CN210743936U - Heat radiator for semiconductor device - Google Patents
Heat radiator for semiconductor device Download PDFInfo
- Publication number
- CN210743936U CN210743936U CN201922017790.5U CN201922017790U CN210743936U CN 210743936 U CN210743936 U CN 210743936U CN 201922017790 U CN201922017790 U CN 201922017790U CN 210743936 U CN210743936 U CN 210743936U
- Authority
- CN
- China
- Prior art keywords
- heat dissipating
- pcb
- semiconductor device
- semiconductor devices
- fins
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 63
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 23
- 229910052802 copper Inorganic materials 0.000 claims abstract description 23
- 239000010949 copper Substances 0.000 claims abstract description 23
- 229910052751 metal Inorganic materials 0.000 claims abstract description 20
- 239000002184 metal Substances 0.000 claims abstract description 20
- 230000017525 heat dissipation Effects 0.000 claims description 33
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 5
- 238000012423 maintenance Methods 0.000 abstract description 3
- 239000000758 substrate Substances 0.000 description 9
- LAXBNTIAOJWAOP-UHFFFAOYSA-N 2-chlorobiphenyl Chemical compound ClC1=CC=CC=C1C1=CC=CC=C1 LAXBNTIAOJWAOP-UHFFFAOYSA-N 0.000 description 3
- 101710149812 Pyruvate carboxylase 1 Proteins 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 230000008676 import Effects 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 239000000498 cooling water Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model discloses a heat abstractor for semiconductor device, its characterized in that: including the copper base PCB board that is used for connecting a plurality of semiconductor devices, through setting up in PCB board surface interconnect between the semiconductor device, and a plurality of semiconductor device even interval distribution are in a plane of PCB board, and another plane that deviates from mutually with this plane is provided with the radiating part that has the heat conductivility metal and make that corresponds the semiconductor device position, adopts this technical scheme, can guarantee the radiating validity of semiconductor device to practice thrift the maintenance cost, prolong semiconductor device's life.
Description
Technical Field
The utility model belongs to the electric automobile field, more specifically says, the utility model relates to a heat abstractor for semiconductor device.
Background
The controller is the core part of new energy automobile, semiconductor device uses in a large number in the controller, semiconductor device's calorific capacity is great, can lead to the inside temperature of controller and the temperature of device too high, the condition such as device burnout and operation difficulty appear, just need to have good heat radiation structure and corresponding heat dissipation mode for guaranteeing the good operation of device, fix semiconductor device on a smooth aluminum plate among the prior art, be empty connecting channel below the aluminum plate, the export of connecting channel is confirmed with the mode of establishing ties to the import, reach radiating purpose, however, aluminum plate's heat conduction area is less, the heat dissipation export temperature is higher than the connecting channel heat dissipation import temperature, export top device temperature is higher, the temperature of device is inconsistent.
SUMMERY OF THE UTILITY MODEL
The utility model aims to solve the technical problem that a heat abstractor for semiconductor device that avoids device during operation high temperature, guarantees the permanent operation of device is provided.
In order to realize the purpose, the utility model discloses the technical scheme who takes does:
a heat dissipation device for semiconductor devices comprises a PCB board used for connecting a plurality of semiconductor devices, wherein the semiconductor devices are electrically connected with each other through the PCB board, the semiconductor devices are uniformly distributed on one plane of the PCB board at intervals, and a heat dissipation part made of metal with heat conductivity and corresponding to the position of the semiconductor devices is arranged on the other plane deviated from the plane.
The utility model discloses a heat abstractor for semiconductor device, the PCB board adopts the copper to make.
The utility model discloses a heat abstractor for semiconductor device, the radiating part include a plurality of quantity with the arch fin that semiconductor device quantity is the same, the both ends fixed connection of this arch fin in the face of PCB board, the face that should connect the face for setting up the semiconductor device and deviate from mutually, and be provided with a plurality of water pipes that are used for the radiating in the arch face that arch fin and PCB board meet side by side.
The utility model discloses a heat abstractor for semiconductor device, the radiating part includes a plurality of bar fin of arranging in the PCB board back of the semiconductor device face, and this bar fin is along PCB axial setting and both ends and PCB looks rigid coupling, and a plurality of bar fins are arranged in proper order along the radial of PCB board.
The utility model discloses a heat abstractor for semiconductor device, the radiating part includes radiator fan and fixed radiator fan's metal support, including a plurality of fin that link to each other with the PCB board back to the semiconductor device face in the metal support, radiator fan sets up on the vertical multi-thread plane of arranging the formation of this fin, and through metal support fixed connection in four summits of copper base PCB board, one side of metal support is provided with the power of being connected with the radiator fan electricity.
By adopting the technical scheme, the heat dissipation part made of the heat dissipation metal material is matched with the copper circuit substrate (copper-based PCB), the heat dissipation performance of the semiconductor device can be improved, the conditions that the device is burnt out due to overhigh temperature, the operation is difficult and the like are avoided, the semiconductor device is fixedly welded on one surface of the copper-based PCB, the heat dissipation area is increased by welding the arched heat dissipation piece on the other surface of the copper substrate, the arched heat dissipation piece can be impacted when water flows through the bottom surface of the copper substrate, the heat dissipation is enhanced, the maintenance cost is saved, the service life of the semiconductor device is prolonged, the strength of the PCB is increased simultaneously, the loss caused by the pressure given by other parts in the use process is avoided, and.
The present invention will be described in more detail with reference to the accompanying drawings and examples.
Drawings
The contents of the description and the references in the drawings are briefly described as follows:
FIG. 1 is a schematic structural view of a copper-based PCB board according to the present invention;
FIG. 2 is a schematic structural view of a middle arch-shaped heat sink of the present invention;
fig. 3 is a schematic structural view of the middle metal bracket and the heat dissipation fan of the present invention.
Labeled as: 1. a copper-based PCB board; 2. a semiconductor device; 3. a metal bracket; 4. a heat dissipation fan.
Detailed Description
The following description of the embodiments of the present invention, with reference to the accompanying drawings, will be made in further detail to explain, for example, the shapes and structures of the components, the mutual positions and connection relationships among the components, the functions and working principles of the components, the manufacturing process, and the operation and use method of the components, so as to help those skilled in the art to understand the concept and technical solutions of the present invention more completely, accurately and deeply.
FIG. 1 is a schematic structural view of a copper-based PCB according to the present invention, and a heat dissipation device for semiconductor devices as shown in the figure comprises a copper-based PCB 1 for connecting a plurality of semiconductor devices, wherein the semiconductor devices 2 are electrically connected with each other by being disposed on the surface of the PCB 1, the semiconductor devices 2 are uniformly distributed on a plane of the PCB 1 at intervals, another plane away from the plane is provided with a heat dissipation portion made of a metal having heat conductivity corresponding to the position of the semiconductor device, the PCB is made of copper, the copper substrate is selected as a bottom plate, the semiconductor devices are soldered on the copper substrate by using solder, the semiconductor devices are in zero-distance contact with the copper substrate, the heat dissipation structure of arch bridges is soldered on the corresponding surface of the semiconductor devices on the copper substrate according to the inlet and outlet directions of a water channel, the heat dissipation area of conduction is increased, and the semiconductor devices are well dissipated heat, the long-term operation of the device is guaranteed.
Example one
Fig. 2 is a schematic structural view of the arched heat sink according to the present invention, in which the heat sink includes a plurality of arched heat sinks having the same number as the semiconductor devices, two ends of each arched heat sink are fixedly connected to the surface of the PCB, and the connecting surface is a surface away from which the semiconductor devices are disposed; the bottom surface of the copper substrate is additionally provided with the arched bridge type heat dissipation structure, so that the heat dissipation area of conduction is increased, the heat dissipation water pipe is arranged in the surface where the arched heat dissipation fins are connected with the PCB, the PCB is subjected to heat dissipation through cooling water flow, the temperature of a device is well controlled, and good operation of the device is guaranteed.
Example two
The radiating part disclosed in the present case can realize the heat dissipation purpose through the vertical range of bar fin, and the radiating part includes a plurality of bar fins of arranging in PCB board back to the semiconductor device face, and this bar fin sets up and both ends and PCB board rigid coupling along PCB board axial, and a plurality of bar fins are arranged in proper order along PCB board's radial, in order to prevent that the bar fin from too frivolous lacerating finger, can be at outside face installation backplate, in order to protect the fin.
EXAMPLE III
Fig. 3 is the utility model discloses well metal support and radiator fan's structural schematic diagram, as shown in the figure the radiating part includes radiator fan 4 and fixed radiator fan's metal support 3, including a plurality of fin that link to each other with the PCB board back to the semiconductor device face in the metal support 3, radiator fan 4 sets up on the multi-thread plane that the vertical range of this fin formed, and through 3 fixed connection of metal support in four summits of copper base PCB board, one side of metal support is provided with the power of being connected with radiator fan 4 electricity, this scheme is equivalent to increase radiator fan on embodiment two's basis, under the great condition of operand, it is higher to semiconductor device's heat dissipation demand, when ordinary metal heat radiation structure can not reach corresponding coefficient of heat dissipation, can adopt to install the fan additional and carry out the forced air cooling heat dissipation.
The embodiment disclosed in the present application is not limited to the above embodiment, and the semiconductor device may be cooled by other heat dissipation structures, and the heat conductor does not necessarily adopt a copper PCB, and the functions of the present application may be realized by combining a common conductive plate with heat dissipation silicone grease and an air-cooled heat sink.
Adopt this technical scheme, the circuit substrate (copper base PCB board) of the heat dissipation part cooperation copper of making through heat dissipation metal material, semiconductor device's heat dissipation performance can be improved, avoid appearing leading to the device to burn out because the high temperature, the condition such as operation difficulty, can guarantee semiconductor device radiating validity under the condition of not adjusting casing and water course height, size simultaneously, in order to practice thrift the maintenance cost, prolong semiconductor device's life, increase the intensity of PCB board simultaneously, avoid causing the loss because the pressure that other parts gave in the use, guarantee semiconductor device's permanent operation.
The present invention has been described above with reference to the accompanying drawings, and it is obvious that the present invention is not limited by the above-mentioned manner, and various insubstantial improvements can be made without modification to the method and technical solution of the present invention, or the present invention can be directly applied to other occasions without modification, all within the scope of the present invention.
Claims (5)
1. A heat dissipating device for a semiconductor device, characterized in that: the PCB comprises a PCB board used for connecting a plurality of semiconductor devices, wherein the semiconductor devices are electrically connected with each other through the surface of the PCB board, the semiconductor devices are uniformly distributed on one plane of the PCB board at intervals, and the other plane deviated from the plane is provided with a heat dissipation part made of metal with heat conduction performance corresponding to the position of the semiconductor device.
2. The heat dissipating device for a semiconductor device as recited in claim 1, wherein the PCB board is made of copper.
3. The heat dissipating device for semiconductor devices as claimed in claim 1, wherein the heat dissipating part includes a plurality of arched fins having the same number as the semiconductor devices, both ends of the arched fins are fixedly connected to the surface of the PCB, the connecting surface is a surface facing away from the semiconductor devices, and a plurality of water pipes for dissipating heat are arranged in parallel in the arched surface where the arched fins are connected to the PCB.
4. The heat dissipating device for semiconductor devices as claimed in claim 1, wherein the heat dissipating part comprises a plurality of strip-shaped heat dissipating fins arranged on the surface of the PCB away from the semiconductor device, the strip-shaped heat dissipating fins being arranged along the axial direction of the PCB and having both ends fixed to the PCB, the plurality of strip-shaped heat dissipating fins being arranged in sequence along the radial direction of the PCB.
5. The heat dissipating device for semiconductor devices as claimed in claim 1, wherein the heat dissipating part comprises a heat dissipating fan and a metal holder for holding the heat dissipating fan, the metal holder comprising a plurality of heat dissipating fins attached to a surface of the PCB plate facing away from the semiconductor device, the heat dissipating fan being disposed on a multi-line plane formed by vertical arrangement of the heat dissipating fins and fixedly attached to four vertices of the PCB plate by the metal holder, and a power supply electrically connected to the heat dissipating fan being provided at one side of the metal holder.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922017790.5U CN210743936U (en) | 2019-11-21 | 2019-11-21 | Heat radiator for semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922017790.5U CN210743936U (en) | 2019-11-21 | 2019-11-21 | Heat radiator for semiconductor device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210743936U true CN210743936U (en) | 2020-06-12 |
Family
ID=70988440
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201922017790.5U Expired - Fee Related CN210743936U (en) | 2019-11-21 | 2019-11-21 | Heat radiator for semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210743936U (en) |
-
2019
- 2019-11-21 CN CN201922017790.5U patent/CN210743936U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20200612 |