CN220526900U - Semiconductor discrete device with double-sided heat dissipation - Google Patents

Abstract

The utility model discloses a semiconductor discrete device with double-sided heat dissipation, which comprises a discrete device frame, wherein one side of the discrete device frame is provided with a placing groove for placing a chip, one side of the discrete device frame, which is opposite to the placing groove, is provided with a groove, a sliding seat is arranged in the groove, and a plurality of radiating fins are uniformly arranged on one side of the sliding seat, which is far away from the groove; the first heat dissipation shell and the second heat dissipation shell are both of a double-layer barrier design, so that the ventilation of the air inside the heat dissipation shell and the air outside the heat dissipation shell is ensured, and the rapid heat dissipation is facilitated; after the frame of the discrete device is fixed in the first heat dissipation shell, the second heat dissipation shell is covered, at the moment, the second heat dissipation shell transfers and disperses the heat at the top end of the chip, the first heat dissipation shell disperses the heat at the low end of the chip, and the surface of the discrete device is reasonably utilized to improve the heat dissipation area so as to realize good heat dissipation.

Description

Semiconductor discrete device with double-sided heat dissipation

Technical Field

The utility model belongs to the technical field of semiconductor devices, and mainly relates to a semiconductor discrete device with double-sided heat dissipation.

Background

With the continuous development of society and the continuous improvement of the scientific and technical level, electronic products are rapidly developed, the internal structure of the electronic products is more and more complicated in order to make the functions of the electronic products more perfect, in the electronic products, a semiconductor discrete device is one of important parts, the semiconductor discrete device is generally referred to as a semiconductor transistor diode, a semiconductor triode, a diode for short, a triode and a semiconductor special device, and a semiconductor power device is also called a power electronic device;

the semiconductor discrete device mainly comprises a chip, a lead/frame and a plastic package shell, wherein the chip determines the function of the device, the plastic package shell provides protection for the chip and an internal structure, the stable realization of the function is ensured, the heat generated by the semiconductor discrete device is large when the existing semiconductor discrete device works, however, the heat radiating area of the existing heat radiating plate is smaller, and a heat radiating plate is usually arranged on the bottom surface of the plastic package body, so that the heat is radiated, the whole heat radiating performance of the semiconductor discrete device is poor, and the chip is burnt out due to the fact that the heat cannot be timely radiated during working.

Disclosure of Invention

In order to solve the problem that the existing semiconductor discrete device is provided with a heat dissipation plate only on the bottom surface of a plastic package body, so that the heat dissipation area is small, and the whole heat dissipation performance of the semiconductor discrete device is poor, and a chip is easy to burn out, the utility model provides a double-sided heat dissipation semiconductor discrete device, and aims to reasonably utilize the surface of the discrete device, improve the heat dissipation area and realize good heat dissipation.

In order to achieve the above purpose, the present utility model adopts the following technical scheme:

the semiconductor discrete device comprises a discrete device frame, wherein a placement groove for placing chips is formed in one side of the discrete device frame, a groove is formed in one side surface of the discrete device frame opposite to the placement groove, a sliding seat is arranged in the groove, and a plurality of radiating fins are uniformly arranged on one side, far away from the groove, of the sliding seat;

the discrete device frame is provided with a second heat dissipation shell and a first heat dissipation shell in a detachable mode from top to bottom respectively, and the first heat dissipation shell and the second heat dissipation shell are of a double-layer barrier design.

Further, a through positioning hole is further formed in the discrete device frame, the positioning hole is located on one side of the placing groove, a positioning block matched with the positioning hole is arranged in the first heat dissipation shell, a first heat conduction plate is arranged on the inner surface of the first heat dissipation shell, a plurality of first heat dissipation fins are uniformly arranged at the bottom end of the first heat conduction plate, and the first heat dissipation fins penetrate through the inner wall of the first heat dissipation shell and extend into the inner cavity of the first heat dissipation shell, and the first heat conduction plate abuts against the heat dissipation fins.

Further, the inner top end of the second heat dissipation shell is elastically connected with a second heat conduction plate through a plurality of springs, a plurality of second heat dissipation fins are uniformly arranged at one end, close to the second heat dissipation shell, of the second heat conduction plate, and gaps exist between the second heat dissipation fins and the inner top end of the second heat dissipation shell.

Further, the side edge of the discrete device frame is connected with three pins through connecting ribs, and a supporting block for supporting the discrete device frame is further arranged in the first heat dissipation shell.

Further, the chip is electrically connected with the pins through wires, and the wires are bonding wires.

The utility model has the beneficial effects that:

according to the heat dissipation device, the first heat dissipation shell and the second heat dissipation shell are arranged on the upper side and the lower side of the discrete device frame, heat generated by the chip during operation is transferred to the first heat conduction plate and the second heat conduction plate from top to bottom respectively and is transferred to the heat dissipation fins through the heat conduction plates, the first heat dissipation shell and the second heat dissipation shell are of a double-layer barrier type design, so that the circulation of air inside the heat dissipation shell and the circulation of air outside the heat dissipation shell are guaranteed, the heat dissipation fins are more beneficial to contact with the outside air, and the heat is eliminated; meanwhile, the second heat-conducting plate always keeps a bonding state with the surface of the discrete device frame and the surface of the chip under the action of the resilience force of the spring, so that the heat dissipation performance of the chip is improved, and the phenomenon that the chip is burnt out due to the fact that heat cannot be dissipated in time during working is avoided.

Drawings

The utility model is further described below with reference to the accompanying drawings.

FIG. 1 is an exploded view of a three-dimensional structure of the present utility model;

FIG. 2 is an enlarged view of a portion of FIG. 1;

fig. 3 is a cross-sectional view of the present utility model.

In the figure: 1. a separator frame; 11. positioning holes; 12. a placement groove; 13. pins; 14. a groove; 2. a first heat dissipation case; 21. a first heat-conducting plate; 211. a first heat sink fin; 22. a positioning block; 23. a support block; 3. a second heat dissipation case; 31. a second heat-conducting plate; 311. a second heat sink fin; 32. a spring; 4. a chip; 5. a sliding seat; 51. a heat sink.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

Referring to fig. 1-3, the utility model discloses a semiconductor discrete device with double-sided heat dissipation, which comprises a discrete device frame 1, wherein a second heat dissipation shell 3 and a first heat dissipation shell 2 are respectively detachably arranged on the discrete device frame 1 up and down, and the first heat dissipation shell 2 and the second heat dissipation shell 3 are both of double-layer barrier designs, so that the ventilation of the air inside the heat dissipation shell and the air outside the heat dissipation shell is ensured, and the rapid heat dissipation is facilitated;

wherein, a placement groove 12 for placing the chip 4 is arranged on one side of the discrete device frame 1, a groove 14 is arranged on one side surface of the discrete device frame 1 opposite to the placement groove 12, a sliding seat 5 is arranged in the groove 14, and a plurality of cooling fins 51 are uniformly arranged on one side of the sliding seat 5 away from the groove 14;

in order to ensure good heat dissipation effect, the inner surface of the first heat dissipation shell 2 is provided with a first heat conduction plate 21, the bottom ends of the first heat conduction plates 21 are uniformly arranged with a plurality of first heat dissipation fins 211, the first heat dissipation fins 211 penetrate through the inner wall of the first heat dissipation shell 2 and extend into the inner cavity of the first heat dissipation shell 2, the first heat conduction plate 21 is propped against the heat dissipation fins 51, so that when the chip 4 works to generate heat, a large amount of heat emitted by the bottom ends of the chip 4 can transfer the heat to the first heat conduction plate 21 through the sliding seat 5 and the heat dissipation fins 51, the first heat conduction plate 21 can continuously disperse the heat to the plurality of first heat dissipation fins 211 arranged at the bottom ends of the first heat conduction plate 21, and the heat dissipation area of the first heat conduction plate 21 is increased by the first heat dissipation fins 211, so that the bottom of the chip 4 can be quickly dissipated;

in order to ensure heat radiation uniformity, the inner top end of the second heat radiation shell 3 is elastically connected with a second heat conduction plate 31 through a plurality of springs 32, a plurality of second heat radiation fins 311 are uniformly arranged at one end of the second heat conduction plate 31 close to the second heat radiation shell 3, and gaps exist between the second heat radiation fins 311 and the inner top end of the second heat radiation shell 3;

when the discrete device frame 1 is fixed in the first heat dissipation shell 2, the second heat dissipation shell 3 is covered, at the moment, the second heat conduction plate 31 can be propped against the top end of the discrete device frame 1, meanwhile, the second heat conduction plate 31 is also directly contacted with the top end of the chip 4 to transfer and disperse heat at the top end of the chip 4, and under the action of the resilience force of the spring 32, the second heat conduction plate 31 can be ensured to be always tightly attached to the discrete device frame 1 and the chip 4, so that the effect of dispersing heat is ensured;

in addition, the side edge of the discrete device frame 1 is connected with three pins 13 through connecting ribs, and one end of each of the three pins 13 penetrates through one side surface of the heat dissipation shell and extends to the outer side of the heat dissipation shell; the chip 4 is electrically connected with the pins 13 through wires, the wires are bonding wires, and the pins 13 can also realize the rapid heat conduction out of the chip 4, so that the effect of reducing the temperature of the chip 4 is achieved, and the heat dissipation capacity and the service life of the discrete device frame 1 are improved;

in order to make the separator frame be placed in the heat dissipation shell better and stably, a through positioning hole 11 is further formed in the separator frame 1, the positioning hole 11 is located at one side of the placing groove 12, a positioning block 22 matched with the positioning hole 11 is arranged in the first heat dissipation shell 2, and a supporting block 23 for supporting the separator frame 1 is further arranged in the first heat dissipation shell 2, so that when the separator frame 1 is installed, quick positioning and installation can be realized through matching of the positioning hole 11 and the positioning block 22, and meanwhile, the separator frame 1 can be placed in the first heat dissipation shell 2 more stably with the aid of the supporting block 23.

In the description of the present utility model, it should be understood that the terms "upper," "lower," "left," "right," and the like indicate an orientation or a positional relationship based on that shown in the drawings, and are merely for convenience of description and simplification of the description, and do not indicate or imply that the apparatus or element in question must have a specific orientation, and that the specific orientation is constructed and operated, and therefore, the present utility model should not be construed as being limited. Furthermore, the "first" and "second" are for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature. In the description of the present utility model, unless otherwise indicated, the meaning of "a plurality" is two or more.

In the description of the present utility model, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and the like are to be construed broadly and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present utility model will be understood in specific cases by those of ordinary skill in the art.

The foregoing describes one embodiment of the present utility model in detail, but the description is only a preferred embodiment of the present utility model and should not be construed as limiting the scope of the utility model. All equivalent changes and modifications within the scope of the present utility model are intended to be covered by the present utility model.

Claims (5)

1. The semiconductor discrete device with double-sided heat dissipation comprises a discrete device frame (1), and is characterized in that a placement groove (12) for placing a chip (4) is formed in one side of the discrete device frame (1), a groove (14) is formed in one side surface of the discrete device frame (1) opposite to the placement groove (12), a sliding seat (5) is arranged in the groove (14), and a plurality of radiating fins (51) are uniformly arranged on one side, far away from the groove (14), of the sliding seat (5);

the discrete device is characterized in that a second heat dissipation shell (3) and a first heat dissipation shell (2) are detachably arranged on the discrete device frame (1) from top to bottom respectively, and the first heat dissipation shell (2) and the second heat dissipation shell (3) are of double-layer barrier type design.

2. The double-sided radiating semiconductor discrete device according to claim 1, wherein the discrete device frame (1) is further provided with a through positioning hole (11), the positioning hole (11) is located at one side of the placing groove (12), a positioning block (22) matched with the positioning hole (11) is arranged in the first radiating shell (2), a first heat conducting plate (21) is arranged on the inner surface of the first radiating shell (2), a plurality of first heat radiating fins (211) are uniformly arranged at the bottom end of the first heat conducting plate (21), and the first heat radiating fins (211) penetrate through the inner wall of the first radiating shell (2) and extend into the inner cavity of the first radiating shell (2), and the first heat conducting plate (21) is abutted against the heat radiating fins (51).

3. The double-sided radiating semiconductor discrete device according to claim 2, wherein the inner top end of the second radiating shell (3) is elastically connected with a second heat conducting plate (31) through a plurality of springs (32), a plurality of second radiating fins (311) are uniformly arranged at one end of the second heat conducting plate (31) close to the second radiating shell (3), and gaps exist between the second radiating fins (311) and the inner top end of the second radiating shell (3).

4. The semiconductor discrete device with double-sided heat dissipation according to claim 2, wherein three pins (13) are connected to the side of the discrete device frame (1) through connecting ribs, and a supporting block (23) for supporting the discrete device frame (1) is further arranged in the first heat dissipation housing (2).

5. The semiconductor discrete device with double-sided heat dissipation according to claim 4, wherein the chip (4) and the leads (13) are electrically connected by wires, and the wires are bonding wires.