CN213675832U

CN213675832U - Good heat dissipation's metal base copper-clad plate

Info

Publication number: CN213675832U
Application number: CN202022361898.9U
Authority: CN
Inventors: 李亚涛; 林英荣; 陈伟福; 闻建明
Original assignee: Guangde Longtai Electronic Sci Tech Co ltd
Current assignee: Guangde Longtai Electronic Sci Tech Co ltd
Priority date: 2020-10-21
Filing date: 2020-10-21
Publication date: 2021-07-13
Anticipated expiration: 2030-10-21

Abstract

The utility model discloses a good heat dissipation's metal base copper-clad plate, including metal substrate layer, the top of metal substrate layer board is provided with the insulating layer, the top of insulating layer is provided with the heat dissipation sheet layer, evenly distributed has a set of louvre on the heat dissipation sheet layer, the louvre sets up to regular hexagon. The utility model discloses simple structure, stable in structure, heat dispersion is excellent.

Description

Good heat dissipation's metal base copper-clad plate

Technical Field

The utility model relates to a copper-clad plate field specifically is a good heat dissipation's metal base copper-clad plate.

Background

With the rapid development of the electronic industry, the volume size of electronic products is smaller and smaller, and the power density is larger and larger, so that the solution of the heat dissipation problem is a great challenge to the design of the electronic industry. The metal-based copper-clad plate is undoubtedly one of effective means for solving the heat dissipation problem. The metal-based copper-clad plate is a copper-clad plate with good heat dissipation function, and consists of a unique three-layer structure, namely a circuit layer, a heat conduction insulating layer and a metal base layer. The working principle of the metal-based copper-clad plate is as follows: the surface of the power device is attached to the circuit layer, and heat generated by the device is conducted to the metal base layer through the insulating layer and then diffused to the outside of the module through the metal substrate, so that heat dissipation of the device is realized.

The existing copper-clad plate has larger thermal resistance of an insulating layer and lower heat dissipation efficiency of a metal base layer, so that the overall heat dissipation effect of the copper-clad plate is poorer.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a good heat dissipation's metal base copper-clad plate to solve the problem that proposes in the above-mentioned background art.

In order to achieve the above object, the utility model provides a following technical scheme:

the utility model provides a good heat dissipation's metal base copper-clad plate, includes metal substrate layer, metal substrate layer's top is provided with the insulating layer, the top of insulating layer is provided with the heat dissipation plate layer, evenly distributed has a set of louvre on the heat dissipation plate layer, the louvre sets up to regular hexagon.

Preferably, be provided with down the heat-conducting layer between metal substrate layer and the insulating layer and bond mutually, be provided with the heat-conducting layer between insulating layer and the heat dissipation sheet layer, go up the heat-conducting layer and make for heat conduction silica gel piece with lower heat-conducting layer.

Preferably, the metal substrate layer, the insulating layer and the lower heat conduction layer are bonded through glue, and the insulating layer, the heat dissipation plate layer and the upper heat conduction layer are also bonded through glue.

Preferably, the insulating layer is made of a glass fiber board.

Preferably, the heat dissipation plate layer is made of copper.

Preferably, the inner wall of the heat dissipation hole is provided with uniformly arranged cooling fins.

Compared with the prior art, the beneficial effects of the utility model are that: the utility model discloses be provided with align to grid's louvre on the well heat dissipation sheet layer, not only guaranteed the stability of whole copper-clad plate, also effectual heat dispersion of helping the copper-clad plate. The insulating layer made of the glass fiber board has good insulativity and good heat-conducting property, a large amount of low-thermal-resistance materials are not needed, and the working performance of the copper-clad plate is improved. The utility model discloses simple structure, stable in structure, heat dispersion is excellent.

Drawings

FIG. 1 is a schematic structural diagram of a metal-based copper-clad plate with good heat dissipation;

fig. 2 is a schematic structural diagram of a heat dissipation plate in a metal-based copper-clad plate with good heat dissipation performance.

In the figure: 1-metal substrate layer, 2-lower heat conduction layer, 3-insulating layer, 4-upper heat conduction layer, 5-heat dissipation plate layer, 6-heat dissipation hole and 7-heat dissipation plate.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1-2, the present invention provides a technical solution:

the utility model provides a good heat dissipation's metal base copper-clad plate, includes metal substrate layer 1, metal substrate layer 1's top is provided with insulating layer 3, insulating layer 3's top is provided with heat dissipation plate layer 5, evenly distributed has a set of louvre 6 on heat dissipation plate layer 5, louvre 6 sets up to regular hexagon.

Insulating layer 3 plays the insulating role, and radiator plate layer 5 improves metal substrate layer 1's radiating efficiency and improves its intensity simultaneously, and radiator plate layer 5 and the area of contact of air are increased to louvre 6, further improve the radiating efficiency.

Preferably, a lower heat conduction layer 2 is arranged between the metal substrate layer 1 and the insulating layer 3 for bonding, an upper heat conduction layer 4 is arranged between the insulating layer 3 and the heat dissipation plate layer 5, and the upper heat conduction layer 4 and the lower heat conduction layer 2 are made of heat conduction silica gel sheets.

The upper heat conduction layer 4 and the lower heat conduction layer 2 made of the heat conduction silica gel sheet improve the heat conduction efficiency among the metal substrate layer 1, the insulating layer 3 and the heat dissipation plate layer 5.

Preferably, the metal substrate layer 1, the insulating layer 3 and the lower heat conducting layer 2 are bonded by glue, and the insulating layer 3, the heat dissipation plate layer 5 and the upper heat conducting layer 4 are also bonded by glue.

Preferably, the insulating layer 3 is made of a glass fiber plate.

The insulating layer 3 made of a glass fiber plate has good insulating properties and good heat conducting properties.

Preferably, the heat dissipation plate layer 5 is made of copper.

The heat dissipation effect of the heat dissipation plate layer 5 supported by the copper material is outstanding.

Preferably, the inner wall of the heat dissipation hole 6 is provided with uniformly arranged heat dissipation fins 7.

The heat radiation fins 7 further improve the heat radiation efficiency of the heat radiation plate layer 5.

The utility model discloses a theory of operation is: insulating layer 3 plays the insulating role, and radiator plate layer 5 improves metal substrate layer 1's radiating efficiency and improves its intensity simultaneously, and radiator plate layer 5 and the area of contact of air are increased to louvre 6, further improve the radiating efficiency. The upper heat conduction layer 4 and the lower heat conduction layer 2 made of the heat conduction silica gel sheet improve the heat conduction efficiency among the metal substrate layer 1, the insulating layer 3 and the heat dissipation plate layer 5. The insulating layer 3 made of a glass fiber plate has good insulating properties and good heat conducting properties. The heat dissipation effect of the heat dissipation plate layer 5 supported by the copper material is outstanding. The heat radiation fins 7 further improve the heat radiation efficiency of the heat radiation plate layer 5.

It is obvious to a person skilled in the art that the invention is not restricted to details of the above-described exemplary embodiments, but that it can be implemented in other specific forms without departing from the spirit or essential characteristics of the invention. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.

Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.

Claims

1. The utility model provides a good heat dissipation's metal base copper-clad plate, includes metal substrate layer (1), its characterized in that: the metal substrate layer is characterized in that an insulating layer (3) is arranged above the metal substrate layer (1), a radiating plate layer (5) is arranged above the insulating layer (3), a group of radiating holes (6) are uniformly distributed in the radiating plate layer (5), and the radiating holes (6) are arranged to be regular hexagons.

2. The metal-based copper-clad plate with good heat dissipation performance according to claim 1, wherein: be provided with down heat-conducting layer (2) between metal substrate layer (1) and insulating layer (3) and bond mutually, be provided with heat-conducting layer (4) between insulating layer (3) and heat dissipation sheet layer (5), go up heat-conducting layer (4) and make for heat conduction silica gel piece with lower heat-conducting layer (2).

3. The metal-based copper-clad plate with good heat dissipation performance according to claim 2, wherein: the metal substrate layer (1), the insulating layer (3) and the lower heat conduction layer (2) are bonded through glue, and the insulating layer (3), the heat dissipation plate layer (5) and the upper heat conduction layer (4) are also bonded through glue.

4. The copper-clad plate with good heat dissipation performance of claim 3, wherein: the insulating layer (3) is made of a glass fiber board.

5. The copper-clad plate with good heat dissipation performance according to claim 4, wherein: the heat dissipation plate layer (5) is made of copper materials.

6. The copper-clad plate with good heat dissipation performance of claim 5, wherein: and the inner wall of the heat dissipation hole (6) is provided with uniformly arranged cooling fins (7).