CN102612302A - Optical module radiator and optical module communication equipment - Google Patents
Optical module radiator and optical module communication equipment Download PDFInfo
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- CN102612302A CN102612302A CN2012100647205A CN201210064720A CN102612302A CN 102612302 A CN102612302 A CN 102612302A CN 2012100647205 A CN2012100647205 A CN 2012100647205A CN 201210064720 A CN201210064720 A CN 201210064720A CN 102612302 A CN102612302 A CN 102612302A
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Abstract
The invention provides an optical module radiator and optical module communication equipment. The optical module radiator comprises an optical module, a connector housing, a radiator, a radiator fastener, a circuit board, structural components and thermal conduction components, wherein the optical module is disposed in the connector housing, the radiator is fixed onto the connector housing via the radiator fastener, the radiator is contacted with the upper surface of the optical module, the lower surface of the optical module is contacted with the bottom of the connector housing, and the thermal conduction components are contacted with the bottom of the connector housing and the structural components respectively. Radiating effect of the optical module is enhanced along with adding of radiating ways of the optical module. .
Description
Technical field
The present invention relates to the communication technology, relate in particular to a kind of optical module heat radiation device and communication equipment.
Background technology
Optical module plays an important role in the optical-fibre communications process, but in communication, can produce great amount of heat; In order to guarantee normally carrying out of optical communication, need the heat that optical module produces in time be distributed.
A kind of optical module heat radiation device of prior art comprises optical module, circuit board, structural member, radiator etc.; This device is provided with radiator at the top of optical module; Radiator is through the top of radiator snap fit at optical module; Make optical module contact, the heat that optical module produces is taken away through radiator with radiator.But above-mentioned heat sink conception heat dissipation capacity is limited, still can't satisfy the heat radiation requirement of optical module, influences normally carrying out of optical communication.
Summary of the invention
First aspect of the present invention provides a kind of optical module heat radiation device, to improve optical module heat radiating effect.
Another aspect of the present invention provides a kind of communication equipment, to improve the optical module heat radiating effect in this communication equipment.
Optical module heat radiation device provided by the invention comprises: optical module, connector shell, radiator, radiator buckle, circuit board, structural member; Said optical module is arranged in the said connector shell, and said radiator buckle is fixed on said radiator on the said connector shell, and said radiator contacts with the upper surface of said optical module; The lower surface of said optical module contacts with the bottom surface of said connector shell; Said optical module heat radiation device also comprises: conducting-heat elements; Said conducting-heat elements contacts with the bottom surface of said connector shell, said structural member respectively.
Communication equipment provided by the invention comprises: optical module heat radiation device of the present invention.
The technique effect of optical module heat radiation device of the present invention is: through making the lower surface of optical module contact with the bottom surface of connector shell; And a conducting-heat elements is set; Connect through bottom surface, the structural member of this conducting-heat elements, can the heat that optical module produces be passed to structural member through bottom surface, the conducting-heat elements of connector shell successively, dispel the heat with respect to of the prior art top at optical module with connector shell; Increase the heat radiation approach of optical module, improved optical module heat radiating effect.
The technique effect of communication equipment of the present invention is: through making the lower surface of optical module contact with the bottom surface of connector shell; And a conducting-heat elements is set; Connect through bottom surface, the structural member of this conducting-heat elements, can the heat that optical module produces be passed to structural member through bottom surface, the conducting-heat elements of connector shell successively, dispel the heat with respect to of the prior art top at optical module with connector shell; Increase the heat radiation approach of optical module, improved optical module heat radiating effect.
Description of drawings
Fig. 1 is the overall structure sketch map of optical module heat radiation device embodiment of the present invention;
Fig. 2 is the decomposing schematic representation of optical module heat radiation device embodiment of the present invention;
Fig. 3 is the generalized section of Fig. 1;
Fig. 4 is the decomposing schematic representation of Fig. 3;
Fig. 5 is the perspective view of optical module heat radiation device embodiment of the present invention;
Fig. 6 is a kind of heat-conducting medium structural representation of optical module heat radiation device embodiment of the present invention;
Fig. 7 is the schematic cross-section of Fig. 6;
Fig. 8 is the another kind of heat-conducting medium structural representation of optical module heat radiation device embodiment of the present invention;
Fig. 9 is the schematic perspective view of Fig. 8.
Embodiment
Main technical schemes of the present invention does, increased a heat radiation approach in the bottom of optical module, from the optical module lower surface heat conducted to structural member through conducting-heat elements, thereby improves optical module heat radiating effect.
Fig. 1 is the overall structure sketch map of optical module heat radiation device embodiment of the present invention, and Fig. 2 is the decomposing schematic representation of optical module heat radiation device embodiment of the present invention, and Fig. 3 is the generalized section of Fig. 1, and Fig. 4 is the decomposing schematic representation of Fig. 3.
In conjunction with Fig. 1-shown in Figure 4, the optical module heat radiation device of present embodiment comprises: optical module 11, connector shell 12, radiator 13, radiator buckle 14, circuit board 15, structural member 16 can also comprise connector body 17.Wherein, optical module 11 is the parts that are used to realize the photosignal conversion.Connector shell 12 is to be used for fixing optical module 11, realization electromagnetic shielding, and the auxiliary parts that optical module 11 is connected with circuit board 15; This connector shell 12 is hollow cavity structures, and it comprises sidewall, bottom surface, end face and the cavity that is enclosed, and optical module 11 is to insert its cavity from the porch of connector shell 12.
Offer a notch on the end face of connector shell 12, radiator 13 is placed in this notch; And; As shown in Figure 2, radiator buckle 14 is buckled on the radiator 13, and the hole clipping 18 on the radiator buckle 14 will match with the projection 19 on connector shell 12 sidewalls; Projection 19 is inserted in the hole clipping 18, thereby realizes through radiator buckle 14 radiator 13 being fixed on the connector shell 12.Under the pressure of radiator buckle 14, the bottom surface of radiator 13 contacts with the upper surface a1 of optical module 11, and optical module 11 can dispel the heat through radiator 13.
Fig. 5 is the perspective view of optical module heat radiation device embodiment of the present invention; Can see more intuitively that by Fig. 5 connector shell 12 is hollow cavity structures; And; Circuit board 15 is provided with a plurality of connecting holes 20, and connector shell 12 is that realization connector shell 12 was fixed with being connected of circuit board 15 in connecting pin 21 these connecting holes 20 of insertion through the bottom surface; Connector body 17 also is to be connected with circuit board 15 through certain connecting hole 20.That is, optical module 11 is through being fixed in the connector shell 12, and is connected with circuit board 15 realization signals through connector body 17.
In the present embodiment; Through radiator buckle 14 chucking radiators 13; And apply downward pressure through 13 pairs of optical modules 11 of radiator, and realize that the lower surface a2 of optical module 11 contacts with the bottom surface a3 of connector shell 12, the heat of optical module 11 can conduct to the bottom surface of connector shell 12; Simultaneously; Present embodiment has also increased conducting-heat elements; This conducting-heat elements is arranged between the bottom surface, structural member of connector shell, and contacts with bottom surface, the structural member 16 of connector shell respectively, and the heat that is mainly used in optical module 11 conducts to structural member 16 from connector shell 12.Owing to respect to prior art, increased the heat radiation approach of optical module bottom, thereby improved optical module heat radiating effect, can effectively reduce the temperature of optical module; And, through strengthening optical module heat radiating effect, can also promote the stability of properties of product so that this optical module heat radiation device to product miniaturization development, reduces production costs, reduce the product power consumption.
Optional, above-mentioned conducting-heat elements can comprise: be arranged on first heat-conducting medium on the circuit board, this first heat-conducting medium contacts with the bottom surface of connector shell, can conduct heat; And second heat-conducting medium 26; This second heat-conducting medium 26 contacts with first heat-conducting medium, structural member respectively; Can heat be conducted to structural member again from first heat-conducting medium, thereby realize the heat of optical module is conducted to structural member through bottom surface, first heat-conducting medium, second heat-conducting medium of connector shell successively.Wherein, can circuit board, second heat-conducting medium, structural member be connected through screw 22 and fix, closely contact with structural member 16, circuit board 15, guarantee radiating effect to guarantee second heat-conducting medium.
Fig. 6 is a kind of heat-conducting medium structural representation of optical module heat radiation device embodiment of the present invention, and Fig. 7 is the schematic cross-section of Fig. 6.Like Fig. 6 and shown in Figure 7, described first heat-conducting medium can comprise: first heat-conducting layer 23, second heat-conducting layer 24 and metallic vias 25.Wherein, first heat-conducting layer 23 is arranged on the upper surface of circuit board 15, can be arranged on the relative position, bottom surface of connector shell 12, and first heat-conducting layer 23 contacts with the bottom surface of connector shell; Second heat-conducting layer 24 is arranged on the lower surface of circuit board 15, is used for contacting with second heat-conducting medium; First heat-conducting layer is connected through the metallic vias on the circuit board 25 with second heat-conducting layer.
In the practical implementation, first heat-conducting layer 23 and second heat-conducting layer 24 can be metal, for example are copper; Second heat-conducting medium 26 can perhaps have the heat-conducting glue of thermal conductive resin for metal.As shown in Figure 3, the copper paving area of the upper surface of circuit board 15 contacts with the bottom surface of connector shell 12, and the copper paving area of the lower surface of circuit board 15 contacts with second heat-conducting medium 26, and second heat-conducting medium 26 contacts with structural member 16.The heat that said structure makes optical module 11 produce can pass through bottom surface, first heat-conducting layer 23, metallic vias 25, second heat-conducting layer 24, second heat-conducting medium 26 of connector shell 12; Finally conduct to structural member 16; Thereby enhance heat has effectively improved optical module heat radiating effect.
Fig. 8 is the another kind of heat-conducting medium structural representation of optical module heat radiation device embodiment of the present invention, and Fig. 9 is the schematic perspective view of Fig. 8.In order further to increase heat-sinking capability, reduce the thermal resistance of heat conduction approach process, promote radiating effect, the structure of Fig. 6 and heat-conducting medium shown in Figure 7 is improved; Like Fig. 8 and shown in Figure 9, the upper surface of circuit board 15 and lower surface no longer are provided with first heat-conducting layer 23 and second heat-conducting layer 24, but circuit board 15 corresponding copper paving areas are hollowed out, and form a through hole 27, the second heat-conducting mediums 26 and are arranged in this through hole 27; And second heat-conducting medium 26 contacts with bottom surface, the structural member 16 of connector shell respectively.
In the said structure, second heat-conducting medium 26 directly contacts with connector shell 12, and the heat that optical module 11 produces can conduct on the structural member 16 from connector shell 12 through second heat-conducting medium 26; Owing to reduced the thermal resistance of heat conduction approach process, thereby further promoted optical module heat radiating effect.
The optical module heat radiation device of present embodiment; Through making the lower surface of optical module contact, and a conducting-heat elements is set, connects through bottom surface, the structural member of this conducting-heat elements with connector shell with the bottom surface of connector shell; Can the heat that optical module produces be passed to structural member through bottom surface, the conducting-heat elements of connector shell successively; Dispel the heat with respect to of the prior art top, increased the heat radiation approach of optical module, improved optical module heat radiating effect at optical module.
The embodiment of the invention also provides a kind of communication equipment, comprises the described optical module heat radiation device of any embodiment of the present invention.The concrete structure of this device can combine referring to the foregoing description said, repeats no more.
What should explain at last is: above each embodiment is only in order to explaining technical scheme of the present invention, but not to its restriction; Although the present invention has been carried out detailed explanation with reference to aforementioned each embodiment; Those of ordinary skill in the art is to be understood that: it still can be made amendment to the technical scheme that aforementioned each embodiment put down in writing, perhaps to wherein part or all technical characteristic are equal to replacement; And these are revised or replacement, do not make the scope of the essence disengaging various embodiments of the present invention technical scheme of relevant art scheme.
Claims (9)
1. an optical module heat radiation device comprises: optical module, connector shell, radiator, radiator buckle, circuit board, structural member; Said optical module is arranged in the said connector shell, and said radiator buckle is fixed on said radiator on the said connector shell, and said radiator contacts with the upper surface of said optical module; It is characterized in that,
The lower surface of said optical module contacts with the bottom surface of said connector shell; Said optical module heat radiation device also comprises: conducting-heat elements; Said conducting-heat elements contacts with the bottom surface of said connector shell, said structural member respectively.
2. optical module heat radiation device according to claim 1 is characterized in that, said conducting-heat elements comprises: first heat-conducting medium and second heat-conducting medium;
Said first heat-conducting medium is arranged on the circuit board, and contacts with the bottom surface of said connector shell;
Said second heat-conducting medium contacts with said first heat-conducting medium, structural member respectively;
3. optical module heat radiation device according to claim 2 is characterized in that, said first heat-conducting medium comprises: first heat-conducting layer, second heat-conducting layer and metallic vias;
Said first heat-conducting layer is arranged on the upper surface of said circuit board, contacts with the bottom surface of said connector shell; Said second heat-conducting layer is arranged on the lower surface of said circuit board, contacts with said second heat-conducting medium; Said first heat-conducting layer is connected through the said metallic vias on the circuit board with second heat-conducting layer.
4. optical module heat radiation device according to claim 3 is characterized in that, said first heat-conducting layer and second heat-conducting layer are metal.
5. optical module heat radiation device according to claim 4 is characterized in that, said metal is a copper.
6. according to the arbitrary described optical module heat radiation device of claim 2-5, it is characterized in that said second heat-conducting medium is metal or heat-conducting glue.
7. optical module heat radiation device according to claim 2 is characterized in that, said circuit board, second heat-conducting medium, structural member connect fixing through screw.
8. optical module heat radiation device according to claim 1 is characterized in that, said conducting-heat elements comprises: second heat-conducting medium;
On the said circuit board through hole is set, said second heat-conducting medium is arranged in the said through hole; And said second heat-conducting medium contacts with bottom surface, the structural member of said connector shell respectively.
9. a communication equipment is characterized in that, comprises the arbitrary described optical module heat radiation device of claim 1-8.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012100647205A CN102612302A (en) | 2012-03-13 | 2012-03-13 | Optical module radiator and optical module communication equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012100647205A CN102612302A (en) | 2012-03-13 | 2012-03-13 | Optical module radiator and optical module communication equipment |
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| CN102612302A true CN102612302A (en) | 2012-07-25 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN2012100647205A Pending CN102612302A (en) | 2012-03-13 | 2012-03-13 | Optical module radiator and optical module communication equipment |
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Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104053336A (en) * | 2013-03-15 | 2014-09-17 | 中兴通讯股份有限公司 | Optical transceiver heat radiating plate and optical transceiver guide rail device |
| WO2015081683A1 (en) * | 2013-12-04 | 2015-06-11 | 中兴通讯股份有限公司 | Optical module heat dissipation apparatus |
| CN105431006A (en) * | 2015-11-27 | 2016-03-23 | 武汉光迅科技股份有限公司 | Low cost photovoltaic module |
| WO2016197602A1 (en) * | 2015-06-11 | 2016-12-15 | 中兴通讯股份有限公司 | Heat dissipation device for optical module |
| CN109673141A (en) * | 2019-02-11 | 2019-04-23 | 上海剑桥科技股份有限公司 | High thermal conductivity mould group and high thermal conductivity radiator structure including it |
| CN109951992A (en) * | 2017-12-21 | 2019-06-28 | 苏州旭创科技有限公司 | Radiating module and optical module |
| CN111338032A (en) * | 2018-12-18 | 2020-06-26 | 中兴通讯股份有限公司 | Optical module communication assembly |
| CN113093349A (en) * | 2020-01-08 | 2021-07-09 | 青岛海信宽带多媒体技术有限公司 | Optical module |
| WO2021147855A1 (en) * | 2020-01-22 | 2021-07-29 | 华为技术有限公司 | Heat dissipation structure for optical module, and communication device |
| US11297734B2 (en) | 2019-07-01 | 2022-04-05 | Delta Electronics, Inc. | Heat dissipation module for optical transceiver |
| CN114488423A (en) * | 2020-10-27 | 2022-05-13 | 青岛海信宽带多媒体技术有限公司 | Optical module |
| WO2024045737A1 (en) * | 2022-08-31 | 2024-03-07 | 华为技术有限公司 | Optical module housing and manufacturing method therefor, and optical module and optical communication device |
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| CN1647599A (en) * | 2002-03-06 | 2005-07-27 | 蒂科电子公司 | Pluggable electronic module and receptacle with heat sink |
| CN1658441A (en) * | 2004-01-06 | 2005-08-24 | 蒂科电子公司 | Release mechanism for transceiver module assembly |
| CN200990754Y (en) * | 2006-12-27 | 2007-12-12 | 东莞莫仕连接器有限公司 | Radiating device |
| CN102565960A (en) * | 2012-01-11 | 2012-07-11 | 聚信科技有限公司 | Connector and communication equipment |
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| CN1180856A (en) * | 1996-10-09 | 1998-05-06 | 惠普公司 | Heat conductive substrate mounted in PC board hole for transferring heat from IC heat sink |
| CN1647599A (en) * | 2002-03-06 | 2005-07-27 | 蒂科电子公司 | Pluggable electronic module and receptacle with heat sink |
| CN1658441A (en) * | 2004-01-06 | 2005-08-24 | 蒂科电子公司 | Release mechanism for transceiver module assembly |
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Cited By (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104053336A (en) * | 2013-03-15 | 2014-09-17 | 中兴通讯股份有限公司 | Optical transceiver heat radiating plate and optical transceiver guide rail device |
| WO2015081683A1 (en) * | 2013-12-04 | 2015-06-11 | 中兴通讯股份有限公司 | Optical module heat dissipation apparatus |
| WO2016197602A1 (en) * | 2015-06-11 | 2016-12-15 | 中兴通讯股份有限公司 | Heat dissipation device for optical module |
| CN105431006A (en) * | 2015-11-27 | 2016-03-23 | 武汉光迅科技股份有限公司 | Low cost photovoltaic module |
| CN105431006B (en) * | 2015-11-27 | 2019-01-22 | 武汉光迅科技股份有限公司 | A kind of optical-electric module of low cost |
| CN109951992A (en) * | 2017-12-21 | 2019-06-28 | 苏州旭创科技有限公司 | Radiating module and optical module |
| CN111338032A (en) * | 2018-12-18 | 2020-06-26 | 中兴通讯股份有限公司 | Optical module communication assembly |
| CN109673141A (en) * | 2019-02-11 | 2019-04-23 | 上海剑桥科技股份有限公司 | High thermal conductivity mould group and high thermal conductivity radiator structure including it |
| US11297734B2 (en) | 2019-07-01 | 2022-04-05 | Delta Electronics, Inc. | Heat dissipation module for optical transceiver |
| CN113093349A (en) * | 2020-01-08 | 2021-07-09 | 青岛海信宽带多媒体技术有限公司 | Optical module |
| CN113093349B (en) * | 2020-01-08 | 2022-08-19 | 青岛海信宽带多媒体技术有限公司 | Optical module |
| WO2021147855A1 (en) * | 2020-01-22 | 2021-07-29 | 华为技术有限公司 | Heat dissipation structure for optical module, and communication device |
| CN114488423A (en) * | 2020-10-27 | 2022-05-13 | 青岛海信宽带多媒体技术有限公司 | Optical module |
| WO2024045737A1 (en) * | 2022-08-31 | 2024-03-07 | 华为技术有限公司 | Optical module housing and manufacturing method therefor, and optical module and optical communication device |
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Application publication date: 20120725 |