CN205584616U - Radiating efficiency height is used for FPC board of camera module - Google Patents
Radiating efficiency height is used for FPC board of camera module Download PDFInfo
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- CN205584616U CN205584616U CN201620195539.1U CN201620195539U CN205584616U CN 205584616 U CN205584616 U CN 205584616U CN 201620195539 U CN201620195539 U CN 201620195539U CN 205584616 U CN205584616 U CN 205584616U
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- fenestra
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- soft board
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- 229910000831 Steel Inorganic materials 0.000 claims abstract description 35
- 239000010959 steel Substances 0.000 claims abstract description 35
- 230000003014 reinforcing effect Effects 0.000 claims abstract description 32
- 238000003825 pressing Methods 0.000 claims description 10
- 238000001816 cooling Methods 0.000 abstract description 3
- 238000010030 laminating Methods 0.000 abstract 1
- 238000000034 method Methods 0.000 description 8
- 230000000694 effects Effects 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- 238000004080 punching Methods 0.000 description 3
- 238000003466 welding Methods 0.000 description 3
- 230000004888 barrier function Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 239000004744 fabric Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000003801 milling Methods 0.000 description 2
- 229920002379 silicone rubber Polymers 0.000 description 2
- 239000004945 silicone rubber Substances 0.000 description 2
- 229920002799 BoPET Polymers 0.000 description 1
- 239000005041 Mylar™ Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
- 230000004083 survival effect Effects 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
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- Structure Of Printed Boards (AREA)
Abstract
The utility model relates to a radiating efficiency height is used for FPC board of camera module. Vacant position in the circuit board region that FPC soft board facing cored piece corresponds is equipped with a plurality of fenestras that can pass the FPC soft board, on this FPC soft board with the steel sheet reinforcing piece of the another side that the cored piece is relative on with fenestra relative position is equipped with the boss that can insert this fenestra, and the mesa of boss touches with the cooling surface that pastes the cored piece and connects. Because the mesa of boss stretches out the fenestra and touches with the chip cooling surface of laminating on this FPC soft board and connect, so, when the chip during operation, partly heat that the chip produced then by boss conduction to whole steel sheet reinforcing piece is led away by the another side of this steel sheet reinforcing piece. The utility model discloses the long -time during operation of reducible chip produces accumulated heat's phenomenon, makes chip work at more stable state.
Description
Technical field
This utility model relates to a kind of FPC soft board, particularly to a kind of for the FPC flexible circuit board used by the digital camera head module product such as mobile phone, computer.
Background technology
FPC is the English abbreviation of flexible circuit board (Flexible Printed Circuit Board), is to have height reliability, excellent flexual printed circuit board (PCB) with polyimides or mylar for the one that base material is made.Have the advantages that distribution density is high, lightweight, thickness is thin, bending property is good.But the technological requirement of FPC surface SMT has a lot of difference with the SMT solution of tradition hardboard PCB.Because FPC plank is the most soft, therefore, its carrying components and parts ability is slightly worse, so in the flexible circuit board having welding component, arranging steel disc reinforcing sheet is one of most common means improving its intensity.
Along with the continuous progress of science and technology, the requirement of people's logarithmic code product is more and more higher, and the convenience of digital product and lightweight become the direction that people constantly pursue, and collocation high-pixel camera head has become the fashion main flow of market development.
At present, consumption electronic product such as mobile phone, the photographic head on panel computer, pixel is the most all more than 5,000,000 pixels.But the raising (such as 8,000,000 or more than 10,000,000 pixel) along with mobile phone camera pixel, the structure of photographic head is the most complicated, the power of imager chip is more and more higher, after it works long hours, the chip of photographic head will produce substantial amounts of heat energy, the temperature causing chip raises, affect image quality, affect the operating time of photographic head, thus the utilization affecting whole electronic product is experienced, the shooting of the most present security protection photographic head, the unmanned plane photographic head of consumer level and autonomous driving vehicle is first-class.
The market status
At present, the photographic head module of consumer level is used mostly Rigid Flex (glass fibre is as insulating barrier), flexible circuit board (PI is as insulating barrier), without using extra radiator structure, the radiating effect of the substrate at camera image chip is all without the most preferable.And the substrate at the image chip of the slr camera that can record a video, DV, professional camera etc. is frequently with costly and the excellent metal basal board of radiating effect, special ceramics substrate etc., the most also increases extra radiator structure.But as the photographic head module of general sieve mass consumption level, cost performance is the important value of survival of product.
So, improve the radiating effect of substrate at flexible circuit board photographic head module imager chip, be demand and the trend meeting production development, and the market competitiveness of Related product can be improved.
Utility model content
The technical problems to be solved in the utility model is to provide high FPC plate for photographic head module of radiating efficiency of a kind of simple in construction, low cost, instant effect and preparation method thereof.
In order to solve above-mentioned technical problem, the technical solution adopted in the utility model is:
Radiating efficiency height of the present utility model is for the FPC plate of photographic head module, including the wiring board region that pasting chip on FPC soft board is corresponding, vacant position in this wiring board region is provided with at least one can be through the fenestra of FPC soft board, another side pressing relative with pasting chip on this FPC soft board has steel disc reinforcing sheet, being to extend and can be inserted into the boss of this fenestra to fenestra direction with described fenestra relative to position in this steel disc reinforcing sheet, the table top of boss touches with the radiating surface of described pasting chip.
In the edge of described fenestra and this wiring board region, the safe distance between adjacent lines is not less than 0.15mm.
The number of described fenestra and corresponding boss is 4.
Being shaped as of described fenestra is square, circular or oval, and the mesa shape of described boss is identical with the shape of described fenestra, and the inner edge of fenestra is not more than 0.05mm with the spacing of the outer rim of boss.
The table top of described boss is by the outwardly directed a length of 0-0.2mm of described fenestra.
Making radiating efficiency height of the present utility model is for the method for the FPC plate of photographic head module, and its step is as follows:
1) on FPC soft board, multiple energy fenestra through FPC soft board is offered at the vacant position in the wiring board region of pasting chip；
2) the steel disc reinforcing sheet being arranged on another side relative with pasting chip on this FPC soft board being fabricated to the steel disc with boss, the mesa shape of boss is identical with described fenestra, and it is corresponding with described fenestra that it arranges position；
3) FPC soft board and steel disc reinforcing sheet are stacked it are put between the top board of vacuum press and lower platen, before pressing, between steel disc reinforcing sheet and the top board of vacuum press, pad setting tool have the hardboard of certain rigidity, between FPC soft board and the lower platen of vacuum press of chip side, pad sets elastic soft board, and pressure used is not less than 20kg/cm2；
4) after vacuum press pressing, outside the plate face of the FPC plate that the table top of the boss in described steel disc reinforcing sheet is placed in chip side through described fenestra.
In method of the present utility model, described boss uses punching press, CNC gong milling, 3D etching or welding method to prepare.
In method of the present utility model, described hardboard is glass cloth pad；Described elastic soft board is silicone rubber pad.
In method of the present utility model, when described vacuum press is fast press, pressure used is 80kg/cm2。
Compared with prior art, this utility model makes several fenestras that may pass through this FPC soft board on the FPC soft board of photographic head module chip position, position corresponding with described fenestra in corresponding steel disc reinforcing sheet again makes some boss, boss stretches into the fenestra of correspondence, and the table top of boss stretches out fenestra and the chip cooling face being fitted on this FPC soft board touches.When chip operation, its a part of heat produced then is led away by described lands conduct to whole steel disc reinforcing sheet the another side by this steel disc reinforcing sheet.This utility model produces the phenomenon of accumulated heat when can reduce prolonged periods work, make chip operation in more stable state.
Accompanying drawing explanation
Fig. 1 is schematic diagram of the present utility model.
Fig. 2 be in Fig. 1 A-A to sectional view.
Fig. 3 is by steel disc reinforcing sheet and schematic diagram during FPC soft board pressing.
Reference is as follows:
FPC soft board 1, wiring board region 11, chip 2, fenestra 3, steel disc reinforcing sheet 4, boss 41, top board 5, lower platen 6, hardboard 7, elastic soft board 8.
Detailed description of the invention
Such as Fig. 1, shown in 2, radiating efficiency height of the present utility model arranges several through holes through this FPC soft board 1 in the FPC plate of photographic head module is the region (also known as wiring board region 11) of pasting chip 2 on FPC soft board 1, it is called for short fenestra 3, simultaneously, FPC soft board 1 intensity at chip 2 place of setting will be improved and be arranged on this FPC soft board 1 back side (i.e. setting chip 2 is mounted on the one side on FPC soft board 1 is front again, at this, the another side of FPC soft board 1 is the back side) steel disc reinforcing sheet 4 be designed with the steel disc of boss 41, the number of boss 41 is identical with the number of described fenestra 3.
The shape of described fenestra 3 does not limits, and can be square, regular polygon, trapezoid, circular or oval, and this utility model preferred fabrication technique is the most circular or square.
The vacant position (i.e. not having the region that circuit is arranged) that all fenestras 3 are arranged in described wiring board region 11, in order to avoid the press damage circuit when making described fenestra 3, cause quality waste product, during design, the edge of described fenestra 3 should and this wiring board region 11 in keep the safe distance not less than 0.15mm between adjacent lines.
The quantity of described fenestra 3 does not limits, and depending on the particular number size according to described empty parts, the preferred fenestra of this utility model 3 is four.
Boss 41 in described steel disc reinforcing sheet 4 highlights the surface of this steel disc reinforcing sheet 4, during by this steel disc reinforcing sheet 4 with FPC soft board 1 pressing, boss 41 side is towards FPC soft board 1, the position that boss 41 is arranged is corresponding with described fenestra 3, will be after this steel disc reinforcing sheet 4 completes with FPC soft board 1 pressing, each boss 41 inserts in the fenestra 3 of correspondence, and the radiating surface of the table top of this boss 41 and described chip 2 to be fit touches.
In order to make described boss 41 be in best fit state (in the case of described fenestra 3 size is limited with described fenestra 3, both the heating surface area of boss 41 can fully have been improved, in turn, ensure that boss 41 inserts among fenestra 3 smoothly), distance between the inner edge of fenestra 3 and the outer rim of corresponding boss 41 is not more than 0.02mm-0.06mm, preferably 0.05mm.
Touching with the radiating surface of described chip 2 in order to ensure the table top of described boss 41, the table top of boss 41 passes the outwardly directed a length of 0-0.2mm of described fenestra 3.
Radiating efficiency height of the present utility model makes in accordance with the following methods for the FPC plate of photographic head module:
The first step: offer fenestra 3 on FPC plate
On FPC soft board 1, multiple energy fenestra 3 through FPC soft board 1 is offered at the vacant position in the wiring board region 11 of pasting chip 2, and the edge of any one fenestra 3 in all fenestras 3 should keep the safe distance not less than 0.15mm with between its adjacent circuit in this wiring board region 11.
Second step: the making of steel disc reinforcing sheet 4
Punching press, CNC gong milling, 3D etching or welding method is used to make and can improve the steel disc reinforcing sheet 4 of the intensity in described wiring board region 11 on FPC soft board 1, this steel disc reinforcing sheet 4 is arranged on another side relative with pasting chip 2 on this FPC soft board 1, punching press or weld several boss 41 in steel disc reinforcing sheet 4, the mesa shape of boss 41 is identical with described fenestra 3, and it is corresponding with described fenestra 3 that it arranges position.
3rd step: by steel disc reinforcing sheet 4 and FPC soft board 1 pressing (as shown in Figure 3)
By between FPC soft board 1 and the stacked upper lower platen being put in vacuum press of steel disc reinforcing sheet 4.The steel disc that table top is evagination due to boss 41, it is easy to be subject to crushing, so, between the top board 5 of steel disc reinforcing sheet 4 and vacuum press, pad setting tool before pressing have the hardboard 7 (this utility model preferred glass cloth pad) of certain rigidity, between the FPC soft board 1 and the lower platen 6 of vacuum press of chip 2 side, pad sets elastic soft board 8 (silicone rubber pad that this utility model is the softest) and is buffered, and pressure used is not less than 20kg/cm2；If using fast press, pressure is arranged on 80kg/cm2Above.After vacuum press pressing, outside the plate face of the FPC plate that the table top of the boss 41 in described steel disc reinforcing sheet 4 is placed in chip 2 side through described fenestra 3.
4th step: apply heat-conducting glue on the table top of boss 41
Before chip 2 is mounted on this FPC soft board 1; the table top of boss 41 applies the glue that heat conduction is good; such as heat conductive silica gel etc.; thus; after chip 2 attachment; the heat produced when chip 2 works can be transmitted to whole steel disc reinforcing sheet 4 by the table top of boss 41, then is distributed to surrounding by the another side of this steel disc reinforcing sheet 4, thus effectively protects chip 2.
Claims (5)
1. a radiating efficiency height is for the FPC plate of photographic head module, including the wiring board region (11) that the upper pasting chip (2) of FPC soft board (1) is corresponding, it is characterized in that: the vacant position in this wiring board region (11) is provided with at least one can be through the fenestra (3) of FPC soft board (1), steel disc reinforcing sheet (4) is had in the upper another side pressing relative with pasting chip (2) of this FPC soft board (1), this steel disc reinforcing sheet (4) is upper is the boss (41) extending and can be inserted into this fenestra (3) to fenestra (3) direction with described fenestra (3) relative position, the table top of boss (41) touches with the radiating surface of described pasting chip (2).
Radiating efficiency height the most according to claim 1 is for the FPC plate of photographic head module, it is characterised in that: the safe distance between edge and this wiring board region (11) interior adjacent lines of described fenestra (3) is not less than 0.15mm.
Radiating efficiency height the most according to claim 2 is for the FPC plate of photographic head module, it is characterised in that: the number of described fenestra (3) and corresponding boss (41) is 4.
Radiating efficiency height the most according to claim 3 is for the FPC plate of photographic head module, it is characterized in that: being shaped as of described fenestra (3) is square, circular or oval, the mesa shape of described boss (41) is identical with the shape of described fenestra (3), and the inner edge of fenestra (3) is not more than 0.05mm with the spacing of the outer rim of boss (41).
Radiating efficiency height the most according to claim 4 is for the FPC plate of photographic head module, it is characterised in that: the table top of described boss (41) is by the outwardly directed a length of 0-0.2mm of described fenestra (3).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620195539.1U CN205584616U (en) | 2016-03-15 | 2016-03-15 | Radiating efficiency height is used for FPC board of camera module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620195539.1U CN205584616U (en) | 2016-03-15 | 2016-03-15 | Radiating efficiency height is used for FPC board of camera module |
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| Publication Number | Publication Date |
|---|---|
| CN205584616U true CN205584616U (en) | 2016-09-14 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620195539.1U Active CN205584616U (en) | 2016-03-15 | 2016-03-15 | Radiating efficiency height is used for FPC board of camera module |
Country Status (1)
| Country | Link |
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| CN (1) | CN205584616U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105578736A (en) * | 2016-03-15 | 2016-05-11 | 深圳华麟电路技术有限公司 | High-cooling-efficiency FPC board used for camera module group and manufacturing method thereof |
-
2016
- 2016-03-15 CN CN201620195539.1U patent/CN205584616U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105578736A (en) * | 2016-03-15 | 2016-05-11 | 深圳华麟电路技术有限公司 | High-cooling-efficiency FPC board used for camera module group and manufacturing method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CP02 | Change in the address of a patent holder |
Address after: 518000 building 101, 102, 201, building B 101, 201, 301, 401, building C 101, 201, 301, 401, Huada technology, No. 1, Jinlong Avenue, Baolong community, Baolong street, Longgang District, Shenzhen, Guangdong Patentee after: SHENZHEN HUALIN CIRCUIT TECHNOLOGY Co.,Ltd. Address before: 518000 No.1, Jinlong Avenue, Baolong Industrial City, Longgang District, Shenzhen City, Guangdong Province Patentee before: SHENZHEN HUALIN CIRCUIT TECHNOLOGY Co.,Ltd. |
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| CP02 | Change in the address of a patent holder | ||
| PP01 | Preservation of patent right |
Effective date of registration: 20221118 Granted publication date: 20160914 |
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| PP01 | Preservation of patent right | ||
| PD01 | Discharge of preservation of patent |
Date of cancellation: 20240527 Granted publication date: 20160914 |
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| PD01 | Discharge of preservation of patent |