CN110868838A - A vapor chamber radiator - Google Patents

Abstract

The invention discloses a temperature-equalizing plate radiator which comprises a substrate and radiating fins, wherein a plurality of groups of radiating fins are arranged at one end of the outer wall of the substrate, the substrate is fixed with the radiating fins in a welding mode, the substrate comprises a first heated part and a second heated part, the first heated part and the second heated part are not communicated with each other, the interiors of the first heated part and the second heated part are both hollow tubular, the radiating fins comprise a first radiating part and a second radiating part, the first radiating part and the second radiating part are not communicated with each other, a first channel is arranged in the first radiating part, the first channel is communicated with the interior of the first heated part, a second channel is arranged in the second radiating part, and the second channel is communicated with the interior of the second heated part. Has the advantages that: compared with radiators with the same size and the same radiating area, the radiator is high in radiating efficiency and strong in practicability, and has very important significance.

Description

A vapor chamber radiator

technical field

The present invention relates to the technical field of heat dissipation of a vapor chamber, in particular to a vapor chamber radiator for efficient heat dissipation of large outdoor products.

Background technique

Large-scale outdoor electrical products, such as LED billboards, signs and other outdoor equipment, will generate a lot of heat when they are used. If they are not dissipated in time, their use will be affected. Radiators are installed in large outdoor products, usually using natural air convection to dissipate heat.

However, the existing radiators have certain disadvantages in use:

1. At present, this type of radiator is fixed by riveting between the base plate and the heat sink, and the heat dissipation efficiency is low;

2. At present, the substrates are all single-channel for heat dissipation. It has been verified by experiments that the heat dissipation effect near the top of the substrate is poor.

In view of the problems in related technologies, we propose a vapor chamber radiator for efficient heat dissipation of large outdoor products.

SUMMARY OF THE INVENTION

(1) Technical problems solved

Aiming at the deficiencies of the prior art, the present invention provides a vapor chamber radiator, which improves the heat dissipation efficiency, enables large outdoor products to efficiently dissipate heat, and further solves the above-mentioned problems in the background art.

(2) Technical solutions

For achieving the above object, the concrete technical scheme adopted in the present invention is as follows:

A heatsink for a uniform temperature plate includes a base plate and a heat sink, one end of the outer wall of the base plate is provided with several groups of heat sinks, and the base plate is fixed with the heat sink by welding, and the base plate includes a first heat receiving part and a second heat sink. The heat receiving part, the first heat receiving part and the second heat receiving part are not connected with each other, and the interiors of the first heat receiving part and the second heat receiving part are both hollow tubular, and the heat sink includes a first heat sink and a second heat sink The first heat dissipation part and the second heat dissipation part do not communicate with each other, the first heat dissipation part is provided with a first channel inside, the first channel communicates with the interior of the first heat receiving part, and the second heat dissipation part A second channel is arranged inside the second channel, and the second channel communicates with the inside of the second heat receiving part.

Further, capillary structures are provided in both the first heat receiving portion and the second heat receiving portion of the substrate.

Further, the first channel includes a channel 1, a channel 2 and a channel 3, the head and tail of the channel 1 are respectively communicated with the channel 2 and the channel 3, and the other ends of the channel 2 and the channel 3 are communicated with the inside of the first heat receiving part. .

Further, the second channel includes channel 4, channel 5 and channel 6, the head and tail of the channel 4 are respectively communicated with the channel 5 and the channel 6, and the other ends of the channel 5 and the channel 6 are connected with the inside of the second heat receiving part. Connected.

Further, the interiors of the first heat receiving part and the second heat receiving part and the first channel and the second channel are all vacuum.

Further, the interiors of the first heat receiving part and the second heat receiving part are filled with liquid working medium.

(3) Beneficial effects

Compared with the prior art, the present invention provides a vapor chamber radiator, which has the following beneficial effects:

The base plate and the heat sink are connected together, and the interior is connected, which greatly reduces the contact thermal resistance between the base plate and the heat sink, and improves the heat dissipation efficiency. Compared with the heat sink of the same size and the same heat dissipation area, this product has high heat dissipation efficiency and strong practicability; The interior of the substrate is divided into multiple groups of structures according to the anti-heating power and the position of the chip, which is of great significance to overcome the problems of poor heat dissipation at the top.

Description of drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the accompanying drawings required in the embodiments will be briefly introduced below. Obviously, the drawings in the following description are only some of the present invention. In the embodiments, for those of ordinary skill in the art, other drawings can also be obtained according to these drawings without any creative effort.

1 is a schematic structural diagram of a front view of a vapor chamber radiator according to an embodiment of the present invention;

Fig. 2 is according to the upper part exploded structure schematic diagram of Fig. 1;

Fig. 3 is according to the lower part exploded structure schematic diagram of Fig. 1;

4 is a schematic structural diagram of a right side view of a vapor chamber radiator according to an embodiment of the present invention;

5 is a schematic structural diagram of a top view of a vapor chamber radiator according to an embodiment of the present invention;

FIG. 6 is a schematic diagram of the heat dissipation principle according to the upper part of the structure of FIG. 1;

FIG. 7 is a schematic diagram of the heat dissipation principle according to the lower part of the structure of FIG. 1 .

In the picture:

1. Substrate; 2. Heat sink; 3. First heat receiving part; 4. Second heat receiving part; 5. First heat dissipation part; 6, Second heat dissipation part; 71, Channel one; 72, Channel two; Three; 81, channel four; 82, channel five; 83, channel six.

Detailed ways

In order to further illustrate the various embodiments, the present invention provides accompanying drawings, which are part of the disclosure of the present invention, and are mainly used to illustrate the embodiments, and can be used in conjunction with the relevant descriptions in the specification to explain the operation principles of the embodiments. For these, those of ordinary skill in the art will understand other possible implementations and the advantages of the present invention. Components in the figures are not drawn to scale, and similar component symbols are generally used to represent similar components.

According to an embodiment of the present invention, a vapor chamber heat sink is provided.

The present invention will now be further described in conjunction with the accompanying drawings and specific embodiments, as shown in Figures 1 to 7:

The vapor chamber radiator of this embodiment includes a base plate 1 and a heat sink 2. One end of the outer wall of the base plate 1 is provided with several sets of heat sinks 2, and the base plate 1 is fixed to the heat sink 2 by welding, and the heat sink 2 is connected to the heat sink 2. The number of openings at the top of the connection surface of the substrate 1 must be greater than the number of bottoms. The interior of the substrate 1 and the heat sink 2 are completely sealed. The substrate 1 includes a first heat receiving part 3 and a second heat receiving part 4. The first heat receiving part 3 and the second heat receiving part The heat receiving parts 4 are not communicated with each other, and the interiors of the first heat receiving part 3 and the second heat receiving part 4 are both hollow tubes. The heat sink 2 includes a first heat dissipation part 5 and a second heat dissipation part 6. The heat dissipation part 5 and the second heat dissipation part 6 do not communicate with each other. The first heat dissipation part 5 is provided with a first channel inside, and the first channel communicates with the inside of the first heat receiving part 3 . A second channel is provided inside, and the second channel communicates with the inside of the second heat receiving part 4 .

In the vapor chamber heat sink of this embodiment, capillary structures are provided in the first heat receiving portion 3 and the second heat receiving portion 4 of the substrate 1 .

In the vapor chamber radiator of this embodiment, the first channel includes a first channel 71, a second channel 72 and a third channel 73. The first and last channels of the first channel 71 are connected to the second channel 72 and the third channel 73 respectively, and the second channel 72 and the other end of the third channel 73 communicate with the inside of the first heat receiving part 3 , and the first heat receiving part 3 , the first channel 71 , the second channel 72 and the third channel 73 form a circulation loop.

In the vapor chamber radiator of this embodiment, the second channel includes a channel four 81, a channel five 82 and a channel six 83, the head and tail of the channel four 81 are respectively connected with the channel five 82 and the channel six 83, and the channel five 82 and the other end of the sixth channel 83 communicate with the inside of the second heat receiving part 4 , and the second heat receiving part 4 , the fourth channel 81 , the fifth channel 82 and the sixth channel 83 form a loop.

In the vapor chamber heat sink of this embodiment, the first heat receiving part 3 and the second heat receiving part 4 and the inside of the first channel and the second channel are all vacuum.

In the vapor chamber radiator of this embodiment, the interiors of the first heat receiving portion 3 and the second heat receiving portion 4 are filled with a certain amount of liquid working medium.

Working principle: As shown in Figure 6 and Figure 7, the left side of the substrate 1 is the heating surface, and the arrow points to the flow direction of the internal working fluid heated hot air. Large outdoor products rely on natural convection to dissipate heat. Therefore, in order to improve the heat dissipation efficiency, the interior of the radiator base plate 1 and the heat sink 2 are divided into multiple sets of parallel separation structures, and the base plate 1 is divided into a first heat receiving part 3 and a second heat receiving part 4. Two areas, the heat sink 2 is divided into two areas: the first heat dissipation part 5 and the second heat dissipation part 6. The internal structure and heat dissipation area are divided according to the size of the anti-thermal power to improve the heat dissipation efficiency. The first heat receiving part 3, the channel The first 71, the second channel 72 and the third channel 73 form a circulation loop. The second heat receiving part 4, the fourth channel 81, the fifth channel 82 and the sixth channel 83 form a loop. Heat is removed by heat exchange with air.

The vapor chamber radiator of this embodiment connects the substrate 1 and the heat sink 2 together, and the interior is connected, which greatly reduces the contact thermal resistance between the substrate 1 and the heat sink 2, and improves the heat dissipation efficiency. Compared with the same size and the same heat dissipation area Heat sink, this product has high heat dissipation efficiency and strong practicability; it is of great significance to divide the interior of the substrate 1 into multiple groups of structures according to the anti-thermal power and the position of the chip to overcome the problems of poor heat dissipation at the top.

In the present invention, unless otherwise expressly specified and limited, terms such as "installation", "arrangement", "connection", "fixation", "swivel connection" and other terms should be understood in a broad sense, for example, it may be a fixed connection, or It can be a detachable connection or an integrated body; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the internal connection of two elements or the interaction between the two elements. Unless otherwise clearly defined, those of ordinary skill in the art can understand the specific meanings of the above terms in the present invention according to specific situations.

The above descriptions are only preferred embodiments of the present invention, and are not intended to limit the present invention. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the scope of the present invention. within the scope of protection.

Claims (6)

1. The utility model provides a temperature-uniforming plate radiator, includes base plate (1) and fin (2), its characterized in that: a plurality of groups of radiating fins (2) are arranged at one end of the outer wall of the base plate (1), the base plate (1) is fixed with the radiating fins (2) in a welding mode, the substrate (1) comprises a first heat receiving unit (3) and a second heat receiving unit (4), the first heat receiving unit (3) and the second heat receiving unit (4) are not communicated with each other, the interiors of the first heat receiving unit (3) and the second heat receiving unit (4) are both hollow tubular, the heat sink (2) comprises a first heat sink part (5) and a second heat sink part (6), the first heat sink piece (5) and the second heat sink piece (6) are not communicated with each other, a first channel is arranged inside the first heat sink piece (5), the first channel is communicated with the interior of the first heated part (3), the second heat radiating part (6) is internally provided with a second channel, and the second channel is communicated with the interior of the second heated part (4).

2. A vapor plate heat sink according to claim 1, wherein a capillary structure is provided in each of the first heat receiving unit (3) and the second heat receiving unit (4) of the base plate (1).

3. A vapor-panel heat sink according to claim 2, wherein the first passage includes a first passage (71), a second passage (72) and a third passage (73), the first passage (71) communicates with the second passage (72) and the third passage (73) from the front to the rear, respectively, and the other ends of the second passage (72) and the third passage (73) communicate with the inside of the first heat receiving unit (3).

4. A vapor-panel heat sink according to claim 3, wherein the second passage includes a fourth passage (81), a fifth passage (82), and a sixth passage (83), the fourth passage (81) communicates with the fifth passage (82) and the sixth passage (83) from the front to the rear, respectively, and the other ends of the fifth passage (82) and the sixth passage (83) communicate with the interior of the second heat receiving unit (4).

5. A temperature-uniformed plate radiator according to claim 1, 2, 3 or 4, wherein the first heat receiving unit (3) and the second heat receiving unit (4) and the first passage and the second passage are evacuated.

6. A temperature-uniforming plate radiator as claimed in claim 5, wherein the interiors of the first heat receiving unit (3) and the second heat receiving unit (4) are filled with a liquid working medium.

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