CN209882216U - Multilayer high-thermal-conductivity composite metal-based circuit board - Google Patents
Multilayer high-thermal-conductivity composite metal-based circuit board Download PDFInfo
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- CN209882216U CN209882216U CN201920342180.XU CN201920342180U CN209882216U CN 209882216 U CN209882216 U CN 209882216U CN 201920342180 U CN201920342180 U CN 201920342180U CN 209882216 U CN209882216 U CN 209882216U
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Abstract
The utility model discloses a multilayer high heat conduction composite metal-based circuit board, including first metal substrate, second metal substrate and insulating layer, two circuit boards are all fixedly welded on both sides of the inner wall of the first metal substrate, a first conductive layer is fixedly welded on the lower surface of the circuit board, a second ink layer is pasted on the lower surface of the first conductive layer, and an insulating layer is pasted on the lower surface of the second ink layer; the utility model discloses a set up the conducting hole, the heat that LED lamp components and parts produced gets into the heat-conducting plate via the aluminium foil and gives off, because thermal transmission needn't pass through the insulating layer, and the heat-transfer medium is the better metal of heat conductivity, so solved current metal-based circuit board because the insulating layer and the problem that the radiating efficiency that leads to is low, the radiating effect is better, the heat on the LED lamp pearl has been avoided can't dispelling fast, it is ageing with higher speed to have slowed down, in case LED lamp pearl breaks away from and produces and scrap, in order to cause the waste, greatly increased the availability factor of device.
Description
Technical Field
The utility model relates to a circuit board technical field specifically is a high heat conduction composite metal base circuit board of multilayer.
Background
The traditional metal-based circuit board mainly comprises a conductive layer 10 (namely a copper foil layer), an insulating layer 20 and a metal base layer 30, the insulating layer 20 is coated on the metal base layer 30 during preparation, the conductive layer 10 is compounded on the insulating layer 20 in a pressing and heating mode, then a copper foil on the conductive layer is corroded by acid liquid medicine to obtain a required circuit, finally, an insulating ink layer 40 is compounded to finish the manufacture of the metal-based circuit board, heat generated by components and parts is required to be transferred to the metal base layer through the insulating layer and dissipated through the metal base layer, and the volume of the components and parts is reduced gradually because the thermal conductivity of the insulating layer is extremely low, and the requirements of power increase and heat dissipation capacity increase gradually are met. And after the metal-based circuit board is used for a period of time, the aging and degumming of the dielectric layer connecting the copper layer and the aluminum substrate on the metal-based copper clad laminate can cause the thermal resistance to be greatly increased, so that the overall heat transfer performance is reduced, and the circuit board in the prior art has defects in use, such as:
the existing circuit board uses copper as a circuit conductor, so that heat generated during the operation of the LED lamp bead can not be quickly dissipated, the lamp bead and the circuit board are separated from products and scrapped due to accelerated aging, the waste of resources is increased, and the requirement of the prior art can not be met.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a high heat conduction composite metal base circuit board of multilayer to solve the problem that proposes in the above-mentioned background art.
In order to achieve the above object, the utility model provides a following technical scheme: a multilayer high-thermal-conductivity composite metal-based circuit board comprises a first metal substrate, a second metal substrate, an insulating layer and a via hole, two circuit boards are fixedly welded on two sides of the inner wall of the first metal substrate, a first conductive layer is fixedly welded on the lower surface of each circuit board, a second ink layer is pasted on the lower surface of the first conductive layer, an insulating layer is pasted on the lower surface of the second ink layer, a first ink layer is adhered to the lower surface of the insulating layer, a second conductive layer is adhered to the lower surface of the first ink layer, a second metal substrate is fixedly welded on the lower surface of the second conducting layer, a heat conducting block is fixedly welded on one side of the upper surface of the second metal substrate, the top end of the heat conducting block is fixedly welded on the lower surface of the circuit board, one side of the first conducting layer is provided with a conducting hole corresponding to the periphery of the heat conducting block, and the bottom end of the conducting hole penetrates through the second conducting layer.
Preferably, the upper surface of the circuit board is uniformly embedded with bumps, and the bumps protrude out of the circuit board.
Preferably, the lugs are connected together through a connecting plate.
Preferably, aluminum foils are uniformly and fixedly welded on the periphery of the heat conducting block, and high-temperature anti-oxidation treatment is performed on the periphery of the heat conducting block.
Preferably, both ends of the circuit board are arranged in a staggered mode, so that the practical effect of the device is improved.
Compared with the prior art, the beneficial effects of the utility model are that:
the utility model discloses a set up the conducting hole in first conducting layer one side, the heat that LED lamp components and parts produced gets into the heat-conducting plate via aluminium foil and gives off, because thermal transmission needn't pass through the insulating layer, and the heat-transfer medium is the better metal of heat conductivity, so solved current metal-based circuit board because the insulating layer and the problem that the radiating efficiency who leads to is low, the radiating effect is better, the heat on the LED lamp pearl has been avoided can't dispelling fast, it ages with higher speed to have slowed down, in case LED lamp pearl breaks away from and produces and scrap, in order to cause the waste, greatly increased the availability factor of device.
Drawings
Fig. 1 is a top view of the present invention;
fig. 2 is a schematic view of a top view structure of the circuit board of the present invention;
fig. 3 is a front view of the circuit board of the present invention.
In the figure: 101-a first metal substrate; 102-a circuit board; 103-a bump; 104-a connecting plate; 105-a first conductive layer; 201-a second metal substrate; 202-a second conductive layer; 301-an insulating layer; 302-a first ink layer; 303-a second ink layer; 401-via holes; 402-heat conducting block.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1-3, the present invention provides a technical solution: a multilayer high-thermal-conductivity composite metal-based circuit board comprises a first metal substrate 101, a second metal substrate 201, an insulating layer 301 and a via hole 401, wherein two circuit boards 102 are fixedly welded on two sides of the inner wall of the first metal substrate 101, a first conductive layer 105 is fixedly welded on the lower surface of the circuit board 102, a second ink layer 303 is pasted on the lower surface of the first conductive layer 105, the insulating layer 301 is pasted on the lower surface of the second ink layer 303, a first ink layer 302 is pasted on the lower surface of the insulating layer 301, a second conductive layer 202 is pasted on the lower surface of the first ink layer 302, a second metal substrate 201 is fixedly welded on the lower surface of the second conductive layer 202, a heat-conducting block 402 is fixedly welded on one side of the upper surface of the second metal substrate 201, the heat-conducting plate 402 is an aluminum plate, the heat-radiating effect is good, the top end of the heat-conducting block 402 is fixedly welded on the lower surface, the bottom end of the via hole 401 penetrates through the second conductive layer 202.
The upper surface of the circuit board 102 is uniformly embedded with bumps 103, the bumps 103 protrude out of the circuit board 102, the bumps 103 are connected together through a connecting plate 104, aluminum foils are uniformly and fixedly welded on the periphery of the heat conducting block 402, high-temperature anti-oxidation treatment is performed on the periphery of the heat conducting block 402, and two ends of the circuit board 102 are arranged in a staggered mode to increase the practical effect of the device.
The working principle is as follows: install LED lamp pearl on lug 103 when using, when the heat that LED lamp pearl components and parts produced, the heat gets into heat-conducting plate 402 via aluminium foil and locates to give off, high temperature anti-oxidation treatment has been carried out in heat-conducting plate 402 periphery simultaneously, greatly increased life, avoid frequent change, such need not pass through insulating layer 301 when the heat dissipation, because thermal transmission needn't pass through insulating layer 301, and the heat transfer medium is the better metal of heat conductivity, so solved current metal line board 102 because the problem that the radiating efficiency that insulating layer 301 leads to is low, the radiating effect is better, the heat on the LED lamp pearl has been avoided can't be dispelled fast, accelerated ageing has been slowed down, in case LED lamp pearl breaks away from and produces and scrap, in order to cause the waste, greatly increased the availability factor of device.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (5)
1. A multilayer high heat conduction composite metal-based circuit board comprises a first metal substrate (101), a second metal substrate (201), an insulating layer (301) and a via hole (401), and is characterized in that: the printed circuit board comprises a first metal substrate (101), two circuit boards (102) fixedly welded on two sides of the inner wall of the first metal substrate (101), a first conductive layer (105) fixedly welded on the lower surface of the circuit board (102), a second ink layer (303) adhered on the lower surface of the first conductive layer (105), an insulating layer (301) adhered on the lower surface of the second ink layer (303), a first ink layer (302) adhered on the lower surface of the insulating layer (301), a second conductive layer (202) adhered on the lower surface of the first ink layer (302), a second metal substrate (201) fixedly welded on the lower surface of the second conductive layer (202), a heat-conducting block (402) fixedly welded on one side of the upper surface of the second metal substrate (201), the top end of the heat-conducting block (402) fixedly welded on the lower surface of the circuit board (102), and a through hole (401) formed on one side of the first, the bottom end of the through hole (401) penetrates through the second conductive layer (202).
2. The multilayer high thermal conductivity composite metal-based circuit board of claim 1, wherein: the upper surface of the circuit board (102) is uniformly embedded with bumps (103), and the bumps (103) protrude out of the circuit board (102).
3. The multilayer high thermal conductivity composite metal-based circuit board of claim 2, wherein: the lugs (103) are connected together through a connecting plate (104).
4. The multilayer high thermal conductivity composite metal-based circuit board of claim 1, wherein: aluminum foils are uniformly and fixedly welded on the periphery of the heat conducting block (402), and high-temperature anti-oxidation treatment is performed on the periphery of the heat conducting block (402).
5. The multilayer high thermal conductivity composite metal-based circuit board of claim 1, wherein: both ends of the circuit board (102) are arranged in a staggered mode, so that the practical effect of the device is improved.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920342180.XU CN209882216U (en) | 2019-03-18 | 2019-03-18 | Multilayer high-thermal-conductivity composite metal-based circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920342180.XU CN209882216U (en) | 2019-03-18 | 2019-03-18 | Multilayer high-thermal-conductivity composite metal-based circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209882216U true CN209882216U (en) | 2019-12-31 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920342180.XU Active CN209882216U (en) | 2019-03-18 | 2019-03-18 | Multilayer high-thermal-conductivity composite metal-based circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209882216U (en) |
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2019
- 2019-03-18 CN CN201920342180.XU patent/CN209882216U/en active Active
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