CN217822769U

CN217822769U - High-heat-dissipation electronic chip

Info

Publication number: CN217822769U
Application number: CN202222096878.2U
Authority: CN
Inventors: 黄建文; 刘清钦
Original assignee: Shenzhen Tianhaoxu Technology Co ltd
Current assignee: Shenzhen Tianhaoxu Technology Co ltd
Priority date: 2022-08-10
Filing date: 2022-08-10
Publication date: 2022-11-15
Anticipated expiration: 2032-08-10

Abstract

The utility model discloses a high radiating electronic chip belongs to the electronic chip field, including the chip main part, be connected with the pin in the chip main part, and be equipped with the connection frame in the chip main part, the last surface mounting who connects the frame has heat radiation structure, and heat radiation structure includes fixed frame, support column and heat dissipation frame, fixed frame is connected with the support column, and the support column installs on connecting the frame, heat dissipation frame installs on fixed frame, fixed connection between chip main part and the pin, and the pin symmetry sets up in the chip main part, connect frame fixed mounting in the chip main part. Through the heat radiation structure who sets up, utilize the heat dissipation frame can accelerate the thermal giving off of chip, guarantee that chip temperature can not be too high, ensured the normal use of chip, set up the support column among the heat radiation structure, raise fixed frame, further guaranteed thermal effect of giving off, the setting can be dismantled to the heat dissipation frame, convenient to detach gets off, uses the flexibility high.

Description

High-heat-dissipation electronic chip

Technical Field

The utility model relates to an electronic chip field, in particular to high radiating electronic chip.

Background

A chip is a general term for semiconductor devices. After the transistors are invented and produced in large quantities, various solid semiconductor components such as diodes, transistors and the like are used in large quantities, and the functions and roles of vacuum tubes in circuits are replaced, so that the integrated circuits become possible. The integrated circuit can integrate a large number of micro-transistors on one electronic chip, and the electronic chip used as the integrated circuit carrier greatly improves the design of the traditional circuit in cost and performance. In the existing chip structure, the chip structure is composed of a chip main body and pins, and the chip main body is installed on a corresponding circuit board through the pins. The existing chip can generate certain heat when in use, and because the chip is not provided with a structure for accelerating heat dissipation, the heat can easily affect the normal use of the chip, the temperature of the chip is too high and abnormal, the chip can be damaged, and certain limitation exists when in use.

SUMMERY OF THE UTILITY MODEL

A primary object of the present invention is to provide a high heat dissipation electronic chip, which can effectively solve the problems in the background art.

In order to achieve the above purpose, the utility model adopts the technical proposal that:

the utility model provides a high radiating electronic chip, includes the chip main part, be connected with the pin in the chip main part, and be equipped with the connection frame in the chip main part, the last surface mounting who connects the frame has heat radiation structure, and heat radiation structure includes fixed frame, support column and heat dissipation frame, fixed frame is connected with the support column, and the support column installs on connecting the frame, heat dissipation frame installs on fixed frame.

Preferably, the chip body is fixedly connected with the pins, the pins are symmetrically arranged on the chip body, and the connecting outer frame is fixedly arranged on the chip body.

Preferably, the corner position of the connecting outer frame is provided with a connecting screw hole, the heat dissipation structure is fixedly arranged on the connecting outer frame, and the heat dissipation structure contacts the chip main body.

Preferably, heat radiation structure still includes connecting screw and chucking groove, connecting screw sets up on fixed frame, and connecting screw's lower extreme runs through in the support column, threaded connection between connecting screw's the end and the connection screw on the connection frame, fixed frame, support column pass through connecting screw to be fixed on the connection frame, the chucking groove is seted up on fixed frame, and the chucking groove symmetry sets up on fixed frame.

Preferably, the heat dissipation frame includes radiating fin, quad slit, head rod and second connecting rod, the quad slit is seted up on the radiating fin, head rod, second connecting rod run through the quad slit on the radiating fin, and fixed connection between head rod, second connecting rod and the radiating fin, the tip joint of head rod, second connecting rod is in the chucking groove on fixed frame, radiating fin installs on fixed frame through first connecting rod, second connecting rod.

Compared with the prior art, the utility model discloses following beneficial effect has: this high radiating electronic chip through the heat radiation structure who sets up, utilizes the heat dissipation frame can accelerate the thermal giving off of chip, guarantees that chip temperature can not be too high, has ensured the normal use of chip, sets up the support column among the heat radiation structure, raises fixed frame, has further guaranteed the thermal effect of giving off, and the heat dissipation frame can be dismantled the setting, and convenient to detach gets off, uses the flexibility high.

Drawings

Fig. 1 is a schematic view of the overall structure of the present invention;

FIG. 2 is a schematic view of the structure of the connecting frame of the present invention;

fig. 3 is a schematic structural view of the heat dissipation structure of the present invention;

fig. 4 is a schematic structural view of the heat dissipation frame of the present invention.

In the figure: 1. a chip body; 2. a pin; 3. connecting the outer frame; 4. a heat dissipation structure; 401. a fixing frame; 402. a support pillar; 403. a connecting screw; 404. a heat dissipation frame; 4041. a heat dissipating fin; 4042. a square hole; 4043. a first connecting rod; 4044. a second connecting rod; 405. a clamping groove; 5. and connecting the screw holes.

Detailed Description

In order to make the technical means, creation features, achievement purposes and functions of the present invention easy to understand, the present invention is further described below with reference to the following embodiments.

As shown in fig. 1-4, a high-heat-dissipation electronic chip includes a chip main body 1, a pin 2 is connected to the chip main body 1, a connection outer frame 3 is disposed on the chip main body 1, a heat dissipation structure 4 is disposed on an upper surface of the connection outer frame 3, the chip main body 1 is fixedly connected to the pin 2, the pin 2 is symmetrically disposed on the chip main body 1, the connection outer frame 3 is fixedly mounted on the chip main body 1, a connection screw hole 5 is disposed at a corner position of the connection outer frame 3, the heat dissipation structure 4 is fixedly mounted on the connection outer frame 3, and the heat dissipation structure 4 contacts the chip main body 1.

When installing the chip, install chip main part 1 on the circuit board through pin 2, make the chip be connected to in the circuit, install heat radiation structure 4 on connecting frame 3 afterwards, structure among the heat radiation structure 4 is connected with connecting screw 5, and then it is fixed to accomplish heat radiation structure 4's installation, after heat radiation structure 4 installation finishes, begin to use electronic chip, electronic chip is at the in-process that uses, can produce certain heat, heat conduction heat that heat radiation structure 4 can be quick this moment, make the heat can give off fast, and then guarantee that electronic chip temperature can not be too high, electronic chip's result of use has been ensured.

Through the above-mentioned embodiment, heat radiation structure 4 includes fixed frame 401, support column 402 and heat dissipation frame 404, fixed frame 401 is connected with support column 402, and support column 402 installs on connecting frame 3, heat dissipation frame 404 installs on fixed frame 401, heat radiation structure 4 still includes connecting screw 403 and chucking groove 405, connecting screw 403 sets up on fixed frame 401, and the lower extreme of connecting screw 403 runs through in support column 402, threaded connection between the end of connecting screw 403 and the connection screw 5 on connecting frame 3, fixed frame 401, support column 402 is fixed on connecting frame 3 through connecting screw 403, chucking groove 405 is seted up on fixed frame 401, and chucking groove 405 sets up on fixed frame 401 symmetrically, heat dissipation frame 404 includes radiating fin 4041, quad slit 4042, head rod 4043 and second connecting rod 4044, quad slit 4042 is seted up on radiating fin 4041, head rod 4043, second connecting rod 4044 runs through the quad slit 4042 on radiating fin 4041, and first connecting rod 4043, the heat dissipation chip 4044 and the heat dissipation chip 4044 can not set up through the radiating fin's on the radiating fin 4044, the heat dissipation frame 4044 can be guaranteed to follow the radiating chip through the radiating fin's heat dissipation effect and has set up the radiating fin 401, the heat dissipation frame 401 can be dismantled to the heat dissipation chip.

When installing heat radiation structure 4, place fixed frame 401 on connecting frame 3, support column 402 of fixed frame 401 lower extreme contacts on connecting frame 3, fixed frame 401 simultaneously, hole on support column 402 aligns with connection screw 5 on connecting frame 3, insert fixed frame 401 with connecting screw 403, in the hole on the support column 402, make connecting screw 403's end revolve connect in the screw 5, thereby fixed frame 401, after fixed frame 401 finishes installing, insert radiating fin 4041 in the space of fixed frame 401 inboard, make the first connecting rod 4043 of connecting on the radiating fin 4041, second connecting rod 4044 tip card is gone into in chucking groove 405, thereby fix whole radiating frame 404, radiating fin 4041's lower extreme supports on chip main part 1 this moment, just so accomplished whole heat radiation structure 4's installation work, heat radiation structure 4 can play radiating effect, produce certain heat when electronic chip uses, radiating fin 4041 gives off heat conduction, guarantee that electronic chip's temperature can not be too high, simultaneously because of support column 402, there is the clearance between fixed frame 401 and the connecting frame 3, the radiating structure also can guarantee the quick radiating effect.

The foregoing has described the principles of use, features and advantages of the present invention. The above embodiments and the description describe the basic principles and features of the present invention, and the present invention can be modified in various ways according to the principles of the present invention, and all such modifications are intended to fall within the scope of the present invention as claimed.

Claims

1. The utility model provides a high radiating electronic chip, includes chip main part (1), be connected with pin (2) on chip main part (1), and be equipped with on chip main part (1) and connect frame (3), its characterized in that: the upper surface of connecting frame (3) installs heat radiation structure (4), and heat radiation structure (4) are including fixed frame (401), support column (402) and heat dissipation frame (404), fixed frame (401) are connected with support column (402), and support column (402) install on connecting frame (3), heat dissipation frame (404) are installed on fixed frame (401).

2. A high heat dissipation electronic chip, as recited in claim 1, wherein: the chip is characterized in that the chip body (1) and the pins (2) are fixedly connected, the pins (2) are symmetrically arranged on the chip body (1), and the connecting outer frame (3) is fixedly arranged on the chip body (1).

3. A high heat dissipation electronic chip according to claim 2, wherein: the chip packaging structure is characterized in that a connecting screw hole (5) is formed in the corner position of the connecting outer frame (3), the heat dissipation structure (4) is fixedly installed on the connecting outer frame (3), and the heat dissipation structure (4) is in contact with the chip main body (1).

4. A high heat dissipation electronic chip as recited in claim 3, wherein: heat radiation structure (4) still include connecting screw (403) and chucking groove (405), connecting screw (403) set up on fixed frame (401), and the lower extreme of connecting screw (403) runs through in support column (402), threaded connection between the terminal of connecting screw (403) and connection screw (5) on connecting frame (3), fixed frame (401), support column (402) are fixed on connecting frame (3) through connecting screw (403), chucking groove (405) are seted up on fixed frame (401), and chucking groove (405) symmetry setting on fixed frame (401).

5. A high heat dissipation electronic chip according to claim 4, wherein: radiating frame (404) includes radiating fin (4041), quad slit (4042), head rod (4043) and second connecting rod (4044), quad slit (4042) are seted up on radiating fin (4041), head rod (4043), second connecting rod (4044) run through quad slit (4042) on radiating fin (4041), and fixed connection between head rod (4043), second connecting rod (4044) and radiating fin (4041), the tip joint of head rod (4043), second connecting rod (4044) is in chucking groove (405) on fixed frame (401), radiating fin (4041) are installed on fixed frame (401) through head rod (4043), second connecting rod (4044).