CN213522934U - Heat radiator for power device - Google Patents
Heat radiator for power device Download PDFInfo
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- CN213522934U CN213522934U CN202023027761.6U CN202023027761U CN213522934U CN 213522934 U CN213522934 U CN 213522934U CN 202023027761 U CN202023027761 U CN 202023027761U CN 213522934 U CN213522934 U CN 213522934U
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- power
- circuit board
- heat
- power device
- heat dissipation
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Abstract
The utility model relates to a power device technical field specifically discloses a heat abstractor of power device. The power device comprises a circuit board, wherein a radiating block and a power device tightly attached to the radiating block are arranged on the back of the circuit board, the power device is inversely arranged on the back of the circuit board, a shell is covered at the bottom of the circuit board, the radiating block and the power device are covered inside the shell, and a radiator is connected to the outer side of the shell. The utility model provides the high space utilization of power to when making the power supply volume reduce, increased heat radiating area, improved the radiating effect, the performance of protection power, the life of extension power, and can also prevent that the power from making the not hard up emergence of power device after bumping in the use. The utility model discloses structure assembly is simple, has improved work efficiency, has more practiced thrift the cost, does benefit to and uses widely.
Description
Technical Field
The utility model relates to a power device technical field specifically discloses a heat abstractor of power device.
Background
In the design of a switching power supply, a power tube is often used, and the heating of the power tube is a problem often encountered in the design of the power supply. Under the normal working condition of the switching power supply, the service life of the switching power supply is directly influenced by the heating condition of the power tube, and the higher the temperature is, the lower the reliability and the service life are, so that auxiliary heat dissipation needs to be carried out on the power tube, for example, a fan and a heat dissipation fin are adopted for heat dissipation.
In the prior art, most of the main bodies of the power devices are arranged on the front side of the circuit board and are additionally provided with the radiators, the assembly process of the heat dissipation structure is complex, the welding effect is poor, and meanwhile, the heat dissipation effect is poor.
The adoption of the fan for heat dissipation increases the complexity of a circuit and a structure and increases the cost of the whole machine. The radiating fins are adopted for radiating, the volume of the radiating fins is increased due to insufficient radiating, the weight of the radiating fins is increased, local stress is caused to a PCB, and the structural reliability of the whole machine is reduced.
Notice No. CN204994070U is the utility model discloses a but be used for switching power supply uniform heat radiation's heat radiation structure, including printed circuit board, power tube, still include fin, set screw, heat-conducting plate, at least fixed power tube on the fin, coating one deck heat conduction silicone grease between fin and the power tube, at least a slice fin is arranged in on the printed circuit board, the pin and the printed circuit board welding of the fixed power tube on the fin, the heat-conducting plate passes through set screw to be fixed on at least a slice fin, coating one deck heat conduction silicone grease between heat-conducting plate and the fin. The power tube heat dissipation device is characterized in that heat generated by the power tube is transmitted to the heat conduction plate through the heat dissipation fins and dissipated out by the heat conduction plate, so that the temperature of a local high-temperature area of the printed circuit board is effectively reduced, the heat dissipation effect of the power tube is enhanced, and the reliability and the service life of power equipment are improved.
The heat that the power tube produced among the above-mentioned disclosed technical scheme dispels the heat through the fin transmission to the heat-conducting plate, exists in the use because the collision makes the power tube and the not hard up condition appear between the fin to can influence the radiating effect, thereby cause local high temperature to warp to the circuit board, influence the life of power, and do not have better utilizing the space, be unfavorable for reducing the volume of power.
SUMMERY OF THE UTILITY MODEL
The utility model discloses an overcome prior art not enough, provide a power device's heat abstractor.
In order to solve the technical problem, the utility model adopts the following technical scheme:
the utility model provides a heat abstractor of power device, includes the circuit board, is equipped with the radiating block and hugs closely the power ware that the radiating block set up at the back of circuit board, the back of circuit board is located in the power tube inversion, covers in the bottom of circuit board and is equipped with the casing, inside is located radiating block and power tube cover to the casing, is connected with the radiator outside the casing.
Preferably, the casing includes a bottom plate fixedly connected with the bottom of the heat dissipation block and a side plate disposed at a side of the bottom plate, and the side plate, the bottom plate and the circuit board enclose a closed space to enclose the heat dissipation block into the casing.
Preferably, the heat dissipation block is assembled and connected with the bottom plate through a fixing screw.
Preferably, the two adjacent power tubes are provided with elastic pressing sheets in a pressing manner, two ends of each elastic pressing sheet are respectively pressed after being connected with the two adjacent power tubes, and the middle parts of the elastic pressing sheets are fixedly connected with the bottom plate through fixing bolts.
Preferably, a ceramic plate for transferring heat is arranged between the power tube and the radiating block.
Preferably, a circuit board lining plate is arranged between the heat dissipation block and the circuit board, and the circuit board lining plate is provided with a mounting hole corresponding to the power tube.
Preferably, the periphery of the circuit board lining plate is provided with a connecting part fixedly connected with the side plate, and the connecting part is fixedly connected with the side plate through a fixing bolt.
Preferably, a rectifier bridge is arranged on the circuit board, an elastic pressing piece is arranged on the rectifier bridge, and two ends of the elastic pressing piece are pressed on the contact surface of the heat dissipation base block after being connected with the rectifier bridge.
The utility model has the advantages that:
the utility model discloses a carry out optimal design with the spatial structure of power device and heat dissipation mechanism, invert the power tube and install the back at the circuit board to use the elasticity preforming to press the power tube on the radiating block, and compress tightly through fixing bolt, the utility model provides the high space utilization of power, thereby when making the power volume reduce, increased heat radiating area, improved the radiating effect, the performance of protection power, the life of extension power, and can also prevent that the power from making the not hard up emergence of power device after bumping in the use. The utility model discloses structure assembly is simple, has improved work efficiency, has more practiced thrift the cost, does benefit to and uses widely.
Drawings
Fig. 1 is a schematic perspective view of the present invention;
FIG. 2 is a first schematic view of a mounting structure of the circuit board of FIG. 1;
FIG. 3 is a second schematic view of the mounting structure of the circuit board of FIG. 1;
fig. 4 is a detailed view of the mounting structure of the power tube of fig. 3.
Detailed Description
The following detailed description of the embodiments of the present invention will be made with reference to the accompanying drawings.
As shown in fig. 1 to 4, a heat dissipation device for a power supply power device includes a circuit board 1, a heat dissipation block 3 and a power device 2 closely attached to a side of the heat dissipation block 3 are disposed on a back surface of the circuit board 1, the power tube 2 is inversely disposed on the back surface of the circuit board 1, a housing 7 is disposed at a bottom of the circuit board 1, the heat dissipation block 2 and the power tube 2 are covered inside the housing 7, and a heat sink 9 is connected to an outer side of the housing 7.
Further, the housing 7 includes a bottom plate 72 fixedly connected to the bottom of the heat dissipation block 3 and a side plate 71 perpendicular to the bottom plate 72, and the side plate 71, the bottom plate 72 and the circuit board 1 enclose a closed space to enclose the heat dissipation block 3 inside the housing 7.
Further, the heat dissipation block 3 is assembled and connected with the bottom plate 72 through a fixing screw.
Furthermore, in order to transmit the heat generated by the power tubes 2 to the heat dissipation block 3 in time, the two adjacent power tubes 2 are provided with the elastic pressing sheets 6, two ends of each elastic pressing sheet 6 are respectively contacted with the two adjacent power tubes 2 and then pressed, and the middle parts of the elastic pressing sheets 6 are fixedly connected with the bottom plate 72 through fixing bolts, so that the power tubes 2 and the heat dissipation block 3 are pressed and conducted heat.
Furthermore, a ceramic plate 4 for transferring heat is arranged between the power tube 2 and the radiating block 3.
Furthermore, a circuit board lining plate 5 is arranged between the radiating block 3 and the circuit board 1, a mounting hole corresponding to the power tube 2 is formed in the circuit board lining plate 5, and the circuit board lining plate 5 plays a role in protecting the circuit board 1 and prevents heat from being transmitted to the circuit board 1 to damage the circuit board 1.
Furthermore, the periphery of the circuit board lining plate 5 is provided with a connecting part 51 which is fixedly connected with the side plate 71, and the connecting part 51 is fixedly connected with the side plate 71 through a fixing bolt.
Further, be provided with rectifier bridge 8 on circuit board 1, in order to make rectifier bridge 8 and heat dissipation base block be connected inseparabler to reach more excellent radiating effect, be equipped with elasticity preforming 6 on rectifier bridge 8, compress tightly on the contact surface of heat dissipation base block after the both ends of elasticity preforming 6 and rectifier bridge 8 contact, and make 8 both sides of rectifier bridge evenly atress, can also keep the radiating effect when preventing to warp.
The utility model provides a heat abstractor of power device, through carrying out optimal design with the spatial structure of power device and heat dissipation mechanism, specifically, invert power tube 2 and install at the back of circuit board 2, and use elasticity preforming 6 to press power tube 2 on radiating block 3, and compress tightly through fixing bolt, the utility model provides the space utilization of high power to increase heat radiating area when making the power volume reduce, improved the radiating effect, protect the performance of power, prolong the life of power; and can also prevent the power device from loosening after the power supply collides in the using process. The utility model discloses structure assembly is simple, has improved work efficiency, has more practiced thrift the cost, does benefit to and uses widely.
The foregoing shows and describes the general principles, essential features, and advantages of the invention. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, but rather is described in the embodiments and descriptions herein to illustrate the principles of the invention and that various changes and modifications may be made without departing from the spirit and scope of the invention, all of which fall within the scope of the claimed invention. The scope of the invention is defined by the appended claims and equivalents.
In the description of the present invention, it should be understood that the terms "front", "back", "left", "right", "center", etc. indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus should not be construed as limiting the scope of the present invention.
Where the words "first", "second", etc. are used in this patent to define parts, those skilled in the art will recognize that: the use of "first" and "second" is merely for convenience in describing the invention and to simplify the description, and the words above have no special meaning.
Claims (8)
1. The heat dissipation device of the power supply power device is characterized by comprising a circuit board, wherein a heat dissipation block and a power device tightly attached to the heat dissipation block are arranged on the back of the circuit board, a power tube is inversely arranged on the back of the circuit board, a shell is covered at the bottom of the circuit board, the heat dissipation block and the power tube are covered inside the shell, and a heat radiator is connected to the outer side of the shell.
2. The power supply device heat sink according to claim 1, wherein the housing includes a bottom plate fixedly connected to a bottom of the heat sink, and a side plate disposed on a side of the bottom plate, and the side plate, the bottom plate, and the circuit board enclose a closed space to enclose the heat sink inside the housing.
3. The heat sink for power devices as claimed in claim 2, wherein the heat slug is connected to the bottom plate by a screw.
4. The heat dissipating device for power devices of claim 1, wherein two adjacent power tubes are pressed with elastic pressing plates, two ends of each elastic pressing plate are respectively pressed with two adjacent power tubes, and the middle of each elastic pressing plate is fixedly connected with the bottom plate through a fixing bolt.
5. The heat sink for power supply device according to any one of claims 1 to 4, wherein a ceramic plate for transferring heat is disposed between the power tube and the heat dissipation block.
6. The heat sink for power supply device according to claim 1, wherein a circuit board substrate is disposed between the heat sink and the circuit board, and the circuit board substrate has mounting holes corresponding to the power tubes.
7. The heat dissipating device for power devices as claimed in claim 6, wherein the circuit board has a connecting portion around the substrate for fixedly connecting to the side plate, and the connecting portion is fixedly connected to the side plate via a fixing bolt.
8. The heat dissipating device of a power supply device as claimed in claim 1, wherein a rectifying bridge is disposed on the circuit board, and an elastic pressing piece is disposed on the rectifying bridge, and both ends of the elastic pressing piece are pressed against the contact surface of the heat dissipating base block after being connected with the rectifying bridge.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202023027761.6U CN213522934U (en) | 2020-12-16 | 2020-12-16 | Heat radiator for power device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202023027761.6U CN213522934U (en) | 2020-12-16 | 2020-12-16 | Heat radiator for power device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN213522934U true CN213522934U (en) | 2021-06-22 |
Family
ID=76429192
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202023027761.6U Active CN213522934U (en) | 2020-12-16 | 2020-12-16 | Heat radiator for power device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN213522934U (en) |
-
2020
- 2020-12-16 CN CN202023027761.6U patent/CN213522934U/en active Active
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