder 31 for closing the opening to form a closed shield cavity with the shield cylinder 31. The tuning plate and the polar plate are arranged in the shielding cylinder 31, the shielding cylinder 31 can provide a mounting foundation for the tuning plate and the polar plate, the purpose of protecting the tuning plate and the polar plate can be achieved, radio frequency signals emitted by the polar plate can be shielded, and radio frequency signal leakage is avoided.

Referring to fig. 13, in some embodiments, a tuning cavity 31e and a thawing cavity 31f are provided in the shield cylinder 31, the tuning plate and the polar plate are both provided in the tuning cavity 31e, the thawing cavity 31f is used for containing food to be thawed, and the polar plate radiates radio frequency energy into the thawing cavity 31f, thereby thawing the food in the thawing cavity 31 f. The tuning plate and the polar plate are placed separately from the food material, so that on one hand, pollution to the food material is avoided, and on the other hand, water melted after thawing the food material is prevented from contacting the tuning plate and the polar plate, and damage to the component 1211 is avoided.

Referring to fig. 14, in some embodiments, the shielding cylinder 31 is further provided with an air inlet 31c and an air outlet 31d that are in communication with the tuning cavity 31e, where the air inlet 31c and the air outlet 31d may be disposed on the same side wall 1121 of the shielding cylinder 31, or may be disposed on different side walls 1121, which is not limited in this aspect of the application.

Example 4:

based on the same inventive concept, an embodiment of the present application provides a refrigerator, as shown in fig. 13, the refrigerator 100 includes a refrigerator main body 20 and the radio frequency thawing apparatus of the above embodiment 3, and a refrigerating assembly 22 for refrigerating is provided in the refrigerator main body 20, for providing cold to at least one of the freezing chamber, the refrigerating chamber, and the temperature-varying compartment. The radio frequency generating device 10 of the radio frequency thawing device is disposed inside or outside the refrigerator main body 20, and the specific structure thereof is described in the above embodiment 3, and will not be repeated here. The radio frequency thawing assembly 30 of the radio frequency thawing device is disposed in the refrigerator main body 20, specifically, the refrigerator main body 20 is provided with an installation cavity 21, the radio frequency thawing assembly 30 is disposed in the installation cavity 21, and the specific structure of the radio frequency thawing device is described in reference to embodiment 3 and will not be repeated here. The installation cavity 21 is located in one of the freezing chamber, the refrigerating chamber, and the temperature changing chamber of the refrigerator 100, and the present application is not limited.

In some embodiments, the rf generating device 10 is disposed outside the refrigerator main body 20, and the rf generating device 10 may be disposed on the top, back or side of the refrigerator main body 20, which is not limited by the present application. Referring to fig. 16, in some embodiments, the rf generating device 10 is located on the top surface of the refrigerator main body 20, the mounting case 11 of the rf generating device 10 is connected to the U-shaped case 23 of the top of the refrigerator main body 20 through the fixing member 18, and when the mounting case 11 includes the base plate 111 and the top cover 112, both the electronic module and the top cover 112 are mounted on the base plate 111, and the base plate 111 is mounted on the top surface of the U-shaped case 23 through the fixing member 18. Referring to fig. 17, in some embodiments, the mounting housing 11 includes only a top cover 112, the electronic module is mounted on an inner surface of a top wall 1124 of the top cover 112, and the top cover 112 is flip-off mounted to a top surface of the U-shaped housing 23 by the fixing member 18.

In some embodiments, referring to fig. 14, the shielding cylinder 31 of the rf thawing assembly 30 is further provided with an air inlet 31c and an air outlet 31d that are in communication with the tuning cavity 31e, and the air inlet 31c and the air outlet 31d may be disposed on the same side wall 1121 of the shielding cylinder 31 or may be disposed on different side walls 1121, which is not limited in this aspect of the application. The side wall 1121 provided with the air inlet 31c and the air outlet 31d and the mounting cavity 21 have a gap a therebetween, so that the air circulation is formed between the air inlet 31c and the air outlet 31d and the gap a between the side wall 1121 provided with the air inlet 31c and the air outlet 31d and the mounting cavity 21, and the heat dissipation is performed on the tuning cavity 31 e.

In some embodiments, referring to fig. 14, the refrigerator 100 further includes a wind flow accelerator 40, and the wind flow accelerator 40 accelerates cool wind into the tuning cavity 31e through the gap a and the wind inlet 31c to accelerate air circulation, thereby improving heat dissipation efficiency.

Example 5:

based on the same inventive concept, an embodiment of the present application provides a refrigerator, referring to fig. 17, a refrigerator 100 includes a refrigerator main body 20 and a radio frequency thawing device. The radio frequency thawing device includes the power module assembly 10b of the above embodiment 1, where the power module assembly 10b is disposed outside or inside the refrigerator main body 20, for example, in the main control box 50 of the refrigerator main body 20, in the cabin of the refrigerator main body 20, the power module assembly 10b is used as the main power source of the refrigerator, and the specific structure of the power module assembly 10b is not described herein again with reference to embodiment 1.

In the present application, unless expressly stated or limited otherwise, a first feature "above" or "below" a second feature may include both the first and second features being in direct contact, as well as the first and second features not being in direct contact but being in contact with each other through additional features therebetween. Moreover, a first feature being "above," "over" and "on" a second feature includes the first feature being directly above and obliquely above the second feature, or simply indicating that the first feature is higher in level than the second feature. The first feature being "under", "below" and "beneath" the second feature includes the first feature being directly under and obliquely below the second feature, or simply means that the first feature is less level than the second feature.

In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise" indicate orientations or positional relationships are based on the orientations or positional relationships shown in the drawings, are merely for convenience in describing the present application and simplify the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and therefore should not be construed as limiting the present application.

It should be noted that all the directional indicators in the embodiments of the present application are only used to explain the relative positional relationship, movement conditions, etc. between the components in a specific posture, and if the specific posture is changed, the directional indicators are correspondingly changed.

In the present application, unless specifically stated and limited otherwise, the terms "connected," "affixed," and the like are to be construed broadly, and for example, "affixed" may be a fixed connection, a removable connection, or an integral body; can be mechanically or electrically connected; either directly or indirectly, through intermediaries, or both, may be in communication with each other or in interaction with each other, unless expressly defined otherwise. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art according to the specific circumstances.

Furthermore, descriptions such as those referred to as "first," "second," and the like, are provided for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implying an order of magnitude of the indicated technical features in the present disclosure. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more features. In the description of the present application, the meaning of "a plurality" is two or more, unless explicitly defined otherwise.

In the description of the present specification, a description referring to terms "one embodiment," "some embodiments," "examples," "specific examples," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present application. In this specification, schematic representations of the above terms are not necessarily directed to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Further, one skilled in the art can engage and combine the different embodiments or examples described in this specification.

In addition, the technical solutions of the embodiments may be combined with each other, but it is necessary to base that the technical solutions can be realized by those skilled in the art, and when the technical solutions are contradictory or cannot be realized, the combination of the technical solutions should be considered to be absent and not within the scope of protection claimed in the present application.

While embodiments of the present application have been shown and described, it will be understood by those of ordinary skill in the art that: many changes, modifications, substitutions and variations may be made to the embodiments without departing from the spirit and principles of the application, the scope of which is defined by the claims and their equivalents.

Claims (12)

1. A power module assembly, comprising:

the mounting shell comprises a bottom plate and a top cover covered on the bottom plate, and the top cover and the bottom plate are surrounded to form a mounting cavity;

the power module is arranged in the mounting cavity and used for supplying power;

the elastic piece is arranged between the bottom plate and the power supply module, and generates thrust pointing to the top cover for the power supply module so as to enable the power supply module to be in contact with the top cover.

2. The power module assembly of claim 1, wherein: one of the bottom plate and the power module is provided with a guide post, the other one of the bottom plate and the power module is provided with a guide hole, and the guide post movably stretches into the guide hole.

3. The power module assembly of claim 2, wherein: the guide post is arranged on the bottom plate, and the guide hole is arranged on the power supply module; the elastic piece is a spring, and the spring is sleeved on the guide post.

4. The power module assembly of claim 2, wherein: the power module includes:

a power supply shell provided with a guide cylinder with the guide hole;

and the power panel is arranged in the power supply shell.

5. The power module assembly of any one of claims 1-4, wherein: at least the part of the top cover, which is contacted with the power module, is made of metal.

6. The power module assembly of claim 5, wherein: the top cover is provided with a heat radiation opening communicated with the mounting cavity, the mounting shell further comprises a metal sheet, and the metal sheet is positioned in the heat radiation opening and is in contact with the power supply module; or, the top cover is made of metal.

7. The power module assembly of any one of claims 1-4, wherein: and a blowing device is arranged in the mounting shell and/or the power module, and a heat dissipation hole is arranged on the mounting shell and is positioned in the flowing direction of wind flow generated by the blowing device.

8. A radio frequency generating device, comprising:

the power module assembly of any one of claims 1-7;

and the power amplification module is arranged in the mounting cavity and connected with the mounting shell, and is powered by the power supply module and used for generating radio frequency signals amplified by power.

9. The radio frequency generating device according to claim 8, wherein: the power amplifier module comprises:

The power amplification plate is provided with a first surface and a second surface which are arranged in a back-to-back manner;

the power amplifier shielding cover is covered on the first surface of the power amplifier board;

the radiating piece is arranged on the second surface of the power amplification plate and connected with the mounting shell, and the radiating piece is provided with an airflow channel;

the subassembly of blowing is equipped with the air outlet, the air outlet communicate in the air current passageway of radiating piece, the subassembly of blowing includes:

a blowing device for generating a wind flow;

the air duct is provided with a first opening and a second opening which are oppositely arranged, the first opening is communicated with a blowing opening of the blowing device, the second opening is communicated with an airflow channel of the radiating piece to form the air outlet, and the size of the second opening in the width direction of the power amplification plate is larger than that of the first opening.

10. The radio frequency generating device according to claim 9, wherein: the heat dissipation piece is made of metal and comprises a metal plate and a plurality of heat dissipation fins which are arranged on one surface of the metal plate at intervals, and gaps among the plurality of heat dissipation fins which are arranged at intervals form the air flow channel; the power amplification plate is connected to the metal plate and is in contact with the metal plate.

11. A radio frequency thawing device, comprising: a radio frequency thawing assembly and a radio frequency generating device as defined in any one of claims 8-10; the radio frequency thawing assembly comprises:

a shielding cylinder provided with an opening end with an opening;

the shielding door is arranged at the opening end of the shielding cylinder body and is used for closing the opening;

the tuning plate is arranged in the shielding cylinder and is electrically connected with the power amplifier module of the radio frequency generating device;

and the polar plate is arranged in the shielding cylinder body, is electrically connected with the tuning plate and is used for transmitting radio frequency signals.

12. A refrigerator, comprising:

a refrigerator main body;

the rf thawing device as defined in claim 11, wherein the rf thawing assembly is disposed inside the refrigerator body, and the rf generating device is disposed inside or outside the refrigerator body.