CN210840505U - Auxiliary heat dissipation device for electronic equipment - Google Patents

Auxiliary heat dissipation device for electronic equipment Download PDF

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Publication number
CN210840505U
CN210840505U CN201921923880.4U CN201921923880U CN210840505U CN 210840505 U CN210840505 U CN 210840505U CN 201921923880 U CN201921923880 U CN 201921923880U CN 210840505 U CN210840505 U CN 210840505U
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electronic equipment
plate
base
heat
auxiliary
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CN201921923880.4U
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Chinese (zh)
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王志勇
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Fujian Xiniu Intelligent Technology Engineering Co ltd
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Fujian Xiniu Intelligent Technology Engineering Co ltd
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Abstract

The utility model discloses an auxiliary heat dissipation device for electronic equipment, be in including setting up the clamp plate and the base plate of electronic equipment's heating element both sides, the clamp plate with the base plate is connected through the linkage unit, can dismantle on the base plate and be connected with a plurality of heat conductor, the heat conductor is higher than the base plate, just the heat conductor laminating heating element, the heat conductor can be dismantled and be connected with the heat pipe, a plurality of mutually parallel's of middle part fixedly connected with fin of heat pipe. The utility model discloses an auxiliary heat dissipation device of electronic equipment radiating effect is good to can directly upgrade current electronic equipment.

Description

Auxiliary heat dissipation device for electronic equipment
Technical Field
The utility model relates to an electronic equipment field, specific auxiliary heat dissipation device of electronic equipment that says so.
Background
The electronic equipment is the core of the automation device. In electronic equipment, the key for realizing automation is a circuit board, in the existing electronic equipment circuit board, main components are various chips, the chips can emit a large amount of heat during operation, if the heat can not be quickly dissipated, the performance of the chips can be reduced, and the performance of the whole electronic equipment is further influenced, so that a plurality of electronic equipment are provided with heat dissipation devices, and only part of the chips are not large in theoretical heat dissipation, so that a plurality of electronic equipment are not provided with the heat dissipation devices. However, the environment in which these electronic devices without a heat sink operate may be very complicated, and a chip that generates a small amount of heat originally may not dissipate heat due to a high-temperature environment or a dust environment.
SUMMERY OF THE UTILITY MODEL
In order to solve the deficiencies in the prior art, the utility model provides a heat abstractor is assisted to electronic equipment, the radiating effect is good to can directly upgrade current electronic equipment.
In order to achieve the above object, the utility model discloses a concrete scheme does:
the utility model provides an auxiliary heat dissipation device of electronic equipment, is in including setting up clamp plate and the base plate of electronic equipment's heating element both sides, the clamp plate with the base plate is connected through the linkage unit, can dismantle on the base plate and be connected with a plurality of heat conductor, the heat conductor is higher than the base plate, just the heat conductor laminating heating element, the heat conductor can be dismantled and be connected with the heat pipe, the middle part fixedly connected with a plurality of fin that are parallel to each other of heat pipe.
Preferably, the connecting unit comprises at least one first connecting piece fixedly connected with the pressure plate and at least one second connecting piece fixedly connected with the base plate, the first connecting piece and the second connecting piece are connected through at least one connecting bolt, and the connecting bolt is locked through a connecting nut.
Preferably, the substrate is provided with a sliding groove, a base body is arranged in the sliding groove in a sliding mode, and the heat conductor is fixedly connected with the base body.
Preferably, the base plate is integrally connected with a main positioning plate, the main positioning plate is located above the sliding groove, and the main positioning plate penetrates through the base body.
Preferably, the base plate is integrally connected with two auxiliary positioning plates, the two auxiliary positioning plates are flush with the main positioning plate and are respectively positioned at two sides of the main positioning plate, and the auxiliary positioning plates penetrate through the base body.
Preferably, the width of the main positioning plate is greater than the width of the auxiliary positioning plate.
Preferably, the heat conductor is integrally connected with the base body, and the base body is fixedly connected with the heat pipe through a mounting bolt.
Preferably, the heat pipe includes two connecting portions connected to the base, the two connecting portions are each integrally connected to an extending portion, a communicating portion is integrally connected between the two extending portions, a distance is left between each of the connecting portions and the base plate, and the heat dissipating fin is fixedly connected to the communicating portion.
Preferably, a base is fixedly connected to each of the two extending portions, a small fan is fixedly arranged on the base, the air supply direction of the small fan is parallel to the extending direction of the heat sink, and the air supply directions of the two small fans are the same.
Preferably, the thickness of the extension portion is smaller than the thickness of the heat conductor.
The utility model discloses an external structure can upgrade existing electronic equipment, need not destroy the structure of electronic equipment itself moreover to can effectively prolong electronic equipment's life.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
Fig. 1 is a schematic view of the overall structure of a platen and a substrate.
Fig. 2 is a detailed structural diagram of the substrate.
Fig. 3 is a schematic view of the installation of the heat pipe.
Reference numerals: 1-connecting bolt, 2-first connecting sheet, 3-second connecting sheet, 4-connecting nut, 5-pressing plate, 6-base plate, 7-sliding groove, 8-auxiliary positioning plate, 9-main positioning plate, 10-heat conductor, 11-base body, 12-mounting screw hole, 13-first through hole, 14-second through hole, 15-mounting bolt, 16-heat pipe, 17-base, 18-small fan and 19-radiating fin.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1 to 3, fig. 1 is a schematic view of an overall structure of a pressure plate and a substrate, fig. 2 is a schematic view of a detailed structure of the substrate, and fig. 3 is a schematic view of an installation manner of a heat pipe.
The utility model provides an auxiliary heat dissipation device of electronic equipment, is including setting up clamp plate 5 and the base plate 6 in electronic equipment's heating element both sides, and clamp plate 5 and base plate 6 are connected through the linkage unit, can dismantle on the base plate 6 to be connected with a plurality of heat conductor 10, and heat conductor 10 is higher than base plate 6, and the heating element of heat conductor 10 laminating, and heat conductor 10 can dismantle and be connected with heat pipe 16, and the middle part fixedly connected with of heat pipe 16 is a plurality of fin 19 that are parallel to each other.
In the present embodiment, in use, the pressing plate 5 and the substrate 6 are respectively placed on both sides of the circuit board of the electronic device, and the heat conductor 10 is closely attached to the heat generating element, and then the pressing plate 5 and the substrate 6 are connected together by the connecting unit, thereby fixing the substrate 6 and the heat conductor 10, and when the electronic device is operated, heat generated from the heat generating element is conducted to the heat dissipating fin 19 by the heat pipe 16, and then heat dissipation is performed by means of a larger heat dissipating area of the heat dissipating fin 19.
The embodiment is an external structure, can upgrade the existing electronic equipment, and does not need to damage the structure of the electronic equipment, so that the service life of the electronic equipment can be effectively prolonged.
Furthermore, the connecting unit comprises at least one first connecting piece 2 fixedly connected with the pressure plate 5 and at least one second connecting piece 3 fixedly connected with the base plate 6, the first connecting piece 2 and the second connecting piece 3 are connected through at least one connecting bolt 1, and the connecting bolt 1 is locked through a connecting nut 4. Can pass through bolted connection between first connection piece 2 and the clamp plate 5 and between second connection piece 3 and the base plate 6, according to electronic equipment's model and size, can change the length of first connection piece 2 and second connection piece 3 in a flexible way to make connecting bolt 1 can walk around the electronic equipment position, thereby realize need not destroying the purpose of electronic product structure itself.
Furthermore, a sliding groove 7 is formed in the substrate 6, a base body 11 is arranged in the sliding groove 7 in a sliding mode, and the heat conductor 10 is fixedly connected with the base body 11. The areas of the heating elements on different electronic devices are different, so the detachable heat conductor 10 is adopted in the embodiment, and the heat conductor 10 with a proper number can be selected according to the areas of the heating elements, so that the heat dissipation requirement is met on one hand, and the cost and the weight can be saved on the other hand.
Further, the base plate 6 is integrally connected with a main positioning plate 9, the main positioning plate 9 is positioned above the sliding chute 7, and the main positioning plate 9 penetrates through the base body 11. Correspondingly, a first through hole 13 corresponding to the main positioning plate 9 is formed on the base body 11. The main positioning plate 9 is used for positioning the base 11 and the heat conductor 10, and the friction between the main positioning plate 9 and the base 11 can be enhanced by increasing the surface roughness of the main positioning plate 9, so as to fix the positions of the base 11 and the heat conductor 10.
Further, the base plate 6 is integrally connected with two auxiliary positioning plates 8, the two auxiliary positioning plates 8 are flush with the main positioning plate 9 and are respectively positioned at two sides of the main positioning plate 9, and the auxiliary positioning plates 8 penetrate through the base body 11. Correspondingly, a second through hole 14 corresponding to the auxiliary positioning plate 8 is formed on the base body 11. The function of the secondary positioning plate 8 is the same as that of the main positioning plate 9, and the secondary positioning plate is used for enhancing the guiding and fixing of the base body 11.
Further, the width of the main positioning plate 9 is larger than that of the sub positioning plate 8.
Further, the heat conductor 10 is integrally connected with the base 11, and the base 11 is fixedly connected with the heat pipe 16 through the mounting bolt 15. Correspondingly, the base body 11 is provided with mounting screw holes 12 corresponding to the mounting bolts 15. The heat pipe 16 is detachably connected with the heat conductor 10, the base body 11 and the heat conductor 10 can be installed firstly in the installation process, and then the heat pipe 16 is installed.
Further, the heat pipe 16 includes two connecting portions connected to the base 11, each of the two connecting portions is integrally connected to an extending portion, a communicating portion is integrally connected between the two extending portions, distances are reserved between the connecting portions and the communicating portions and between the connecting portions and the base plate 6, and the heat dissipating fins 19 are fixedly connected to the communicating portions. The heat pipes 16 are circumferentially distributed on the periphery of the substrate 6, so that the substrate 6 can be prevented from interfering with the heat pipes 16.
Furthermore, a base 17 is fixedly connected to each of the two extending portions, a small fan 18 is fixedly arranged on the base 17, the air blowing direction of the small fan 18 is parallel to the extending direction of the heat sink 19, and the air blowing directions of the two small fans 18 are the same. The heat dissipation of the heat dissipation fins 19 is a passive heat dissipation mode, when the heat emitted by the heating element is more and the temperature is higher, the passive heat dissipation effect is limited, so that the small-sized fan 18 is added, and the small-sized fan 18 is used for blowing air to the heat dissipation fins 19 to realize active heat dissipation, thereby realizing a better heat dissipation effect.
Further, the thickness of the extension is smaller than the thickness of the heat conductor 10. Therefore, the heat pipe 16 can be separated from the heating element when the heat conductor 10 can be in contact with the heating element, and the problem that the heat conductor 10 cannot be tightly attached to the heating element due to the fact that the surface of the heat pipe 16 is uneven to cause reduction of the heat dissipation effect is avoided.
In this embodiment, the pressing plate 5 and the substrate 6 may be made of plastic or PCB material, and the heat conductor 10 and the heat sink 19 may be made of copper material.
The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims (10)

1. The utility model provides an auxiliary heat dissipation device of electronic equipment which characterized in that: including setting up clamp plate (5) and base plate (6) of electronic equipment's heating element both sides, clamp plate (5) with base plate (6) are connected through the linkage unit, can dismantle on base plate (6) and be connected with a plurality of heat conductor (10), heat conductor (10) are higher than base plate (6), just heat conductor (10) laminating heating element, heat conductor (10) can be dismantled and be connected with heat pipe (16), the middle part fixedly connected with a plurality of fin (19) that are parallel to each other of heat pipe (16).
2. An auxiliary heat sink for electronic equipment according to claim 1, wherein: the connecting unit comprises at least one first connecting piece (2) fixedly connected with the pressing plate (5) and at least one second connecting piece (3) fixedly connected with the base plate (6), the first connecting piece (2) is connected with the second connecting piece (3) through at least one connecting bolt (1), and the connecting bolt (1) is locked through a connecting nut (4).
3. An auxiliary heat sink for electronic equipment according to claim 1, wherein: the heat conducting plate is characterized in that a sliding groove (7) is formed in the substrate (6), a base body (11) is arranged in the sliding groove (7) in a sliding mode, and the heat conductor (10) is fixedly connected with the base body (11).
4. An auxiliary heat sink for electronic equipment according to claim 3, wherein: the base plate (6) an organic whole is connected with main locating plate (9), main locating plate (9) are located the top of spout (7), main locating plate (9) pass base member (11).
5. An auxiliary heat sink for electronic equipment according to claim 4, wherein: the base plate (6) is integrally connected with two auxiliary positioning plates (8), the two auxiliary positioning plates (8) are flush with the main positioning plate (9) and are respectively positioned on two sides of the main positioning plate (9), and the auxiliary positioning plates (8) penetrate through the base body (11).
6. An auxiliary heat sink for electronic equipment according to claim 5, wherein: the width of the main positioning plate (9) is larger than that of the auxiliary positioning plate (8).
7. An auxiliary heat sink for electronic equipment according to claim 4, wherein: the heat conductor (10) and the base body (11) are integrally connected, and the base body (11) and the heat pipe (16) are fixedly connected through a mounting bolt (15).
8. An auxiliary heat sink for electronic equipment according to claim 7, wherein: the heat pipe (16) comprises two connecting parts connected with the base body (11), the two connecting parts are respectively and integrally connected with an extending part, a communicating part is integrally connected between the two extending parts, distances are reserved between the connecting parts and the communicating part and between the connecting parts and the base plate (6), and the radiating fins (19) are fixedly connected with the communicating part.
9. An auxiliary heat sink for electronic equipment according to claim 8, wherein: two extension portion each fixedly connected with a base (17), fixedly on base (17) be provided with small-size fan (18), the air supply direction of small-size fan (18) with the extending direction of fin (19) is parallel, and two the air supply direction of small-size fan (18) is the same.
10. An auxiliary heat sink for electronic equipment according to claim 8, wherein: the thickness of the extension is smaller than the thickness of the thermal conductor (10).
CN201921923880.4U 2019-11-09 2019-11-09 Auxiliary heat dissipation device for electronic equipment Active CN210840505U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201921923880.4U CN210840505U (en) 2019-11-09 2019-11-09 Auxiliary heat dissipation device for electronic equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201921923880.4U CN210840505U (en) 2019-11-09 2019-11-09 Auxiliary heat dissipation device for electronic equipment

Publications (1)

Publication Number Publication Date
CN210840505U true CN210840505U (en) 2020-06-23

Family

ID=71260355

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201921923880.4U Active CN210840505U (en) 2019-11-09 2019-11-09 Auxiliary heat dissipation device for electronic equipment

Country Status (1)

Country Link
CN (1) CN210840505U (en)

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