CN216744266U - Heat radiation structure and circuit board used by LED lamp - Google Patents
Heat radiation structure and circuit board used by LED lamp Download PDFInfo
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- CN216744266U CN216744266U CN202220172392.XU CN202220172392U CN216744266U CN 216744266 U CN216744266 U CN 216744266U CN 202220172392 U CN202220172392 U CN 202220172392U CN 216744266 U CN216744266 U CN 216744266U
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Abstract
The utility model relates to the relevant technical field of LED lamps, in particular to a heat dissipation structure, which comprises a heat conduction plate and a heat dissipation assembly, wherein the heat conduction plate is a rectangular flat plate, the edge of the heat conduction plate is provided with a first mounting hole, the lower surface of the heat conduction plate is provided with a mounting groove, the bottom of the mounting groove is provided with a through hole, the heat dissipation assembly is formed by combining a heat transfer plate, a mounting pipe, a heat dissipation plate and a heat conduction column, and the heat transfer plate is connected with the heat dissipation plate through the mounting pipe and the heat conduction column; through setting up the heat radiation structure who constitutes by heat-conducting plate and radiator unit combination to through heat-conducting plate, heat transfer plate, installation pipe, heat conduction post with heat transfer to the heating panel on, thereby be convenient for with heat transfer to the outside on the relatively poor panel of heat conduction effect, thereby be convenient for give off the heat on its panel, thereby improve the radiating effect.
Description
Technical Field
The utility model relates to the technical field of LED lamp correlation, in particular to a heat dissipation structure and a circuit board used by an LED lamp.
Background
The LED lamp is an electroluminescent semiconductor material chip, but because the density of electronic elements on the circuit board inside the LED lamp is high, and the LED lamp beads can generate certain heat when being used, the temperature of the circuit board can rise quickly when the LED lamp is continuously used, so that the service life of the LED lamp can be seriously reduced when the LED lamp is continuously used for a long time.
SUMMERY OF THE UTILITY MODEL
The utility model aims to provide a heat dissipation structure and a circuit board used by an LED lamp, so as to solve the problems in the background technology.
In order to achieve the purpose, the utility model provides the following technical scheme: a heat dissipation structure, the heat dissipation structure comprising:
the heat conduction plate is a rectangular flat plate, a first mounting hole is formed in the edge of the heat conduction plate, a mounting groove is formed in the lower surface of the heat conduction plate, and a through hole is formed in the bottom of the mounting groove;
the heat dissipation assembly is composed of a heat transfer plate, an installation pipe, a heat dissipation plate and a heat conduction column in a combined mode, the heat transfer plate is connected with the heat dissipation plate through the installation pipe and the heat conduction column, the heat transfer plate is of a rectangular frame structure, the heat transfer plate is attached to the lower side face of the heat conduction plate, a second installation hole is formed in the heat transfer plate, and a third installation hole is formed in the heat dissipation plate.
Preferably, the heat transfer plate, the mounting pipe, the heat dissipation plate and the heat conduction column are integrally formed, and the heat conduction plate and the heat dissipation assembly are both made of heat conduction metal through casting.
Preferably, the size of the outer contour of the heat transfer plate is matched with that of the outer contour of the heat dissipation plate, the first mounting hole, the second mounting hole and the third mounting hole are correspondingly arranged, and the sizes of the first mounting hole, the second mounting hole and the third mounting hole are matched.
Preferably, the installation pipe and the second installation hole are arranged correspondingly, and the inner diameter value of the installation pipe is matched with the aperture value of the second installation hole.
Preferably, the upper surface of the heat dissipation plate is provided with heat dissipation protrusions, the heat dissipation protrusions are of a hemispherical structure, and multiple groups of heat dissipation protrusions are uniformly arranged on the surface of the heat dissipation plate.
Preferably, the circuit board that the LED lamp used has above-mentioned heat radiation structure, and the circuit board that the LED lamp used includes upper base plate, next base plate and heat radiation structure, upper base plate fixed glue is in the upper surface of heat-conducting plate, and next base plate fixed glue is in the mounting groove of heat-conducting plate, and has seted up first pin hole on the upper base plate, and has seted up second pin hole on the next base plate, and the lower surface printing of next base plate has the printing line, the fourth mounting hole has been seted up on the upper base plate, the fourth mounting hole sets up with first mounting hole is corresponding, and its both sizes are identical.
Preferably, the size of the upper substrate is matched with that of the heat conducting plate, the size of the lower substrate is matched with that of the mounting groove, the size of the first pin hole is matched, and the first pin hole and the second pin hole are arranged corresponding to the through hole.
Preferably, the diameter value of the through hole is smaller than the diameter values of the first pin hole and the second pin hole.
Preferably, the inner side walls of the first pin hole, the second pin hole and the through hole are all provided with insulating coatings.
Compared with the prior art, the utility model has the beneficial effects that:
1. the heat-radiating structure formed by combining the heat-conducting plate and the heat-radiating component is arranged, so that heat is transferred to the heat-radiating plate through the heat-conducting plate, the mounting pipe and the heat-conducting column, and the heat on the plate with poor heat-conducting effect is conveniently transferred to the outer side, so that the heat on the plate is conveniently radiated, and the heat-radiating effect is improved;
2. and the upper surface of the plate body of the heat dissipation plate is provided with a plurality of groups of heat dissipation bulges in a hemispherical shape, so that the heat dissipation area of the heat dissipation plate is effectively increased through the heat dissipation bulges, and the integral heat dissipation effect of the structure is further improved.
Drawings
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is a view of the underside of the thermally conductive plate of the present invention;
FIG. 3 is a half sectional view of the heat sink assembly of the present invention;
FIG. 4 is an enlarged view of the structure at A in FIG. 3;
FIG. 5 is a half-sectional view of a circuit board of the present invention;
fig. 6 is an enlarged view of the structure at B in fig. 5.
In the figure: the heat-conducting plate comprises a heat-conducting plate 1, a heat-radiating component 2, a heat-conducting plate 3, a mounting pipe 4, a heat-radiating plate 5, a heat-conducting column 6, a first mounting hole 7, a mounting groove 8, a through hole 9, a second mounting hole 10, a third mounting hole 11, a heat-radiating bulge 12, an upper substrate 13, a lower substrate 14, a fourth mounting hole 15, a first pin hole 16 and a second pin hole 17.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1-6, the present invention provides a technical solution: a heat dissipation structure, the heat dissipation structure comprising:
the heat conduction plate comprises a heat conduction plate 1, wherein the heat conduction plate 1 is a rectangular flat plate, the edge of the heat conduction plate 1 is provided with a first mounting hole 7, the lower surface of the heat conduction plate 1 is provided with a mounting groove 8, and the bottom of the mounting groove 8 is provided with a through hole 9;
The heat transfer plate 3, the mounting pipe 4, the heat dissipation plate 5 and the heat conduction column 6 are integrally formed, the heat conduction plate 1 and the heat dissipation assembly 2 are both formed by casting heat conduction metal, and the heat dissipation structure formed by combining the heat conduction plate 1 and the heat dissipation assembly 2 is arranged, so that heat is transferred to the heat dissipation plate 5 through the heat conduction plate 1, the heat transfer plate 3, the mounting pipe 4 and the heat conduction column 6, heat on a plate with poor heat conduction effect is conveniently transferred to the outer side, and heat on the plate is conveniently dissipated;
the size of the outer contour of the heat transfer plate 3 is matched with that of the outer contour of the heat dissipation plate 5, the first mounting hole 7, the second mounting hole 10 and the third mounting hole 11 are correspondingly arranged, and the sizes of the first mounting hole 7, the second mounting hole 10 and the third mounting hole 11 are matched;
the installation pipe 4 is arranged corresponding to the second installation hole 10, and the inner diameter value of the installation pipe 4 is matched with the aperture value of the second installation hole 10;
the upper surface of the heat dissipation plate 5 is provided with heat dissipation bulges 12, the heat dissipation bulges 12 are of a hemispherical structure, a plurality of groups of heat dissipation bulges 12 are uniformly arranged on the surface of the heat dissipation plate 5, and a plurality of groups of heat dissipation bulges 12 in the hemispherical shape are arranged on the upper surface of the plate body of the heat dissipation plate 5, so that the heat dissipation area of the heat dissipation plate 5 is effectively increased through the heat dissipation bulges 12, and the integral heat dissipation effect of the structure is further improved;
the circuit board used by the LED lamp is provided with the heat dissipation structure and comprises an upper substrate 13, a lower substrate 14 and the heat dissipation structure, wherein the upper substrate 13 is fixedly glued on the upper surface of the heat conduction plate 1, the lower substrate 14 is fixedly glued in the mounting groove 8 of the heat conduction plate 1, the upper substrate 13 is provided with a first pin hole 16, the lower substrate 14 is provided with a second pin hole 17, the lower surface of the lower substrate 14 is printed with a printed line, the upper substrate 13 is provided with a fourth mounting hole 15, the fourth mounting hole 15 is arranged corresponding to the first mounting hole 7, and the sizes of the fourth mounting hole 15 and the first mounting hole 7 are matched;
the size of the upper substrate 13 is matched with that of the heat-conducting plate 1, the size of the lower substrate 14 is matched with that of the mounting groove 8, the size of the first pin hole 16 is matched, and the first pin hole 16 and the second pin hole 17 are arranged corresponding to the through hole 9;
the diameter value of the through hole 9 is smaller than the diameter values of the first pin hole 16 and the second pin hole 17;
insulating coatings are arranged on the inner side walls of the first pin hole 16, the second pin hole 17 and the through hole 9, so that the heat conducting plate 1 is prevented from contacting pins of components on the circuit board;
the working principle is as follows: by arranging the heat dissipation structure formed by combining the heat conduction plate 1 and the heat dissipation component 2, heat is transferred to the heat dissipation plate 5 through the heat conduction plate 1, the heat conduction plate 3, the installation pipe 4 and the heat conduction column 6, thereby facilitating the heat on the board with poor heat conduction effect to be transferred to the outside, facilitating the heat dissipation on the board, when the circuit board works to generate heat in actual use, the heat is conducted to the heat transfer plate 3 through the heat conduction plate 1, and is diffused to the installation tube 4, the heat conduction column 6 and the heat dissipation plate 5 through the heat transfer plate 3, and the heat is dissipated to the outside through the installation tube 4, the heat conduction column 6 and the heat dissipation plate 5, thereby achieving the purpose of heat dissipation, and a plurality of groups of hemispherical heat dissipation bulges 12 are arranged on the upper surface of the plate body of the heat dissipation plate 5, thereby effectively increasing the heat dissipation area of the heat dissipation plate 5 by the heat dissipation protrusions 12, and further improving the overall heat dissipation effect of the structure.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.
Claims (9)
1. A heat radiation structure is characterized in that: the heat dissipation structure includes:
the heat conduction plate (1) is a rectangular flat plate, a first mounting hole (7) is formed in the edge of the heat conduction plate (1), a mounting groove (8) is formed in the lower surface of the heat conduction plate (1), and a through hole (9) is formed in the bottom of the mounting groove (8);
radiating component (2), radiating component (2) comprises heat transfer plate (3), installation pipe (4), heating panel (5), heat conduction post (6) combination, connect through installation pipe (4), heat conduction post (6) between heat transfer plate (3) and heating panel (5), heat transfer plate (3) are the rectangle frame structure, and heat transfer plate (3) and the downside of heat-conducting plate (1) laminating setting mutually, and seted up second mounting hole (10) on heat transfer plate (3), third mounting hole (11) have been seted up on heating panel (5).
2. A heat dissipating structure according to claim 1, wherein: the heat transfer plate (3), the mounting pipe (4), the heat dissipation plate (5) and the heat conduction column (6) are integrally formed, and the heat transfer plate (1) and the heat dissipation assembly (2) are both made of heat conduction metal through casting.
3. A heat dissipating structure according to claim 1, wherein: the outer contour size of the heat transfer plate (3) is matched with that of the heat dissipation plate (5), the first mounting hole (7), the second mounting hole (10) and the third mounting hole (11) are correspondingly arranged, and the first mounting hole (7), the second mounting hole (10) and the third mounting hole (11) are matched in size.
4. A heat dissipating structure according to claim 3, wherein: the installation pipe (4) and the second installation hole (10) are arranged correspondingly, and the inner diameter value of the installation pipe (4) is matched with the aperture value of the second installation hole (10).
5. The heat dissipating structure of claim 4, wherein: the upper surface of heating panel (5) is provided with heat dissipation arch (12), heat dissipation arch (12) are half spherical structure, and heat dissipation arch (12) evenly are provided with the multiunit on the surface of heating panel (5).
6. The utility model provides a circuit board that LED lamp used which characterized in that: the circuit board used by the LED lamp is provided with the heat dissipation structure of any one of the claims 1 to 5, and comprises an upper substrate (13), a lower substrate (14) and the heat dissipation structure, wherein the upper substrate (13) is fixedly glued on the upper surface of the heat conduction plate (1), the lower substrate (14) is fixedly glued in the mounting groove (8) of the heat conduction plate (1), the upper substrate (13) is provided with a first pin hole (16), the lower substrate (14) is provided with a second pin hole (17), the lower surface of the lower substrate (14) is printed with a printed wire, the upper substrate (13) is provided with a fourth mounting hole (15), and the fourth mounting hole (15) is correspondingly arranged with the first mounting hole (7) and is matched with the first mounting hole in size.
7. The circuit board for the LED lamp according to claim 6, wherein: the size of the upper substrate (13) is matched with that of the heat conducting plate (1), the size of the lower substrate (14) is matched with that of the mounting groove (8), the size of the first pin hole (16) is matched, and the first pin hole (16) and the second pin hole (17) are arranged correspondingly to the through hole (9).
8. The circuit board for the LED lamp according to claim 7, wherein: the diameter value of the through hole (9) is smaller than the diameter values of the first pin hole (16) and the second pin hole (17).
9. The circuit board for an LED lamp according to claim 8, wherein: and insulating coatings are arranged on the inner side walls of the first pin hole (16), the second pin hole (17) and the through hole (9).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220172392.XU CN216744266U (en) | 2022-01-22 | 2022-01-22 | Heat radiation structure and circuit board used by LED lamp |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220172392.XU CN216744266U (en) | 2022-01-22 | 2022-01-22 | Heat radiation structure and circuit board used by LED lamp |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216744266U true CN216744266U (en) | 2022-06-14 |
Family
ID=81915331
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202220172392.XU Active CN216744266U (en) | 2022-01-22 | 2022-01-22 | Heat radiation structure and circuit board used by LED lamp |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216744266U (en) |
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2022
- 2022-01-22 CN CN202220172392.XU patent/CN216744266U/en active Active
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