CN115315076A - Multilayer pcb manufacturing method of embedded heat dissipation pipeline - Google Patents
Multilayer pcb manufacturing method of embedded heat dissipation pipeline Download PDFInfo
- Publication number
- CN115315076A CN115315076A CN202210908989.0A CN202210908989A CN115315076A CN 115315076 A CN115315076 A CN 115315076A CN 202210908989 A CN202210908989 A CN 202210908989A CN 115315076 A CN115315076 A CN 115315076A
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- Prior art keywords
- heat dissipation
- dissipation pipeline
- manufacturing
- embedded
- pcb
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0207—Cooling of mounted components using internal conductor planes parallel to the surface for thermal conduction, e.g. power planes
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The invention relates to a method for manufacturing a multilayer pcb with embedded heat dissipation pipelines, wherein the multilayer pcb comprises two core plates which are symmetrically distributed, three uniformly distributed bonding sheets are bonded between the two core plates, and a plurality of heat dissipation pipelines are embedded in the bonding sheets positioned in the middle; in the application, the heat dissipation pipeline is buried in the plate, and mechanical depth control milling and electroplating filling are carried out above the heat dissipation pipeline; the problem that in the prior art, the radiating pipe is bonded on the surface of the pcb through resin, so that air bubbles are difficult to avoid, and the residual air bubbles have the risk of board explosion when high-temperature treatment is carried out on the radiating pipe; the inner diameter of the heat dissipation pipeline is limited, and the heat dissipation pipeline with larger inner diameter cannot be selected, so that the heat dissipation effect is poor; in addition, in the prior art, the position of the radiating pipe is plated flat by an electroplating method, so that the thickness of the conductive copper layer is obviously increased, and the problem which is difficult to solve is brought to subsequent circuit manufacturing and solder mask manufacturing.
Description
Technical Field
The invention relates to the technical field of circuit board manufacturing, in particular to a method for manufacturing a multilayer pcb with an embedded heat dissipation pipeline.
Background
At present, the development speed of electronic information technology is faster and faster, and various electronic products as product ends are also rapidly developed in the direction of miniaturization and multi-functionalization. Therefore, the function and heat generation of the CPU, one of the core devices in the electronic product, are also increasing. Therefore, the pcb for carrying the CPU needs to provide a better heat dissipation environment for the CPU.
In the current pcb manufacturing method, a radiating pipe is directly placed on the surface of the pcb, bonding is realized through resin, and the radiating pipe is plated flat through an electroplating method. However, this method has significant limitations and poor operability. The specific defects are as follows:
1. the radiating pipe is placed on the surface of the pcb and is bonded by the resin, and the resin belongs to high-viscosity fluid, so that air bubbles are difficult to avoid, and the residual air bubbles have the risk of board explosion when high-temperature treatment is carried out on the radiating pipe, such as smt;
2. the radiating pipe is plated flat by an electroplating method, so that the thickness of the conductive copper layer is obviously increased, and the problem which is difficult to solve is brought to subsequent circuit manufacturing and solder mask manufacturing.
3. The embedded heat dissipation pipeline is positioned on the surface of the pcb, the inner diameter of the heat dissipation pipeline is limited, and the heat dissipation pipeline with larger inner diameter cannot be selected, so that the heat dissipation effect is poor.
In order to solve the above-mentioned drawbacks, a technical solution is now provided.
Disclosure of Invention
The invention aims to provide a method for manufacturing a multilayer pcb with a built-in heat dissipation pipeline.
The technical problems to be solved by the invention are as follows:
in the prior art, the radiating pipe is bonded on the surface of the pcb through resin, so that air bubbles are difficult to avoid, and the risk of board explosion exists when the residual air bubbles are subjected to high-temperature treatment; the inner diameter of the heat dissipation pipeline is limited, and the heat dissipation pipeline with larger inner diameter cannot be selected, so that the heat dissipation effect is poor; in addition, in the prior art, the position of the radiating pipe is plated flat by an electroplating method, so that the thickness of the conductive copper layer is obviously increased, and the problem which is difficult to solve is brought to subsequent circuit manufacturing and solder mask manufacturing.
The purpose of the invention can be realized by the following technical scheme:
a multilayer pcb manufacturing method of an embedded heat dissipation pipeline comprises two core boards which are symmetrically distributed, three bonding pieces which are uniformly distributed are bonded between the two core boards, and a plurality of heat dissipation pipelines are embedded in the bonding pieces positioned in the middle of the core boards; the manufacturing method of the multilayer pcb of the embedded heat dissipation pipeline comprises the following steps:
step one, windowing is carried out on the middle bonding sheets to obtain windowing holes, the windowing holes are placing positions of the heat dissipation pipelines, and the bonding sheets on the uppermost layer and the lowermost layer are not windowed;
coarsening the surface of the heat dissipation pipeline, and performing heat leveling treatment on the heat dissipation pipeline;
step three, placing the processed heat dissipation pipeline in the opening hole on the middle bonding sheet, and performing mechanical depth control milling on the position above the heat dissipation pipeline;
after the depth control milling is finished, removing residual bonding sheets at other positions of the heat dissipation pipeline through laser milling to enable the deep milling groove to be communicated with the windowing hole;
step five, drilling holes on the two pcb, metalizing the holes, electroplating and thickening the holes;
and sixthly, electroplating and filling the deep milling groove, wherein the electroplating filling area needs to be 0.05mm higher than the upper surface of the upper core plate, then milling the part of the electroplating filling area with 0.05mm higher by adopting depth control milling, obtaining the multilayer pcb with the embedded heat dissipation pipeline after the completion, and transferring the multilayer pcb into a subsequent process for manufacturing.
Furthermore, the inner diameter of the windowing hole is 0.05mm larger than the outer diameter of the heat dissipation pipeline.
Furthermore, the depth control depth is 0.05mm downward from the position of the tangent plane of the upper surface of the heat dissipation pipeline.
Further, the core board comprises a dielectric and a conductive copper layer.
Further, the adhesive sheet is one of epoxy resin adhesive sheets and ptfe adhesive sheets.
Furthermore, the heat dissipation pipeline is a hollow copper pipe, and the copper pipe is a seamless capillary tube.
The invention has the beneficial effects that:
compared with the traditional air cooling mode, the cooling pipeline absorbs and takes away system heat through cooling liquid, the cooling effect is better, and the heat dissipation pipeline is grooved, electroplated and leveled, so that the heat dissipation efficiency is effectively improved.
Compare in conventional water-cooling mode, like the water-cooling mode that the display card adopted, inside embedded heat dissipation pipeline embedded board, guaranteed that pcb face area can be used for the wiring or place the IC device, does not influence the pcb whole integrated level.
Compared with the technical scheme of placing the radiating pipe on the surface, the radiating pipe is embedded into the plate, so that air remaining in the plate can be avoided, and meanwhile, the thickness of the surface conductive copper layer also belongs to a normal range, so that the manufacturing of fine patterns is facilitated.
Drawings
The invention is described in further detail below with reference to the figures and specific embodiments.
FIG. 1 is a process flow diagram of a method of fabricating a multi-layer pcb with embedded heat dissipation pipes in accordance with the present invention;
FIG. 2 is a schematic view of a laminated structure of a core board and an adhesive sheet according to the present invention;
FIG. 3 is a schematic structural diagram of the mechanical depth-control milling of deep milling grooves according to the present invention;
FIG. 4 is a schematic diagram of a structure of the plating fill of the present invention.
In the figure: 1. a core board; 2. an adhesive sheet; 3. a heat dissipation pipeline.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1-4, the present invention provides a technical solution:
a multilayer pcb manufacturing method of a built-in heat dissipation pipeline comprises two core boards 1 which are symmetrically distributed, three bonding sheets 2 which are uniformly distributed are bonded between the two core boards 1, the bonding sheet 2 positioned in the middle can also be a core board 1 with the thickness being the same as the diameter of the heat dissipation pipeline 3, and a plurality of heat dissipation pipelines 3 are buried in the bonding sheet 2 positioned in the middle; the method for manufacturing the multilayer pcb of the embedded heat dissipation pipeline 3 comprises the following steps:
step one, windowing is carried out on the middle bonding sheet 2 to obtain a windowing hole, the windowing hole is a position where the heat dissipation pipeline 3 is placed, the size of the windowing hole is +0.05mm of the outer diameter of the heat dissipation pipeline 3, the bonding sheets 2 on the uppermost layer and the lowermost layer are not windowed, and the bonding sheet 2 in the middle is windowed;
coarsening the surface of the heat dissipation pipeline 3, performing thermal leveling treatment on the heat dissipation pipeline 3, and removing the stress of the heat dissipation pipeline 3 to prevent the PCB from warping due to deformation;
thirdly, placing the processed heat dissipation pipeline 3 in a windowing position on the middle bonding sheet 2, and mechanically milling the position above the heat dissipation pipeline 3 in a depth control manner, wherein the depth control is that the section position of the upper surface of the heat dissipation pipeline 3 is 0.05mm downward;
after the depth control milling is finished, removing the residual bonding sheets 2 at the rest positions of the heat dissipation pipeline 3 through laser milling to enable the deep milling grooves to be communicated with the windowing holes;
step five, drilling holes on the two pcb, and electroplating and thickening the holes to metalize the holes;
and sixthly, electroplating and filling the deep milling groove, wherein the electroplating filling area needs to be 0.05mm higher than the upper surface of the upper core plate 1, then milling the part of the electroplating filling area with 0.05mm higher by adopting depth control milling, obtaining a plurality of layers of pcb of the embedded heat dissipation pipeline 3 after the completion, and transferring to the next process for manufacturing.
In addition, the core board 1 includes a dielectric and a conductive copper layer; the adhesive sheet 2 can be one of epoxy resin adhesive sheets or ptfe adhesive sheets; the heat dissipation pipeline 3 is embedded in the board for dissipating heat, and can be cooled by using cooling liquid or compressed air; the heat dissipation pipeline 3 is a hollow copper pipe, and the copper pipe is a seamless capillary pipe; the heat dissipation pipeline 3 is embedded below the center of the heating chip on the core plate 1 and is grounded.
The embodiment of the invention has the following advantages:
1. the radiating pipeline 3 is embedded in the plate, so that the defects that the radiating pipeline 3 is placed on the surface, bubbles are in the resin, and the pattern cannot be manufactured are effectively overcome.
2. The surface of the heat dissipation pipeline 3 is roughened before lamination, so that the bonding force of the heat dissipation pipeline 3 is ensured, and the layering condition is avoided.
3. The heat dissipation pipe 3 is subjected to heat leveling before lamination, so that internal stress of the heat dissipation pipe 3 is removed, and the problems of deformation and the like of the heat dissipation pipe 3 caused by stress are prevented.
4. Grooving and electroplating filling are carried out at the heat dissipation pipeline 3, and the heat dissipation efficiency is effectively improved.
5. Compared with the traditional air cooling and water cooling, the heat dissipation capacity is ensured, the area and the space of the board surface are not occupied, and the system integration degree is ensured.
While one embodiment of the present invention has been described in detail, the description is only a preferred embodiment of the present invention and should not be taken as limiting the scope of the invention. All equivalent changes and modifications made within the scope of the present invention shall fall within the scope of the present invention.
Claims (6)
1. A multilayer pcb manufacturing method of an embedded heat dissipation pipeline comprises two core plates (1) which are symmetrically distributed, three uniformly distributed bonding sheets (2) are bonded between the two core plates (1), and a plurality of heat dissipation pipelines (3) are embedded in the bonding sheet (2) positioned in the middle; the manufacturing method is characterized in that the manufacturing method of the multilayer pcb with the embedded heat dissipation pipeline (3) comprises the following steps:
firstly, windowing is carried out on the middle bonding sheets (2) to obtain windowing holes, the windowing holes are placing positions of the heat dissipation pipelines (3), and the bonding sheets (2) on the uppermost layer and the lowermost layer are not windowed;
step two, roughening the surface of the heat dissipation pipeline (3) and leveling the heat dissipation pipeline (3) by heat;
thirdly, placing the processed heat dissipation pipeline (3) in a window hole on the middle bonding sheet (2), and mechanically controlling the depth of the upper position of the heat dissipation pipeline (3) by milling;
after the depth control milling is finished, removing the residual bonding sheets (2) at the rest positions of the heat dissipation pipeline (3) through laser milling, so that the deep milling groove is communicated with the windowing hole;
step five, drilling holes on the two pcb, and electroplating and thickening the holes to metalize the holes;
and sixthly, electroplating and filling the deep milling groove, wherein the electroplating filling area needs to be 0.05mm higher than the upper surface of the upper core plate (1), then milling the raised electroplating filling area of 0.05mm by adopting depth control milling, obtaining a plurality of layers of pcb of the embedded heat dissipation pipeline (3) after the completion, and turning to the next process for manufacturing.
2. The method for manufacturing a multi-layer pcb with embedded heat dissipation pipe as recited in claim 1, wherein the inner diameter of the fenestration hole is 0.05mm larger than the outer diameter of the heat dissipation pipe (3).
3. The method as claimed in claim 1, wherein the depth control is 0.05mm downward from the upper surface of the heat dissipation pipe (3).
4. A method of fabricating a multi-layer pcb with embedded heat dissipation pipe as claimed in claim 1, wherein the core board (1) comprises dielectric and conductive copper layers.
5. The method of claim 1, wherein the bonding sheet (2) is one of an epoxy-based bonding sheet and a ptfe-based bonding sheet.
6. The method for manufacturing a multilayer pcb with embedded heat dissipation pipe as recited in claim 1, wherein the heat dissipation pipe (3) is a hollow copper pipe, and the copper pipe is a seamless capillary tube.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210908989.0A CN115315076A (en) | 2022-07-29 | 2022-07-29 | Multilayer pcb manufacturing method of embedded heat dissipation pipeline |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210908989.0A CN115315076A (en) | 2022-07-29 | 2022-07-29 | Multilayer pcb manufacturing method of embedded heat dissipation pipeline |
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| Publication Number | Publication Date |
|---|---|
| CN115315076A true CN115315076A (en) | 2022-11-08 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210908989.0A Pending CN115315076A (en) | 2022-07-29 | 2022-07-29 | Multilayer pcb manufacturing method of embedded heat dissipation pipeline |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117812849A (en) * | 2024-02-23 | 2024-04-02 | 倍利得电子科技(深圳)有限公司 | Anti-deformation display card integrated circuit board and preparation process thereof |
-
2022
- 2022-07-29 CN CN202210908989.0A patent/CN115315076A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117812849A (en) * | 2024-02-23 | 2024-04-02 | 倍利得电子科技(深圳)有限公司 | Anti-deformation display card integrated circuit board and preparation process thereof |
| CN117812849B (en) * | 2024-02-23 | 2024-04-30 | 倍利得电子科技(深圳)有限公司 | Anti-deformation display card integrated circuit board and preparation process thereof |
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