CN117812849B - Anti-deformation display card integrated circuit board and preparation process thereof - Google Patents
Anti-deformation display card integrated circuit board and preparation process thereof Download PDFInfo
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- CN117812849B CN117812849B CN202410204040.1A CN202410204040A CN117812849B CN 117812849 B CN117812849 B CN 117812849B CN 202410204040 A CN202410204040 A CN 202410204040A CN 117812849 B CN117812849 B CN 117812849B
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- 238000002360 preparation method Methods 0.000 title claims abstract description 17
- 238000005507 spraying Methods 0.000 claims abstract description 338
- 238000009736 wetting Methods 0.000 claims abstract description 36
- 239000011248 coating agent Substances 0.000 claims abstract description 16
- 238000000576 coating method Methods 0.000 claims abstract description 16
- 238000013499 data model Methods 0.000 claims abstract description 16
- 238000005476 soldering Methods 0.000 claims abstract description 16
- 229910001174 tin-lead alloy Inorganic materials 0.000 claims abstract description 14
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 4
- 238000003486 chemical etching Methods 0.000 claims abstract description 4
- 229910052802 copper Inorganic materials 0.000 claims abstract description 4
- 239000010949 copper Substances 0.000 claims abstract description 4
- 238000005553 drilling Methods 0.000 claims abstract description 4
- 239000007921 spray Substances 0.000 claims description 53
- 230000008021 deposition Effects 0.000 claims description 48
- 238000000034 method Methods 0.000 claims description 26
- 238000007751 thermal spraying Methods 0.000 claims description 9
- 238000004519 manufacturing process Methods 0.000 claims description 6
- 238000007747 plating Methods 0.000 claims description 6
- 238000010276 construction Methods 0.000 claims description 4
- 238000001816 cooling Methods 0.000 claims 1
- 238000010438 heat treatment Methods 0.000 claims 1
- 238000003466 welding Methods 0.000 description 21
- 229910000679 solder Inorganic materials 0.000 description 13
- 238000012797 qualification Methods 0.000 description 6
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 5
- 238000005137 deposition process Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4007—Surface contacts, e.g. bumps
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3494—Heating methods for reflowing of solder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/16—Inspection; Monitoring; Aligning
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention relates to the technical field of preparation of display card integrated circuit boards, and provides a preparation process of an anti-deformation display card integrated circuit board, which comprises the following steps: carrying out chemical etching, copper coating and drilling on the surface of the display card integrated circuit board; carrying out pad spraying on the display card integrated circuit board to obtain a spraying area; comprising the following steps: acquiring a spraying state of the tin-lead alloy, and acquiring the spraying coverage rate of the tin-lead alloy based on the spraying state; acquiring a display card integrated circuit board with qualified spraying coverage, setting spraying parameters based on a spraying contact angle data model, spraying a spraying region, completing spraying work, calculating a wetting value of the spraying region, and comparing the wetting value with a wetting threshold; and coating printing soldering paste on a bonding pad of the display card integrated circuit board, and then placing the printed soldering paste in reflow soldering equipment to heat and cool the soldering paste to obtain the display card integrated circuit board.
Description
Technical Field
The invention relates to the technical field of preparation of display card integrated circuit boards, in particular to a deformation-resistant display card integrated circuit board and a preparation process thereof.
Background
The integrated circuit board of the display card, also called as the PCB board of the display card, is the circuit board of the display card, similar to the PCB board of the main board. It is responsible for connecting other components on the graphics card, similar to the action of a motherboard. The display card integrated circuit board mainly comprises a display chip, a display memory, a power supply module and the like;
In the preparation process of the display card integrated circuit board, spraying plating is required to be carried out on a designated area on the surface of the display card integrated circuit board, then tin paste is coated, small electronic components such as a plug-in capacitor, a resistor and the like are attached to the display card integrated circuit board, then the electronic components enter a welding furnace, and pins of the miniature electronic components are firmly welded on the display card integrated circuit board in a reflow soldering mode;
In the process of welding the pins of the electronic components, the pins of the electronic components are welded on the spraying coating area on the surface of the display card integrated circuit board through solder paste, and the area size and the spraying coating thickness of the spraying coating area on the surface of the display card integrated circuit board are important factors influencing the connection of the pins of the electronic components and the display card integrated circuit board, so that the area size and the spraying coating thickness of the spraying coating area on the surface of the display card integrated circuit board are required to be accurately and effectively controlled in the preparation process of the display card integrated circuit board, and the welding stability of the pins of the electronic components and the display card integrated circuit board in the subsequent preparation process is better ensured.
Disclosure of Invention
The invention aims to provide an anti-deformation display card integrated circuit board and a preparation process thereof, so as to solve the problems in the background.
The aim of the invention can be achieved by the following technical scheme:
a preparation process of a deformation-resistant display card integrated circuit board comprises the following steps:
step one: carrying out chemical etching, copper coating and drilling on the surface of the display card integrated circuit board;
Step two: carrying out pad spraying on the display card integrated circuit board to obtain a spraying area; comprising the following steps:
a1: acquiring a spraying state of the tin-lead alloy, acquiring the spraying coverage rate of the tin-lead alloy based on the spraying state, and marking the obtained product as PF;
A2: judging whether the spraying coverage PF is in a preset spraying coverage value range [ PFx, PFy ]; wherein PFx is less than 1 and less than PFy;
If the spraying coverage rate PF is smaller than a preset spraying coverage rate value PFx, a spraying coverage rate failure signal is obtained;
if the spraying coverage PF is larger than a preset spraying coverage value PFx, a spraying coverage exceeding signal is obtained;
if the spraying coverage PF is in a preset spraying coverage value range [ PFx, PFy ], the spraying coverage is qualified, and a spraying area with qualified spraying coverage is obtained;
A3: acquiring a display card integrated circuit board with qualified spraying coverage rate, setting spraying parameters based on a spraying contact angle data model, spraying a spraying region, completing spraying work, acquiring a spraying thickness value of the spraying region, marking as PH, calculating to acquire a spraying contact angle value JC, simultaneously acquiring a spraying temperature value PW, calculating to acquire a wetting value of the spraying region, and marking as RS;
A4: comparing the wetting degree value RS with a wetting degree threshold RSy;
If the wetting value RS is smaller than the wetting threshold RSy, generating a spraying failure signal;
If the wetting value RS is larger than or equal to the wetting threshold RSy, generating a spraying qualified signal;
Step three: and coating printing soldering paste on a bonding pad of the display card integrated circuit board, and then placing the printed soldering paste in reflow soldering equipment to heat and cool the soldering paste to obtain the display card integrated circuit board.
As a further scheme of the invention: the deposition parameters include a deposition time value Tp, a deposition pressure value Py, and a deposition temperature value PW.
As a further scheme of the invention: acquiring historical spraying coverage rate and spraying distance values, and marking the historical spraying coverage rate and the spraying distance values as PLf and Jf respectively;
by fitting the historical spray coverage PLf and spray distance value Jf to the formula of the impact relationship of spray coverage to spray distance The deposition distance influence coefficient a and the deposition coverage correction factor b are calculated and obtained.
As a further scheme of the invention: if the spray coverage exceeds the standard signal or the spray coverage does not reach the standard signal is obtained, the spray coverage is adjusted based on an influence relation formula of the spray coverage and the spray coverage.
As a further scheme of the invention: the construction mode of the thermal spraying contact angle data model is as follows:
S1: acquiring historical spraying data at a spraying distance JF under the condition that the spraying area is qualified;
S2: acquiring historical spraying parameters in a state that the wettability value of a spraying area in the historical spraying data is qualified, wherein the historical spraying parameters comprise a historical spraying time value Tps and a historical spraying pressure value Pys; meanwhile, acquiring a historical spraying thickness value PHs under the historical spraying parameters; calculating to obtain a spraying time influence coefficient m, a spraying pressure influence coefficient n and a spraying thickness correction factor f;
S3: acquiring a historical spray thickness value PHs and a historical spray contact angle value JCs when the historical spray thickness value PHs in the historical spray data; calculating to obtain an influence coefficient u of the spraying contact angle and a spraying contact angle correction factor v;
s4: obtaining a spray contact angle value based on the spray time influence coefficient m, the spray pressure influence coefficient n, the spray thickness correction factor f, the spray contact angle influence coefficient u, and the spray contact angle correction factor v: 。
as a further scheme of the invention: s2: fitting the historical deposition time values Tps, the historical deposition pressure values Pys, and the historical deposition thickness values PHs to And calculating to obtain a spraying time influence coefficient m, a spraying pressure influence coefficient n and a spraying thickness correction factor f.
As a further scheme of the invention: s3: historical deposition contact angle values JCs for historical deposition thickness values PHs and PHs are fit to the formulaAnd calculating to obtain a spraying contact angle influence coefficient u and a spraying contact angle correction factor v between the spraying contact angle and the spraying thickness.
As a further scheme of the invention: the wettability value RS of the deposition region is calculated from the deposition contact angle value JC and the deposition temperature PW: wherein,H is the thermal spraying temperature influence coefficient.
As a further scheme of the invention: if a spraying failure signal is obtained: the deposition data is adjusted to adjust the deposition temperature RS and/or the deposition contact angle value JC.
The anti-deformation display card integrated circuit board is prepared by the preparation process.
The invention has the beneficial effects that:
According to the invention, the spray coating area on the display card integrated circuit board is detected, so that the qualification rate of the spray coating area is ensured, and the connection stability of pins of the electronic component and the spray coating area is further ensured when the solder paste is coated and welded; secondly, in the spraying process, the thickness of a tin-lead alloy layer sprayed in the spraying process is obtained, and the wettability is a decisive factor for determining the stability of welding of pins of subsequent electronic components and the spraying area because of the wettability of the spraying area determined by the spraying thickness, so that the wettability of the whole spraying area needs to be ensured, and the spraying layer qualified in spraying can be obtained through calculating the wettability threshold value, so that the stability of subsequent tin paste in the welding process is further ensured.
Drawings
The invention is further described below with reference to the accompanying drawings.
FIG. 1 is a schematic illustration of a preparation process flow of the present invention;
FIG. 2 is a schematic diagram of a spray contact angle model construction flow in the present invention.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
Example 1
Referring to fig. 1, the present invention is a process for preparing a deformation-resistant integrated circuit board of a graphics card, comprising:
step one: carrying out chemical etching, copper coating and drilling on the surface of the display card integrated circuit board;
Step two: carrying out pad spraying on the display card integrated circuit board to obtain a spraying area; comprising the following steps:
a1: acquiring a spraying state of the tin-lead alloy, acquiring the spraying coverage rate of the tin-lead alloy based on the spraying state, and marking the obtained product as PF;
A2: judging whether the spraying coverage PF is in a preset spraying coverage value range [ PFx, PFy ]; wherein PFx is less than 1 and less than PFy;
If the spraying coverage rate PF is smaller than a preset spraying coverage rate value PFx, a spraying coverage rate failure signal is obtained;
if the spraying coverage PF is larger than a preset spraying coverage value PFx, a spraying coverage exceeding signal is obtained;
if the spraying coverage PF is in a preset spraying coverage value range [ PFx, PFy ], the spraying coverage is qualified, and a spraying area with qualified spraying coverage is obtained;
In the subsequent welding process of the pins of the electronic component and the display card integrated circuit, the pins and the spraying areas are required to be tightly welded and fixed through the solder paste, so that the spraying area is required to reach a preset standard, and the connection stability of the pins of the electronic component and the spraying areas can be effectively ensured when the solder paste is coated and welded;
A3: the method comprises the steps of obtaining a display card integrated circuit board with qualified spraying coverage rate, setting spraying parameters based on a spraying contact angle data model, spraying a spraying area, and completing spraying work, wherein the spraying parameters comprise a spraying time value Tp, a spraying pressure value Py and a spraying temperature value PW; obtaining a spraying thickness value of a spraying region, marking the spraying thickness value as PH, calculating a spraying contact angle value JC, simultaneously obtaining a spraying temperature value PW, calculating a wetting value of the spraying region, and marking the wetting value as RS;
A4: comparing the wetting degree value RS with a wetting degree threshold RSy;
If the wetting value RS is smaller than the wetting threshold RSy, generating a spraying failure signal;
If the wetting value RS is larger than or equal to the wetting threshold RSy, generating a spraying qualified signal; obtaining a spraying coating area with a qualified wetting value RS;
Because the pins of the electronic components are welded with tin-lead alloy sprayed on the display card integrated circuit board through tin paste, the wettability of the sprayed area determines the main factor of the welding stability of the tin paste, if the wettability of the sprayed area is not good, the tin paste cannot be well attached to the sprayed area during welding, the phenomenon of poor welding such as cold welding and cold welding easily occurs, the use of the whole display card integrated circuit board is influenced, the qualification rate is reduced, and the sprayed area with good wettability can effectively improve the welding reliability, reduce welding defects, ensure the welding stability, and further improve the overall stability and qualification rate of the display card integrated circuit board;
Step three: and coating printing soldering paste on a bonding pad of the display card integrated circuit board, and then placing the printed soldering paste in reflow soldering equipment to heat and cool the soldering paste to obtain the display card integrated circuit board.
In the preparation process of the display card integrated circuit board, the spraying data of the spraying area is obtained and detected by detecting the spraying area of the spraying coating of the tin-lead alloy, so that the coverage of the spraying area is ensured to meet the requirement, and the stability of the subsequent welding of the pins of the electronic components and the spraying area through the solder paste is ensured; further, the thickness of the tin-lead alloy layer sprayed in the spraying process is obtained, and the wettability is a decisive factor for determining the stability of welding of the pins of the subsequent electronic components and the spraying region because of the wettability of the spraying region determined by the spraying thickness, so that the wettability of the whole spraying region needs to be ensured, and the spraying qualified sprayed layer can be further obtained through calculating the wettability threshold value, so that the stability of the subsequent solder paste in the welding process is further ensured.
Example two
When spraying, the spraying distance has a certain influence on the spraying coverage rate, so when a spraying coverage rate exceeding signal or a spraying coverage rate not reaching signal is obtained, the spraying distance is adjusted based on an influence relation formula of the spraying coverage rate and the spraying distance;
the method for obtaining the influence relation formula of the spraying coverage rate and the spraying distance comprises the following steps:
acquiring historical spraying coverage rate and spraying distance values, and marking the historical spraying coverage rate and the spraying distance values as PLf and Jf respectively;
by fitting the historical spray coverage PLf and spray distance value Jf to the formula of the impact relationship of spray coverage to spray distance Calculating to obtain a spraying distance influence coefficient a and a spraying coverage rate correction factor b;
If the spraying coverage rate is unqualified, the spraying coverage rate can be directly adjusted, so that the spraying coverage rate meets the standard, the wetting degree of the spraying area after the spraying is finished can better meet the requirement of solder paste welding, and the connection stability of the pins of the electronic component and the display card integrated circuit board is ensured.
Example III
Based on the embodiment, under the condition that the spraying coverage rate is qualified, the spraying parameters are required to be selected, so that the moisture of the spraying area is further ensured to be qualified; therefore, it is necessary to ensure accuracy of the deposition time, deposition pressure, and deposition temperature in the deposition process, and therefore, in the deposition process, a deposition contact angle data model is constructed for setting deposition parameters based on the history data; so that the wettability of the spraying area after the spraying is finished can better meet the requirements of solder paste welding;
specifically, the construction mode of the thermal spraying contact angle data model is as follows:
S1: acquiring historical spraying data at a spraying distance JF under the condition that the spraying area is qualified;
S2: acquiring historical spraying parameters in a state that the wettability value of a spraying area in the historical spraying data is qualified, wherein the historical spraying parameters comprise a historical spraying time value Tps and a historical spraying pressure value Pys; meanwhile, acquiring a historical spraying thickness value PHs under the historical spraying parameters; calculating to obtain a spraying time influence coefficient m, a spraying pressure influence coefficient n and a spraying thickness correction factor f;
Wherein the historical deposition time value Tps, the historical deposition pressure value Pys, and the historical deposition thickness value PHs are fit to Calculating to obtain a spraying time influence coefficient m, a spraying pressure influence coefficient n and a spraying thickness correction factor f;
S3: acquiring a historical spray thickness value PHs and a historical spray contact angle value JCs when the historical spray thickness value PHs in the historical spray data; calculating to obtain an influence coefficient u of the spraying contact angle and a spraying contact angle correction factor v;
wherein the historical deposition contact angle values JCs for the historical deposition thickness values PHs and PHs are fit to the formula Calculating to obtain a spraying contact angle influence coefficient u and a spraying contact angle correction factor v between the spraying contact angle and the spraying thickness;
s4: obtaining a spray contact angle value based on the spray time influence coefficient m, the spray pressure influence coefficient n, the spray thickness correction factor f, the spray contact angle influence coefficient u, and the spray contact angle correction factor v: 。
The thermal spraying contact angle data model is a model for further calculating the contact property between the surface of the thermal spraying region and the solder paste liquid drop based on the thickness of the thermal spraying region; the spraying contact angle is the included angle between the surface of the spraying area and the solder paste liquid drop, and in the calculation of the spraying contact angle, the size of the spraying contact angle of the spraying area is inversely related to the spraying thickness under the condition that other factors are certain, so that the spraying thickness is in the range of a preset value, and the smaller the contact angle of the solder paste in the spraying area is, the better wettability is indicated;
Further, after the spray contact angle is obtained, in the spray process, the influence of the spray temperature on the spray thickness of the spray region needs to be calculated;
Therefore, in spraying the sprayed region, it is necessary to provide a spraying temperature value, a spraying time value, and a spraying pressure value based on the acceptable wettability value RS to ensure that the wettability of the sprayed region meets the spraying standard after the spraying is completed; the spraying efficiency of the display card integrated circuit board in the spraying process is further improved.
Example IV
Based on the above embodiment, after the deposition is performed by providing the deposition time and the deposition pressure by the deposition contact angle data model, it is necessary to detect the deposition region where the deposition is completed;
Based on this, the following detection scheme is provided in this embodiment:
q1: obtaining a spraying thickness value of a spraying region, marking the spraying thickness value as PH, calculating to obtain a spraying contact angle value JC, simultaneously obtaining a spraying temperature value PW, and calculating to obtain a wetting value RS of the spraying region;
Q2: comparing the wetting degree value RS with a wetting degree threshold RSy;
If the wetting value RS is smaller than the wetting threshold RSy, generating a spraying failure signal;
If the wetting value RS is larger than or equal to the wetting threshold RSy, generating a spraying qualified signal;
q3: if a spraying failure signal is obtained: adjusting the spraying data, and adjusting the spraying temperature RS and/or the spraying contact angle value JC;
Specific: in the adjusting process, the spraying temperature RS is preferably selected and adjusted, and the spraying temperature can improve the wettability of tin-lead alloy in the spraying area in the spraying process; therefore, when the humidity value RS of the spraying area is unqualified, the spraying temperature value is preferentially adjusted, and because the spraying temperature can increase the humidity within a certain range, after the spraying temperature exceeds the temperature threshold value, the spraying material is easy to react or decompose, therefore, when the spraying temperature reaches the preset value, the humidity value still cannot reach the humidity threshold value standard, the spraying contact angle value JC is further adjusted, and the factor affecting the spraying contact angle value JC is the spraying thickness value, and the spraying time and the spraying pressure are determined for the spraying thickness, and therefore, after the spraying temperature is adjusted to the spraying temperature threshold value, the spraying thickness is increased by adopting a mode of adjusting the spraying pressure, and the spraying contact angle value is further increased, so that the humidity value of the spraying area meets the standard;
the reason why the deposition time and the deposition pressure are selectively adjusted when the deposition thickness is adjusted, and the deposition pressure is preferentially adjusted is that if the deposition time is selectively increased to increase the deposition thickness, the deposition rate is affected, and the rate of the graphics card integrated circuit board in the process of manufacturing is reduced.
Based on the feedback adjustment of the spraying temperature, spraying pressure or spraying time in the embodiment, calculating the wettability value of the sprayed area, if the qualified wettability value data is obtained, fitting the adjusted spraying pressure value, spraying time value and spraying temperature value into a spraying contact angle data model, re-verifying and constructing the spraying contact angle data model to update the accuracy of the whole spraying contact angle data model and ensure the accuracy of the spraying parameter determination in the subsequent spraying process; the qualification rate of the subsequent spraying process is better ensured;
The spray coating area on the display card integrated circuit board is detected to ensure the qualification rate of the spray coating area and further ensure the connection stability of pins of the electronic component and the spray coating area when the solder paste is coated and welded; secondly, in the spraying process, the thickness of a tin-lead alloy layer sprayed in the spraying process is obtained, and the wettability is a decisive factor for determining the stability of welding of pins of a subsequent electronic component and a spraying area because the spraying thickness determines the wettability of the spraying area, so that the wettability of the whole spraying area needs to be ensured, and a spraying layer qualified in spraying can be obtained through calculating a wetting threshold value, so that the stability of the subsequent solder paste in the welding process is further ensured;
Secondly, after the spraying moisture value is unqualified, the spraying pressure value, the spraying time value and the spraying temperature value which are adjusted can be fitted into a spraying contact angle data model after the spraying area is adjusted, and the spraying contact angle data model is re-verified and constructed so as to update the accuracy of the whole spraying contact angle data model and ensure the accuracy of the spraying parameter determination in the follow-up spraying process; and the qualification rate of the subsequent spraying process is better ensured.
Example five
The deformation-resistant display card integrated circuit board is prepared by the preparation process in the embodiment.
The foregoing describes one embodiment of the present invention in detail, but the description is only a preferred embodiment of the present invention and should not be construed as limiting the scope of the invention. All equivalent changes and modifications within the scope of the present invention are intended to be covered by the present invention.
Claims (7)
1. A preparation process of a deformation-resistant display card integrated circuit board is characterized by comprising the following steps:
step one: carrying out chemical etching, copper coating and drilling on the surface of the display card integrated circuit board;
Step two: carrying out pad spraying on the display card integrated circuit board to obtain a spraying area; comprising the following steps:
a1: acquiring a spraying state of the tin-lead alloy, acquiring the spraying coverage rate of the tin-lead alloy based on the spraying state, and marking the obtained product as PF;
A2: judging whether the spraying coverage PF is in a preset spraying coverage value range [ PFx, PFy ]; wherein PFx is less than 1 and less than PFy;
If the spraying coverage rate PF is smaller than a preset spraying coverage rate value PFx, a spraying coverage rate failure signal is obtained;
if the spraying coverage PF is larger than a preset spraying coverage value PFx, a spraying coverage exceeding signal is obtained;
if the spraying coverage PF is in a preset spraying coverage value range [ PFx, PFy ], the spraying coverage is qualified, and a spraying area with qualified spraying coverage is obtained;
A3: acquiring a display card integrated circuit board with qualified spraying coverage rate, setting spraying parameters based on a spraying contact angle data model, spraying a spraying region, completing spraying work, acquiring a spraying thickness value of the spraying region, marking as PH, calculating to acquire a spraying contact angle value JC, simultaneously acquiring a spraying temperature value PW, calculating to acquire a wetting value of the spraying region, and marking as RS;
A4: comparing the wetting degree value RS with a wetting degree threshold RSy;
If the wetting value RS is smaller than the wetting threshold RSy, generating a spraying failure signal;
If the wetting value RS is larger than or equal to the wetting threshold RSy, generating a spraying qualified signal; obtaining a spraying coating area with a qualified wetting value RS;
Step three: coating printing soldering paste on a bonding pad of the display card integrated circuit board, and then placing the bonding pad in reflow soldering equipment, and heating and cooling the soldering paste to obtain the display card integrated circuit board;
the spraying parameters comprise a spraying time value Tp, a spraying pressure value Py and a spraying temperature value PW;
acquiring historical spraying coverage rate and spraying distance values, and marking the historical spraying coverage rate and the spraying distance values as PLf and Jf respectively;
by fitting the historical spray coverage PLf and spray distance value Jf to the formula of the impact relationship of spray coverage to spray distance Calculating to obtain a spraying distance influence coefficient a and a spraying coverage rate correction factor b;
the construction mode of the thermal spraying contact angle data model is as follows:
S1: acquiring historical spraying data when a spraying distance value is JF under the condition that a spraying area is qualified;
S2: acquiring historical spraying parameters in a state that the wettability value of a spraying area in the historical spraying data is qualified, wherein the historical spraying parameters comprise a historical spraying time value Tps and a historical spraying pressure value Pys; meanwhile, acquiring a historical spraying thickness value PHs under the historical spraying parameters; calculating to obtain a spraying time influence coefficient m, a spraying pressure influence coefficient n and a spraying thickness correction factor f;
S3: acquiring a historical spray thickness value PHs and a historical spray contact angle value JCs when the historical spray thickness value PHs in the historical spray data; calculating to obtain an influence coefficient u of the spraying contact angle and a spraying contact angle correction factor v;
s4: obtaining a spray contact angle value based on the spray time influence coefficient m, the spray pressure influence coefficient n, the spray thickness correction factor f, the spray contact angle influence coefficient u, and the spray contact angle correction factor v: 。
2. The process of claim 1, wherein the plating distance is adjusted based on a formula of an influence relationship between the plating coverage and the plating distance if a plating coverage exceeding signal or a plating coverage not reaching signal is obtained.
3. The process for manufacturing a graphics card integrated circuit board with deformation resistance according to claim 1, wherein in S2: fitting the historical deposition time values Tps, the historical deposition pressure values Pys, and the historical deposition thickness values PHs toAnd calculating to obtain a spraying time influence coefficient m, a spraying pressure influence coefficient n and a spraying thickness correction factor f.
4. The process for manufacturing a graphics card integrated circuit board with deformation resistance according to claim 1, wherein in S3: historical deposition contact angle values JCs for historical deposition thickness values PHs and PHs are fit to the formulaAnd calculating to obtain a spraying contact angle influence coefficient u and a spraying contact angle correction factor v between the spraying contact angle and the spraying thickness.
5. The process for manufacturing a graphics card integrated circuit board according to claim 1, wherein the wettability value RS of the sprayed area is calculated from a sprayed contact angle value JC and a sprayed temperature PW: wherein,H is the thermal spraying temperature influence coefficient.
6. The process for manufacturing a graphics card integrated circuit board of claim 1, wherein, in A4, if a thermal spraying failure signal is obtained: the deposition data is adjusted to adjust the deposition temperature RS and/or the deposition contact angle value JC.
7. A deformation-resistant graphics card integrated circuit board, wherein the deformation-resistant graphics card integrated circuit board is prepared by the preparation process of any one of claims 1-6.
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| CN1781348A (en) * | 2003-12-05 | 2006-05-31 | 三井金属矿业株式会社 | Printed wiring board, its manufacturing method, and circuit device |
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| CN215729534U (en) * | 2021-10-08 | 2022-02-01 | 倍利得电子科技(深圳)有限公司 | Display card with anti-static breakdown mechanism |
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| CN217932569U (en) * | 2022-07-19 | 2022-11-29 | 沥拓科技(深圳)有限公司 | Integrated circuit embedded computer mainboard |
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| CN1781348A (en) * | 2003-12-05 | 2006-05-31 | 三井金属矿业株式会社 | Printed wiring board, its manufacturing method, and circuit device |
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