CN219205054U - Semiconductor heat dissipation module - Google Patents

Abstract

The utility model belongs to the technical field of semiconductor refrigeration, and discloses a semiconductor heat dissipation module. The semiconductor heat dissipation module comprises a refrigeration component and a radiator. The refrigerating assembly comprises a semiconductor unit, a hot surface guide bar and a cold surface guide bar, and two ends of the semiconductor unit are respectively fixedly connected with the hot surface guide bar and the cold surface guide bar; the hot surface flow guide strip is fixedly connected with the radiator. The radiator can directly radiate the heat of the heat-face guide bar by directly fixedly connecting the heat-face guide bar with the radiator, compared with the prior art, the ceramic plate and radiating silica gel between the radiator and the heat-face guide bar are removed, the gap between the radiator and the heat-face guide bar is eliminated, the thermal resistance between the radiator and the heat-face guide bar is further reduced, and the radiating efficiency is improved.

Description

Semiconductor heat dissipation module

Technical Field

The utility model relates to the technical field of semiconductor refrigeration, in particular to a semiconductor heat dissipation module.

Background

As shown in fig. 1 and 2, the conventional semiconductor heat dissipation module is formed by combining a semiconductor refrigeration component with a radiator, and the semiconductor refrigeration module generally comprises a N, P type semiconductor, a cold surface porcelain plate, a hot surface porcelain plate, a cold surface flow guide bar and a hot surface flow guide bar, when an N type semiconductor material and a P type semiconductor material are connected into a galvanic couple pair, after a direct current power supply is connected in the circuit, energy transfer can be generated, current flows from the N type semiconductor to the P type semiconductor, and heat is absorbed at a joint of the N type semiconductor to become a cold end; the current flows from the P-type semiconductor to the N-type semiconductor, releasing heat at its junction, becoming the hot side. The cold end is provided with a cold surface guide bar and a cold surface porcelain plate, the hot end is provided with a hot surface guide bar and a hot surface porcelain plate, wherein the hot surface porcelain plate is fixed on the radiator, and a heat dissipation silica gel gasket or a heat dissipation silicone grease is coated between the hot surface porcelain plate and the radiator, so that a complete heat dissipation module is formed by assembly.

However, a thermal surface porcelain plate and a silica gel sheet or silicone grease are arranged between the radiator and the thermal surface flow guide strip, so that a certain thermal obstruction exists between the radiator and the thermal surface flow guide strip, and the radiating effect is poor.

Disclosure of Invention

The utility model aims to provide a semiconductor heat radiation module which reduces the heat resistance between a radiator and a hot surface flow guide strip and improves the heat radiation efficiency.

To achieve the purpose, the utility model adopts the following technical scheme:

the utility model relates to a semiconductor heat dissipation module, which comprises:

the refrigerating assembly comprises a semiconductor unit, a hot surface guide bar and a cold surface guide bar, wherein two ends of the semiconductor unit are fixedly connected with the hot surface guide bar and the cold surface guide bar respectively;

and the heat radiator is fixedly connected with the hot-surface flow guide strip.

Optionally, the refrigeration assembly further comprises a ceramic plate, and the cold face guide strip is sintered on the ceramic plate.

Optionally, the refrigeration assembly further comprises a wire connected to one of the hot-face or cold-face guide bars.

Optionally, the hot-surface flow guide strip is fixedly connected with the radiator in a welding mode.

Optionally, the hot-face flow guide bar is welded with the radiator through soldering paste.

Optionally, the hot-surface flow guide strip is connected with the radiator in a bonding manner.

Optionally, the hot-surface flow guide strip is adhered to the radiator through heat-conducting glue.

Optionally, the semiconductor unit includes a plurality of N-type semiconductors and a plurality of P-type semiconductors, and the plurality of N-type semiconductors and the plurality of P-type semiconductors are alternately distributed between the hot-face flow guiding strip and the cold-face flow guiding strip.

Optionally, a plurality of heat dissipation fins are arranged on the heat sink.

Optionally, the heat dissipation fins are corrugated plate structures.

The utility model has the beneficial effects that:

the semiconductor heat dissipation module provided by the utility model comprises a refrigeration component and a radiator. The refrigerating assembly comprises a semiconductor unit, a hot surface guide bar and a cold surface guide bar, and two ends of the semiconductor unit are respectively fixedly connected with the hot surface guide bar and the cold surface guide bar; the hot surface flow guide strip is fixedly connected with the radiator. The radiator can directly radiate the heat of the heat-face guide strip by directly fixedly connecting the heat-face guide strip with the radiator, so that the gap between the radiator and the heat-face guide strip is eliminated, the heat resistance between the radiator and the heat-face guide strip is further reduced, and the radiating efficiency is improved.

Drawings

FIG. 1 is a schematic diagram of an overall structure of a prior art semiconductor heat dissipation module;

FIG. 2 is a schematic illustration of a prior art hot-face deflector strip connected to a wire;

FIG. 3 is a schematic diagram of the overall structure of the semiconductor heat dissipation module of the present utility model;

fig. 4 is a schematic illustration of the hot-side deflector strip and wire connection of the present utility model.

In the figure:

100. a hot-face porcelain plate;

1. a refrigeration assembly; 11. a semiconductor unit; 111. an N-type semiconductor; 112. a P-type semiconductor; 12. a hot-surface flow guide strip; 13. cold face guide strips; 14. a ceramic plate; 15. a wire;

2. a heat sink; 21. and the heat dissipation fins.

Detailed Description

The utility model is described in further detail below with reference to the drawings and examples. It is to be understood that the specific embodiments described herein are merely illustrative of the utility model and are not limiting thereof. It should be further noted that, for convenience of description, only some, but not all of the structures related to the present utility model are shown in the drawings.

In the description of the present utility model, unless explicitly stated and limited otherwise, the terms "connected," "connected," and "fixed" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be the communication between two semiconductors or the interaction relationship between the two semiconductors. The specific meaning of the above terms in the present utility model will be understood in specific cases by those of ordinary skill in the art.

In the present utility model, unless expressly stated or limited otherwise, a first feature "above" or "below" a second feature may include both the first and second features being in direct contact, as well as the first and second features not being in direct contact but being in contact with each other through additional features therebetween. Moreover, a first feature being "above," "over" and "on" a second feature includes the first feature being directly above and obliquely above the second feature, or simply indicating that the first feature is higher in level than the second feature. The first feature being "under", "below" and "beneath" the second feature includes the first feature being directly under and obliquely below the second feature, or simply means that the first feature is less level than the second feature.

In the description of the present embodiment, the terms "upper", "lower", "right", etc. orientation or positional relationship are based on the orientation or positional relationship shown in the drawings, and are merely for convenience of description and simplicity of operation, and do not indicate or imply that the apparatus or semiconductor in question must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as limiting the utility model. Furthermore, the terms "first," "second," and the like, are used merely for distinguishing between descriptions and not for distinguishing between them.

In order to eliminate the heat resistance between the radiator and the heat surface flow guide strip and improve the heat radiation efficiency, the embodiment provides a semiconductor heat radiation module.

As shown in fig. 3 to 4, the semiconductor heat dissipation module includes a refrigeration assembly 1 and a heat sink 2. The refrigeration assembly 1 comprises a semiconductor unit 11, a hot surface guide bar 12 and a cold surface guide bar 13, wherein two ends of the semiconductor unit 11 are respectively and fixedly connected with the hot surface guide bar 12 and the cold surface guide bar 13, and the hot surface guide bar 12 is fixedly connected with the radiator 2. By directly fixedly connecting the hot-surface flow guide strip 12 with the radiator 2, the radiator 2 can directly radiate the hot-surface flow guide strip 12, and compared with the prior art, the ceramic plate 100 with the hot-surface and the radiating silica gel are eliminated, the space distance between the radiator 2 and the hot-surface flow guide strip 12 is reduced, the thermal resistance between the radiator 2 and the hot-surface flow guide strip 12 is further eliminated, and the radiating efficiency is improved.

In this embodiment, the hot-surface flow guiding strip 12 and the cold-surface flow guiding strip 13 are fixed at two ends of the semiconductor unit 11 by welding, and in order to ensure the reliability of welding, welding paste is generally selected as a welding material for welding. And the hot surface guide strips 12 and the cold surface guide strips 13 are both copper sheet structures.

Optionally, as shown in fig. 3, the refrigeration assembly 1 further includes a ceramic plate 14, and the cold surface flow bars 13 are sintered on the ceramic plate 14. By providing the ceramic plate 14 on the cold-face baffle 13, heat transfer can be further enhanced, heat dissipation efficiency can be improved, and since the baffle is generally a plurality of independent units, heat dissipation can be performed more uniformly by providing the ceramic plate 14.

In this embodiment, the ceramic plate 14 and the cold surface guide strip 13 are integrally connected by high-temperature sintering. Thereby making the connection between the ceramic plate 14 and the cold face guide strip 13 even tighter. In other embodiments, the ceramic plate 14 and the cold-surface flow guiding strip 13 may be fixedly connected by means of heat-conducting glue, which is lower in cost and easier to operate than the high-temperature sintering method.

Optionally, as shown in fig. 3-4, the refrigeration assembly 1 further includes a wire 15, where the wire 15 is connected to one of the hot-side flow bars 12 or the cold-side flow bars 13. Thereby facilitating connection of the semiconductor heat sink module to upstream equipment.

In this embodiment, the wires 15 are connected to the hot side guide bars 12, and in other embodiments, the wires 15 may be connected to the cold side guide bars 13.

Optionally, the hot-face flow guiding strip 12 is fixedly connected with the radiator 2 by welding. The hot-surface guide strips 12 and the radiator 2 are integrated by welding, and the hot-surface guide strips 12 and the radiator 2 can be connected more tightly by welding.

In the present embodiment, the hot-face flow guide 12 is soldered to the heat sink 2 by solder paste in consideration of the effect of soldering.

Optionally, the hot-side flow bars 12 are connected to the heat sink 2 by means of adhesive bonding. The hot-surface flow guide strips 12 and the radiator 2 are connected in an adhesive mode, so that the operation is simple and convenient, and the cost is low. Can effectively improve the production efficiency and reduce the production cost.

In the present embodiment, the hot-side flow guide 12 is bonded to the heat sink 2 by the heat conductive adhesive because the heat dissipation efficiency is taken into consideration.

Alternatively, as shown in fig. 3, the semiconductor unit 11 includes a plurality of N-type semiconductors 111 and a plurality of P-type semiconductors 112, and the plurality of N-type semiconductors 111 and the plurality of P-type semiconductors 112 are alternately distributed between the hot-side flow guide bar 12 and the cold-side flow guide bar 13. The heat dissipation efficiency is further improved by the joint work of a plurality of groups of N/P semiconductors.

In this embodiment, the wires 15 include an anode wire and a cathode wire, and the working principle of the wires is that the anode wire and the cathode wire are respectively connected with a dc power supply, the current sequentially passes through the cathode wire, the hot surface guide bar 12, the N-type semiconductor 111, the cold surface guide bar 13 and the p-type semiconductor 112 from the cathode of the dc power supply, and then sequentially passes through the N groups of wires to reach the anode of the dc power supply; the heat-generating phenomenon is generated on the heat-surface flow guide strips 12, the heat-absorbing phenomenon is generated on the cold-surface substrate, namely, a cold surface and a heat surface are formed, and the released heat is led out by the radiator 2, so that the radiating effect is achieved.

Optionally, as shown in fig. 3, a plurality of heat dissipation fins 21 are provided on the heat sink 2. By adding a plurality of heat radiation fins 21 to the heat sink 2, the heat radiation efficiency of the heat sink 2 is further improved.

In the present embodiment, the plurality of heat radiation fins 21 are arranged at equal intervals, thereby ensuring uniform heat radiation of the heat sink 2. In other embodiments, the heat dissipation fins 21 may be disposed at unequal intervals while ensuring the heat dissipation effect.

Further, as shown in fig. 3, the radiator fins 21 have a corrugated plate structure. By providing the radiator fins 21 with the corrugated plate structure, the heat exchanging area of the radiator fins 21 is increased, thereby further improving the heat exchanging efficiency of the radiator 2.

It is to be understood that the above examples of the present utility model are provided for clarity of illustration only and are not limiting of the embodiments of the present utility model. Various obvious changes, rearrangements and substitutions can be made by those skilled in the art without departing from the scope of the utility model. It is not necessary here nor is it exhaustive of all embodiments. Any modification, equivalent replacement, improvement, etc. which come within the spirit and principles of the utility model are desired to be protected by the following claims.

Claims (10)

1. The semiconductor heat dissipation module, its characterized in that, semiconductor heat dissipation module includes:

the refrigerating assembly (1), the refrigerating assembly (1) comprises a semiconductor unit (11), a hot surface guide bar (12) and a cold surface guide bar (13), and two ends of the semiconductor unit (11) are fixedly connected with the hot surface guide bar (12) and the cold surface guide bar (13) respectively;

and the heat radiator (2), and the hot-surface flow guide strip (12) is fixedly connected with the heat radiator (2).

2. The semiconductor heat sink module according to claim 1, wherein the refrigeration assembly (1) further comprises a ceramic plate (14), the cold face deflector (13) being sintered on the ceramic plate (14).

3. The semiconductor heat sink module according to claim 1, wherein the refrigeration assembly (1) further comprises a wire (15), the wire (15) being connected to one of the hot-side flow-guiding strips (12) or the cold-side flow-guiding strips (13).

4. The semiconductor heat dissipation module according to claim 1, wherein the hot-side flow guide strip (12) is fixedly connected with the heat sink (2) by means of welding.

5. The semiconductor heat sink module according to claim 4, wherein the hot-side flow bars (12) are soldered to the heat spreader (2) by means of solder paste.

6. The semiconductor heat dissipation module according to claim 1, characterized in that the hot-side flow-guiding strip (12) is connected to the heat sink (2) by means of bonding.

7. The semiconductor heat dissipation module according to claim 6, characterized in that the hot-side flow guide strip (12) is bonded to the heat sink (2) by means of a heat-conducting glue.

8. The semiconductor heat dissipation module according to claim 1, wherein the semiconductor unit (11) comprises a plurality of N-type semiconductors (111) and a plurality of P-type semiconductors (112), the plurality of N-type semiconductors (111) and the plurality of P-type semiconductors (112) being alternately distributed between the hot-side guide bar (12) and the cold-side guide bar (13).

9. A semiconductor heat sink module according to claim 1, characterized in that the heat sink (2) is provided with a plurality of heat sink fins (21).

10. The semiconductor heat dissipation module according to claim 9, wherein the heat dissipation fins (21) are of corrugated plate-like structure.

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