CN211210305U

CN211210305U - Heat dissipation type DCDC voltage converter

Info

Publication number: CN211210305U
Application number: CN201922226752.0U
Authority: CN
Inventors: 陈可璜; 胡兆利; 邵志勇
Original assignee: Xiamen Hongfa Automotive Electronics Co Ltd
Current assignee: Xiamen Hongfa Automotive Electronics Co Ltd
Priority date: 2019-12-12
Filing date: 2019-12-12
Publication date: 2020-08-07
Anticipated expiration: 2029-12-12

Abstract

The utility model discloses a heat dissipation type DCDC voltage converter, which comprises a metal upper shell, a metal lower shell and a PCB board, wherein the metal upper shell and the metal lower shell are connected up and down, and the PCB board is arranged in a cavity enclosed by the metal upper shell and the metal lower shell; still include device heat dissipation cushion and PCB heat dissipation cushion, device heat dissipation cushion sets up between the components and parts that generate heat on metal epitheca and the PCB board, and PCB heat dissipation cushion sets up between PCB board back and metal inferior valve. The utility model discloses can utilize device heat dissipation cushion to direct, conduct the metal epitheca fast of the heat that components and parts produced that generate heat, utilize PCB heat dissipation cushion to conduct the metal inferior valve directly, fast with the heat on the PCB board, rethread metal epitheca, metal inferior valve are external to be dispelled the heat. Therefore, the utility model discloses a radiating effect is better to, the viscidity that directly utilizes heat dissipation cushion itself can fix a position device heat dissipation cushion and PCB heat dissipation cushion, and the assembly is convenient, production efficiency is high, is favorable to reduction in production cost.

Description

Heat dissipation type DCDC voltage converter

Technical Field

The utility model relates to a DCDC voltage converter especially relates to a heat dissipation type DCDC voltage converter.

Background

In the existing DCDC voltage converter, except for designing a metal shell with radiating fins for radiating, liquid radiating glue is coated on the surface of a heating element on a PCB (printed circuit board), and the radiating glue needs to be dried or shade-dried and has higher requirements on production line operation, so that the mode has the defects of long production period, high cost and the like; some PCB plates are pasted with radiating fins as heat conducting media, however, the method cannot directly and quickly conduct heat generated by heating components, and therefore the radiating effect is poor.

SUMMERY OF THE UTILITY MODEL

The utility model aims at providing a heat dissipation type DCDC voltage converter of radiating effect preferred to the technical problem that prior art exists.

The utility model provides a technical scheme that its technical problem adopted is: a heat dissipation type DCDC voltage converter comprises a metal upper shell, a metal lower shell and a PCB, wherein the metal upper shell and the metal lower shell are connected up and down; still include device heat dissipation cushion and PCB heat dissipation cushion, device heat dissipation cushion sets up between the components and parts that generate heat on metal epitheca and the PCB board, and PCB heat dissipation cushion sets up between PCB board back and metal inferior valve.

Furthermore, the device heat dissipation rubber mat is attached to or in interference fit with the metal upper shell and the heating element.

Furthermore, the PCB heat dissipation rubber mat is attached to or in interference fit with the PCB and the metal lower shell.

Furthermore, a convex part extending downwards is arranged in the metal upper shell, the convex part is opposite to the heating component up and down, and the component heat dissipation rubber mat is matched between the bottom surface of the convex part and the top surface of the heating component.

Further, the top surface of the metal upper case is formed with a concave portion corresponding to the convex portion at the position of the convex portion.

Furthermore, the number of the device heat dissipation rubber mats is a plurality, and the device heat dissipation rubber mats correspond to the plurality of heating components on the PCB one by one.

Furthermore, the PCB heat dissipation rubber mat is positioned in the region with concentrated heat generated on the back of the PCB.

Furthermore, a plurality of first radiating fins are arranged on the top surface of the metal upper shell, and are distributed at intervals and are parallel to each other.

Furthermore, a plurality of second radiating fins are arranged on the bottom surface of the metal lower shell, and are distributed at intervals and parallel to each other.

Compared with the prior art, the utility model discloses following beneficial effect has:

1. because the utility model discloses still include device heat dissipation cushion and PCB heat dissipation cushion, between the components and parts that generate heat of device heat dissipation cushion setting on metal epitheca and PCB board, PCB heat dissipation cushion sets up between the PCB board back and metal inferior valve, makes the utility model discloses can utilize the heat that the components and parts produced that will generate heat of device heat dissipation cushion direct, conduct the metal epitheca fast, utilize PCB heat dissipation cushion directly, conduct the metal inferior valve fast on with the PCB board, rethread metal epitheca, metal inferior valve are external to be dispelled the heat. Therefore, the utility model discloses a radiating effect is better to, utilize the viscidity of heat dissipation cushion itself can carry out prepositioning to device heat dissipation cushion and PCB heat dissipation cushion, the assembly is convenient, production efficiency is high, is favorable to reduction in production cost.

2. The device heat dissipation rubber mat is attached to or in interference fit with the metal upper shell and the heating element, so that heat generated by the heating element can be conducted in time by the device heat dissipation rubber mat, and the heat dissipation effect is further improved. Similarly, the PCB heat dissipation rubber mat with PCB board, metal inferior valve laminating or interference fit make PCB heat dissipation rubber mat can in time conduct the heat on the PCB board to further improve the radiating effect.

3. The metal upper shell is internally provided with a convex part extending downwards, the convex part is opposite to the heating component up and down, and the heat dissipation rubber mat is matched between the bottom surface of the convex part and the top surface of the heating component, so that the thickness of the heat dissipation rubber mat can be smaller, and the material cost is reduced.

4. The metal epitheca top surface is in the position department of convex part be formed with the concave part that the convex part corresponds makes metal epitheca and convex part, concave part on it can adopt die-casting forming process to, can utilize the concave part to increase the heat radiating area of metal epitheca, thereby further improve the utility model discloses a radiating effect.

5. First radiating fin, second radiating fin's setting can increase the heat radiating area of metal epitheca, metal inferior valve respectively, thereby further improve the utility model discloses a radiating effect.

The present invention will be described in further detail with reference to the accompanying drawings and examples; however, the present invention is not limited to the embodiments.

Drawings

FIG. 1 is an exploded view of the present invention (metal lower shell facing up);

fig. 2 is a cross-sectional view of the present invention;

fig. 3 is a partially enlarged schematic view of fig. 2.

Detailed Description

In an embodiment, please refer to fig. 1-3, the present invention provides a heat dissipation DCDC voltage converter, which includes a metal upper shell 1, a metal lower shell 2, and a PCB 3, wherein the metal upper shell 1 and the metal lower shell 2 are connected to each other, and the PCB 3 is disposed in a cavity enclosed by the metal upper shell 1 and the metal lower shell 2. The utility model discloses still include device heat dissipation cushion 4 and PCB heat dissipation cushion 5, device heat dissipation cushion 4 sets up between the components and parts 6 that generate heat on metal epitheca 1 and PCB board 3 to, device heat dissipation cushion 4 and metal epitheca 1, the components and parts 6 interference fit that generate heat. PCB heat dissipation cushion 5 sets up between 3 backs of PCB board and metal inferior valve 2 to, PCB heat dissipation cushion 5 is located the PCB back and generates heat comparatively concentrated region, PCB heat dissipation cushion 5 and

PCB board

3, 2 interference fit of metal inferior valve, and the thickness of PCB heat dissipation cushion 5 is greater than the clearance between PCB board 3 and the metal inferior valve 2 promptly. The device heat dissipation rubber mat 4 and the PCB heat dissipation rubber mat 5 adopt the same heat dissipation rubber mat in the prior art, the device is added before the heat dissipation rubber mat, and the PCB is only used for distinguishing different application parts of the heat dissipation rubber mat.

In this embodiment, a protrusion 11 extending downward is provided inside the metal upper case 1, the protrusion 11 is vertically opposite to the heat generating component 6, and the device heat dissipation rubber 4 is fitted between the bottom surface of the protrusion 11 and the top surface of the heat generating component 6. The top surface of the metal upper shell 1 is formed with a concave part 13 corresponding to the convex part 11 at the position of the convex part 11, and specifically, the metal upper shell 1, the convex part 11 and the concave part 13 are formed by die casting. Because the device heat dissipation rubber mat 4 is in interference fit with the metal upper shell 1 and the heating component 6, the thickness of the device heat dissipation rubber mat 4 is larger than the gap between the convex part 11 of the metal upper shell 1 and the heating component 6.

In this embodiment, the number of the device heat dissipation rubber pads 4 is a plurality, and the device heat dissipation rubber pads correspond to the plurality of heating elements 6 on the PCB 3 one by one. The number of the convex parts 11 is also a plurality, and the convex parts correspond to the device heat dissipation rubber pads 4 one by one.

In this embodiment, the top surface of the metal upper shell 1 is provided with a plurality of first heat dissipation fins 12, and the plurality of first heat dissipation fins 12 are distributed at intervals and are parallel to each other. The bottom surface of the metal lower shell 2 is provided with a plurality of second radiating fins 21, and the plurality of second radiating fins 21 are distributed at intervals and are parallel to each other.

The utility model discloses a heat dissipation type DCDC voltage converter, during the equipment, paste each device heat dissipation cushion 4 earlier at the 6 top surfaces of corresponding components and parts or corresponding convex part 11 bottom surfaces that generate heat, paste PCB heat dissipation cushion 5 on the 3 backs of PCB board or the corresponding position of metal inferior valve 2, put PCB board 3 again on metal inferior valve 2, cover metal epitheca 1 to it is fixed with metal epitheca 1 and metal inferior valve 2 locking to adopt the screw. Because the device heat dissipation rubber mat 4 and the PCB heat dissipation rubber mat 5 have certain viscosity, the viscosity can be utilized to provide prepositioning for the device heat dissipation rubber mat 4 and the PCB heat dissipation rubber mat 5 during assembly, so that the device heat dissipation rubber mat and the PCB heat dissipation rubber mat are not easy to fall off, and the assembly is convenient. After assembly, the device heat dissipation rubber mat 4 is extruded between the convex part 11 of the metal upper shell 1 and the heating component 6, and the PCB heat dissipation rubber mat 5 is extruded between the PCB board 3 and the metal lower shell 2, so that the device heat dissipation rubber mat 4 and the PCB heat dissipation rubber mat 5 cannot fall off.

When the heat dissipation device works, heat generated by each heating component 6 is directly conducted to the metal upper shell 1 through the corresponding component heat dissipation rubber mat 4 respectively, and then is dissipated outwards through the metal upper shell 1; the heat on the PCB 3 is directly conducted to the metal lower shell 2 through the PCB heat dissipation rubber mat 5, and then is dissipated outwards through the metal lower shell 2. Therefore, the utility model discloses a radiating effect is better.

The above embodiments are only used to further illustrate the present invention, but the present invention is not limited to the embodiments, and any simple modification, equivalent change and modification made by the technical entity of the present invention to the above embodiments all fall into the protection scope of the present invention.

Claims

1. A heat dissipation type DCDC voltage converter comprises a metal upper shell, a metal lower shell and a PCB, wherein the metal upper shell and the metal lower shell are connected up and down; the method is characterized in that: still include device heat dissipation cushion and PCB heat dissipation cushion, device heat dissipation cushion sets up between the components and parts that generate heat on metal epitheca and the PCB board, and PCB heat dissipation cushion sets up between PCB board back and metal inferior valve.

2. The heat dissipating DCDC voltage converter according to claim 1, wherein: the device heat dissipation rubber mat is attached to or in interference fit with the metal upper shell and the heating component.

3. The heat dissipating DCDC voltage converter according to claim 1, wherein: the PCB heat dissipation rubber mat is attached to or in interference fit with the PCB and the metal lower shell.

4. The heat dissipating DCDC voltage converter according to claim 1, wherein: the metal upper shell is internally provided with a convex part extending downwards, the convex part is opposite to the heating component up and down, and the component heat dissipation rubber mat is matched between the bottom surface of the convex part and the top surface of the heating component.

5. The heat dissipating DCDC voltage converter of claim 4, wherein: and the top surface of the metal upper shell is provided with a concave part corresponding to the convex part at the position of the convex part.

6. The heat dissipating DCDC voltage converter of any of claims 1-5, wherein: the number of the device heat dissipation rubber mats is a plurality, and the device heat dissipation rubber mats correspond to the plurality of heating components on the PCB one by one.

7. The heat dissipating DCDC voltage converter according to claim 1, wherein: the PCB heat dissipation rubber mat is positioned in the region with concentrated heat generated on the back of the PCB.

8. The heat dissipating DCDC voltage converter according to claim 1, wherein: the top surface of the metal upper shell is provided with a plurality of first radiating fins which are distributed at intervals and are parallel to each other.

9. The heat dissipating DCDC voltage converter according to claim 1, wherein: the bottom surface of the metal lower shell is provided with a plurality of second radiating fins which are distributed at intervals and are parallel to each other.