CN212628553U - PCB circuit board with many louvres - Google Patents
PCB circuit board with many louvres Download PDFInfo
- Publication number
- CN212628553U CN212628553U CN202021244754.9U CN202021244754U CN212628553U CN 212628553 U CN212628553 U CN 212628553U CN 202021244754 U CN202021244754 U CN 202021244754U CN 212628553 U CN212628553 U CN 212628553U
- Authority
- CN
- China
- Prior art keywords
- circuit board
- heat dissipation
- board body
- plate
- holes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 230000017525 heat dissipation Effects 0.000 claims abstract description 50
- 238000010521 absorption reaction Methods 0.000 claims abstract description 20
- 230000007246 mechanism Effects 0.000 claims description 11
- 238000007789 sealing Methods 0.000 claims description 6
- 230000000149 penetrating effect Effects 0.000 claims description 2
- 238000010438 heat treatment Methods 0.000 abstract description 13
- 238000004519 manufacturing process Methods 0.000 abstract description 13
- 238000000034 method Methods 0.000 abstract description 3
- 230000008569 process Effects 0.000 abstract description 3
- 230000000694 effects Effects 0.000 description 3
- 239000000463 material Substances 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses a PCB circuit board with many louvres relates to the circuit board field, including the circuit board body, the heat dissipation through-hole has been seted up to the array of circuit board body, the bottom center fixedly connected with bottom plate of department of circuit board body, and the surface of bottom plate is seted up flutedly, is provided with the heating panel in the recess, and one side array distribution of heating panel has the heat absorption stand, heat absorption stand and heat dissipation through-hole one-to-one, and the heat absorption stand passes the circuit board body through the heat dissipation through-hole, and one side array distribution that the heat absorption. The utility model discloses a be provided with fixture, the heating panel is installed through fixture and circuit board for be dismantled and assembled state between heating panel and the circuit board, this in process of production, just need not to design the heat dissipation layer in the circuit board, only need assemble alright at last, simple structure, convenient operation has reduced required precision when circuit board production, has improved production efficiency.
Description
Technical Field
The utility model relates to a circuit board field, specificly is a PCB circuit board with many louvres.
Background
At least one conductive pattern is attached to the circuit board and has holes to interconnect electronic components, which is the basis of almost all electronic products. With the continuous progress of technology, circuit boards have been developed toward high power, miniaturization, and high density assembly, so that a multilayer circuit board (i.e. a circuit board with more than two layers) has appeared, which is composed of connecting wires on a base insulating substrate and bonding pads for mounting and soldering electronic components, and has the functions of conducting lines of each layer and insulating each other.
At present in order to dispel the heat to the circuit board, except through external device, still can have the heat dissipation layer on the circuit board for accelerate the heat dissipation to the circuit board, but present heat dissipation layer is mostly direct design in the circuit board, is a whole with the circuit board, and is undetachable, and this work load and the work precision that need when having just increased circuit board production have reduced production efficiency.
SUMMERY OF THE UTILITY MODEL
For solving the not enough that mentions in the above-mentioned background art, the utility model aims to provide a PCB circuit board with many louvres, the utility model discloses a be provided with fixture, the heating panel is installed through fixture and circuit board for be dismantled and assembled state between heating panel and the circuit board, this in process of production, just need not to design the heat dissipation layer in the circuit board, only need assemble alright at last, simple structure, convenient operation has reduced required precision when circuit board production, has improved production efficiency.
The purpose of the utility model can be realized by the following technical scheme:
a PCB circuit board with multiple heat dissipation holes comprises a circuit board body, wherein heat dissipation through holes are formed in the array of the circuit board body, a bottom plate is fixedly connected to the center of the bottom of the circuit board body, a groove is formed in the surface of the bottom plate, a heat dissipation plate is arranged in the groove, heat absorption stand columns are distributed on one side of the heat dissipation plate in an array mode and correspond to the heat dissipation through holes one by one, the heat absorption stand columns penetrate through the circuit board body through the heat dissipation through holes, and heat dissipation fins are distributed on one side of;
and clamping mechanisms are arranged in the bottom plate and on two sides of the heat dissipation plate, and the heat dissipation plate is fixedly connected with the circuit board body through the clamping mechanisms.
Furthermore, the heat absorption upright post penetrates through one end surface of the circuit board body and is sleeved with a sealing gasket, and the sealing gasket is tightly attached to the surface of the circuit board body.
Further, fixture includes splint, and the movable groove has been seted up to the bottom plate, splint in the movable groove and with circuit board body sliding connection, one side that circuit board body was kept away from to splint is provided with fixed handle, and the one end that heating panel was kept away from to splint is provided with reset spring, and splint are connected with circuit board body through reset spring, and the breach with splint matched with is seted up on the surface of heating panel.
Further, the equal fixedly connected with in both sides of splint removes the slider, and the spout has been seted up to the inside wall in activity groove, removes the slider and is located the spout, and splint through removing slider and circuit board body sliding connection.
The utility model has the advantages that:
the utility model discloses a be provided with fixture, the heating panel is installed through fixture and circuit board for be dismantled and assembled state between heating panel and the circuit board, this in process of production, just need not to design the heat dissipation layer in the circuit board, only need assemble alright at last, simple structure, convenient operation has reduced required precision when circuit board production, has improved production efficiency.
Drawings
The present invention will be further described with reference to the accompanying drawings.
FIG. 1 is a schematic view of the overall structure of the present invention;
FIG. 2 is a schematic view of the structure of the heat dissipation plate of the present invention;
fig. 3 is a sectional view of the clamping mechanism of the present invention;
fig. 4 is a schematic structural view of the clamping mechanism of the present invention.
In the figure: 1. a circuit board body; 11. a heat dissipating through hole; 2. a base plate; 21. a movable groove; 3. a heat dissipation plate; 31. a heat sink; 4. a heat absorbing column; 5. a gasket; 6. a clamping mechanism; 61. a splint; 62. fixing a handle; 63. a return spring; 64. the slider is moved.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by a person of ordinary skill in the art without creative efforts belong to the protection scope of the present invention.
In the description of the present invention, it is to be understood that the terms "open hole", "upper", "lower", "thickness", "top", "middle", "length", "inner", "around", and the like, indicate positional or positional relationships, are merely for convenience in describing the present invention and to simplify the description, and do not indicate or imply that the components or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore should not be construed as limiting the present invention.
A PCB circuit board with multiple heat dissipation holes is disclosed, as shown in figures 1 and 2, comprising a circuit board body 1, heat dissipation through holes 11 are arranged on the array of the circuit board body 1, a bottom plate 2 is fixedly connected with the center of the bottom of the circuit board body 1, a groove is arranged on the surface of the bottom plate 2, a heat dissipation plate 3 is arranged in the groove, heat absorption upright posts 4 are distributed on one side of the heat dissipation plate 3 in an array manner, the heat absorption upright posts 4 correspond to the heat dissipation through holes 11 one by one, the heat absorption upright posts 4 penetrate through the circuit board body 1 through the heat dissipation through holes 11 and extend upwards, heat dissipation fins 31 are distributed on one side of the heat dissipation plate 3 away from the heat absorption upright posts 4 in an array manner, the heat absorption upright posts 4 are made of metal with quick heat absorption and quick heat conduction, heat generated by the circuit board body 1 after working is transferred to the heat dissipation plate, and is radiated from the heat sink 31, so that the temperature of the circuit board body 1 can be rapidly lowered.
The end surface of the heat absorption upright post 4 penetrating through the circuit board body 1 is sleeved with a sealing gasket 5, and the sealing gasket 5 is tightly attached to the surface of the circuit board body 1.
As shown in fig. 3 and 4, the clamping mechanism 6 includes a clamping plate 61, the bottom plate 2 has an active slot 21, the clamping plate 61 is in the active slot 21 and is slidably connected to the circuit board body 1, one side of the clamping plate 61 away from the circuit board body 1 is provided with a fixing handle 62, one end of the clamping plate 61 away from the heat dissipation plate 3 is provided with a return spring 63, and the clamping plate 61 is connected to the circuit board body 1 through the return spring 63, a gap matched with the clamping plate 61 is formed on the surface of the heat dissipation plate 3, during installation, the clamping plate 61 is pushed by the fixing handle 62, the return spring 63 is pressed inwards by the clamping plate 61, after the heat dissipation plate 3 is installed in the groove, the clamping plate 61 is inserted into the gap on the surface.
The equal fixedly connected with in both sides of splint 61 removes slider 64, and the spout has been seted up to the inside wall of activity groove 21, removes slider 64 and is located the spout, and splint 61 is through removing slider 64 and circuit board body 1 sliding connection.
When using, through promoting splint 61 to both sides, splint 61 extrudees reset spring 63, put into the recess of circuit board body 1 bottom with the one side that heating panel 3 has heat absorption stand 4, heat absorption stand 4 upwards stretches out along heat dissipation through-hole 11, and it is fixed with it through sealed 5 that fills up, and simultaneously, splint 61 is under reset spring 63's spring action, insert in the breach on heating panel 3 surface along activity groove 21, thereby fix heating panel 3, moreover, the steam generator is simple in structure, and convenient for operation, need not to design the heat dissipation layer in circuit board body 1, the precision when having reduced production, and the production efficiency is improved.
In the description herein, references to the description of "one embodiment," "an example," "a specific example," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
The foregoing shows and describes the general principles, essential features, and advantages of the invention. It will be understood by those skilled in the art that the present invention is not limited to the above embodiments, and that the foregoing embodiments and descriptions are provided only to illustrate the principles of the present invention without departing from the spirit and scope of the present invention.
Claims (4)
1. A PCB circuit board with multiple heat dissipation holes comprises a circuit board body (1) and is characterized in that heat dissipation through holes (11) are formed in an array of the circuit board body (1), a bottom plate (2) is fixedly connected to the center of the bottom of the circuit board body (1), grooves are formed in the surface of the bottom plate (2), heat dissipation plates (3) are arranged in the grooves, heat absorption upright columns (4) are distributed in an array mode on one side of each heat dissipation plate (3), the heat absorption upright columns (4) correspond to the heat dissipation through holes (11) in a one-to-one mode, the heat absorption upright columns (4) penetrate through the circuit board body (1) through the heat dissipation through holes (11), and heat dissipation fins (31) are distributed in;
clamping mechanisms (6) are arranged in the bottom plate (2) and on two sides of the heat dissipation plate (3), and the heat dissipation plate (3) is fixedly connected with the circuit board body (1) through the clamping mechanisms (6).
2. The PCB circuit board with multiple heat dissipation holes as claimed in claim 1, wherein a sealing gasket (5) is sleeved on one end surface of the heat absorption column (4) penetrating through the circuit board body (1), and the sealing gasket (5) is tightly attached to the surface of the circuit board body (1).
3. The PCB circuit board with multiple heat dissipation holes as claimed in claim 1, wherein the clamping mechanism (6) comprises a clamping plate (61), the bottom plate (2) is provided with a movable groove (21), the clamping plate (61) is arranged in the movable groove (21) and is slidably connected with the circuit board body (1), one side of the clamping plate (61) far away from the circuit board body (1) is provided with a fixed handle (62), one end of the clamping plate (61) far away from the heat dissipation plate (3) is provided with a return spring (63), the clamping plate (61) is connected with the circuit board body (1) through the return spring (63), and the surface of the heat dissipation plate (3) is provided with a notch matched with the clamping plate (61).
4. The PCB circuit board with multiple heat dissipation holes as claimed in claim 3, wherein both sides of the clamping plate (61) are fixedly connected with movable sliding blocks (64), the inner side wall of the movable groove (21) is provided with a sliding groove, the movable sliding blocks (64) are positioned in the sliding groove, and the clamping plate (61) is slidably connected with the circuit board body (1) through the movable sliding blocks (64).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021244754.9U CN212628553U (en) | 2020-06-29 | 2020-06-29 | PCB circuit board with many louvres |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021244754.9U CN212628553U (en) | 2020-06-29 | 2020-06-29 | PCB circuit board with many louvres |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212628553U true CN212628553U (en) | 2021-02-26 |
Family
ID=74757401
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202021244754.9U Expired - Fee Related CN212628553U (en) | 2020-06-29 | 2020-06-29 | PCB circuit board with many louvres |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN212628553U (en) |
-
2020
- 2020-06-29 CN CN202021244754.9U patent/CN212628553U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20210226 |