CN211240607U

CN211240607U - Novel heat dissipation device

Info

Publication number: CN211240607U
Application number: CN201922330489.XU
Authority: CN
Inventors: 徐君博
Original assignee: Dongguan Tongyu Electronics Co ltd
Current assignee: Dongguan Tongyu Electronics Co ltd
Priority date: 2019-12-23
Filing date: 2019-12-23
Publication date: 2020-08-11
Anticipated expiration: 2029-12-23

Abstract

The utility model discloses a novel heat dissipation device, it includes circuit board, circuit board upper end is provided with the radiating seat, the radiating seat cross-section is the U-shaped structure, be provided with a plurality of components and parts that generate heat on the circuit board, the radiating seat encloses to establish and forms the heat dissipation chamber, the components and parts that generate heat are arranged in the heat dissipation intracavity, the radiating seat is provided with a plurality of fin groups in heat dissipation intracavity interval, fin group passes through screw spare lock solid in the radiating seat, fin group interval is provided with a plurality of first heat radiation fins. The utility model discloses a set up the U-shaped radiating seat on circuit board, the cooperation sets up fin group in the radiating seat, utilizes screw spare with fin group and radiating seat fixed connection to the convenience is changed fin group, with satisfying different circuit board, sets up the upper end and the lateral part of the components and parts that generate heat on circuit board through first heat radiation fins simultaneously, conducts the heat that the components and parts that generate heat produce more high-efficiently, improves the radiating efficiency of device.

Description

Novel heat dissipation device

Technical Field

The utility model belongs to the technical field of the electronic equipment heat dissipation technique and specifically relates to a novel heat dissipation device is related to.

Background

With the progress of science and technology, the electronic industry has been developed rapidly, for example, computers are used by many people, heat generating components in computers, such as central units, transformer units, inductance units, etc., need to be separately provided with heat dissipating components to dissipate heat, so as to prevent the heat generating components from being overheated to reduce the efficiency or damage thereof in use.

SUMMERY OF THE UTILITY MODEL

Therefore, it is necessary to provide a novel heat dissipation device with convenient installation and good heat dissipation effect for overcoming the defects in the prior art.

In order to solve the technical problem, the utility model discloses the technical scheme who adopts is: a novel heat dissipation device comprises a circuit main board, wherein a heat dissipation seat is arranged at the upper end of the circuit main board, the cross section of the heat dissipation seat is of a U-shaped structure, a plurality of heating components are arranged on the circuit main board, the heat dissipation seat is surrounded to form a heat dissipation cavity, the heating components are arranged in the heat dissipation cavity, a plurality of heat dissipation fin groups are arranged at intervals in the heat dissipation cavity of the heat dissipation seat, the heat dissipation fin groups are locked in the heat dissipation seat through screws, and a plurality of first heat dissipation fins are arranged at intervals in the heat dissipation fin groups.

In one embodiment, a part of the first heat dissipation fins of the heat dissipation fin group is attached to the upper end of the heating component, and the other part of the first heat dissipation fins of the heat dissipation fin group is arranged on the peripheral side of the heating component.

In one embodiment, a connecting sheet is arranged between the first radiating fins, and the connecting sheet is attached to the upper end of the heating element.

In one embodiment, a heat dissipation fan is arranged on one side of the circuit main board, and the heat dissipation fan is attached to one side of the heat dissipation seat.

In one embodiment, the heat dissipation seat is provided with a heat dissipation fin group at an outlet of the heat dissipation cavity, the heat dissipation fin group is tightly provided with second heat dissipation fins, and the heat dissipation fan is attached to one side of the second heat dissipation fins.

In one embodiment, the first heat sink fins have a height lower than a height of the heat dissipation chamber.

To sum up, the utility model relates to a novel heat dissipation device sets up the radiating seat of U-shaped through setting up on circuit motherboard, and the cooperation sets up fin group in the radiating seat, utilizes screw spare with fin group and radiating seat fixed connection to conveniently change fin group to satisfy different circuit motherboard, set up the upper end and the lateral part of the components and parts that generate heat on circuit motherboard through first radiating fin simultaneously, conduct the heat that the components and parts produced that generate heat more high-efficiently, improve device's radiating efficiency.

Drawings

Fig. 1 is a schematic structural view of a novel heat dissipation device of the present invention;

FIG. 2 is a schematic view of the structure combination of the heat sink set and the heat sink seat of the present invention;

FIG. 3 is a schematic view of a structural combination of a heat sink assembly and a heat sink according to another embodiment of the present invention;

fig. 4 is a schematic view of the structural combination of the heat dissipating fin set and the heat dissipating base of the present invention.

Detailed Description

For further understanding of the features and technical means of the present invention, as well as the specific objects and functions attained by the present invention, the present invention will be described in further detail with reference to the accompanying drawings and detailed description.

As shown in fig. 1 to 4, the utility model relates to a novel heat dissipation device includes circuit board 10, circuit board 10 upper end is provided with radiating seat 20, radiating seat 20 cross-section is the U-shaped structure, radiating seat 20 is fixed to be set up in circuit board 10 both sides, be provided with a plurality of components 30 that generate heat on the circuit board 10, for example transformer, electric capacity, chip etc. radiating seat 20 encloses to establish and forms radiating chamber 21, components 30 that generate heat are arranged in radiating chamber 21, radiating seat 20 is provided with a plurality of fin groups 40 in radiating chamber 21 interval, fin group 40 passes through screw 50 lock solid in radiating seat 20 for fin group 40 is detachable ground and radiating seat 20 fixed connection, thereby conveniently changes fin group 40 to accord with the circuit board 10 of different structures.

The plurality of first heat dissipation fins 41 are arranged at intervals on the heat dissipation fin group 40, the height of each first heat dissipation fin 41 is lower than that of the heat dissipation cavity 21, wherein one part of the first heat dissipation fins 41 is attached to the upper end part of the heating element 30, the other part of the first heat dissipation fins 41 is arranged on the periphery of the heating element 30, and the vacant positions reserved for placing the heating element 30 on the circuit mainboard 10 are fully utilized, so that heat generated by the heating element 30 is conducted to the first heat dissipation fins 41 to be effectively conveyed, and the heat dissipation efficiency of the circuit mainboard 10 is greatly improved.

In one embodiment, the connecting pieces 42 are disposed between the first heat dissipation fins 41, and the connecting pieces 42 can be disposed at the upper end of the heat-generating component 30 in a fitting manner, so as to increase the contact area between the heat dissipation piece set 40 and the heat-generating component 30, so that the heat generated by the heat-generating component 30 can be more efficiently conducted to the connecting pieces 42, and then the heat is dissipated through the first heat dissipation fins 41 and the heat dissipation base 20.

In one embodiment, the heat dissipation fan 60 is disposed on one side of the circuit board 10, the heat dissipation fan 60 is attached to one side of the heat dissipation seat 20, and the heat dissipation fan 60 rapidly discharges the heat in the heat dissipation cavity 21 and the heat on the heat dissipation seat 20, thereby further improving the heat dissipation efficiency of the device.

In one embodiment, the heat sink 20 is provided with a heat dissipating fin set 70 at an outlet of the heat dissipating cavity 21, the heat dissipating fin set 70 is closely provided with second heat dissipating fins 71, the heat dissipating fan 60 is attached to one side of the second heat dissipating fins 71, and gaps are formed between the second heat dissipating fins 71 for air to pass through in a convection manner, so that the heat dissipating capability of the device is improved.

To sum up, the utility model relates to a novel heat abstractor is through setting up U-shaped radiating seat 20 on circuit motherboard 10, and the cooperation sets up fin group 40 in radiating seat 20, utilizes screw 50 with fin group 40 and radiating seat 20 fixed connection to conveniently change fin group 40, with satisfy different circuit motherboard 10, set up the upper end and the lateral part of components and parts 30 that generate heat on circuit motherboard 10 through first heat radiation fins 41 simultaneously, more high-efficiently conduct the heat that components and parts 30 that generate heat produced, improve device's radiating efficiency.

The above-described embodiments are merely illustrative of several embodiments of the present invention, which are described in detail and specific, but not intended to be construed as limiting the scope of the present invention. It should be noted that, for those skilled in the art, without departing from the spirit of the present invention, several variations and modifications can be made, which are within the scope of the present invention. Therefore, the protection scope of the present invention should be subject to the appended claims.

Claims

1. The utility model provides a novel heat abstractor which characterized in that: the radiating seat is arranged at the upper end of the circuit main board, the cross section of the radiating seat is of a U-shaped structure, a plurality of heating components are arranged on the circuit main board, the radiating seat is surrounded to form a radiating cavity, the heating components are arranged in the radiating cavity, a plurality of radiating fin groups are arranged at intervals in the radiating cavity of the radiating seat, the radiating fin groups are locked in the radiating seat through screw pieces, and a plurality of first radiating fins are arranged at intervals of the radiating fin groups.

2. The novel heat dissipation device of claim 1, wherein: one part of the first radiating fins of the radiating fin group are attached to the upper end part of the heating component, and the other part of the first radiating fins of the radiating fin group are arranged on the peripheral side of the heating component.

3. A novel heat sink according to claim 1 or 2, wherein: and connecting pieces are arranged among the first radiating fins and are attached to the upper end parts of the heating components.

4. A novel heat sink according to claim 1 or 2, wherein: and a heat radiation fan is arranged on one side of the circuit main board and is attached to one side of the heat radiation seat.

5. The novel heat dissipation device of claim 4, wherein: the heat dissipation seat is provided with a heat dissipation fin group at the outlet of the heat dissipation cavity, the heat dissipation fin group is tightly provided with second heat dissipation fins, and the heat dissipation fan is attached to one side of the second heat dissipation fins.

6. A novel heat sink according to claim 1 or 2, wherein: the height of the first radiating fins is lower than that of the radiating cavity.