CN216213416U

CN216213416U - Semiconductor chip supporting structure

Info

Publication number: CN216213416U
Application number: CN202122342591.9U
Authority: CN
Inventors: 吴秋英; 张嘉露
Original assignee: Individual
Current assignee: Individual
Priority date: 2021-09-27
Filing date: 2021-09-27
Publication date: 2022-04-05
Anticipated expiration: 2031-09-27

Abstract

The utility model relates to the technical field of chips and discloses a semiconductor chip supporting structure which comprises a chip mounting seat and a chip body, wherein pins are arranged at two ends of the chip body, one ends of the pins, which are close to the chip body, are connected with clamping blocks, one ends of the chip body, which are close to the pins, are provided with clamping grooves, the clamping blocks are clamped with the clamping grooves, the upper surface of the chip mounting seat is provided with a chip mounting groove, the shape of the chip mounting groove is matched with that of the bottom of the chip body, and the bottom of the chip body is clamped with the chip mounting groove. According to the utility model, the end parts of the pins are provided with the clamping blocks, and the end parts of the chip body are provided with the clamping grooves, so that when the pins and the chip body are installed, the clamping blocks and the clamping grooves can be butted at first to achieve the purpose of pre-installation, and the pins and the chip body are tightly installed through the connection of the sealant, so that the problem of falling-off can be avoided.

Description

Semiconductor chip supporting structure

Technical Field

The utility model relates to the technical field of chips, in particular to a semiconductor chip supporting structure.

Background

A semiconductor chip: etching and wiring are performed on the semiconductor wafer to obtain a semiconductor device capable of realizing a certain function. Not only silicon chips, but also gallium arsenide (gallium arsenide is toxic, so some inferior circuit boards do not decompose it), germanium and other semiconductor materials are commonly included. Semiconductors are also in the trend of automobiles. In the seventies of the twentieth century, the dynamic random access memory (D-RAM) market has been popular with intel and other american enterprises. However, in the eighties of the twentieth century, beginning with the name of Japanese corporation, high performance D-RAM was required due to the advent of large computers. The pins in the semiconductor chip in the prior art are not firmly installed with the chip, and the pins are easy to fall off when falling.

SUMMERY OF THE UTILITY MODEL

Technical problem to be solved

In view of the deficiencies of the prior art, the present invention provides a semiconductor chip supporting structure to solve the problems mentioned above in the background art.

(II) technical scheme

In order to achieve the purpose, the utility model provides the following technical scheme: a semiconductor chip supporting structure comprises a chip mounting seat and a chip body, wherein pins are arranged at two ends of the chip body;

one end of the pin close to the chip body is connected with a clamping block;

one end of the chip body, which is close to the pins, is provided with a clamping groove;

the clamping block is clamped with the clamping groove.

Preferably, the chip mounting groove has been seted up to the upper surface of chip mounting seat, the shape of chip mounting groove matches with the bottom shape of chip body, the bottom and the chip mounting groove joint of chip body make chip body can zonulae occludens on the chip mounting seat.

Preferably, the lower surface of the chip mounting seat is provided with a cavity, and the heat at the bottom of the chip mounting seat can be dissipated by the cavity, so that the efficient heat dissipation effect is achieved.

Preferably, the bottom of the cavity is communicated with the bottom of the chip mounting seat, so that heat can be rapidly dissipated.

Preferably, the radiating holes are formed in the periphery of the inner wall of the cavity and communicate the outside with the inside of the cavity, and the outside cold air can enter the cavity through the radiating holes, so that the radiating purpose is achieved.

Preferably, the shape in joint piece and joint groove is spherical, the middle part of joint piece still is provided with the cavity, sets up the cavity through the inside at the joint piece to let the joint piece have elasticity, thereby let the joint piece can the joint advance the inside in joint groove.

Preferably, the top in joint groove is provided with one-way hole, one-way hole supplies sealed glue to get into, can pour into sealed glue into from one-way hole, makes joint piece and joint groove zonulae occludens.

Preferably, the inner wall of the clamping groove is provided with an inserting hole, one end, close to the inserting hole, of the clamping block is connected with an inserting column, the inserting column is inserted into the inserting hole, the outer end of the clamping groove is provided with a groove, a plastic sleeve is installed in the groove, and the pin can be tightly clamped outside the chip body by the plastic sleeve.

Compared with the prior art, the utility model provides a semiconductor chip supporting structure, which has the following beneficial effects:

1. according to the utility model, the end parts of the pins are provided with the clamping blocks, and the end parts of the chip body are provided with the clamping grooves, so that when the pins and the chip body are installed, the clamping blocks and the clamping grooves can be butted at first to achieve the purpose of pre-installation, and the pins and the chip body are tightly installed through the connection of the sealant, so that the problem of falling-off can be avoided.

2. According to the utility model, the cavity is arranged at the bottom of the chip mounting seat, and the radiating holes are arranged around the cavity, so that external cold air can enter the cavity from the radiating holes, and the chip mounting seat is effectively radiated.

Drawings

FIG. 1 is a schematic perspective view of the present invention;

FIG. 2 is an exploded view of the present invention;

FIG. 3 is a bottom block diagram of the present invention;

fig. 4 is a view showing a structure of mounting the lead and the chip body according to the present invention.

In the figure: 1 chip mounting seat, 2 chip bodies, 3 pins, 4 cavities, 5 heat dissipation holes, 601 clamping blocks, 602 clamping grooves, 603 one-way holes, 604 plug holes, 605 plug columns, 606 grooves and 607 plastic kits.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments.

Examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are illustrative and intended to be illustrative of the utility model and are not to be construed as limiting the utility model.

In the description of the present invention, it is to be understood that the terms "central," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," "circumferential," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the utility model and to simplify the description, and are not intended to indicate or imply that the referenced devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and are therefore not to be considered limiting of the utility model.

In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can, for example, be fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.

Referring to fig. 1-4, the present invention provides a technical solution: a semiconductor chip supporting structure comprises a chip mounting seat 1 and a chip body 2, wherein pins 3 are arranged at two ends of the chip body 2;

one end of the pin 3 close to the chip body 2 is connected with a clamping block 601;

a clamping groove 602 is formed in one end of the chip body 2 close to the pin 3;

the clip block 601 is clipped with the clip groove 602.

Chip mounting groove 7 has been seted up to the upper surface of chip mounting seat 1, and the shape of chip mounting groove 7 matches with the bottom shape of chip body 2, and the bottom and the 7 joints of chip mounting groove of chip body 2 make chip body 2 can zonulae occludens on chip mounting seat 1.

The lower surface of chip mounting seat 1 is provided with cavity 4, can give off the heat of 1 bottoms of chip mounting seat through setting up cavity 4, reaches high-efficient radiating effect.

The bottom of the cavity 4 is communicated with the bottom of the chip mounting seat 1, so that heat can be quickly dissipated.

Be provided with louvre 5 around the inner wall of cavity 4, louvre 5 with external and cavity 4's inside intercommunication, can let external cold wind can enter into cavity 4 in through setting up louvre 5, reach radiating purpose.

The shape of joint piece 601 and joint groove 602 is spherical, and the middle part of joint piece 601 still is provided with the cavity, sets up the cavity through the inside at joint piece 601 to let joint piece 601 have elasticity, thereby let joint piece 601 can the joint advance the inside in joint groove 602.

The top of joint groove 602 is provided with one-way hole 603, and one-way hole 603 supplies sealed glue to get into, can pour into sealed glue into from one-way hole 603, makes joint piece 601 and joint groove 602 zonulae occludens.

The inner wall of the clamping groove 602 is provided with a plugging hole 604, one end of the clamping block 601 close to the plugging hole 604 is connected with a plugging column 605, the plugging column 605 is plugged with the plugging hole 604, the outer end of the clamping groove 602 is provided with a groove 606, a plastic sleeve 607 is installed in the groove 606, and the plastic sleeve 607 can tightly clamp the pin 3 outside the chip body 2.

When using, tip at pin 3 sets up joint piece 601, tip at chip body 2 sets up joint groove 602, thereby when pin 3 and chip body 2 installation, can dock joint piece 601 and joint groove 602 earlier, reach the purpose of preinstallation, and connect through sealed glue, it is inseparable to make the installation between pin 3 and the chip body 2, the problem that drops can not appear, it is insecure to have solved the installation between pin 3 and the chip body 2 of prior art, the problem that can drop easily, make chip body 2's cost of maintenance reduce.

In summary, according to the utility model, the end of the pin 3 is provided with the clamping block 601, and the end of the chip body 2 is provided with the clamping groove 602, so that when the pin 3 and the chip body 2 are installed, the clamping block 601 and the clamping groove 602 can be butted at first to achieve the purpose of pre-installation, and the pin 3 and the chip body 2 are installed tightly through the connection of the sealant, and the problem of falling-off can not occur, and the bottom of the chip mounting seat 1 is provided with the cavity 4, and the periphery of the cavity 4 is also provided with the heat dissipation holes 5, so that the external cold air can enter the cavity 4 from the heat dissipation holes 5, and the chip mounting seat 1 can be effectively cooled.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in the embodiments without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.

Claims

1. A semiconductor chip supporting structure comprises a chip mounting base (1) and a chip body (2), and is characterized in that: pins (3) are arranged at two ends of the chip body (2);

one end of the pin (3) close to the chip body (2) is connected with a clamping block (601);

a clamping groove (602) is formed in one end, close to the pin (3), of the chip body (2);

the clamping block (601) is clamped with the clamping groove (602).

2. The semiconductor chip supporting structure according to claim 1, wherein: chip mounting groove (7) have been seted up to the upper surface of chip mount pad (1), the shape of chip mounting groove (7) matches with the bottom shape of chip body (2), the bottom and chip mounting groove (7) joint of chip body (2).

3. The semiconductor chip supporting structure according to claim 1, wherein: the lower surface of the chip mounting seat (1) is provided with a cavity (4).

4. A semiconductor chip supporting structure according to claim 3, wherein: the bottom of the cavity (4) is communicated with the bottom of the chip mounting seat (1).

5. The semiconductor chip supporting structure according to claim 4, wherein: the heat dissipation holes (5) are formed in the periphery of the inner wall of the cavity (4), and the outside is communicated with the inside of the cavity (4) through the heat dissipation holes (5).

6. The semiconductor chip supporting structure according to claim 1, wherein: the shape of joint piece (601) and joint groove (602) is spherical, the middle part of joint piece (601) still is provided with the cavity.

7. The semiconductor chip supporting structure according to claim 6, wherein: the top of joint groove (602) is provided with one-way hole (603), one-way hole (603) supply sealed glue to get into.

8. The semiconductor chip supporting structure according to claim 7, wherein: the inner wall of the clamping groove (602) is provided with a plugging hole (604), one end, close to the plugging hole (604), of the clamping block (601) is connected with a plugging column (605), the plugging column (605) is plugged with the plugging hole (604), the outer end of the clamping groove (602) is provided with a groove (606), and a plastic sleeve (607) is installed in the groove (606).