WO2015081683A1

WO2015081683A1 - Optical module heat dissipation apparatus

Info

Publication number: WO2015081683A1
Application number: PCT/CN2014/079985
Authority: WO
Inventors: 翟厚明; 么东升
Original assignee: 中兴通讯股份有限公司
Priority date: 2013-12-04
Filing date: 2014-06-16
Publication date: 2015-06-11
Also published as: CN203645968U

Abstract

An optical module heat dissipation apparatus comprises an optical module shielding cover (103), which is located at a position above an optical module (102) and set to provide a plug structure for the optical module (102) and shield the optical module (102); and a heat dissipation structure, which is located at a position above the optical module shielding cover (103) and set to dissipate heat transferred out by the optical module (102) through the optical module shielding cover (103). Compared with a conventional optical module heat radiator, the optical module heat dissipation apparatus is simple in structure and low in costs.

Description

TECHNICAL FIELD The present invention relates to the field of communications, and in particular to a heat dissipation device for an optical module. BACKGROUND With the continuous development of optical fiber networks, more and more network devices are used for optical modules, and the application environment is more and more complicated. Since the power consumption of optical modules is large and they are all inserted in the shield of the optical module, heat dissipation has always been an important issue. The traditional heat dissipation method of the optical module is to use active air-cooling heat dissipation, or to install a heat sink on the optical module shield to naturally dissipate heat, or a combination of the two. These methods are suitable for the case where there is sufficient space above the optical module or air-cooled conditions, and the box with a quiet space above the optical module needs to be quietly designed, or a box with a narrow space above the optical module and can be effectively cooled by air cooling alone. Both of these heat dissipation methods cannot meet the heat dissipation requirements. In view of the heat dissipation problem of the optical module when the space above the optical module is narrow and the heat sink cannot be installed in the related art, an effective solution has not been proposed yet. SUMMARY OF THE INVENTION Embodiments of the present invention provide a heat dissipation device for an optical module to solve at least the problem of heat dissipation of an optical module when a space above the optical module is narrow and the heat sink cannot be installed. According to an embodiment of the present invention, an optical module heat dissipation device is provided, including: an optical module shielding cover, located at an upper position of the optical module, configured to provide an optical module with a plug-in structure, a shielding optical module; a heat dissipation structure, located in the optical module shielding cover The upper position is set to the heat that the diffused light module transmits through the light module shield. Preferably, the heat dissipation structure comprises: a heat conducting block and a thermal pad. Preferably, the material of the heat conducting block comprises: copper or aluminum. Preferably, the thermal pad is the same size as the thermal block. Preferably, the material used for the thermal pad has thermal conductivity, flexibility, compressibility, and natural cohesiveness of the surface. Preferably, the number of the heat conducting blocks is 1, and the number of the heat conducting pads is 2. wherein the two heat conducting pads are respectively located above and below the heat conducting block. Preferably, the light module heat dissipation device further comprises: a frame housing located above the heat dissipation structure, configured to radiate heat radiated from the heat dissipation structure into the air. Preferably, the heat dissipation structure and the heat conducting block are connected by screws and screws. Preferably, the material of the frame outer casing is metal. Preferably, the optical module is cooled by using a heat dissipation structure or an air cooling method. According to the embodiment of the present invention, a heat dissipation structure is disposed in the upper space of the optical module, and the heat dissipation structure can dissipate the heat transmitted from the optical module through the shield of the optical module, thereby solving the problem that the space above the optical module is narrow and cannot be installed. The heat dissipation problem of the optical module when the heat sink is achieved has the advantage of being simple in structure compared with the conventional light module heat sink, and can reduce the cost. BRIEF DESCRIPTION OF THE DRAWINGS The accompanying drawings, which are set to illustrate,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,, BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a schematic structural view of a heat dissipation device for an optical module according to an embodiment of the present invention; FIG. 2 is an exploded perspective view of each module in a heat dissipation device for an optical module according to a preferred embodiment of the present invention; FIG. 4 is a flow chart showing the assembly of the heat dissipation device of the optical module according to a preferred embodiment of the present invention. FIG. BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, the present invention will be described in detail with reference to the accompanying drawings. It should be noted that the embodiments in the present application and the features in the embodiments may be combined with each other without conflict. 1 is a schematic structural diagram of a heat dissipation device for an optical module according to an embodiment of the present invention. As shown in FIG. 1, the device includes: an optical module shield 1 and a heat dissipation structure 2. The optical module shield 1 is located above the optical module. The optical module is provided with a plug-in structure to shield the optical module. The heat-dissipating structure 2 is located above the optical module shield 1 and is disposed to transmit heat from the light-emitting module through the optical module shield 1. In this embodiment, the heat dissipation structure may include: a heat conductive block and a thermal pad. Among them, the material of the thermal block includes: copper or aluminum. The size of the thermal pad is the same as the size of the thermal block. Of course, in practical applications, the size of the thermal pad and the thermal block may be different, but not limited to the installation of other modules. In this embodiment, the material used for the thermal pad has thermal conductivity, flexibility, compressibility, and natural cohesiveness of the surface. The use of such materials is to make the thermal pad and the thermal block more compact, and save space, easy to install and conduct heat. Preferably, the number of the heat conducting blocks is 1, and the number of the heat conducting pads is 2. wherein the two heat conducting pads are respectively located above and below the heat conducting block. Of course, this is only a preferred embodiment. In practical applications, the number of thermal conductive blocks and thermal pads can be set according to the upper space of the optical module, and the best thermal conduction effect has been achieved. In this embodiment, the heat dissipation device of the optical module may further include: a frame housing located above the heat dissipation structure, configured to radiate heat radiated from the heat dissipation structure into the air. Preferably, the heat dissipation structure and the heat conducting block may be connected by screws and screws. In this embodiment, the material of the frame housing is metal. Preferably, in practical applications, in order to pursue a better heat dissipation effect, the heat dissipation structure or the air cooling method may be used to dissipate the optical module. In this embodiment, the heat conduction module, the heat conduction block, and the like can be used to efficiently conduct heat of the optical module and the optical module shield to the metal frame outer casing, and radiate heat from the surface of the frame outer casing to achieve heat dissipation for the optical module. Or use the surface of the rack casing and the external environment for radiative heat transfer and natural convection heat dissipation to achieve the heat dissipation function of the enhanced optical module, or at the same time, combined with the air-cooling heat dissipation to achieve a better heat dissipation function of the optical module. The optical module heat dissipation device provided by the above embodiment is described and illustrated in more detail below with reference to FIG. 2 to FIG. 4 and the preferred embodiment. 2 is an exploded perspective view of each module in the heat dissipation device of the optical module according to a preferred embodiment of the present invention. As shown in FIG. 2, the module includes: a fiber optic cable 101, configured to transmit and receive data of the optical module. The optical module 102 can be plugged and unplugged, and cannot meet the heat dissipation requirements. The optical module shielding cover 103 provides an insertion and extraction guide for the optical module and a shielding function for the optical module. The thermal pad 104 has a certain flexibility, compressibility and surface natural viscosity in addition to thermal conductivity, and can fill the gap between the thermal block 105 and the optical module shield 103 and the optical module 102 and the optical module shield 103. The gap between the heat conducting block 105 and the optical module shield 103 and the optical module 102 is good for conducting heat of the optical module 102 to the heat conducting block 105. In the preferred embodiment, the size of the thermal pad 104 may depend on the contact area of the thermal block 105 and the optical module shield 103. The heat conducting block 105, in the preferred embodiment, may use a metal block of a material such as aluminum or copper for conducting heat from the optical module 102 to the frame housing 107. The heat conducting block 105 has mounting screw holes therein that are configured to secure the heat conducting block to the frame housing 107. The length and width of the heat-conducting block depend on the heat dissipation effect to be achieved. The larger the heat-conducting block 105 has better thermal conductivity, but the design needs to consider whether it interferes with other devices, processing cost, and installation. The height of the heat conducting block 105 is the height of the space above the optical module shield 103 minus the thickness of the thermal pad 104 after the thermal pad 106 is compressed. This ensures that each contact surface is in effective close contact and improves the thermal conductivity. The thermal pad 106 has the same material and function as the thermal pad 104, and has the same size as the upper surface of the thermal block 105 for good contact between the thermal block 105 and the frame housing 107, and facilitates conduction of heat from the thermal block 105 to the chassis housing 107. . The thermal pad 106 and the heat conducting block 105 have mounting holes for easy installation. The frame of the frame 107, the metal material, and the outer casing of the entire frame, in this heat dissipation scheme, also bears the heat radiated from the heat conducting block 105 to the air through natural convection, because the frame and the air contact surface are large, thereby Achieve good heat dissipation. 3 is a schematic view showing the assembly of each module in the heat dissipation device of the optical module according to a preferred embodiment of the present invention. As shown in FIG. 3, the position of each module in the heat dissipation system device is a light module shield 103 from the bottom to the top, and a thermal pad. 104, a thermal block 105, a thermal pad 106, a chassis housing 107. 4 is a flow chart showing the assembly of a heat dissipation device for an optical module according to a preferred embodiment of the present invention. As shown in FIG. 4, the installation process of the heat dissipation device for the optical module includes the following steps (step S402 to step S406): Step S402, a thermal pad 106 and 104 are respectively attached to the upper and lower surfaces of the heat conducting block 105. In step S404, the heat conducting block 105 to which the thermal pad is pasted is fixed to the frame casing 107 by screws. Step S406, the top cover of the rack casing is installed, so that the thermal pad 104 and the optical module shield 103 are in good contact. The heat dissipation device of the optical module provided by the preferred embodiment can solve the problem that the heat dissipation space cannot be added to the optical module when the heat dissipation space above the optical module is narrow, and the device has a simple structure compared with the conventional optical module heat sink. , the advantage of lower cost. It should be noted that each of the above modules can be implemented by hardware. For example: a processor, including the above modules, or each of the above modules is located in one processor. From the above description, it can be seen that the following technical effects are achieved in the embodiment of the present invention: a heat dissipation structure is disposed in the upper space of the optical module, and the heat dissipation structure can transmit the heat transmitted by the optical module through the shield of the optical module. The way of going out solves the problem of heat dissipation of the optical module when the space above the optical module is narrow and the heat sink cannot be installed, and the structure of the conventional light module heat sink is simple, and the cost can be reduced. The above is only the preferred embodiment of the present invention, and is not intended to limit the present invention, and various modifications and changes can be made to the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and scope of the present invention are intended to be included within the scope of the present invention.

Industrial Applicability As described above, an optical module heat dissipating device provided by an embodiment of the present invention has the following beneficial effects: a heat dissipating structure is disposed in a space above the optical module, and the optical module can pass the optical module through the optical module shielding cover. The way the heat is dissipated solves the problem of heat dissipation of the optical module when the space above the optical module is narrow and the heat sink cannot be installed, and the utility model has the advantages of simple structure compared with the conventional light module heat sink, and the cost can be reduced.

Claims

The optical module heat dissipation device includes: an optical module shielding cover, located at an upper position of the optical module, configured to provide a plug-in structure for the optical module, and shield the optical module;

The heat dissipation structure is located above the shield of the optical module and is configured to dissipate heat transferred by the optical module through the shield of the optical module. The heat dissipation device for an optical module according to claim 1, wherein the heat dissipation structure comprises: a heat conductive block and a thermal pad. The heat dissipation device of the optical module according to claim 2, wherein the material of the heat conducting block comprises: copper or aluminum. The heat dissipation device for an optical module according to claim 2, wherein the size of the thermal pad is the same as the size of the thermal block. The heat dissipation device for an optical module according to claim 2, wherein the material used for the thermal pad has heat conductivity, flexibility, compressibility, and natural viscosity of the surface. The heat dissipation block of the optical module according to claim 2, wherein the number of the heat conducting blocks is 1, and the number of the heat conducting pads is 2, wherein two of the heat conducting pads are respectively located above the heat conducting block And below. The heat dissipation device of the optical module according to any one of claims 2 to 6, wherein the heat dissipation device of the optical module further comprises: a chassis housing located above the heat dissipation structure, configured to dissipate the heat dissipation structure The heat is radiated into the air. The heat dissipation device for an optical module according to claim 7, wherein the heat dissipation structure and the heat transfer block are connected by screws and screws. The heat dissipation device for an optical module according to claim 7, wherein the frame outer casing is made of metal. The heat dissipation device of the optical module according to claim 1, wherein the heat dissipation structure or the air-cooling heat dissipation method is used to dissipate heat from the optical module.