CN214154945U - Multilayer circuit board that rolls over is prevented in resistance to compression - Google Patents
Multilayer circuit board that rolls over is prevented in resistance to compression Download PDFInfo
- Publication number
- CN214154945U CN214154945U CN202023035940.4U CN202023035940U CN214154945U CN 214154945 U CN214154945 U CN 214154945U CN 202023035940 U CN202023035940 U CN 202023035940U CN 214154945 U CN214154945 U CN 214154945U
- Authority
- CN
- China
- Prior art keywords
- conductive
- circuit board
- heat dissipation
- insulating substrate
- insulating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000007906 compression Methods 0.000 title claims abstract description 11
- 230000006835 compression Effects 0.000 title claims abstract description 10
- 230000017525 heat dissipation Effects 0.000 claims abstract description 39
- 239000010410 layer Substances 0.000 claims abstract description 35
- 239000000758 substrate Substances 0.000 claims abstract description 35
- 239000011229 interlayer Substances 0.000 claims abstract description 16
- 239000011241 protective layer Substances 0.000 claims abstract description 12
- 239000002184 metal Substances 0.000 claims abstract description 7
- 229910052751 metal Inorganic materials 0.000 claims abstract description 7
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 6
- 229910021389 graphene Inorganic materials 0.000 claims description 6
- 238000005260 corrosion Methods 0.000 claims description 5
- 238000007747 plating Methods 0.000 claims description 5
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 4
- 229920001296 polysiloxane Polymers 0.000 claims description 4
- 229910000679 solder Inorganic materials 0.000 claims description 4
- 238000001125 extrusion Methods 0.000 abstract description 4
- 230000010354 integration Effects 0.000 abstract description 4
- 238000010438 heat treatment Methods 0.000 description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 239000000741 silica gel Substances 0.000 description 4
- 229910002027 silica gel Inorganic materials 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 239000004744 fabric Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 238000005096 rolling process Methods 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 241001391944 Commicarpus scandens Species 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 230000005489 elastic deformation Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
Images
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- Production Of Multi-Layered Print Wiring Board (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The utility model provides a compression-resistant and folding-resistant multilayer circuit board, which comprises a first insulating substrate, a circuit board unit, a heat dissipation plate unit and an insulating protective layer which are sequentially stacked, wherein a plurality of heat dissipation metal balls are arranged in the first insulating substrate, and a bonding pad is arranged in the insulating protective layer; the circuit board unit comprises at least two conductive circuit layers, an insulating interlayer is connected between every two adjacent conductive circuit layers, conductive lugs are fixed on one sides of the conductive circuit layers, and interlayer conductive columns are connected between the conductive lugs; the heat dissipation plate unit comprises a second insulating substrate, an elastic conductive column connected with a bonding pad and a conductive circuit layer is arranged in the second insulating substrate, a plurality of heat dissipation fins are further arranged in the second insulating substrate, and elastic pieces are fixed above and below the heat dissipation fins. The utility model discloses can effectively realize alleviating through deformation when receiving great extrusion force, can effectively avoid the multilayer circuit board to be broken because of the extrusion force, overall structure is compact reliable, and the integration degree is high.
Description
Technical Field
The utility model relates to a circuit board field specifically discloses a multilayer circuit board that rolls over is prevented in resistance to compression.
Background
The electronic product can not work without a circuit board, and the circuit board is a carrier for fixing, assembling and mechanically supporting various electronic elements such as an integrated circuit and the like, and can be used for welding and mounting the electronic elements and providing corresponding conductive circuits.
The circuit board usually uses an epoxy glass fabric laminated board as a substrate, and a copper-clad layer with conductive circuits obtained by etching is arranged on the substrate, and the multilayer circuit board refers to a circuit board structure with multiple layers of conductive circuits. As modern electronic products gradually develop towards portability, circuit boards as important parts in electronic products also need to be applied in portable scenes, but circuit boards in the prior art are easy to break when being squeezed, and the anti-seismic performance is poor.
SUMMERY OF THE UTILITY MODEL
Therefore, it is necessary to provide a compression-resistant and folding-resistant multilayer circuit board, which has good compression-resistant and folding-resistant performance, load-bearing capacity and good heat dissipation performance, in view of the problems in the prior art.
In order to solve the prior art problem, the utility model discloses a multilayer circuit board with compression resistance and folding resistance, which comprises a first insulating substrate, a circuit board unit, a heat radiation plate unit and an insulating protective layer which are stacked in sequence, wherein a plurality of heat radiation metal balls are arranged in the first insulating substrate, and a bonding pad is arranged in the insulating protective layer;
the circuit board unit comprises at least two conductive circuit layers, an insulating interlayer is connected between every two adjacent conductive circuit layers, conductive lugs are fixed on one sides of the conductive circuit layers, and interlayer conductive columns are connected between the conductive lugs;
the heat dissipation plate unit comprises a second insulating substrate, an elastic conductive column connected with a bonding pad and a conductive circuit layer is arranged in the second insulating substrate, a plurality of heat dissipation fins perpendicular to the insulating protective layer are further arranged in the second insulating substrate, and elastic pieces are fixed on the upper portion and the lower portion of each heat dissipation fin.
Furthermore, the surfaces of the conductive bump and the interlayer conductive column are covered with an anti-corrosion coating.
Further, the second insulating substrate is a heat-conducting silica gel plate.
Furthermore, the elastic conductive column is a conductive silver glue column.
Further, the radiating fins are graphene fins, and the elastic pieces are heat-conducting silica gel blocks.
Furthermore, the insulating protective layer is a solder mask ink layer.
The utility model has the advantages that: the utility model discloses a multilayer circuit board that resistance to compression is prevented rolling over is provided with special heating panel unit, can effectively realize alleviating through deformation when receiving great extrusion force, can effectively avoid multilayer circuit board to be broken because of the extrusion force, in addition, the elastic conductive column and the radiating fin that set up vertically in the second insulating substrate can effectively improve the bearing and bearing the heavy burden ability of overall structure, and overall structure is compact reliable, and the integration degree is high; the conducting structure between the conducting circuit layers is arranged outside the circuit board unit, so that the circuit board unit can be effectively and conveniently processed and maintained, and the heat dissipation plate unit and the heat dissipation metal balls inside the first insulating substrate have good heat dissipation performance, so that the working performance of the multilayer circuit board can be effectively ensured.
Drawings
Fig. 1 is a schematic perspective view of the present invention.
Fig. 2 is a schematic top view of the present invention.
Fig. 3 is a schematic cross-sectional view along a-a' in fig. 2.
The reference signs are: the circuit board comprises a first insulating substrate 10, heat dissipation metal balls 11, a circuit board unit 20, a conductive circuit layer 21, a conductive bump 211, an interlayer conductive column 212, an anti-corrosion plating layer 213, an insulating interlayer 22, a heat dissipation plate unit 30, a second insulating substrate 31, an elastic conductive column 32, a heat dissipation fin 33, an elastic piece 34, an insulating protection layer 40 and a pad 41.
Detailed Description
For further understanding of the features and technical means of the present invention, as well as the specific objects and functions attained by the present invention, the present invention will be described in further detail with reference to the accompanying drawings and detailed description.
Refer to fig. 1 to 3.
The embodiment of the utility model discloses multilayer circuit board that anti-compression is prevented rolling over, include from the first insulating substrate 10 that stacks gradually down to supreme, circuit board unit 20, heating panel unit 30 and insulating protective layer 40, be equipped with a plurality of heat dissipation metal balls 11 in the first insulating substrate 10, heat dissipation metal ball 11 is not with the top surface or the bottom surface contact of first insulating substrate 10, can effectively prevent to take place the short circuit, can also effectively ensure the heat dispersion of first insulating substrate 10, preferably, first insulating substrate 10 is epoxy glass cloth laminated board, be equipped with in the insulating protective layer 40 and be used for supplying electronic component welding continuous pad 41, preferably, pad 41 is tin-plated copper pad;
the circuit board unit 20 includes at least two conductive circuit layers 21, an insulating interlayer 22 is connected between each two adjacent conductive circuit layers 21, a conductive bump 211 protruding out of the side surface of the heat dissipation plate unit 30 is fixed on one side of the conductive circuit layer 21, preferably, the conductive bump 211 and the conductive circuit layer 21 are in an integrated structure, an interlayer conductive pillar 212 is connected between corresponding conductive bumps 211, preferably, the interlayer conductive pillar 212 is a copper pillar for realizing communication of the corresponding conductive circuit layer 21, and the conductive circuit layers 21 of the circuit board unit 20 are communicated with corresponding circuits through the external interlayer conductive pillar 212, so that the processing and the maintenance are convenient;
the heat dissipation plate unit 30 includes a second insulating substrate 31, the second insulating substrate 31 is provided with an elastic conductive pillar 32 having upper and lower ends respectively connected to the pad 41 and the conductive trace layer 21, the elastic conductive pillar 32 has good electrical conductivity and elasticity, which not only ensures reliable electrical connection between the pad 41 and the conductive trace, meanwhile, the elasticity of the heat dissipation plate unit 30 can be ensured, a plurality of heat dissipation fins 33 perpendicular to the insulating protective layer 40 are arranged in the second insulating substrate 31, the heat dissipation fins 33 have good heat dissipation performance and can effectively guide heat to the outside along the longitudinal direction, an elastic piece 34 is fixed on the upper and lower parts of each heat dissipation fin 33, the elastic piece 34 can effectively improve the pressure resistance of the heat dissipation plate unit 30, the heat dissipation fins 33 and the elastic conductive columns 32 are arranged in a staggered manner, that is, the heat dissipating fins 33 are not in contact with the elastic conductive columns 32, and the heat dissipating plate unit 30 can have elasticity and load bearing capability close to each other in each region. Preferably, the heat dissipation fins 33 and the elastic conductive columns 32 are collectively referred to as support members, and all the support members are distributed in the second insulating substrate 31 in an equally spaced array, so that the reliability of the heat dissipation plate unit 30 can be ensured.
When heating panel unit 30 receives the pressure of perpendicular to insulating protective layer 40, elasticity is led electrical pillar 32 and elastic component 34 and is all possessed good elasticity, possess certain deformability, can effectively avoid the circuit board to be broken by pressure, the integration has multiple functions's structure in heating panel unit 30, can realize corresponding switching on, heat conduction and elastically deformable function, overall structure is compact reliable, the degree of integration is high, the elasticity that is vertical setting in the second insulating substrate 31 is led electrical pillar 32 and radiating fin 33 and can also effectively improve the holistic bearing capacity of heating panel unit 30, the utility model discloses a multilayer circuit board possesses good bending resistance deformability and good bearing capacity simultaneously.
In this embodiment, the surfaces of the conductive bumps 211 and the interlayer conductive pillars 212 are covered with the anti-corrosion plating layer 213, and preferably, the anti-corrosion plating layer 213 is a nickel plating layer, which can effectively prevent the conductive bumps 211 and the interlayer conductive pillars 212 from being corroded and damaged.
In this embodiment, the second insulating substrate 31 is a heat-conducting silica gel plate, and the elastic deformation capability of the second insulating substrate can be effectively improved through the heat-conducting silica gel plate, so that the compression resistance of the multilayer circuit board is effectively improved.
In the present embodiment, the elastic conductive column 32 is a conductive silver paste column, and the conductive silver paste has good conductive performance and elastic deformability.
In this embodiment, the heat dissipation fins 33 are graphene fins, the elastic member 34 is a heat conductive silicone block, the graphene fins have excellent heat conductivity, the heat dissipation performance of the heat dissipation plate unit 30 can be remarkably improved, the heat conductive silicone block has good elasticity and heat conductivity, the insulation performance of the heat dissipation plate unit can effectively prevent the graphene fins and the conductive circuit layer 21 from being connected and short-circuited, the graphene fins are light, and the reduction of the weight of the multilayer circuit board can be limited.
In this embodiment, the insulating protective layer 40 is a solder resist ink layer, and the solder resist ink can increase the rigidity of the surface of the multilayer circuit board, thereby preventing the heat dissipation plate unit 30 from being pierced during use.
The above-mentioned embodiments only represent some embodiments of the present invention, and the description thereof is specific and detailed, but not to be construed as limiting the scope of the present invention. It should be noted that, for those skilled in the art, without departing from the spirit of the present invention, several variations and modifications can be made, which are within the scope of the present invention. Therefore, the protection scope of the present invention should be subject to the appended claims.
Claims (6)
1. The compression-resistant and folding-resistant multilayer circuit board is characterized by comprising a first insulating substrate (10), a circuit board unit (20), a heat dissipation plate unit (30) and an insulating protection layer (40) which are sequentially stacked, wherein a plurality of heat dissipation metal balls (11) are arranged in the first insulating substrate (10), and a bonding pad (41) is arranged in the insulating protection layer (40);
the circuit board unit (20) comprises at least two conductive circuit layers (21), an insulating interlayer (22) is connected between every two adjacent conductive circuit layers (21), conductive bumps (211) are fixed on one side of each conductive circuit layer (21), and interlayer conductive columns (212) are connected between the conductive bumps (211);
the heat dissipation plate unit (30) comprises a second insulating substrate (31), elastic conductive columns (32) connected with the bonding pads (41) and the conductive circuit layer (21) are arranged in the second insulating substrate (31), heat dissipation fins (33) perpendicular to the insulating protection layer (40) are further arranged in the second insulating substrate (31), and elastic pieces (34) are fixed on the upper portions and the lower portions of the heat dissipation fins (33).
2. The circuit board of claim 1, wherein the surfaces of the conductive bumps (211) and the interlayer conductive pillars (212) are covered with an anti-corrosion plating layer (213).
3. The circuit board of claim 1, wherein the second insulating substrate (31) is a thermal conductive silicone sheet.
4. The circuit board of claim 1, wherein the elastic conductive posts (32) are conductive silver paste posts.
5. The circuit board of claim 1, wherein the heat dissipation fins (33) are graphene fins, and the elastic member (34) is a thermally conductive silicone block.
6. The circuit board as claimed in claim 1, wherein the insulating protective layer (40) is a solder resist ink layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202023035940.4U CN214154945U (en) | 2020-12-15 | 2020-12-15 | Multilayer circuit board that rolls over is prevented in resistance to compression |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202023035940.4U CN214154945U (en) | 2020-12-15 | 2020-12-15 | Multilayer circuit board that rolls over is prevented in resistance to compression |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214154945U true CN214154945U (en) | 2021-09-07 |
Family
ID=77587566
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202023035940.4U Expired - Fee Related CN214154945U (en) | 2020-12-15 | 2020-12-15 | Multilayer circuit board that rolls over is prevented in resistance to compression |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN214154945U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117812849A (en) * | 2024-02-23 | 2024-04-02 | 倍利得电子科技(深圳)有限公司 | Anti-deformation display card integrated circuit board and preparation process thereof |
-
2020
- 2020-12-15 CN CN202023035940.4U patent/CN214154945U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117812849A (en) * | 2024-02-23 | 2024-04-02 | 倍利得电子科技(深圳)有限公司 | Anti-deformation display card integrated circuit board and preparation process thereof |
| CN117812849B (en) * | 2024-02-23 | 2024-04-30 | 倍利得电子科技(深圳)有限公司 | Anti-deformation display card integrated circuit board and preparation process thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20210907 |