CN202276548U - Electrical connection component - Google Patents
Electrical connection component Download PDFInfo
- Publication number
- CN202276548U CN202276548U CN2011203664364U CN201120366436U CN202276548U CN 202276548 U CN202276548 U CN 202276548U CN 2011203664364 U CN2011203664364 U CN 2011203664364U CN 201120366436 U CN201120366436 U CN 201120366436U CN 202276548 U CN202276548 U CN 202276548U
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- Prior art keywords
- circuit board
- electrical connection
- substrate
- wafer
- hole
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- Expired - Lifetime
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Abstract
The utility model relates to an electrical connection component which comprises a circuit board and a processor, wherein the circuit board is provided with an electronic component mounting surface and a machine shell mounting surface which are opposite and is also provided with a through hole penetrating through the electronic component mounting surface and the machine shell mounting surface; the processor comprises a wafer and a substrate, wherein the wafer is electrically connected with the substrate and is positioned in the through hole of the circuit board, and the substrate is electrically connected with the machine shell mounting surface of the circuit board. The electrical connection component has the beneficial effects that the heights occupied by the wafer and the circuit board are partially superposed at least, so that the height of the entire electrical connection component only needs to consider the height of the circuit board, the height of the substrate and the height of a connecting part between the substrate and the circuit board; and compared with a manner of directly welding the processor on the circuit board, the height of the wafer can be negligible, so that the entire height of the electrical connection component is further reduced, and further, the demands of ultra-thin development of a notebook computer can be satisfied.
Description
[technical field]
The utility model relates to a kind of electrical connection module, refers to the electrical connection module of a kind of processor and circuit board especially.
[background technology]
At present, the electric connection of processor and circuit board generally realizes through electric connector.As shown in Figure 1; Said electric connector 1 comprises an insulating body 11 and a plurality of terminals 12 that are located in the said insulating body 11; Each said terminal 12 has a contact site 121 and stretches out said insulating body 11 upper surfaces and electrically contact with the contact 20 of a processor 2 lower surfaces; And weld part 122 weld pad 30 welding of extending said insulating body 11 lower surfaces and a circuit board 3 upper surfaces, be bridge with said terminal 12, said processor 2 is realized electrically connecting with said circuit board 3.This electrical connection module whole height not only comprises the height of said processor 2 itself, the height of said circuit board 3, the height of welding portion; And need the height of said electric connector 1 is included in it; Thereby the whole height of this electrical connection module is bigger, can't satisfy the for example development trend of compactization of notebook computer court of electronic product.
For reducing the processor whole height, industry a kind of new electrical connection module occurs to reduce processor connection circuit slab integral height.As shown in Figure 2, this electrical connection module directly saves electric connector, and the contact 40 of processor 4 lower surfaces and the weld pad 50 of circuit board 5 upper surfaces are directly welded through scolder, realizes the purpose of the two electric connection.Though can abandoning the height of electric connector, this electrical connection module disregards; But its whole height equals processor 4 height own adds the height of circuit board 5, the height of welding portion, and this whole height still can't satisfy the demand of notebook computer toward ultra-thinization development to a certain extent.
Therefore, it is thinner with the integral body that realizes processor and circuit board to be necessary to design a kind of new electrical connection module.
[utility model content]
The purpose of the utility model is to provide the thinner processor of a kind of integral body and the electrical connection module of circuit board.
For realizing above-mentioned purpose, the utility model adopts following technical scheme:
A kind of electrical connection module comprises: a circuit board, have a relative electronic component installed surface and a casing installed surface, and said circuit board is provided with a through hole and runs through said electronic component installed surface and said casing installed surface; One processor comprises a wafer and a substrate, and said wafer is electrically connected to said substrate, and said substrate and said casing installed surface electrically connect, and said wafer is positioned at said through hole.
As the further improvement of such scheme, the said face of connecting is provided with a plurality of contacts site in said wafer periphery, and said contact site and said casing installed surface electrically connect.
Further, said contact is many row's arrangements.
Further, the said contact of adjacent rows is not all at same row.
Further, said wafer gets between the wall of part and said through hole in the said through hole and is formed with a gap.
As the further improvement of such scheme, said wafer has an end face and a bottom surface that is oppositely arranged, and said bottom surface and said substrate electrically connect, and said end face is positioned at said through hole and is no more than said electronic component installed surface.
Further, said circuit board is provided with a heat dissipation element, and said heat dissipation element partly gets into said through hole and contacts with said processor.
Further, said heat dissipation element has a heat-conducting part, and the size of said heat-conducting part is less than the size of said through hole.
Further, said heat-conducting part gets into said through hole from said electronic component installed surface and contacts with said processor.
Further improvement as such scheme; Said circuit board is arranged with a groove from said casing installed surface towards said electronic component installed surface; Said groove and said through hole lateral communication, said substrate part at least get into said groove and electrically connect with said circuit board.
Compared with prior art; The utility model is owing to offer said through hole on said circuit board; And said wafer is positioned at the said through hole of said circuit board; Thereby said wafer and the shared height of said circuit board partially overlap at least, thereby the height of whole electrical connection module only need be considered the height of said circuit board, the height of said substrate, and the height of coupling part between said substrate and the said circuit board; Compare the height that to disregard said wafer with the mode that directly said processor is welded on the said circuit board; Further reduced the whole height of said electrical connection module, can satisfy the demand of notebook computer, because the said casing installed surface of said substrate and said circuit board electrically connects toward ultra-thinization development; Make the said substrate portion of said processor or all in the gap between said casing installed surface and chassis sidewall; Make full use of this gap and hold substrate, all can reach and reduce the place and state reason device and said circuit board purpose, and realize the electric connection of processor and circuit board with respect to the casing whole height.
[description of drawings]
Fig. 1 is the sketch map that processor is electrically connected with circuit board in first kind of prior art;
Fig. 2 is the sketch map that processor is electrically connected with circuit board in second kind of prior art;
Fig. 3 is the stereogram after the utility model first embodiment decomposes;
Fig. 4 is the cutaway view after the utility model first embodiment decomposes;
Fig. 5 is the cutaway view after the utility model first embodiment combination;
Fig. 6 is the cutaway view after the utility model first embodiment adds metal-back;
Fig. 7 is the cutaway view of the utility model second embodiment;
Fig. 8 is the cutaway view of the utility model the 3rd embodiment;
Fig. 9 is the stereogram after the utility model the 4th embodiment decomposes.
The drawing reference numeral explanation of background technology:
Electric connector 1 insulating body 11 terminals 12
Contact site 121 weld parts 122 processors 2
Contact 20 circuit boards, 3 weld pads 30
Processor 4 contacts 40 circuit boards 5
Circuit board 50
The drawing reference numeral explanation of embodiment:
Metal-back 82 grooves 9 diapires 90
[embodiment]
Purpose, structure, characteristic and effect etc. for ease of better understanding the utility model combine accompanying drawing and embodiment that the utility model is described further at present.
Like Fig. 3, the processor 7 that the utility model electrical connection module comprises a circuit board 6, electrically connects with said circuit board 6, and be installed on the said circuit board 6 and a heat dissipation element 8 that contacts with said processor 7.
With reference to Fig. 3 to Fig. 5, be first embodiment of the utility model electrical connection module.Said circuit board 6 is a common used motherboard in the computer, and it has relative upper surface and lower surface, and wherein said upper surface is used to install electronic equipments such as radiator, electric capacity, resistance, is electronic component installed surface 61; Said lower surface then is used to be mounted on the computer chassis and is adjacent with said computer chassis (being generally metal shell) sidewall, is casing installed surface 62.Usually; Motherboard generally is locked on the computer chassis through screw etc.; But add for plug-in mounting DIP type electronic component on the said electronic component installed surface 61 that can make said circuit board 1 etc., can have a fixed gap between the said casing installed surface 62 of said circuit board 1 and casing (not shown) sidewall.In the present embodiment, the said electronic component installed surface 61 of said circuit board 6 is provided with an electronic component 63.Said casing installed surface 62 is provided with a plurality of weld pads 620, in order to electrically connect with said processor 7.
Said circuit board 6 also is provided with a through hole 64 and runs through said electronic component installed surface 61 and said casing installed surface 62.
Like Fig. 4 and shown in Figure 5, said processor 7 comprises that a plurality of wafers 70 are positioned at said through hole 64, and a wafer 70 only schematically draws in the Figure of description of the utility model.Be convenient heat radiation and assembling, the size of said wafer 70 is less than the size of said through hole 64, thereby said wafer 70 gets between the wall of part and said through hole 64 in the said through hole 64 and is formed with a gap.Said wafer 70 has an end face 701 and a bottom surface that is oppositely arranged.The said end face 701 of said wafer 70 is positioned at said through hole 64 and is lower than said electronic component installed surface 61, and in other embodiments, said end face 701 also can be concordant with said electronic component installed surface 61, do not detail here.
Further; Said processor 7 also comprises a substrate 71; Said substrate 71 have one connect face 711 and said wafer 70 said bottom surface electrically connect; Said connecting also is provided with the periphery that a plurality of contacts 7110 are positioned at said wafer 70 on the face 711, the said weld pad 620 on said contact 7110 and the said circuit board 6 is through the scolder welding.
As preferred embodiment, said electronic component installed surface 61 also is equipped with said heat dissipation element 8.Said heat dissipation element 8 covers in said through hole 64 tops, and part gets into said through hole 64.In the present embodiment; Said heat dissipation element 8 has a heat-conducting part 81; The size of said heat-conducting part 81 is less than the size of said through hole 64; Be provided with for example heat-conducting silicone grease of conduction material between the said end face 701 of the lower surface of said heat-conducting part 81 and said wafer 70, extend upward a plurality of fin 811 that are provided with dispersed arrangement from said heat-conducting part 81.
Alternatively; Said heat dissipation element 8 comprises that also a metal-back 82 is located at the said of said substrate 71 and connects on the face 711, and as shown in Figure 6, said metal-back 82 covers said wafer 70; The upper surface of said metal-back 82 is no more than said electronic component installed surface 61; And and be filled with heat-conducting silicone grease between the lower surface of said heat-conducting part 81, in this way, said metal-back 82 provides heat radiation support in said processor 7 runnings; Can the heat that said wafer 70 produces be conducted to said junction 81 through heat-conducting silicone grease when working, and distribute through said fin 811.
With reference to Fig. 7; As second embodiment of the utility model, its structure and first embodiment are roughly the same, and different is; Said circuit board 6 is arranged with a groove 9 from said casing installed surface 62 towards said electronic component installed surface 61; Said groove 9 and said through hole 64 lateral communications, the two forms one stepped jointly, and said substrate 71 gets into said grooves 9 and electrically connects with said circuit board 6.In the present embodiment, it is relative with said electronic component installed surface 61 to have a diapire 90 in the said groove 9, and said diapire 90 is provided with a plurality of weld pads 91.Said substrate 71 parts get in the said groove 9, and the said said contact 7110 that connects on the face 711 is realized electrically connecting through the scolder welding with said weld pad 91.In the present embodiment; Said substrate 71 partially overlaps with said circuit board 6 shared height at least; The height of whole electrical connection module only need be considered the height of said circuit board 6 and the height of the said substrate 71 of part; When said substrate 71 gets into said groove 9 fully, when the lower surface of promptly said substrate 71 is no more than said casing installed surface 62 downwards, even can disregard the height of said substrate 71; Can further reduce the whole height of said processor 7 and said circuit board 6, realize ultra-thinization truly.
In addition; When not having the gap when fitting tightly between said casing installed surface 62 and the computer chassis, said substrate 71 all gets into said groove 9, and the bottom surface of said substrate 71 is roughly concordant with said casing installed surface 62; And can select heat conductivility material preferably for use when making said substrate 71; Bottom surface with said substrate 71 during assembling directly contacts with computer chassis, utilizes computer chassis to realize heat radiation, can be omitted in said electronic component installed surface 61 said heat dissipation element 8 is installed.Because said processor 7 all sinks in the said through hole 64 of said circuit board 6, and need not extra heat dissipation element 8, whole electrical connection module only takies the height of said circuit board 6, can satisfy the thinner demand of notebook computer.
In slim notebook computer, two installed surfaces of said circuit board 6 are all coated by computer chassis, and therefore the computer chassis that is positioned at said electronic component installed surface 62 tops capable of using dispels the heat; Shown in the 3rd embodiment among Fig. 8, its structure and first embodiment are roughly the same, and different is; In the present embodiment, said heat dissipation element 8 does not comprise other element, only has a heat-conducting part 81; And the size of said heat-conducting part 81 is less than the size of said through hole 64; Said heat-conducting part 81 gets into said through hole 64, and its bottom surface contacts with said metal-back 82, and its end face then protrudes out said through hole 64 and contacts with computer chassis.Utilize this structure, the heat that said heat-conducting part 81 produces said processor 7 in the course of the work directly passes to computer chassis and is distributed to the outside, when reducing some coupling assembling height, realizes good heat sinking function.
With reference to Fig. 9; Four embodiment for the utility model; The present embodiment structure and the first embodiment difference are: said substrate 71 is provided with the said contact 7110 of many rows; And the said contact 7110 of adjacent two rows is arranged in the said interleaved that connects on the face 711, and promptly adjacent two rows' said contact 7110 is not all at same row.So be provided with; Can make full use of the said limited area that connects face 711 to lay more said contact 7110; Simultaneously can draw back the spacing between the adjacent two said contacts 7110, thereby when welding, can prevent because scolder spreads and short circuit toward adjacent contacts 7110 at said contact 7110 and said weld pad 620.
Compared with prior art, the utlity model has following beneficial effect:
1. because said wafer 70 is positioned at the said through hole 64 of said circuit board 6; Thereby said wafer 70 partially overlaps with said circuit board 6 shared height at least; Thereby the height of whole electrical connection module only need be considered the height of said circuit board 6, the height of said substrate 71; And be connected height partly between said substrate 71 and the said circuit board 6; Compare the height that to disregard said wafer 70 with the mode that directly said processor 7 is welded on the said circuit board 6, further reduced the whole height of said electrical connection module, can satisfy the demand of notebook computer toward ultra-thinization development.
2. because said casing installed surface 62 electric connections of said substrate 71 and said circuit board 6; Make the said substrate 71 of said processor 7 partly or entirely in the gaps between said casing installed surface 62 and chassis sidewall; Make full use of this gap and hold said substrate 71; All can reach and reduce said processor 7 and the purpose of said circuit board 6, and realize the electric connection of processor 7 and circuit board 6 with respect to the casing whole height.
3. owing to getting into said through hole 64, said heat dissipation element 8 parts contact with said processor 7; Thereby can reduce said heat dissipation element 8 with respect to the casing whole height, can guarantee good heat radiating function when realizing ultra-thinization of said electrical connection module to said processor 7.
4. because the said casing installed surface 62 of said circuit board 6 is concaved with said groove 9; Said groove 9 and said through hole 64 lateral communications; Said substrate 71 part at least gets into said groove 9 and electrically connects with said circuit board 6; Thereby said substrate 71 partially overlaps with said circuit board 6 shared height at least; The height of whole electrical connection module only need be considered the height of the said substrate 71 of height, part of said circuit board 6, and is connected height partly between said substrate 71 and the said circuit board 6, can further reduce the whole height of said processor 7 and said circuit board 6.
More than specify the explanation of the preferred embodiment that is merely the utility model; Non-thus the limitation the utility model claim; So the equivalence techniques that all this creation of utilization specifications and diagramatic content are done changes, and all is contained in the claim of the utility model.
Claims (10)
1. an electrical connection module is characterized in that, comprising:
One circuit board has a relative electronic component installed surface and a casing installed surface, and said circuit board is provided with a through hole and runs through said electronic component installed surface and said casing installed surface;
One processor comprises a wafer and a substrate, and said wafer is electrically connected to said substrate, and said substrate and said casing installed surface electrically connect, and said wafer is positioned at said through hole.
2. electrical connection module as claimed in claim 1; It is characterized in that: said substrate has one and connects face and the electric connection of said wafer; The said face of connecting is provided with a plurality of contacts and is positioned at said wafer periphery, and said contact and said casing installed surface electrically connect.
3. electrical connection module as claimed in claim 2 is characterized in that: said contact is many rows and arranges.
4. electrical connection module as claimed in claim 3 is characterized in that: the said contact of adjacent rows is not all at same row.
5. electrical connection module as claimed in claim 1 is characterized in that: said wafer gets between the wall of part and said through hole in the said through hole and is formed with a gap.
6. electrical connection module as claimed in claim 1 is characterized in that: said wafer has an end face and a bottom surface that is oppositely arranged, and said bottom surface and said substrate electrically connect, and said end face is positioned at said through hole and is no more than said electronic component installed surface.
7. electrical connection module as claimed in claim 1 is characterized in that: said circuit board is provided with a heat dissipation element, and said heat dissipation element partly gets into said through hole and contacts with said processor.
8. electrical connection module as claimed in claim 7 is characterized in that: said heat dissipation element has a heat-conducting part, and the size of said heat-conducting part is less than the size of said through hole.
9. electrical connection module as claimed in claim 8 is characterized in that: said heat-conducting part gets into said through hole from said electronic component installed surface and contacts with said processor.
10. electrical connection module as claimed in claim 1; It is characterized in that: said circuit board is arranged with a groove from said casing installed surface towards said electronic component installed surface; Said groove and said through hole lateral communication, said substrate part at least get into said groove and electrically connect with said circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011203664364U CN202276548U (en) | 2011-09-26 | 2011-09-26 | Electrical connection component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011203664364U CN202276548U (en) | 2011-09-26 | 2011-09-26 | Electrical connection component |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202276548U true CN202276548U (en) | 2012-06-13 |
Family
ID=46196877
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011203664364U Expired - Lifetime CN202276548U (en) | 2011-09-26 | 2011-09-26 | Electrical connection component |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202276548U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103635019A (en) * | 2012-08-28 | 2014-03-12 | 国基电子（上海）有限公司 | Circuit board mounting structure |
| CN115003025A (en) * | 2022-07-18 | 2022-09-02 | 之江实验室 | Detachable interconnection structure of on-chip system and PCB and manufacturing method |
| CN115087258A (en) * | 2021-03-12 | 2022-09-20 | 斯玛特电子公司 | Circuit protection device |
-
2011
- 2011-09-26 CN CN2011203664364U patent/CN202276548U/en not_active Expired - Lifetime
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103635019A (en) * | 2012-08-28 | 2014-03-12 | 国基电子（上海）有限公司 | Circuit board mounting structure |
| CN115087258A (en) * | 2021-03-12 | 2022-09-20 | 斯玛特电子公司 | Circuit protection device |
| CN115003025A (en) * | 2022-07-18 | 2022-09-02 | 之江实验室 | Detachable interconnection structure of on-chip system and PCB and manufacturing method |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20120613 |