CN211909457U

CN211909457U - Water pump controller MOS manages heat dissipation mechanism

Info

Publication number: CN211909457U
Application number: CN202020973090.3U
Authority: CN
Inventors: 李京翰; 戴震班; 汪于博
Original assignee: Wenling Vocational & Technical School
Current assignee: Wenling Vocational & Technical School
Priority date: 2020-06-01
Filing date: 2020-06-01
Publication date: 2020-11-10
Anticipated expiration: 2030-06-01

Abstract

The utility model provides a water pump controller MOS manages heat dissipation mechanism belongs to the brushless water pump field. The problems that the existing material is simple, the installation is complex, the integration level is low, the process cost is high, the production efficiency is low and the like are solved. This water pump controller MOS pipe heat dissipation mechanism, this water pump controller includes base plate and circuit board, the base plate is made by aluminium and forms, the preceding terminal surface of base plate is by interior toward having conducting layer and insulating paint layer to constitute outward in proper order, the integration has the power supply line of easily contacting the paster on the base plate, the preceding terminal surface of base plate still is provided with the MOS pipe paster, the conducting layer surface is provided with the pad that can supply MOS pipe paster welding subsides dress, weld fixation after congealing the thick liquid through soldering tin heat conduction between pad and this MOS pipe paster, the MOS pipe paster inserts circuit board and weld fixation with three pins through soldering tin heat conduction congeals thick liquid. The utility model has the advantages of light material, convenient installation, high integration level and low cost through less installation process.

Description

Water pump controller MOS manages heat dissipation mechanism

Technical Field

The utility model belongs to brushless water pump field relates to a water pump controller, in particular to water pump controller MOS manages heat dissipation mechanism.

Background

Nowadays, in a water pump controller, requirements on aspects such as circuit design and performance of the water pump controller depend on the heat dissipation problem of an MOS (metal oxide semiconductor) tube to a great extent. The aluminum plate convenient for heat dissipation is generally selected as a main material for the existing heat dissipation function, a row of mounting holes for mounting the patches are formed in the surface of the aluminum plate, the aluminum plate and the MOS tube patches are effectively separated and insulated through an insulating sheet, and in addition, a power circuit communicated with a grounding circuit is welded on a circuit board connected with the aluminum plate through patch pins.

However, there is an obvious problem in the process of producing the aluminum plate heat dissipation combination mechanism, for example, several fixing holes are formed on the surface of the substrate, and the patch and the substrate are fixedly mounted through screws under the condition that a certain amount of labor is needed, so that the process is complicated, the production efficiency is greatly reduced, and the cost of the whole process is increased by adding an insulating sheet between the substrate and the patch, and in addition, the integration level of the mechanism is reduced by the grounding circuit and the power circuit which are integrated on the circuit board.

Disclosure of Invention

The utility model aims at the above-mentioned problem that exists among the prior art, provide a material light, simple to operate, integrated level height, low and improvement production efficiency's water pump controller MOS pipe heat dissipation mechanism.

The purpose of the utility model can be realized by the following technical proposal: water pump controller MOS pipe heat dissipation mechanism, this water pump controller include base plate and circuit board, its characterized in that, the base plate form by aluminium preparation, the preceding terminal surface of base plate by interior toward having conducting layer and insulating paint layer to constitute outward in proper order, the base plate on the integrated power supply line who has easily contact the paster, the preceding terminal surface of base plate still is provided with the MOS pipe paster, the conducting layer surface be provided with the pad that can supply MOS pipe paster welding to paste, pad and this MOS pipe paster between through soldering tin heat conduction congeal thick liquid after welded fastening, the MOS pipe paster through soldering tin heat conduction congeal thick liquid with three pin insert circuit board and welded fastening.

In the above MOS tube heat dissipation mechanism for a water pump controller, the substrate end face is provided with two fixed mounting holes for mounting the substrate patch combination mechanism in the water pump controller.

In the above-mentioned water pump controller MOS pipe heat dissipation mechanism, the base plate be one can supply a plurality of MOS pipe paster and the rectangle that the pad that sets up on the base plate terminal surface carries out welding dress.

In the above MOS tube heat dissipation mechanism for a water pump controller, the bonding pad disposed on the surface of the conductive layer has a T-shaped orthographic projection corresponding to the position where the MOS tube is attached by welding.

In the above-mentioned water pump controller MOS pipe heat dissipation mechanism, the substrate surface except the position where the MOS pipe paster and the bonding pad are welded and pasted, the rest is covered with the insulating paint layer.

Compared with the prior art, this be used for water pump controller MOS pipe heat dissipation mechanism has following advantage:

1. the end face of the substrate is provided with two fixed mounting holes which can mount the substrate paster combination mechanism in the water pump controller, and the arrangement reduces the process steps of manual fixed mounting between the substrate and the MOS tube paster respectively and improves the production efficiency in the original technology;

2. the positions of the MOS tube patches and the welding and pasting positions of the bonding pads are distributed on the surface of the substrate, and the rest parts are paint layers with an insulating effect, so that the cost of the substrate patch combination body mechanism in the production process is greatly reduced after one layer of insulating sheet is removed;

3. the conducting layer in the substrate is integrated with a power circuit which is easy to contact with the patch, and the arrangement has the advantages of preventing short circuit phenomenon existing in the original circuit board, reducing the space occupied by the circuit board, and improving the integration level by integrating the conducting layer in the substrate.

Drawings

Fig. 1 is a schematic plan structure view of a substrate in the heat dissipation mechanism for the MOS tube of the water pump controller.

Fig. 2 is a schematic plane structure diagram of the connection between the substrate and the circuit board in the MOS tube heat dissipation mechanism for the water pump controller.

In the figure, 1, a substrate; 2. a conductive layer; 3. an insulating paint layer; 4. fixing the mounting hole; 5. a pad; 6. mounting an MOS tube; 7. a pin; 8. a power supply line; 9. a circuit board.

Detailed Description

The following are specific embodiments of the present invention and the accompanying drawings are used to further describe the technical solution of the present invention, but the present invention is not limited to these embodiments.

As shown in fig. 1 and fig. 2, this water pump controller MOS pipe heat dissipation mechanism, this water pump controller includes base plate 1, circuit board 9, base plate 1 is made by aluminium and forms, base plate 1's preceding terminal surface is by interior toward having set gradually conducting layer 2 and insulating paint layer 3 outward, integrated power supply line 8 that has easily contact the paster on base plate 1, base plate 1's preceding terminal surface still is provided with MOS pipe paster 6, and conducting layer 2 surface is provided with can supply the pad 5 that MOS pipe paster 6 welding pasted and pasted, weld through soldering tin heat conduction coagulation thick liquid after welding between pad 5 and this MOS pipe paster 6 and fix, MOS pipe paster 6 inserts circuit board 9 and weld through soldering tin heat conduction coagulation thick liquid with three pins.

Further explaining, in order to better sense the effect brought by welding and pasting the MOS tube patch 6 on the surface of the substrate 1, a layer of insulating paint layer 3 with excellent insulating property and heat resistance capable of meeting the requirements of the MOS tube is fully distributed on the rest part where the MOS tube patch 6 is welded and pasted, a plurality of welding pads 5 with T-shaped orthographic projection surfaces are arranged at the welding and pasting positions of the MOS tube patch 6 and respectively correspond to the MOS tube patch 6, and two fixed mounting holes 4 capable of mounting the substrate 1 patch combination mechanism in a water pump controller are arranged on the surface of the substrate 1.

The specific embodiments described herein are merely illustrative of the spirit of the invention. Various modifications, additions and substitutions for the specific embodiments described herein may be made by those skilled in the art without departing from the spirit of the invention or exceeding the scope of the invention as defined in the accompanying claims.

Claims

1. The utility model provides a water pump controller MOS manages heat dissipation mechanism, this water pump controller includes base plate (1) and circuit board (9), its characterized in that, base plate (1) form by aluminium preparation, the preceding terminal surface of base plate (1) is by interior toward having set gradually conducting layer (2) and insulating paint layer (3) outward, base plate (1) on integrated power supply line (8) that have easily contact the paster, the preceding terminal surface of base plate (1) still is provided with MOS pipe paster (6), conducting layer (2) surface be provided with pad (5) that can supply MOS pipe paster (6) welding subsides, pad (5) and this MOS pipe paster (6) between through soldering tin heat conduction congeals thick liquid after welded fastening, MOS pipe paster (6) through soldering tin heat conduction congeal thick liquid insert circuit board (9) and welded fastening with three pins (7).

2. The MOS tube heat dissipation mechanism of the water pump controller as recited in claim 1, wherein two fixing holes (4) for mounting the substrate (1) patch combination mechanism in the water pump controller are formed in the end surface of the substrate (1).

3. The heat dissipation mechanism of the water pump controller MOS tube according to claim 1, wherein the substrate (1) is rectangular and a plurality of MOS tube patches (6) and a bonding pad (5) arranged on the end surface of the substrate (1) are welded and attached.

4. The MOS tube heat dissipation mechanism of the water pump controller according to claim 1, wherein an orthographic projection surface of the bonding pad (5) arranged on the surface of the conductive layer (2) is T-shaped and can correspond to a position where the MOS tube patch (6) is welded and attached.

5. The MOS tube heat dissipation mechanism of the water pump controller according to claim 1, wherein the rest of the surface of the substrate (1) is covered with the insulating paint layer (3) except the position where the MOS tube patch (6) and the bonding pad (5) are welded and attached.