CN215011342U - Cold drawing fastening heat radiation structure and printed circuit board subassembly - Google Patents

Abstract

The embodiment of the utility model provides a cold drawing fastening heat radiation structure and printed circuit board assembly, wherein, cold drawing fastening heat radiation structure includes: the cooling plate, the heat dissipation working medium and the first turbulence column; an inner flow passage is arranged in the cold plate; the cold plate is at least provided with a pair of working medium inlets and working medium outlets; the working medium inlet and the working medium outlet are respectively communicated with the inner flow passage; the heat dissipation working medium enters the inner flow passage from the working medium inlet, circulates in the inner flow passage and flows out from the working medium outlet; one or more first flow disturbing columns are arranged in the inner flow passage; threaded blind holes are formed in the first turbulence columns, and openings of the threaded blind holes are formed in the surface of the cold plate. The utility model discloses, increased area of contact and the contact time between cold drawing and the heat dissipation working medium through first vortex post, improved the radiating efficiency, simultaneously, to the inside tapping that carries out of first vortex post, form the screw thread blind hole that the opening is located the cold drawing surface, for directly inserting the fixed point that electronic device provided bolted connection, electronic device changes in the installation, and the radiating effect is good.

Description

Cold drawing fastening heat radiation structure and printed circuit board subassembly

Technical Field

The utility model relates to a heat transfer technology field particularly, relates to a cold drawing fastening heat radiation structure and printed circuit board subassembly.

Background

With the rapid development of electronic devices, the total power density of electronic components is increasing, but the size of the electronic components is smaller and smaller, so that the heat flux density is continuously increased, and the performance index of the electronic components is influenced in the high-temperature environment, so that the heat control of the electronic components needs to be enhanced.

The mainstream heat dissipation modes of the vehicle-mounted power electronic device are air cooling and liquid cooling. The air cooling is a heat dissipation mode that natural wind or a fan is utilized, a heat dissipation fan is additionally arranged at one end of an electronic device, and the other end of the electronic device flows out of a ventilation hole, so that air flows around the electronic device or among gaps at an accelerated speed to take away high heat generated during the operation of the electronic device, and the liquid cooling heat dissipation mode takes away the heat generated by the electronic device through liquid convection heat exchange to reduce the temperature of the electronic device.

In the prior art, the most common heat dissipation mode of the direct-insert electronic device is air cooling, and a heat radiator is directly attached to the back of a package and then is matched with a fan to take away heat. Along with the continuous rise of the heat consumption of the electronic device and the continuous reduction of the product volume, the air-cooled heat dissipation limit is lower, the occupied volume of the air-cooled heat dissipation mode is larger, meanwhile, the thermal interface material between the heat radiator and the electronic device cannot be well attached to the heat radiator and the electronic device, so that the heat resistance between the heat radiator and the electronic device is high, and the heat dissipation performance is insufficient.

Disclosure of Invention

The present specification provides a cold plate fastening heat dissipation structure and a printed circuit board assembly to overcome at least one technical problem in the prior art.

In a first aspect, according to the present description, there is provided a cold plate fastening heat dissipation structure comprising:

the cold plate is internally provided with an internal flow passage; the cold plate is at least provided with a pair of working medium inlets and working medium outlets; the working medium inlet and the working medium outlet are respectively communicated with the inner flow passage;

the heat dissipation working medium enters the inner flow channel from the working medium inlet, circulates in the inner flow channel and flows out from the working medium outlet;

the inner runner is provided with one or more first flow disturbing columns; the first turbulence column is provided with a threaded blind hole, and an opening of the threaded blind hole is formed in the surface of the cold plate.

Optionally, a second turbulence column is further included; and a plurality of second flow disturbing columns are arranged in the inner flow passage.

Further optionally, the second turbulence columns and the first turbulence columns are arranged in an array.

Optionally, the cold plate comprises a housing, a cover plate fastened to the housing; the inner flow passage which is sealed relatively is formed between the shell and the cover plate; the opening of the threaded blind hole is arranged on the outer surface of the cover plate and/or on the outer surface of the shell.

Further optionally, a sealing ring is disposed between the housing and the cover plate.

Optionally, the cold plate and the first spoiler column are both thermally conductive materials.

In a second aspect, according to the present specification, there is provided a printed circuit board assembly comprising: a PCB board, one or more in-line electronic devices, and the cold plate fastening heat dissipation structure of the first aspect; the direct-insert electronic device is provided with a through hole; the direct-insert electronic device is installed on the PCB and sequentially penetrates through the through hole and the threaded blind hole through bolts to be connected to the cold plate.

Optionally, a thermal interface material is disposed between the in-line electronic device and the cold plate.

Further optionally, the thermal interface material is a thermally conductive pad.

Optionally, the bolt is of a thermally conductive material.

The beneficial effects of this description are as follows:

on the one hand, the cold plate fastening heat dissipation structure adopts a mode of combining large and small turbulence columns, so that the heat exchange area of a heat dissipation working medium is increased, the speed uniformity of each position of a flow field in a cold plate is improved, and the heat dissipation performance of the cold plate is effectively improved. Meanwhile, the threaded blind hole is formed in the large turbulence column, a mounting position is provided for the device to be cooled, the device to be cooled can transmit the heat inside the device to the turbulence column through the bolt, and the improvement of the cooling efficiency and the cooling effect of the device to be cooled is facilitated.

On the other hand, the printed circuit board assembly adopts the direct-insert electronic device, the through hole in the direct-insert electronic device is penetrated through by the bolt, the direct-insert electronic device is connected with the cold plate, the PCB, the direct-insert electronic device and the heat dissipation structure are compactly assembled together, the integration is high, the bolt fastening structure can better provide the fastening force required by the thermal interface material, meanwhile, the compression degree of the thermal interface material can be controlled by controlling the bolt torque, the overall thermal resistance is small, the heat dissipation performance is good, the heat dissipation can be rapidly and effectively carried out on the electronic device, the good working environment is ensured, the service performance of the electronic device is improved, and the service life of the electronic device is prolonged.

The innovation points of the specification include:

1. the utility model discloses in, adopt the vortex mode that big or small vortex post combined together, big vortex post is in the heat transfer area of increase heat dissipation working medium, still it is more even to make the flow of the inside heat dissipation working medium of cold drawing, the effect of increase heat transfer power has been played, little vortex post is arranged in the clearance of big vortex post, both form the array structure of arranging, in the time of increase heat transfer area, the flow field speed distribution around big vortex post has been optimized, the speed homogeneity everywhere in the cold drawing is improved, the holistic heat dispersion of heat radiation structure has been improved, be one of the innovation point of this specification.

2. The utility model discloses in, the inside hollowing out and the tapping of big vortex post, the bolt for being used for connecting to treat heat dissipation device and cold drawing provides the fixed point, the problem of treating that the heat dissipation device is difficult for the installation that leads to because the cold drawing lateral wall is thin among the prior art has been solved, and simultaneously, wear to establish through the bolt and treat the heat dissipation device and install it on the cold drawing, can make the inside heat direct transmission of cold drawing to the vortex post on, the heat dissipation of treating the heat dissipation device has not only been accelerated, and the radiating effect of treating the heat dissipation device has been improved, guarantee to treat that the heat dissipation device can be effective quick dispels the heat everywhere, be one of the innovation point of this specification.

3. The utility model discloses in, on big vortex post branch was located the apron and the casing of cold drawing, and the big vortex post crisscross setting each other on the apron of branch locating the cold drawing and the casing, made this cold drawing fastening heat radiation structure can dispel the heat for treating the heat dissipation device as much as possible simultaneously to make each treat and have certain clearance between the heat dissipation device, guarantee good heat dispersion, be one of the innovation point of this specification.

4. The utility model discloses in, because the lateral wall of cold drawing is thinner relatively, add big or small turbulent flow post in the interior runner of cold drawing, can improve the structural strength of cold drawing, be one of the innovation point of this specification.

5. The utility model discloses in, printed circuit board assembly adopts and cut straightly formula electron device, and will cut straightly formula electron device and thermal interface material snap-on the cold drawing through the bolt, make the PCB board, the assembly is compact between cut straightly formula electron device and the heat radiation structure, integrate highly, the electron device is great area links to each other with the cold drawing, be favorable to electron device's heat dissipation, and cut straightly formula electron device's pin cartridge at the PCB board, make its radiating heat transfer route bypass the PCB board, help reducing the overall thermal resistance, heat dispersion is better, be one of the innovation point of this specification.

6. The utility model discloses in, adopt the bolt-up structure, establish thermal interface material clamp between electron device and cold plate through the bolt, not only provide its required fastening force for thermal interface material, can also further reduce overall thermal resistance through the degree that compresses tightly of control bolt torque control thermal interface material simultaneously, improve heat dispersion, be one of the innovation point of this specification.

Drawings

In order to more clearly illustrate the embodiments of the present disclosure or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present disclosure, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.

Fig. 1 is a perspective view of a cold plate fastening heat dissipation structure provided in an embodiment of the present disclosure;

fig. 2 is a front view of a cold plate fastening heat dissipation structure provided by an embodiment of the present description;

fig. 3 is a rear view of a cold plate fastening heat dissipation structure provided by an embodiment of the present description;

FIG. 4 is a front view of a cold plate fastening heat dissipation structure without a cover plate provided in an embodiment of the present disclosure;

fig. 5 is a schematic structural diagram of a cover plate in a cold plate fastening heat dissipation structure provided in an embodiment of the present disclosure;

FIG. 6 is a perspective view of a cover plate in a cold plate fastening heat dissipation structure provided in an embodiment of the present disclosure;

fig. 7 is a cross-sectional view of a cover plate in a cold plate fastening heat dissipation structure provided in an embodiment of the present disclosure;

FIG. 8 is a comparative liquid flow diagram for the presence and absence of turbulence columns in a cold plate fastening heat dissipation structure provided in an embodiment of the present disclosure; wherein, (a) is a liquid flow diagram provided with a flow disturbing column, and (b) is a liquid flow diagram without the flow disturbing column;

fig. 9 is a flow field velocity distribution diagram near a first spoiler column and a second spoiler column in a cold plate fastening heat dissipation structure according to an embodiment of the present disclosure;

fig. 10 is a schematic structural diagram of a printed circuit board assembly provided in an embodiment of the present disclosure;

fig. 11 is a schematic structural diagram of an in-line electronic device in a printed circuit board assembly according to an embodiment of the present disclosure;

fig. 12 is an exploded view of a printed circuit board assembly provided by embodiments of the present description; wherein the in-line electronic device of fig. 12 is shown with only a major portion thereof for a clearer representation of the various components of the printed circuit board assembly;

description of reference numerals: the structure comprises a cold plate 1, an inner flow channel 2, a working medium inlet 3, a working medium outlet 4, a first flow disturbing column 5, a threaded blind hole 6, a second flow disturbing column 7, a shell 8, a cover plate 9, an annular groove 10, a PCB 11, a direct-insert electronic device 12, a through hole 13, a bolt 14, a thermal interface material 15, a threaded blind hole 16 and a mounting hole 17.

Detailed Description

The technical solutions in the embodiments of the present disclosure will be clearly and completely described below with reference to the drawings in the embodiments of the present disclosure, and it is obvious that the described embodiments are only some embodiments of the present disclosure, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without any creative effort belong to the protection scope of the present invention.

It should be noted that the terms "including" and "having" and any variations thereof in the embodiments of the present specification and the drawings are intended to cover non-exclusive inclusions. For example, a process, method, system, article, or apparatus that comprises a list of steps or elements is not limited to only those steps or elements listed, but may alternatively include other steps or elements not listed, or inherent to such process, method, article, or apparatus.

The embodiment of the specification discloses a cold plate fastening heat dissipation structure, which is mainly used for absorbing heat from a device to be dissipated and dissipating the heat in a heat transfer mode. The following are detailed below.

Fig. 1 illustrates a cold plate fastening heat dissipation structure provided according to an embodiment of the present disclosure. As shown in fig. 1, the cold plate fastening heat dissipation structure mainly includes: the cold plate 1, a heat dissipation working medium (not shown in the figure) and the first turbulence column 5 dissipate heat by the heat dissipation working medium flowing in the cold plate 1 to take away heat.

The cold plate 1 is a main body part of the cold plate fastening heat dissipation structure, and an inner flow passage 2 is arranged in the cold plate 1 so that heat dissipation working media flow in the cold plate 1. Meanwhile, at least one pair of working medium inlet 3 and working medium outlet 4 is arranged on the cold plate 1, and the working medium inlet 3 and the working medium outlet 4 are respectively communicated with the inner runner 2, so that a heat dissipation working medium can enter the inner runner 2 of the cold plate 1 through the working medium inlet 3, circulate in the inner runner 2, take away the heat of a device to be dissipated, and flow out from the working medium outlet 4. The inner flow passage 2 may be designed as a direct flow passage as shown in fig. 1, and may also be designed as a curved passage, a serpentine passage, or the like.

In one embodiment, the cold plate 1 includes a housing 8 and a cover plate 9, the housing 8 is a cavity with an opening on one side, and the cover plate 9 is fastened to the housing 8, so that a relatively sealed cavity, i.e., the inner flow channel 2, is formed between the housing 8 and the cover plate 9. In the specific implementation process, a plurality of mounting holes 17 may be respectively formed at corresponding positions of the cover plate 9 and the housing 8, and the cover plate 9 is fixedly fastened to the housing 8 by sequentially penetrating the mounting holes 17 of the cover plate 9 and the housing 8 through screws (not shown).

Further, as the heat dissipation working medium flows in the inner flow channel 2 of the cold plate 1, the sealing property between the shell 8 and the cover plate 9 needs to be ensured, so as to prevent the liquid heat dissipation working medium in the inner flow channel 2 from flowing out of the cold plate 1 to pollute the electronic device, and even damage the electronic device. In a specific embodiment, a sealing ring (not shown) is disposed between the housing 8 and the cover plate 9, as shown in fig. 5 and 6, an annular groove 10 is disposed on an inner surface of the cover plate 9 opposite to the housing 8, and the sealing ring is disposed in the annular groove 10 to ensure the sealing property between the housing 8 and the cover plate 9 when the cover plate 9 is fastened to the housing 8. Of course, it is also possible to open the annular groove 10 on the inner surface of the housing 8 with respect to the cover 9, the sealing ring being arranged in the annular groove 10.

In the embodiment of the present description, the heat dissipation working medium functions to carry away a large amount of heat when the inner flow channel 2 of the cold plate 1 flows, so as to achieve the effect of cooling and heat dissipation.

The cold plate fastening heat dissipation structure in the embodiment of the present specification adopts a bolt connection mode to connect with an electronic device in an application process, so as to realize the bolt connection mode, a threaded hole corresponding to a bolt needs to be formed in the cold plate 1, and meanwhile, in order to ensure that a larger contact area exists between the heat dissipation device and the cold plate 1, the threaded hole needs to be formed in a side surface with a relatively larger area of the cold plate 1, but the inner wall of the cold plate 1 corresponding to the side surface with the relatively larger area of the cold plate 1 is thinner, and the cold plate fastening heat dissipation structure is not suitable for forming the threaded hole.

In the embodiment of the present specification, in order to provide a space for the threaded hole of the bolt, one or more first flow disturbing columns 5 are disposed in the inner flow channel 2 of the cold plate 1, and the inside of the first flow disturbing columns 5 is hollowed to be tapped, so that threaded blind holes are formed therein, and meanwhile, one end of an opening of each threaded blind hole is disposed on the surface of the cold plate 1, and the bolt for connection can connect a device to be cooled to the cold plate 1 by penetrating the threaded blind holes. On one hand, the first turbulence column 5 solves the problem that the thin wall of the cold plate 1 is not suitable for forming a threaded hole, provides a forming space for the threaded hole of a bolt for connection, enables a device to be cooled to be arranged on the side surface of the cold plate 1 with a relatively large area, greatly increases the contact area between the device to be cooled and the cold plate 1, and is beneficial to improving the cooling effect; on the other hand, the first flow disturbing column 5 is additionally arranged in the inner flow passage 2 where the heat dissipation working medium flows, so that the heat dissipation area of the cold plate 1 and the heat dissipation working medium can be increased, the flow of the heat dissipation working medium in the cold plate 1 can be more uniform, the effect of increasing the heat exchange power is achieved, and the heat dissipation effect is further improved. The number of the first turbulence columns 5 can be set according to the number of bolts in the specific implementation process and the related requirements of the heat dissipation working medium flow rate and the like. For an example, the opening end of the blind threaded hole is disposed on the cover plate 9 of the cold plate 1, as shown in fig. 7, a blind threaded hole 6 is disposed on the first turbulent flow column 5, and the opening end of the blind threaded hole 6 is disposed on the surface of the cover plate 9, so that a bolt for connection is inserted into the blind threaded hole 6.

In a particular embodiment, the opening of the blind threaded hole 6 is provided on the outer surface of the cover plate 9 and/or on the outer surface of the housing. In order to enable the cold plate fastening heat dissipation structure to perform heat dissipation operation on as many devices to be cooled as possible, referring to fig. 1-4, a plurality of openings 16 with blind threaded holes 6 are formed on the outer surface of the cover plate 9 and the outer surface of the housing 8, and a plurality of first turbulence columns 5 with corresponding blind threaded holes 6 are arranged in the inner flow channel 2. Further, the first flow disturbing columns 5 on the cover plate 9 and the first flow disturbing columns 5 in the shell 8 are arranged in a staggered mode, so that each threaded blind hole 6 is guaranteed to be connected with a to-be-cooled device through a bolt, the to-be-cooled devices connected to the cold plate 1 are guaranteed not to be overlapped, preferably, a certain interval is reserved between every two to-be-cooled devices connected to the same side surface of the cold plate 1, and good heat dissipation performance is guaranteed. In the specific implementation process, in order to ensure the tightness of the inner flow channel 2, the first turbulence column 5 is extended from the corresponding inner wall of the cold plate 1, as shown in fig. 7, that is, the first turbulence column 5 on the cover plate 9 is integrally formed with the cover plate 9, and correspondingly, the first turbulence column 5 in the housing is integrally formed with the housing.

In another specific embodiment, a plurality of second turbulence columns 7 are further disposed in the inner flow channel 2 of the cold plate 1, the volume of the second turbulence columns 7 is smaller than that of the first turbulence columns 5, preferably, the plurality of second turbulence columns 7 are arranged in gaps between the plurality of first turbulence columns 5, so that the plurality of second turbulence columns and the first turbulence columns 5 are arranged in an array, the heat exchange area is further increased, the velocity distribution of the flow field around the first turbulence columns 5 with a larger volume is optimized, and the velocity uniformity of each position of the flow field is improved (as shown in fig. 9), so as to improve the heat dissipation performance of the cold plate fastening heat dissipation structure.

In the embodiment of the present specification, the inner flow channel 2 of the cold plate 1 forms a mesh flow channel by the flow disturbing columns of a plurality of sizes arranged in an array, and the flow speed of the heat dissipation working medium in the inner flow channel 2 is controlled while the heat exchange area is increased, so that the heat dissipation working medium can exchange heat with the device to be cooled at a relatively stable flow speed in the inner flow channel 2, and further the working temperature of the device to be cooled is kept constant. Meanwhile, the structural strength of the cold plate is improved due to the arrangement of the large and small turbulence columns. The shapes of the first turbulence column 5 and the second turbulence column 7 can be designed according to specific needs, including but not limited to a cylinder, a polygonal cylinder, an ellipsoid, and the like.

As shown in fig. 8, fig. 8 (a) shows a velocity vector diagram of the flow channel 2 in the cold plate 1 with the large and small turbulence columns, and fig. 8 (b) shows a velocity vector diagram of the flow channel 2 in the cold plate 1 without the large and small turbulence columns, which are shown in fig. 8, and further prove that the flow of the heat dissipation working medium in the flow channel 2 in the cold plate 1 can be more uniform and the flow rate is more stable due to the added large and small turbulence columns.

In addition, cold drawing 1, first turbulent flow post 5 of this cold drawing fastening heat radiation structure are the heat conduction material, and further preferred, second turbulent flow post 7 is the heat conduction material also, has strengthened cold drawing fastening heat radiation structure's heat conductivility, has improved its radiating effect. Treat that the heat dissipation device contacts with cold drawing 1 large tracts of land, transmit its heat to cold drawing 1 on, and then transmit to the first spoiler post 5 that links to each other with cold drawing 1, on the second spoiler post 7, thereby make heat dissipation working medium accessible and the cold drawing 1 inner wall of rather than contact, first spoiler post 5, second spoiler post 7 absorbs the heat, heat transfer area has been increased, simultaneously, because first spoiler post 5 internally mounted has the bolt that is used for connecting and treats the heat dissipation device, make treat that the heat dissipation device can directly pass through the bolt with heat transfer to first spoiler post 5 on, in order to transmit the heat to the heat dissipation working medium that flows from first spoiler post 5, further improve heat dispersion, treat the heat dissipation of heat dissipation device, the radiating effect and efficiency have been improved.

To sum up, this specification discloses a cold drawing fastening heat radiation structure, adopts the mode that big or small turbulence column combined together, increases the heat transfer area of heat dissipation working medium, improves the speed homogeneity everywhere in the cold drawing, has effectively improved the heat dispersion of cold drawing. Meanwhile, the threaded blind hole is formed in the large turbulence column, a mounting position is provided for the device to be cooled, the device to be cooled can transmit the heat inside the device to the turbulence column through the bolt, and the improvement of the cooling efficiency and the cooling effect of the device to be cooled is facilitated.

With the continuous rise of heat consumption of electronic devices and the continuous reduction of product volume, the problems of low air-cooled heat dissipation limit and large occupied volume are gradually highlighted. In comparison, the liquid cooling heat dissipation mode is easier to integrate with the vehicle-mounted shell, and the water circulation advantage of the vehicle body can be utilized, so that the liquid cooling heat dissipation mode is easier to integrate with the existing system of the vehicle body. In addition, in the prior art, because there is an insulation requirement between the circuits of each layer of the Printed Circuit Board (PCB), FR4 material, i.e. an electrical insulation pad with a thickness specification of more than 0.1mm, is used, which can significantly increase the thermal resistance and affect the heat dissipation performance of the chip electronic device.

Based on this, this specification embodiment also discloses a printed circuit board assembly, as shown in fig. 10, fig. 12, this printed circuit board assembly mainly includes: a PCB board 11, one or more in-line electronic devices 12, and a cold plate fastening heat dissipation structure as provided in the previous embodiments.

The cold plate fastening heat dissipation structure mainly includes a cold plate 1, a heat dissipation working medium (not shown in the figure), and a first turbulence column 5, and the specific structure and principle thereof are the same as those of the foregoing embodiments.

As shown in fig. 11, the in-line electronic component 12 is provided with a through hole 13. In the specific embodiment, the direct-insert electronic device 12 is installed on the PCB 11, that is, the pin of the direct-insert electronic device 12 is inserted into the socket of the PCB 11 for packaging, and the through hole 13 and the threaded blind hole 6 are sequentially penetrated through by the bolt 14 to connect the direct-insert electronic device 12 to the cold plate 1, so as to further fix the PCB 11, and meanwhile, the direct-insert electronic device 12 is connected with the cold plate 1 in a large area, thereby being beneficial to the direct-insert electronic device 12 to transmit the heat of the direct-insert electronic device 12 to the cold plate 1 and rapidly dissipating the heat of the direct-insert electronic device.

In the embodiment of the present disclosure, the in-line electronic device 12 may be directly fixed on the PCB 11 through pins, and the side surface of the in-line electronic device is fixed on the cold plate 1 through the through holes 13 by the bolts 14, so that the PCB 11, the in-line electronic device 12 and the cold plate 1 can be compactly assembled together, and the heat transfer path of the printed circuit board assembly can bypass the PCB 11, which is beneficial to reducing the overall thermal resistance.

In a specific embodiment, the thermal interface material 15 is arranged between the direct-insert electronic device 12 and the cold plate 1, and since the direct-insert electronic device 12 is connected with the cold plate 1 through the bolt 14 and the thermal interface material 15 is arranged between the direct-insert electronic device 12 and the cold plate 1, the pressing force applied to the thermal interface material 15 can be controlled by controlling the pre-tightening force of the bolt 14, so that the adhesion degree of the thermal interface material 15 is ensured, the thermal resistance is reduced, and the problems of high thermal resistance and insufficient heat dissipation performance caused by the lack of a pressing design of the thermal interface material between the radiator and the electronic device in the prior art are effectively solved. The thermal interface material 15 in the embodiment of the present disclosure is an assembly of materials used for being disposed between the in-line electronic device 12 and the cold plate 1 to reduce the contact thermal resistance between the in-line electronic device 12 and the cold plate 1, and in a specific implementation process, the thermal interface material 15 may be a thermal pad. In addition, it should be noted and understood that, when the thermal interface material 15 is disposed between the in-line electronic device 12 and the cold plate 1, the bolt 14 is required to be sequentially inserted into the through hole 13, the thermal interface material 15, and the blind threaded hole 6 for installation when the bolt 14 is installed, and since the thermal interface material 15 is easily penetrated by the bolt 14, the thermal interface material 15 may be provided with a corresponding through hole, or the thermal interface material 15 may not be provided with any through hole.

In another specific embodiment, the bolt 14 is made of a heat conductive material, so that heat inside the direct-insert electronic device 12 can be transferred to the first turbulence column 5 through the bolt 14, and the heat inside the direct-insert electronic device 12 is taken away through the heat dissipation working medium, thereby realizing heat dissipation inside the direct-insert electronic device 12, further improving the heat dissipation effect of the direct-insert electronic device 12, and effectively ensuring the stability of the temperature of the working environment of the direct-insert electronic device 12.

To sum up, this specification discloses a printed circuit board subassembly, adopt and cut straightly formula electron device to wear to establish the through-hole on the formula electron device of cuting straightly through the bolt, link to each other formula electron device and cold drawing, make the compact assembly of PCB board, formula electron device and heat radiation structure together, it is high to integrate, and the required fastening force of thermal interface material can be better provided to the structure of bolt-up, can also be through the degree that compresses tightly of control bolt torque control thermal interface material simultaneously, the overall thermal resistance is little, heat dispersion is good, can dispel the heat to electron device effectively fast, guaranteed its good operational environment, the performance of electron device has been improved, and the life of electron device has been prolonged.

It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.

In addition, in the description of the embodiments of the present invention, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.

In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention.

Finally, it is to be noted that: the above-mentioned embodiments are only specific embodiments of the present invention, and are not intended to limit the technical solution of the present invention, and the protection scope of the present invention is not limited thereto, although the present invention is described in detail with reference to the foregoing embodiments, those skilled in the art should understand that: those skilled in the art can still modify or easily conceive of changes in the technical solutions described in the foregoing embodiments or make equivalent substitutions for some technical features within the technical scope of the present disclosure; such modifications, changes or substitutions do not substantially depart from the spirit and scope of the embodiments of the present invention, and are intended to be included within the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.

Claims (10)

1. A cold plate fastening heat dissipation structure, comprising:

the cold plate is internally provided with an internal flow passage; the cold plate is at least provided with a pair of working medium inlets and working medium outlets; the working medium inlet and the working medium outlet are respectively communicated with the inner flow passage;

the heat dissipation working medium enters the inner flow channel from the working medium inlet, circulates in the inner flow channel and flows out from the working medium outlet;

the inner runner is provided with one or more first flow disturbing columns; the first turbulence column is provided with a threaded blind hole, and an opening of the threaded blind hole is formed in the surface of the cold plate.

2. The cold plate fastening heat dissipating structure of claim 1, further comprising a second turbulence column; and a plurality of second flow disturbing columns are arranged in the inner flow passage.

3. The cold plate fastening heat dissipation structure of claim 2, wherein the second turbulator posts are arranged in an array with the first turbulator posts.

4. The cold plate fastening heat dissipation structure of claim 1, wherein the cold plate comprises a housing, a cover plate fastened to the housing; the inner flow passage which is sealed relatively is formed between the shell and the cover plate; the opening of the threaded blind hole is arranged on the outer surface of the cover plate and/or on the outer surface of the shell.

5. The cold plate fastening heat dissipation structure of claim 4, wherein a seal is disposed between the housing and the cover plate.

6. The cold plate fastening heat dissipating structure of claim 1, wherein the cold plate and the first turbulator post are both thermally conductive materials.

7. A printed circuit board assembly, comprising: a PCB board, one or more in-line electronic devices, and the cold plate-secured heat dissipating structure of any of claims 1-6; the direct-insert electronic device is provided with a through hole; the direct-insert electronic device is installed on the PCB and sequentially penetrates through the through hole and the threaded blind hole through bolts to be connected to the cold plate.

8. The printed circuit board assembly of claim 7, wherein a thermal interface material is disposed between the in-line electronic device and the cold plate.

9. The printed circuit board assembly of claim 8, wherein the thermal interface material is a thermal pad.

10. The printed circuit board assembly of claim 7, wherein the bolt is a thermally conductive material.

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