CN219778884U

CN219778884U - MOS pipe radiator

Info

Publication number: CN219778884U
Application number: CN202321257254.2U
Authority: CN
Inventors: 刘志斌
Original assignee: Tianjin Novartis Optoelectronic Technology Co ltd
Current assignee: Tianjin Novartis Optoelectronic Technology Co ltd
Priority date: 2023-05-23
Filing date: 2023-05-23
Publication date: 2023-09-29
Anticipated expiration: 2033-05-23

Abstract

The utility model relates to the technical field of high-power supplies and discloses a MOS tube radiator. The MOS tube radiator comprises an upper heat sink, wherein the lower surface of the upper heat sink is provided with an MOS tube embedded groove, the upper surface of the upper heat sink is provided with an MOS tube pin outlet, and the MOS tube pin outlet is communicated with the MOS tube embedded groove. When the device is used, the MOS tube is embedded from the bottom, the pins of the MOS tube extend out from the pin outlets of the MOS tube, and then the MOS tube is welded with the PCB. The MOS tube radiator provided by the utility model fully utilizes the space between the PCB and the bottom surface of the MOS tube, and reduces the installation volume of the MOS tube compared with the installation of the MOS tube on the surface of the radiator.

Description

MOS pipe radiator

Technical Field

The utility model relates to the technical field of high-power supplies, in particular to a MOS tube radiator.

Background

With the rapid development of industry, the application range of high-power supplies is becoming wider and wider. The high-power supply is not separated from the use of an MOS (metal-oxide-semiconductor field effect transistor), and when the MOS is installed, a heat sink for heat dissipation is usually needed to be matched so as to prevent the MOS from being burnt due to the excessively high temperature of the MOS when the power supply works. In the prior art, the design of direct contact connection of three layers of a heat sink, an MOS tube and a PCB is generally adopted, pins of the MOS tube are welded with holes on the PCB, and then the MOS tube is fixed on the heat sink by using screws, as shown in fig. 1. According to the assembly mode, no matter whether the pins of the MOS tube are bent or not, a certain distance is reserved between the MOS tube and the PCB, so that the power supply is large in size, and the requirement of modern industry on power supply miniaturization is hardly met.

Disclosure of Invention

Based on the above, the utility model aims to provide the MOS tube radiator, which can reduce the installation volume of the MOS tube.

In order to achieve the above purpose, the utility model adopts the following technical scheme:

a MOS transistor heat sink comprising: the MOS tube embedded groove is formed in the lower surface of the upper heat sink, an MOS tube pin outlet is formed in the upper surface of the upper heat sink, and the MOS tube pin outlet is communicated with the MOS tube embedded groove.

As an alternative scheme of the MOS tube radiator, an MOS tube mounting hole is formed in the upper surface of the upper heat sink, and the MOS tube mounting hole is a threaded hole and is communicated with the MOS tube embedding groove.

As an alternative scheme of the MOS tube radiator, the MOS tube radiator further comprises a lower heat sink, wherein the upper surface of the lower heat sink is abutted with the lower surface of the upper heat sink, and a heat dissipation supporting table is arranged on the upper surface of the lower heat sink and is configured to be abutted with the upper surface of the MOS tube so as to perform direct heat exchange.

As an alternative scheme of the MOS tube radiator, the upper surface of the radiating support table is provided with a screw cap avoiding groove.

As an alternative to the MOS tube radiator, the lower heat sink further includes a plurality of heat dissipating teeth.

As an alternative scheme of the MOS tube radiator, the heat dissipation teeth and the lower heat sink are of a split structure and can be selectively connected.

The beneficial effects of the utility model are as follows:

the utility model provides a MOS tube radiator, which comprises an upper heat sink, wherein the lower surface of the upper heat sink is provided with a MOS tube embedded groove, the upper surface of the upper heat sink is provided with a MOS tube pin outlet, and the MOS tube pin outlet is communicated with the MOS tube embedded groove. When in use, the MOS tube is embedded from the bottom of the upper heat sink, and the pins of the MOS tube extend out from the pin outlets of the MOS tube and are welded with the PCB. The MOS tube radiator fully utilizes the distance between the PCB and the bottom surface of the MOS tube, and reduces the installation volume of the MOS tube compared with the installation of the MOS tube on the surface of the radiator.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the following description will briefly explain the drawings needed in the description of the embodiments of the present utility model, and it is obvious that the drawings in the following description are only some embodiments of the present utility model, and other drawings may be obtained according to the contents of the embodiments of the present utility model and these drawings without inventive effort for those skilled in the art.

FIG. 1 is a diagram of the connection relationship between a heat sink, a MOS tube and a PCB in the prior art;

fig. 2 is a cross-sectional view of a MOS transistor radiator according to an embodiment of the present utility model;

fig. 3 is an assembly exploded view of a MOS tube radiator according to an embodiment of the present utility model.

In the figure:

a PCB;2-MOS tube; 3-a heat sink; 4-an additional heat sink;

an upper heat sink; 101-MOS tube embedded groove; 102-an outlet of a MOS tube pin; 103-MOS tube mounting holes; 104-upper heat sink connection holes;

200-a lower heat sink; 201-a heat dissipation supporting table; 202-a screw cap avoiding groove; 203-heat dissipation teeth; 204-lower heatsink attachment holes.

Description of the embodiments

In order to make the technical problems solved by the present utility model, the technical solutions adopted and the technical effects achieved more clear, the technical solutions of the embodiments of the present utility model will be described in further detail below with reference to the accompanying drawings, and it is obvious that the described embodiments are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

As shown in fig. 1, in the prior art, the MOS tube 2 is typically soldered to the PCB1 and then connected to the heat sink 3 by screws, and this assembly method results in a gap between the PCB1 and the heat sink 3. When the power level of the MOS transistor 2 is high, the additional radiator 4 needs to be installed to increase the heat dissipation efficiency. Along with the high-speed development of industry, the requirements of modern industry on power supply miniaturization are higher and higher, therefore, the utility model provides the MOS tube radiator, and the MOS tube 2 is embedded into the radiator through the change of the radiator structure, so that the installation volume of the MOS tube 2 is reduced, and the gap between the PCB1 and the heat sink 3 is eliminated.

As shown in fig. 2, the embodiment provides a MOS tube radiator, which includes an upper heat sink 100, a MOS tube embedded groove 101 is provided on the lower surface of the upper heat sink 100, a MOS tube pin outlet 102 is provided on the upper surface of the upper heat sink 100, and the MOS tube pin outlet 102 is communicated with the MOS tube embedded groove 101. When in use, the MOS tube 2 is embedded from the bottom of the upper heat sink 100, pins of the MOS tube 2 extend out of the MOS tube pin outlets 102, and then the pins of the MOS tube 2 are welded with the PCB 1. The MOS tube radiator fully utilizes the distance between the PCB1 and the bottom surface of the MOS tube 2, and compared with the prior art that the MOS tube 2 is installed on the surface of the radiator, the installation volume of the MOS tube 2 is reduced.

In this embodiment, in order to ensure the heat dissipation condition of the MOS tube 2, the upper surface of the upper heat sink 100 is provided with a MOS tube mounting hole 103, and the MOS tube mounting hole 103 is a threaded hole and is communicated with the MOS tube embedding groove 101. With continued reference to fig. 2, during use, the bottom surface of the MOS tube 2 may be abutted to the inner wall of the MOS tube embedding groove 101 by using the MOS tube mounting hole 103, so that the MOS tube 2 and the upper heat sink 100 directly perform heat exchange, thereby improving heat dissipation efficiency. Preferably, a heat conducting gasket or heat conducting silicone grease is arranged between the bottom surface of the MOS tube 2 and the inner wall of the MOS tube embedded groove 101, so that the heat dissipation efficiency is further improved. In addition, the bottom surface of the MOS tube 2 can be connected with the inner wall of the MOS tube embedded groove 101 in an insulating manner by the heat conducting gasket or the heat conducting silicone grease.

As a preferred technical solution, the MOS tube radiator further includes a lower heat sink 200, and an upper surface of the lower heat sink 200 is abutted with a lower surface of the upper heat sink 100 and can be fastened by screws. The upper surface of the lower heat sink 200 is provided with a heat dissipation supporting table 201, and the heat dissipation supporting table 201 is abutted with the upper surface of the MOS tube 2, so that the direct heat exchange area is increased, and the heat dissipation efficiency is improved. Similarly to the above-described embodiment, in order to improve the heat dissipation efficiency, a heat-conductive spacer or a heat-conductive silicone grease may be further provided between the heat dissipation support table 201 and the upper surface of the MOS tube 2 and at the abutment of the upper heat sink 100 and the lower heat sink 200 to fill the gaps between the solid connections.

Further preferably, in order to prevent interference abutment of the screw cap when the heat dissipation support stand 201 abuts against the upper surface of the MOS tube 2, the upper surface of the heat dissipation support stand 201 is provided with a screw cap avoiding groove 202.

As a preferred solution, as shown in fig. 3, when the power level of the MOS transistor 2 is high, the lower heat sink 200 further includes a plurality of heat dissipating teeth 203 to improve the heat dissipating capability. Further preferably, the heat dissipation teeth 203 and the lower heat sink 200 are of a split structure, and can be selectively connected. Specifically, in this embodiment, the top of the heat dissipation teeth 203 is provided with a connection platform, and the connection platform is provided with a threaded hole. The long screws sequentially pass through the upper heat sink connecting holes 104 and the lower heat sink connecting holes 204 and are connected with the threaded holes on the heat dissipation teeth 203 in a threaded manner, so that the assembly is completed.

Note that the above is only a preferred embodiment of the present utility model and the technical principle applied. It will be understood by those skilled in the art that the present utility model is not limited to the particular embodiments described herein, but is capable of various obvious changes, rearrangements and substitutions as will now become apparent to those skilled in the art without departing from the scope of the utility model. Therefore, while the utility model has been described in connection with the above embodiments, the utility model is not limited to the embodiments, but may be embodied in many other equivalent forms without departing from the spirit or scope of the utility model, which is set forth in the following claims.

In the description of the present utility model, it should be noted that the directions or positional relationships indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. are based on the directions or positional relationships shown in the drawings, are merely for convenience of describing the present utility model and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present utility model. Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying relative importance. Wherein the terms "first position" and "second position" are two different positions.

In the description of the present utility model, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present utility model will be understood in specific cases by those of ordinary skill in the art.

Claims

1. A MOS transistor radiator, comprising: the upper heat sink (100), the lower surface of upper heat sink (100) is equipped with MOS pipe embedded groove (101), the upper surface of upper heat sink (100) is equipped with MOS pipe pin export (102), MOS pipe pin export (102) with MOS pipe embedded groove (101) intercommunication.

2. The MOS tube radiator of claim 1, wherein a MOS tube mounting hole (103) is provided on an upper surface of the upper heat sink (100), and the MOS tube mounting hole (103) is a threaded hole and is communicated with the MOS tube embedding groove (101).

3. The MOS transistor radiator as claimed in claim 1, further comprising a lower heat sink (200), an upper surface of the lower heat sink (200) being in abutment with a lower surface of the upper heat sink (100), an upper surface of the lower heat sink (200) being provided with a heat dissipation support table (201), the heat dissipation support table (201) being configured to be in abutment with an upper surface of the MOS transistor for direct heat exchange.

4. A MOS transistor radiator as claimed in claim 3, characterized in that the upper surface of the heat radiation support table (201) is provided with screw cap avoiding grooves (202).

5. A MOS transistor radiator according to claim 3, characterized in that the lower heat sink (200) further comprises a plurality of heat radiating teeth (203).

6. The MOS transistor radiator of claim 5, wherein the radiating teeth (203) and the lower heat sink (200) are of a split type structure, and are selectively connectable.