CN212013184U - High heat conduction combined type circuit board for new energy automobile - Google Patents
High heat conduction combined type circuit board for new energy automobile Download PDFInfo
- Publication number
- CN212013184U CN212013184U CN202021224217.8U CN202021224217U CN212013184U CN 212013184 U CN212013184 U CN 212013184U CN 202021224217 U CN202021224217 U CN 202021224217U CN 212013184 U CN212013184 U CN 212013184U
- Authority
- CN
- China
- Prior art keywords
- circuit board
- groove
- new energy
- grooves
- energy automobile
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Structure Of Printed Boards (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses a high heat conduction composite circuit board for a new energy automobile, which comprises a unit circuit board A and a unit circuit board B, wherein the unit circuit board A comprises a copper plate (1) and a circuit layer (6), a plurality of groups of grooves are formed in the top surface of the copper plate (1), each group of grooves comprises a plurality of grooves (2), a strip-shaped foamy copper (3) soaked with heat conduction oil is embedded into each groove (2), the height of the foamy copper (3) is larger than or equal to the groove depth of each groove (2), a plurality of through grooves (4) are arranged on the front end surface of the copper plate (1), a tooth-type radiator (5) is fixedly arranged in each through groove (4), the circuit layer (6) is fixedly arranged on the top surface of the copper plate (1), a plurality of windows (7) corresponding to the groove sets are formed in the circuit layer (6), and the windows (7) are communicated with the groove sets. The utility model has the advantages that: compact structure, long service life, high heat dissipation efficiency.
Description
Technical Field
The utility model relates to a combined type is circuit board technical field of circuit board structure for new energy automobile, especially a high heat conduction combined type is circuit board for new energy automobile.
Background
The composite circuit board for the new energy automobile is an important component in an electrical appliance part of the new energy automobile. The composite circuit board for the new energy automobile is a copper-based circuit board and comprises a copper plate and a circuit layer, wherein the circuit layer is fixedly arranged on the top surface of the copper plate. The manufacturing process of the composite new energy automobile circuit board comprises the steps of using a copper plate, plating a copper foil layer on the upper surface of the copper plate, wrapping the copper plate and the copper foil layer through a film, forming a notch on the film, enabling the shape of the notch to be equal to that of a circuit layer, clamping the copper plate by a clamp, immersing the copper plate into an etching tank containing etching liquid, enabling the etching liquid to enter from the notch and corrode the exposed copper foil part, etching for a period of time to obtain the circuit layer on the copper foil, manufacturing a unit circuit board, overlapping and compounding the two unit circuit boards into a whole, and finally manufacturing the finished composite new energy automobile circuit board. However, although the composite circuit board for the new energy automobile can be applied to the new energy automobile, the following defects still exist: the circuit layer produces a large amount of heats on it after using a period of time, and in heat partly released the air, the copper was given in another part transmission, and the heat is given the air by the copper again in, this kind of radiating mode though can reduce the temperature on the circuit layer surface, but the heat on the circuit layer needs very long time to transmit the copper, and then leads to the circuit layer all to be in the high temperature state in a very long period, burns out the circuit layer very easily.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to overcome prior art's shortcoming, provide a compact structure, long service life, high heat conduction combined type circuit board for new energy automobile that the radiating efficiency is high.
The purpose of the utility model is realized through the following technical scheme: a high-heat-conductivity composite circuit board for a new energy automobile comprises a unit circuit board A and a unit circuit board B, wherein the unit circuit board A comprises a copper plate and a circuit layer, a plurality of groups of grooves are arranged on the top surface of the copper plate, each group of grooves comprises a plurality of grooves, a strip-shaped foamy copper which is soaked with heat conducting oil is embedded into each groove, the height of the foamy copper is more than or equal to the groove depth of the groove, the front end surface of the copper plate is provided with a plurality of through grooves, a tooth-type radiator is fixedly arranged in each through groove, the circuit layer is fixedly arranged on the top surface of the copper plate, a plurality of windows respectively corresponding to the groove groups are arranged on the circuit layer, the windows are communicated with the groove groups, a heat-conducting adhesive layer is embedded in each window and is in contact with the circuit layer, the bottom surface of the copper plate of the unit circuit board a is soldered to the bottom surface of the copper plate of the unit circuit board B.
The grooves are longitudinally arranged.
The base plate of the tooth heat sink is welded on the top surface of the through groove.
The horizontal spacing between two adjacent grooves is equal.
The unit circuit board A and the unit circuit board B are arranged up and down symmetrically.
The window is rectangular or square.
The utility model has the advantages of it is following: the utility model discloses compact structure, long service life, radiating efficiency are high.
Drawings
Fig. 1 is a schematic structural view of the present invention;
FIG. 2 is a top view of FIG. 1;
FIG. 3 is a schematic structural diagram of a unit circuit board A of the present invention;
FIG. 4 is a schematic structural view of FIG. 3 with the thermal conductive adhesive layer removed;
in the figure, 1-copper plate, 2-groove, 3-foam copper, 4-through groove, 5-tooth type radiator, 6-circuit layer, 7-window and 8-heat conducting glue layer.
Detailed Description
The invention will be further described with reference to the accompanying drawings, without limiting the scope of the invention to the following:
as shown in fig. 1 to 4, a high thermal conductivity composite circuit board for a new energy vehicle comprises a unit circuit board a and a unit circuit board B, wherein the unit circuit board a comprises a copper plate 1 and a circuit layer 6, a plurality of groups of grooves are formed on the top surface of the copper plate 1, each group of grooves comprises a plurality of grooves 2, the grooves 2 are longitudinally arranged, the horizontal distance between every two adjacent grooves 2 is equal, a strip-shaped copper foam 3 soaked with thermal conductive oil is embedded in each groove 2, the height of the copper foam 3 is greater than or equal to the groove depth of the groove 2, a plurality of through grooves 4 are formed on the front end surface of the copper plate 1, a tooth-type radiator 5 is fixedly arranged in each through groove 4, the circuit layer 6 is fixedly arranged on the top surface of the copper plate 1, a plurality of windows 7 respectively corresponding to the groove groups are formed on the circuit layer 6, the windows 7 are rectangular or square, and the, a heat conducting adhesive layer 8 is embedded into each window 7, the heat conducting adhesive layer 8 is in contact with the circuit layer 6, the unit circuit boards A and the unit circuit boards B are symmetrically arranged from top to bottom, and the bottom surfaces of the copper plates 1 of the unit circuit boards A are welded on the bottom surfaces of the copper plates 1 of the unit circuit boards B. The base plate of the tooth heat sink 5 is soldered to the top surface of the through slot 4.
The working process of the utility model is as follows:
when the high-heat-conduction combined type new energy automobile circuit board works, a large amount of heat is generated on the circuit layers 6 of the unit circuit board A and the unit circuit board B, part of heat on the circuit layers 6 is transferred to the copper plate 1, the copper plate 1 transfers the heat to heat conduction oil on the foamy copper 3, the heat conduction oil has the function of absorbing heat, the heat conduction oil quickly releases the heat to the air, and meanwhile, the copper plate 1 also transfers the heat to the tooth type heat radiator 5 and transfers the heat to the air through the tooth type heat radiator 5; in addition, because the heat-conducting adhesive layer 8 directly contacts with the circuit layer 6, another part of heat of the circuit layer 6 is directly transferred to the heat-conducting adhesive layer 8, the heat-conducting adhesive layer 8 transfers the heat to the heat-conducting oil of the foamy copper 3, and the heat-conducting oil quickly releases the heat to the air, so that the purpose of reducing the surface temperature of the circuit layer is achieved.
Therefore, compared with the traditional circuit board for the combined type new energy automobile, the circuit board for the high-heat-conductivity combined type new energy automobile has the advantages that the temperature on the surface of the circuit layer is quickly reduced in a short time, the heat dissipation efficiency is greatly improved, the characteristic of high heat dissipation efficiency is realized, and meanwhile, the service life of the circuit board for the combined type new energy automobile is prolonged.
The foregoing is illustrative of the preferred embodiments of the present invention, and it is to be understood that the invention is not limited to the precise forms disclosed herein, and that various other combinations, modifications, and environments may be resorted to, falling within the scope of the invention as defined by the appended claims. But that modifications and variations may be effected by those skilled in the art without departing from the spirit and scope of the invention, which is to be limited only by the claims appended hereto.
Claims (6)
1. The utility model provides a high heat conduction combined type new energy automobile is with circuit board which characterized in that: the circuit board comprises a unit circuit board A and a unit circuit board B, wherein the unit circuit board A comprises a copper plate (1) and a circuit layer (6), a plurality of groups of grooves are formed in the top surface of the copper plate (1), each group of grooves comprises a plurality of grooves (2), a strip-shaped copper foam (3) infiltrated with heat conduction oil is embedded into each groove (2), the height of the copper foam (3) is larger than or equal to the depth of each groove (2), a plurality of through grooves (4) are formed in the front end surface of the copper plate (1), a tooth-type radiator (5) is fixedly arranged in each through groove (4), the circuit layer (6) is fixedly arranged on the top surface of the copper plate (1), a plurality of windows (7) corresponding to the groove groups respectively are formed in the circuit layer (6), the windows (7) are communicated with the groove groups, a heat conduction adhesive layer (8) is embedded into each window (7), and the heat conduction adhesive layer (8) is in contact with, the bottom surface of the copper plate (1) of the unit circuit board A is soldered to the bottom surface of the copper plate (1) of the unit circuit board B.
2. The high-thermal-conductivity composite circuit board for the new energy automobile according to claim 1, characterized in that: the grooves (2) are arranged longitudinally.
3. The high-thermal-conductivity composite circuit board for the new energy automobile according to claim 1, characterized in that: the base plate of the tooth type heat radiator (5) is welded on the top surface of the through groove (4).
4. The high-thermal-conductivity composite circuit board for the new energy automobile according to claim 1, characterized in that: the horizontal spacing between two adjacent grooves (2) is equal.
5. The high-thermal-conductivity composite circuit board for the new energy automobile according to claim 1, characterized in that: the unit circuit board A and the unit circuit board B are arranged up and down symmetrically.
6. The high-thermal-conductivity composite circuit board for the new energy automobile according to claim 1, characterized in that: the window (7) is rectangular or square.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021224217.8U CN212013184U (en) | 2020-06-29 | 2020-06-29 | High heat conduction combined type circuit board for new energy automobile |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021224217.8U CN212013184U (en) | 2020-06-29 | 2020-06-29 | High heat conduction combined type circuit board for new energy automobile |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212013184U true CN212013184U (en) | 2020-11-24 |
Family
ID=73402557
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202021224217.8U Active CN212013184U (en) | 2020-06-29 | 2020-06-29 | High heat conduction combined type circuit board for new energy automobile |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN212013184U (en) |
-
2020
- 2020-06-29 CN CN202021224217.8U patent/CN212013184U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN201513770U (en) | Heat-dissipation type LED light source module | |
| CN215011262U (en) | Corrugated heat dissipation device for graphene heating sheet assembly | |
| CN212013184U (en) | High heat conduction combined type circuit board for new energy automobile | |
| CN201093439Y (en) | LED heat sinking base plate | |
| CN204497950U (en) | A kind of modular power source | |
| CN111683475B (en) | Production method of composite high-frequency circuit board | |
| CN215121297U (en) | Copper-clad plate with holes and of multilayer composite structure | |
| CN215177187U (en) | Adopt 3D heat dissipation module of samming plate structure | |
| CN213777331U (en) | LED ball bubble lamp convenient to equipment | |
| CN213213952U (en) | PCB assembly with good heat dissipation performance | |
| CN211152322U (en) | Copper-based copper-clad plate with thin insulating layer and high thermal conductivity, car lamp and car | |
| CN210928123U (en) | Copper substrate easy to radiate heat | |
| CN202485510U (en) | Gapless heat pipe combined structure | |
| CN209882216U (en) | Multilayer high-thermal-conductivity composite metal-based circuit board | |
| CN218735213U (en) | Electronic circuit board convenient to combination | |
| CN209882231U (en) | Composite high heat conduction circuit board | |
| CN217154063U (en) | Car light heat dissipation module | |
| CN218998367U (en) | Aluminum-based circuit board | |
| CN217985513U (en) | Composite heat-conducting type electric heating pot circuit board | |
| CN218215552U (en) | Power battery and new energy electric car thereof | |
| CN212013180U (en) | Thickened copper-plated large-current-resistant heat dissipation circuit board | |
| CN213675832U (en) | Good heat dissipation's metal base copper-clad plate | |
| CN210807788U (en) | Circuit board with quick heat dissipation function | |
| CN217768353U (en) | Carbon nano-film soaking structure | |
| CN213818360U (en) | High-efficient radiating bluetooth circuit board |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |