CN210807788U - Circuit board with quick heat dissipation function - Google Patents
Circuit board with quick heat dissipation function Download PDFInfo
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- CN210807788U CN210807788U CN201921845036.4U CN201921845036U CN210807788U CN 210807788 U CN210807788 U CN 210807788U CN 201921845036 U CN201921845036 U CN 201921845036U CN 210807788 U CN210807788 U CN 210807788U
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- heat dissipation
- heat
- circuit board
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- insulating plate
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Abstract
The utility model belongs to the technical field of the circuit board technique and specifically relates to a circuit board with quick heat dissipation function, which comprises a circuit board body, the circuit board body is provided with the protective sheath along the circumferencial direction, the bottom of protective sheath is equipped with the heat conduction insulation board, the bottom of heat conduction insulation board is equipped with the absorber plate, the intracavity of heat conduction insulation board is equipped with the metal heat dissipation stick, the top of absorber plate is seted up flutedly, the bottom of recess is equipped with heat dissipation silica gel gasket, and this circuit board with quick heat dissipation function compares current circuit board advantage and has improved the radiating ability of circuit board, has guaranteed the stability and the reliability of circuit board work operation, and simple structure has stronger practicality and improves the radiating rate, is favorable to electronic component's heat dissipation, increase of service life.
Description
Technical Field
The utility model relates to a circuit board technical field especially relates to a circuit board with quick heat dissipation function.
Background
The circuit board is an indispensable basic part of all electronic products, is a carrier of all electronic components, and is a main supporting body for electronic components during installation and interconnection. Along with the continuous development of electronic technology, the integration level of a circuit board is higher and higher, the number of electronic components on the circuit board is higher and higher, the power is higher and higher, the temperature of the surface of the circuit board is also increased, the requirement on the heat dissipation effect of the circuit board is higher and higher, and along with the fact that electronic products enter the times of component miniaturization, high-density installation and high-heating assembly, if the heat dissipation is not enough only by the surfaces of components with very small surface areas, once the problem of non-ideal heat dissipation occurs, serious negative effects can be brought to the work, and therefore a circuit board with a quick heat dissipation function is provided to solve the problems.
SUMMERY OF THE UTILITY MODEL
The utility model aims at solving the problem that the prior art is not enough to radiate heat only by the surface of a very small element, and once the problem of poor radiating effect occurs, the circuit board with the function of fast radiating heat is provided.
In order to achieve the above purpose, the utility model adopts the following technical scheme:
the design one kind has a circuit board with fast heat dissipation function, including the circuit board body, the circuit board body is provided with the protective sheath along the circumferencial direction, the bottom of the protective sheath is equipped with the heat conduction insulation board, the bottom of the heat conduction insulation board is equipped with the absorber plate, the intracavity of the heat conduction insulation board is equipped with the metal heat dissipation stick, the top of the absorber plate is seted up flutedly, the bottom of the recess is equipped with the heat dissipation silica gel gasket, the heat dissipation silica gel gasket with be equipped with the heat conduction glue film between the heat conduction insulation board, a plurality of horizontal louvres have been seted up to the absorber plate intracavity, the absorber plate is located a.
Preferably, the transverse radiating holes are arranged in six rows and are arranged at equal intervals, the diameters of the longitudinal radiating holes are matched with the transverse radiating holes and are arranged at equal intervals, and the heat-conducting insulating plate is a ceramic heat-conducting insulating plate.
Preferably, the protective sheath is located the contact surface of circuit board body is equipped with the foam-rubber cushion, horizontal louvre with longitudinal louvre intracavity has been scribbled and has been hindered green oil layer, the protective sheath with be equipped with graphite alkene heat dissipation layer between the heat conduction insulation board.
Preferably, the metal heat dissipation rods are arranged in five rows and twenty rows at equal intervals, penetrate through the bottom of the heat conduction insulation plate and are in contact with the heat absorption plate and the heat conduction adhesive layer.
The utility model provides a pair of circuit board with quick heat dissipation function, beneficial effect lies in: carry out the heat conduction to the circuit board body through being equipped with the heat conduction insulation board, the heat conduction intensity through metal heat dissipation stick reinforcing heat conduction insulation board, carry out the heat absorption to the heat through the heat-conducting glue film, absorb and three openings to steam through absorber plate and heat dissipation silica gel gasket, improve the radiating effect through being equipped with horizontal louvre and vertical louvre, this circuit board with quick heat dissipation function has improved the radiating ability of circuit board, the stability and the reliability of circuit board work operation have been guaranteed, moreover, the steam generator is simple in structure, it improves the radiating rate to have stronger practicality, be favorable to electronic component's heat dissipation, and service life is prolonged.
Drawings
Fig. 1 is a schematic structural diagram of a circuit board with a fast heat dissipation function according to the present invention;
fig. 2 is a schematic structural diagram of a circuit board a-a with a fast heat dissipation function according to the present invention.
In the figure: the circuit board comprises a circuit board body 1, a protective sleeve 2, a heat conduction insulating plate 3, a metal heat dissipation rod 4, a heat absorption plate 5, a groove 6, a heat conduction adhesive layer 7, a heat dissipation silica gel gasket 8, a transverse heat dissipation hole 9 and a longitudinal heat dissipation hole 10.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments.
Referring to fig. 1-2, a circuit board with a rapid heat dissipation function comprises a circuit board body 1, wherein the circuit board body 1 is provided with a protective sleeve 2 along a circumferential direction, the bottom of the protective sleeve 2 is provided with a heat conduction insulation plate 3, the bottom of the heat conduction insulation plate 3 is provided with a heat absorption plate 5, a metal heat dissipation rod 4 is arranged in a cavity of the heat conduction insulation plate 3, a groove 6 is formed in the top of the heat absorption plate 5, the bottom of the groove 6 is provided with a heat dissipation silica gel gasket 8, a heat conduction adhesive layer 7 is arranged between the heat dissipation silica gel gasket 8 and the heat conduction insulation plate 3, a plurality of transverse heat dissipation holes 9 are formed in the cavity of the heat.
Six rows of transverse heat dissipation holes 9 are arranged at equal intervals, the diameter of each longitudinal heat dissipation hole 10 is matched with the diameter of each transverse heat dissipation hole 9 and is arranged at equal intervals, heat dissipation can be comprehensively performed, the heat dissipation effect is enhanced, each heat conduction insulation plate 3 is a ceramic heat conduction insulation plate, the heat conduction performance is high, a sponge pad is arranged on the contact surface, located on the circuit board body 1, of the protective sleeve 2, damage to the circuit board body 1 is prevented, a solder resist green oil layer is coated in the cavities of the transverse heat dissipation holes 9 and the longitudinal heat dissipation holes 10, electronic elements on the circuit board body 1 are protected in the process of heat conduction, a graphene heat dissipation layer is arranged between the protective sleeve 2 and the heat conduction insulation plates 3, the heat dissipation strength is enhanced, five rows of twenty rows of heat dissipation rods 4 are arranged at equal intervals, the heat dissipation rods penetrate through the bottoms of the heat conduction, the circuit board body 1 is heat-conductive by being provided with the heat-conductive insulating plate 3.
Through the heat conduction intensity of 4 reinforcing heat conduction insulation boards 3 of metal heat dissipation stick, absorb the heat through heat conduction glue film 7, absorb and three openings to steam through absorber plate 5 and heat dissipation silica gel gasket 8, improve the radiating effect through being equipped with horizontal louvre 9 and vertical louvre 10, this circuit board with quick heat dissipation function has improved the radiating ability of circuit board, the stability and the reliability of circuit board work operation have been guaranteed, moreover, the steam generator is simple in structure, the heat dissipation speed is improved to stronger practicality, the heat dissipation that is favorable to electronic component, and service life is prolonged.
The above, only be the concrete implementation of the preferred embodiment of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art is in the technical scope of the present invention, according to the technical solution of the present invention and the utility model, the concept of which is equivalent to replace or change, should be covered within the protection scope of the present invention.
Claims (4)
1. A circuit board with a rapid heat dissipation function comprises a circuit board body (1) and is characterized in that, the circuit board body (1) is provided with a protective sleeve (2) along the circumferential direction, the bottom of the protective sleeve (2) is provided with a heat conduction insulating plate (3), the bottom of the heat-conducting insulating plate (3) is provided with a heat absorbing plate (5), a metal heat dissipation rod (4) is arranged in the cavity of the heat-conducting insulating plate (3), a groove (6) is formed in the top of the heat absorbing plate (5), a heat dissipation silica gel gasket (8) is arranged at the bottom of the groove (6), a heat-conducting adhesive layer (7) is arranged between the heat-radiating silica gel gasket (8) and the heat-conducting insulating plate (3), a plurality of transverse heat dissipation holes (9) are formed in the cavity of the heat absorption plate (5), and a plurality of longitudinal heat dissipation holes (10) are formed in the bottom, located on the transverse heat dissipation holes (9), of the heat absorption plate (5).
2. The circuit board with rapid heat dissipation function according to claim 1, wherein the transverse heat dissipation holes (9) are arranged in six rows and at equal intervals, the diameter of the longitudinal heat dissipation hole (10) matches the transverse heat dissipation holes (9) and is arranged at equal intervals, and the heat-conducting insulating plate (3) is a ceramic heat-conducting insulating plate.
3. The circuit board with the function of fast heat dissipation according to claim 1, wherein a sponge pad is disposed on the contact surface of the protective casing (2) on the circuit board body (1), a solder resist green oil layer is smeared in the cavities of the transverse heat dissipation holes (9) and the longitudinal heat dissipation holes (10), and a graphene heat dissipation layer is disposed between the protective casing (2) and the heat conductive insulating plate (3).
4. The circuit board with rapid heat dissipation function according to claim 1, wherein the metal heat dissipation rods (4) are arranged in five rows and twenty columns and are arranged at equal intervals, and penetrate through the bottom of the heat conduction and insulation plate (3) to be in contact with the heat absorption plate (5) and the heat conduction adhesive layer (7).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921845036.4U CN210807788U (en) | 2019-10-30 | 2019-10-30 | Circuit board with quick heat dissipation function |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921845036.4U CN210807788U (en) | 2019-10-30 | 2019-10-30 | Circuit board with quick heat dissipation function |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210807788U true CN210807788U (en) | 2020-06-19 |
Family
ID=71226137
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921845036.4U Active CN210807788U (en) | 2019-10-30 | 2019-10-30 | Circuit board with quick heat dissipation function |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210807788U (en) |
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2019
- 2019-10-30 CN CN201921845036.4U patent/CN210807788U/en active Active
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Legal Events
| Date | Code | Title | Description |
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address | ||
| CP03 | Change of name, title or address |
Address after: Room 503, Building 9, Jason Home Appliance Intelligent Manufacturing Center, No. 2 Huatian South 1st Road, Huakou Community, Ronggui Street, Shunde District, Foshan City, Guangdong Province, 528000 (Residence Application) Patentee after: Foshan Huashen Electrical Technology Co.,Ltd. Address before: 528000 5th Floor, No. 29, Changxing Road, Ronggui Haiwei Neighborhood Committee, Shunde District, Foshan, Guangdong Patentee before: Foshan Huashen Electrical Technology Co.,Ltd. |