CN207706615U - A kind of radiator - Google Patents
A kind of radiator Download PDFInfo
- Publication number
- CN207706615U CN207706615U CN201820017186.5U CN201820017186U CN207706615U CN 207706615 U CN207706615 U CN 207706615U CN 201820017186 U CN201820017186 U CN 201820017186U CN 207706615 U CN207706615 U CN 207706615U
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- heat
- cooling fin
- chip unit
- conducting plate
- radiating
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Abstract
The utility model discloses a kind of radiators, including radiating subassembly, and with the matched circuit board of the radiating subassembly, the radiating subassembly includes heat-conducting plate, and multiple first cooling fins being detachably connected with the heat-conducting plate, parallel interval is arranged between adjacent first cooling fin；The circuit board includes substrate, and is set to multiple chip units of the upper surface of base plate, and the bottom surface of the heat-conducting plate is tightly attached to the upper surface of the multiple chip unit., can be according to the heating temperature of heat-conducting plate bottom surface difference chip unit since the first cooling fin is mutually clamped with heat-conducting plate with the radiator of this structure design, the flexible quantity for adjusting the first cooling fin then effectively promotes the radiating efficiency of the radiating subassembly.
Description
Technical field
The utility model is related to LED display technical field more particularly to a kind of radiators.
Background technology
It flourishes with high-tech, electronic product intelligence and complication, the volume of electronic component increasingly tends to be small
Change, the closeness on unit area is also more and more high.And it is electronic product in operational process that such case, which is brought, which directly affects,
The heat of middle generation is increasing.If excluding hot caused by electronics, these excessively high temperature without good radiating mode
Phenomena such as degree will cause electronic component to generate free electronics and thermal stress, whole stability is caused to reduce, and shortens electronics
The service life of element itself.Therefore, these heats how to be excluded to avoid the overheat of electronic component, always are that be can not be ignored asks
Topic.
Since the chip on PCB is different, temperature when work is different, if will appear temperature using the radiator of unified adaptation
It spends higher chip and is unable to rapid cooling, heat dissipation is uneven, and chip performance is caused to decline.
Therefore, it is necessary to propose a kind of new radiator, to solve the above technical problems.
Utility model content
The purpose of this utility model is to provide a kind of simple in structure, heat dissipation is uniform, can be adjusted flexibly according to calorific value
The radiator of cooling fin quantity.
For this purpose, the utility model uses following technical scheme：
A kind of radiator, including radiating subassembly, and with the matched circuit board of the radiating subassembly, the heat dissipation group
Part includes heat-conducting plate, and multiple first cooling fins being detachably connected with the heat-conducting plate, adjacent first cooling fin it
Between parallel interval be arranged；The circuit board includes substrate, and is set to multiple chip units of the upper surface of base plate, described
The bottom surface of heat-conducting plate is tightly attached to the upper surface of the multiple chip unit.
Wherein, planar projections, the upper surface one parallel interval of the planar projections are provided in the middle part of the heat-conducting plate
It is provided with the second cooling fin.
Wherein, parallel interval is provided with multiple radiating grooves, institute respectively for the upper surface of the heat-conducting plate of the planar projections both sides
The first cooling fin is stated to be inserted in the radiating groove and be mutually clamped with the radiating groove.
Wherein, parallel interval is provided with multiple radiating grooves, phase respectively for the upper surface of the heat-conducting plate of the planar projections both sides
Partition wall upper surface between the adjacent radiating groove is connected with first cooling fin.
Wherein, the thickness of first cooling fin is more than the thickness of second cooling fin, first cooling fin and institute
State being equal in length for the second cooling fin.
Wherein, the multiple chip unit include be located at the substrate in the middle part of metal-oxide-semiconductor chip unit, be located at the MOS
The red chip unit of tube core blade unit side, blue chip unit, Yi Jiwei positioned at the metal-oxide-semiconductor chip unit other side
Green Chip unit on the outside of the blue chip unit.
Wherein, the metal-oxide-semiconductor chip unit is located at the underface of the planar projections.
The beneficial effects of the utility model：The utility model includes radiating subassembly, and is matched with the radiating subassembly
Circuit board, the radiating subassembly includes heat-conducting plate, and multiple first cooling fins being detachably connected with the heat-conducting plate, phase
Parallel interval is arranged between adjacent first cooling fin；The circuit board includes substrate, and is set to the upper surface of base plate
Multiple chip units, the bottom surface of the heat-conducting plate is tightly attached to the upper surface of the multiple chip unit.With this structure design
Radiator can be according to heat-conducting plate bottom surface difference chip since the first cooling fin is detachably connected with heat-conducting plate
The heating temperature of unit, the flexible quantity for adjusting the first cooling fin, then effectively promotes the radiating efficiency of the radiating subassembly.
Description of the drawings
Fig. 1 is a kind of exploded view of radiator of the utility model.
Fig. 2 is a kind of sectional view of radiator of the utility model.
Fig. 3 is the end view drawing of radiating subassembly in Fig. 1.
Fig. 4 is the vertical view of Fig. 3.
Specific implementation mode
Further illustrate the technical solution of the utility model below with reference to the accompanying drawings and specific embodiments.
In conjunction with shown in Fig. 1 to Fig. 4, a kind of radiator in the present embodiment, including radiating subassembly 1, and with radiating subassembly 1
Matched circuit board 2, radiating subassembly 1 include heat-conducting plate 11, and multiple first cooling fins 12 with the clamping of 11 phase of heat-conducting plate,
Parallel interval is arranged between adjacent first cooling fin 12；Circuit board 2 includes substrate 21, and is set to the more of 21 upper surface of substrate
A chip unit, the bottom surface of heat-conducting plate 11 are tightly attached to the upper surface of multiple chip units.
Specifically, in conjunction with shown in Fig. 1, Fig. 3 and Fig. 4, the middle part of heat-conducting plate 11 is provided with planar projections 13, planar projections 13
Upper surface one parallel interval be provided with the second cooling fin 14.
As the preferred embodiment of the present embodiment, in present embodiment, the heat-conducting plate 11 of 13 both sides of planar projections it is upper
Parallel interval is provided with multiple radiating grooves 15 respectively on surface, the first cooling fin 12 be inserted in radiating groove 15 and with 15 phase card of radiating groove
It connects, the installation number and position of the first cooling fin can be adjusted flexibly according to the calorific value of lower die unit with this,
And then effectively promote the radiating efficiency of the radiating subassembly.
As the another preferred embodiment of the present embodiment, in the embodiment, the heat-conducting plate 11 of 13 both sides of planar projections
Parallel interval is provided with multiple radiating grooves 15 respectively for upper surface, the partition wall upper surface between adjacent heat radiation slot 15 is connected with first
Cooling fin 12.
In the present embodiment, the thickness of the first cooling fin 12 is more than the thickness of the second cooling fin 14, the first cooling fin 12 and the
Two cooling fins 14 are equal in length.
In addition, in conjunction with shown in Fig. 4, the both sides of heat-conducting plate are reserved with installation position in the present embodiment, in order to which the later stage carries out
It is used when machining or assembly.
In the present embodiment, multiple chip units include the metal-oxide-semiconductor chip unit 22 for being located at 21 middle part of substrate, are located at metal-oxide-semiconductor
The red chip unit 23 of 22 side of chip unit, positioned at 22 other side of metal-oxide-semiconductor chip unit blue chip unit 24 and
Green Chip unit 25 positioned at 24 outside of blue chip unit.
Metal-oxide-semiconductor chip unit 22 is located at the underface of planar projections 13.It is metal-oxide-semiconductor chip unit 22 in the present embodiment, red
Color chip unit 23, blue chip unit 24, Green Chip unit 25 have multiple independent chips to set in a row successively.
As being explained further for the present embodiment, the calorimeter method of the present embodiment chips is as follows：
It illustrates：50 degree of environment temperature highest, according to work formula and parameter,
Red chip PD (act)=(0.01*5)+(0.018*1* (5-2.1) * 16)=0.8852W；
Temperature is upgraded to：63 DEG C of 70.9*0.8852 ≈, 50 degree of environment temperature highests, then chip maximum temperature is 113 DEG C.
Similarly：
Green Chip PD (act)=(0.01*5)+(0.015*1* (5-3.2) * 16)=0.482W；
Temperature is upgraded to：34 DEG C of 70.9*0.482 ≈, 50 degree of environment temperature highests, then chip maximum temperature is 84 DEG C.
Blue chip PD (act)=(0.01*5)+(0.01*1* (5-3.4) * 16)=0.306W；
Temperature is upgraded to：22 DEG C of 70.9*0.306 ≈, 50 degree of environment temperature highests, then chip maximum temperature is 72 DEG C.
For metal-oxide-semiconductor in 2A output currents, output impedance is 100m Ω.Thermal resistance is 188oC/W；Assuming that LED display is bright
Efficient degree is 75%, then：
Consuming power is：PD=I2R=22*0.1=0.4W
Then temperature is upgraded to：0.4*188*75%=56.4 DEG C
50 degree of environment temperature, chip maximum temperature are：106.4℃.
Above-mentioned value of bringing into is the original included parameter of chip during production.To obtain 113 DEG C of red chip maximum temperature,
84 DEG C of Green Chip, 72 DEG C of blue chip, 106.4 DEG C of metal-oxide-semiconductor chip, it can thus be appreciated that the high chip of temperature needs the heat dissipation of bigger
Space；The red chip is set to one single side of pcb board, and the metal-oxide-semiconductor chip is set to pcb board stage casing, Green Chip, indigo plant
Color chip is set to another single side of pcb board, and the distance of the Green Chip and blue chip setting is closer, blue chip with
Metal-oxide-semiconductor chip distance is closer, and red chip installation position is far from metal-oxide-semiconductor chip.
The radiator designed using the above structure, by changing the quantity of the first cooling fin come the chip to different temperatures
It radiates, reduces the chip performance caused by heat dissipation distribution is uneven and decline, be arranged using dismountable first cooling fin, made
Must be laid out chip when, pay the utmost attention to functionality, thermal diffusivity can at any time be adjusted according to the temperature of chip, and Installation Flexibility is strong,
Assembling process is simple, sense that the user experience is improved.
The technical principle of the utility model is described above in association with specific embodiment.These descriptions are intended merely to explain this reality
With novel principle, and it cannot be construed to the limitation to scope of protection of the utility model in any way.Based on the explanation herein,
Those skilled in the art would not require any inventive effort the other specific implementation modes that can associate the utility model,
These modes are fallen within the scope of protection of the utility model.
Claims (7)
1. a kind of radiator, including radiating subassembly, and with the matched circuit board of the radiating subassembly, it is characterised in that:
The radiating subassembly includes heat-conducting plate, and multiple first cooling fins being detachably connected with the heat-conducting plate, and adjacent described
Parallel interval is arranged between one cooling fin；The circuit board includes substrate, and is set to multiple cores of the upper surface of base plate
Blade unit, the bottom surface of the heat-conducting plate are tightly attached to the upper surface of the multiple chip unit.
2. a kind of radiator according to claim 1, it is characterised in that：It is convex it to be provided with plane in the middle part of the heat-conducting plate
It rises, the upper surface one parallel interval of the planar projections is provided with the second cooling fin.
3. a kind of radiator according to claim 2, it is characterised in that：The heat-conducting plate of the planar projections both sides it is upper
Parallel interval is provided with multiple radiating grooves respectively on surface, first cooling fin be inserted in the radiating groove and with the radiating groove
Mutually it is clamped.
4. a kind of radiator according to claim 2, it is characterised in that：The heat-conducting plate of the planar projections both sides it is upper
Parallel interval is provided with multiple radiating grooves respectively on surface, and the partition wall upper surface between the adjacent radiating groove is connected with described first
Cooling fin.
5. a kind of radiator according to claim 2, it is characterised in that：The thickness of first cooling fin is more than described
The thickness of second cooling fin, first cooling fin are equal in length with second cooling fin.
6. a kind of radiator according to claim 2, it is characterised in that：The multiple chip unit includes positioned at described
Metal-oxide-semiconductor chip unit in the middle part of substrate, positioned at metal-oxide-semiconductor chip unit side red chip unit, be located at the metal-oxide-semiconductor
The blue chip unit of the chip unit other side and the Green Chip unit on the outside of the blue chip unit.
7. a kind of radiator according to claim 6, it is characterised in that：The metal-oxide-semiconductor chip unit is located at described flat
The underface of face protrusion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820017186.5U CN207706615U (en) | 2018-01-02 | 2018-01-02 | A kind of radiator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820017186.5U CN207706615U (en) | 2018-01-02 | 2018-01-02 | A kind of radiator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207706615U true CN207706615U (en) | 2018-08-07 |
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ID=63034541
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820017186.5U Active CN207706615U (en) | 2018-01-02 | 2018-01-02 | A kind of radiator |
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| Country | Link |
|---|---|
| CN (1) | CN207706615U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107969099A (en) * | 2018-01-02 | 2018-04-27 | 深圳市德彩光电有限公司 | A kind of radiator |
| CN110970700A (en) * | 2019-12-23 | 2020-04-07 | 李居强 | Heat radiation structure and mobile communication antenna device |
-
2018
- 2018-01-02 CN CN201820017186.5U patent/CN207706615U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107969099A (en) * | 2018-01-02 | 2018-04-27 | 深圳市德彩光电有限公司 | A kind of radiator |
| CN110970700A (en) * | 2019-12-23 | 2020-04-07 | 李居强 | Heat radiation structure and mobile communication antenna device |
| CN110970700B (en) * | 2019-12-23 | 2021-11-30 | 李居强 | Heat radiation structure and mobile communication antenna device |
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Legal Events
| Date | Code | Title | Description |
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP03 | "change of name, title or address" |
Address after: 518000 201, No. 13, Huiye Road, Tangjia community, Fenghuang street, Guangming District, Shenzhen City, Guangdong Province Patentee after: Shendecai photoelectric (Shenzhen) Co., Ltd Address before: 518000 Guangdong province Shenzhen Guangming New District Gongming building village community Zhongtai road 18 German color Industrial Park Patentee before: Shenzhen Dicolor Optoelectronics Co., Ltd. |
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| CP03 | "change of name, title or address" | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 518000 201, No. 13, Huiye Road, Tangjia community, Fenghuang street, Guangming District, Shenzhen City, Guangdong Province Patentee after: Shendecai Technology (Shenzhen) Co., Ltd Address before: 518000 201, No. 13, Huiye Road, Tangjia community, Fenghuang street, Guangming District, Shenzhen City, Guangdong Province Patentee before: Shendecai photoelectric (Shenzhen) Co.,Ltd. |
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| CP01 | Change in the name or title of a patent holder |