CN211061991U - Server radiator, server mainboard and server - Google Patents
Server radiator, server mainboard and server Download PDFInfo
- Publication number
- CN211061991U CN211061991U CN201922369431.6U CN201922369431U CN211061991U CN 211061991 U CN211061991 U CN 211061991U CN 201922369431 U CN201922369431 U CN 201922369431U CN 211061991 U CN211061991 U CN 211061991U
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- Prior art keywords
- server
- radiator
- supporting legs
- supporting
- mainboard
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- 238000010438 heat treatment Methods 0.000 claims abstract description 11
- 230000017525 heat dissipation Effects 0.000 claims description 3
- 230000010354 integration Effects 0.000 claims description 2
- 239000000126 substance Substances 0.000 claims description 2
- 238000009434 installation Methods 0.000 abstract description 2
- 238000010586 diagram Methods 0.000 description 7
- 235000017166 Bambusa arundinacea Nutrition 0.000 description 3
- 235000017491 Bambusa tulda Nutrition 0.000 description 3
- 241001330002 Bambuseae Species 0.000 description 3
- 235000015334 Phyllostachys viridis Nutrition 0.000 description 3
- 239000011425 bamboo Substances 0.000 description 3
- 238000004080 punching Methods 0.000 description 3
- 238000006467 substitution reaction Methods 0.000 description 3
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000002860 competitive effect Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model provides a server radiator, server mainboard and server all includes: the radiator body is used for being arranged above a server heating component to be radiated, and a group of supporting legs for supporting the radiator body are arranged at the bottom of the radiator body; the server radiator also comprises a group of limiting cylinders which are used for being arranged at the board end where the server heating component is arranged by adopting SMT; the number of the limiting cylinders is equal to that of the supporting legs; the supporting legs are matched with the limiting cylinders in an inserting mode. The utility model is used for when avoiding the fin installation to the occupation of line space is walked to board end internal signal.
Description
Technical Field
The utility model relates to a server heat dissipation field, concretely relates to server radiator, server mainboard and server.
Background
With the progress of the times, the network communication architecture is more and more huge, and the server system is also more and more precise. In a system architecture configuration, server performance is often optimized and maximized in order to remain competitive and maximize the architecture. In this case, the problem of heat dissipation of the server system has been a problem that has been regarded as important.
Generally, a heat sink is used to dissipate heat from a main chip of a server and components that generate high heat energy during computation. The radiator adopts a Heat Sink (HS for short) to radiate Heat. The heat sink is made of metal (mostly aluminum or copper, silver is too expensive, and silver is generally not used) with good thermal conductivity, light weight, and easy processing, and is attached to the heat-generating surface to dissipate heat.
In order to have a good positioning effect, a plurality of positioning pins (screws) are usually arranged for the heat sink to provide locking, for example, positioning pins B (screws) (a is a heat sink body) in fig. 1 and fig. 2, when in use, holes need to be punched on the board, then the heat sink body a is installed through the positioning pins B (screws) and the punched holes, and it is seen that the positioning pins need to sacrifice layout wiring space in the board end (which is a PCB), which is not favorable for the integrity of signal wiring inside the PCB.
Therefore, the utility model provides a server radiator, server mainboard and server for solve above-mentioned technical problem.
SUMMERY OF THE UTILITY MODEL
The above-mentioned not enough to prior art, the utility model provides a server radiator, server mainboard and server for to the occupation of line space is walked to board end internal signal when avoiding the fin installation.
In a first aspect, the utility model provides a server radiator, including being used for setting up the radiator body in treating radiating server heating component top, wherein:
the bottom of the radiator body is provided with a group of supporting legs for supporting the radiator body;
the server radiator also comprises a group of limiting cylinders for being mounted at the board end of the heating component of the server by adopting Surface Mount Technology (SMT);
the number of the limiting cylinders is equal to that of the supporting legs;
the supporting legs are matched with the limiting cylinders in an inserting mode.
Furthermore, the bottom end of each supporting leg is provided with a ball.
Furthermore, each supporting leg adopts a telescopic leg.
In a second aspect, the present invention provides a server motherboard, wherein a server heat generating component to be cooled is integrated on the server motherboard, and the server heat generating component is provided with the server heat sink as described above.
Further, the heat generating component of the server includes at least one of a Central Processing Unit (CPU), a Voltage conversion (VR) chip, and a south bridge (PCH) chip.
In a third aspect, the present invention provides a server, including a server chassis box and a box cover, wherein the server chassis box is integrated with the server motherboard; the limiting cylinder of the server radiator is mounted on the server mainboard by adopting SMT and is positioned on the periphery of the server heating component;
the supporting legs of the server radiator are opposite to the position of each limiting cylinder;
each supporting leg is inserted in the corresponding limiting cylinder;
after the box cover is covered on the box body of the server case and locked, the box cover tightly pushes the radiator body between the server mainboards where the limiting cylinders are located through the supporting legs.
Furthermore, a limiting cylinder of the server radiator is welded on the server mainboard.
The beneficial effects of the utility model reside in that:
(1) the utility model provides a server radiator sets up the supporting legs that is used for supporting the radiator body in the bottom of radiator body to set a set and be used for adopting SMT to install the server generates heat the part place board end and be used for the spacing section of thick bamboo that the cooperation was used with each supporting legs is pegged graft, wherein, spacing section of thick bamboo adopts SMT to install the part place board end that generates heat of server, this has avoided punching at board end (PCB board promptly) and has installed the radiator, and it is obvious to have avoided when the radiator is installed to a certain extent to walk occupation of line space to board end internal signal, helps keeping the integrality that board end internal signal walked the line.
(2) The utility model provides a server mainboard sets the server radiator, has the whole advantages of server radiator no longer give unnecessary details here.
(3) The utility model provides a server, its server machine case box internal integration have the server mainboard, have the whole advantages of server mainboard are no longer repeated here.
Furthermore, the utility model relates to a principle is reliable, and simple structure has very extensive application prospect.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious for those skilled in the art that other drawings can be obtained according to the drawings without creative efforts.
Fig. 1 is a schematic structural diagram (Top diagram) of a heat sink in the prior art.
Fig. 2 is a Bottom view of the heat sink shown in fig. 1 (Bottom view).
Fig. 3 is a schematic structural diagram of a server radiator according to an embodiment of the present invention.
Fig. 4 is a schematic diagram of a usage state of the server heat sink shown in fig. 3.
Fig. 5 is a schematic structural diagram of a server motherboard according to an embodiment of the present invention.
Fig. 6 is a schematic structural diagram of a server according to an embodiment of the present invention.
Fig. 7 is a schematic exploded view of fig. 6.
Detailed Description
In order to make the technical solutions in the present invention better understood, the following description is made in conjunction with the accompanying drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts shall belong to the protection scope of the present invention.
Example 1:
fig. 3 is an embodiment of the server heat sink of the present invention.
As shown in fig. 3, the server heat sink includes a heat sink body 100 disposed above a heat generating component 700 of the server to be heat dissipated, and the bottom of the heat sink body 100 is provided with 4 supporting legs 200 for supporting the heat sink body 100. The 4 supporting legs 200 are distributed in a rectangular shape. The server heat sink further includes four limiting cylinders 400 for being mounted on the board end 600 where the server heat generating component 700 is located by SMT (in this embodiment, specifically, by welding). The number of the limiting cylinders 400 is equal to that of the supporting feet 200. The supporting leg 200 is inserted and matched with the limiting cylinder 400 for use.
When the server radiator is used specifically, the limiting cylinders 400 can be vertically welded to the board end 600, the limiting cylinders 400 are opposite to the supporting legs 200, the server heating component 700 to be radiated is placed between the limiting cylinders 400, the supporting legs 200 at the bottom of the radiator body 100 are inserted into the limiting cylinders 400, and then the server radiator can be locked to the board end 600 by applying force to lock the server radiator in combination with the server case cover 800, as shown in fig. 4. The board end 600 is installed in the server chassis box. The cover 800 in fig. 4 is in a locked state at the opening of the server chassis housing.
The utility model discloses a spacing section of thick bamboo 400 adopts SMT to install server heat generating component 700 place board end 600, this has avoided punching at board end 600 (PCB board promptly, for example can be the mainboard of server) and has installed the radiator, and it is visible to have avoided when the radiator is installed to a certain extent to the board end 600 internal signal to walk the occupation of line space, helps keeping the integrality that the line was walked to board end 600 internal signal.
Optionally, a ball 300 is mounted at the bottom end of each support foot 200. The ball 300 is used, so that the tail end of the free end of the supporting foot 200 can slide into the limiting cylinder 400 relatively conveniently on one hand, and when the supporting foot 200 slides into the bottommost end of the limiting cylinder 400 on the other hand, the collision damage to the plate end 600 can be avoided to a certain extent.
Example 2:
compared with embodiment 1, the difference of this embodiment is that, in the server heat sink described in this embodiment, each support leg 200 is a support leg capable of automatically extending and retracting. The use of the telescopic leg is convenient for keeping the rolling of the ball 300 at the tail end thereof, thereby being convenient for the ball 300 to roll and slide into the limiting cylinder 400, and further driving the supporting leg 200 to be inserted into the limiting cylinder 400.
It should be noted that, when the supporting legs 200 in this embodiment are compressed to the shortest length, the supporting legs 200 are substantially the same as the supporting legs 200 in embodiment 1, and accordingly, the usage of the server heat sink in this embodiment is the same as that of the server heat sink in embodiment 1, and the description thereof is omitted here.
It should be noted that, in this embodiment, the supporting legs that can stretch out and draw back automatically, its concrete implementation does not belong to the utility model discloses a protection scope, technical personnel in the field can be according to actual conditions, select corresponding prior art to realize can. Based on this, the present embodiment does not provide corresponding drawings, and a person skilled in the art can implement the server radiator in the present embodiment based on the text in the present embodiment and the drawings in embodiment 1.
Example 3:
this embodiment provides a server motherboard, on which a heat-generating component 700 of a server to be dissipated is integrated, and the heat-generating component 700 of the server to be dissipated is equipped with the server heat sink described in embodiment 1, as shown in fig. 5.
Optionally, the heat generating component 700 of the server in this embodiment is a CPU of the server.
In this embodiment, in order to simplify the description and the drawings, only one server heat generating component 700 to be dissipated is integrated on the server motherboard as an example. In a specific implementation, referring to this embodiment, a server heat sink as described in embodiment 1 is respectively configured for each heat generating component 700 (such as a VR chip, and also such as a PCH chip) of the server, which is integrated on the server motherboard and is to be cooled.
Example 4:
compared with embodiment 3, the difference of this embodiment is that the server motherboard in this embodiment adopts the telescopic pins for each supporting leg 200 of the server heat sink disposed on the server heat generating component 700 to be radiated.
Example 5:
fig. 6 and 7 illustrate an embodiment of the server according to the present invention.
Referring to fig. 6: the server comprises a server case body 500 (the case opening of which is arranged at the top end of the case body 500) and a case cover 800 (which is a case body upper cover) which are used in a matching way, wherein the server mainboard in embodiment 3 is integrated in the server case body 500; the limiting cylinder 400 of the server radiator is vertically welded on the server mainboard and is positioned on the periphery of the server heating component 700; the supporting feet 200 of the server radiator are opposite to the positions of the limiting cylinders 400; each supporting foot 200 is inserted into the corresponding limiting cylinder 400; after the cover 800 is covered and locked on the server chassis 500, the cover 800 tightly pushes the radiator body 100 against the server motherboard where the limiting cylinder 400 is located.
Fig. 7 shows a split structure diagram of the server in this embodiment.
It can be seen that this server has avoided punching at board end 600, on the one hand, makes the inboard signal walk the line more complete to a certain extent, and makes the plane of on-board power also more complete to a certain extent, and on the other hand has reduced the manpower that the lock attaches the screw, and this not only indirectly has reduced the assembly cost of server, has still avoided the emergence of the extra problem that the lock attached the screw and brought.
Example 6:
compared with embodiment 5, the difference of this embodiment is that in the server described in this embodiment, each supporting leg 200 of the server heat sink is a telescopic leg.
The same and similar parts in the various embodiments in this specification may be referred to each other.
Although the present invention has been described in detail by referring to the drawings in conjunction with the preferred embodiments, the present invention is not limited thereto. Various equivalent modifications or substitutions can be made on the embodiments of the present invention by those skilled in the art without departing from the spirit and substance of the present invention, and these modifications or substitutions are intended to be within the scope of the present invention/any person skilled in the art can easily conceive of changes or substitutions within the technical scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.
Claims (7)
1. The utility model provides a server radiator, includes the radiator body that is used for setting up the server that treats heat dissipation and generates heat the part top, its characterized in that:
the bottom of the radiator body is provided with a group of supporting legs for supporting the radiator body;
the server radiator also comprises a group of limiting cylinders which are used for being arranged at the board end where the server heating component is arranged by adopting SMT;
the number of the limiting cylinders is equal to that of the supporting legs;
the supporting legs are matched with the limiting cylinders in an inserting mode.
2. The server heatsink of claim 1, wherein:
the bottom of each supporting leg is provided with a ball.
3. The server heat sink of claim 1 or 2, wherein:
each supporting leg adopts a telescopic leg.
4. The utility model provides a server mainboard, the integration is waited radiating server heating element on it which characterized in that: the server heat generating component is provided with the server heat sink according to any one of claims 1 to 3.
5. The server motherboard of claim 4, wherein: the server heating component comprises at least one of a server CPU, a VR chip and a PCH chip.
6. The utility model provides a server, includes server machine case box and case lid that the cooperation was used, its characterized in that: the server main board of any one of claims 4 to 5 is integrated in the server case body; wherein the content of the first and second substances,
the limiting cylinder of the server radiator is arranged on the server mainboard by adopting SMT and is positioned at the periphery of the heating part of the server;
the supporting legs of the server radiator are opposite to the position of each limiting cylinder;
each supporting leg is inserted in the corresponding limiting cylinder;
after the box cover is covered on the box body of the server case and locked, the box cover tightly pushes the radiator body between the server mainboards where the limiting cylinders are located through the supporting legs.
7. The server of claim 6, wherein: and a limiting cylinder of the server radiator is welded on the server mainboard.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922369431.6U CN211061991U (en) | 2019-12-25 | 2019-12-25 | Server radiator, server mainboard and server |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922369431.6U CN211061991U (en) | 2019-12-25 | 2019-12-25 | Server radiator, server mainboard and server |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211061991U true CN211061991U (en) | 2020-07-21 |
Family
ID=71593891
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201922369431.6U Expired - Fee Related CN211061991U (en) | 2019-12-25 | 2019-12-25 | Server radiator, server mainboard and server |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211061991U (en) |
-
2019
- 2019-12-25 CN CN201922369431.6U patent/CN211061991U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20200721 |