CN210224009U - IGBT module cooling device - Google Patents
IGBT module cooling device Download PDFInfo
- Publication number
- CN210224009U CN210224009U CN201921205199.6U CN201921205199U CN210224009U CN 210224009 U CN210224009 U CN 210224009U CN 201921205199 U CN201921205199 U CN 201921205199U CN 210224009 U CN210224009 U CN 210224009U
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- CN
- China
- Prior art keywords
- igbt module
- cooling
- cooling device
- cooling chamber
- installation department
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000001816 cooling Methods 0.000 title claims abstract description 55
- 238000009434 installation Methods 0.000 claims abstract description 15
- 239000002826 coolant Substances 0.000 claims abstract description 7
- 239000007788 liquid Substances 0.000 claims abstract description 7
- 238000005452 bending Methods 0.000 claims description 4
- 239000000565 sealant Substances 0.000 claims description 3
- 230000017525 heat dissipation Effects 0.000 description 5
- 239000003292 glue Substances 0.000 description 4
- 238000007789 sealing Methods 0.000 description 4
- 230000010354 integration Effects 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 239000006071 cream Substances 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000002480 mineral oil Substances 0.000 description 1
- 235000010446 mineral oil Nutrition 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model discloses a IGBT module cooling device, this cooling device are located machine controller's casing, including the cooling chamber, the splendid attire has insulating coolant liquid in the cooling chamber, and the upper end in cooling chamber is extended there is the installation department, is provided with the IGBT module on the installation department, and the IGBT module bonds on the side in cooling chamber and is provided with the fin. The utility model discloses simple structure, reasonable in design uses through the fin of setting and the cooperation of cooling pin, can effectively increase the area of contact of IGBT module and insulating coolant liquid, further improves the radiating efficiency.
Description
Technical Field
The utility model belongs to the technical field of the IGBT heat dissipation, concretely relates to IGBT module cooling device.
Background
Insulated Gate Bipolar Transistors (IGBTs), abbreviated as IGBT modules. With the continuous development of the IGBT module, the integration level of the IGBT module is required to be higher and higher, but the high integration level is necessarily accompanied by a large amount of heat generation. When the IGBT chip module works, the heat flow density is high, the temperature rising speed is high, heat is easy to accumulate in a large amount in the electronic element, and the service life of the electronic element is greatly reduced along with the increase of the service temperature. Especially when the temperature exceeds a certain temperature, the element is directly burned out.
Traditional IGBT heating components and parts generally adopt the forced air cooling heat dissipation mode, because the specific heat capacity of air is less, the heat of taking away through the air is less relatively, can satisfy the heat dissipation demand to the less IGBT components and parts of calorific capacity, but in the face of the IGBT component that the structure is compacter day by day, power increases day by day, traditional heat dissipation mode can't satisfy the heat dissipation demand, in addition, current cooling device is because the restriction of casting level, the ubiquitous problem that cooling capacity is not enough.
SUMMERY OF THE UTILITY MODEL
To the problem that exists among the prior art, the utility model aims to provide an IGBT module cooling device.
The utility model discloses a following technical scheme realizes:
IGBT module cooling device, this cooling device is located machine controller's casing, its characterized in that includes the cooling chamber, insulating coolant liquid has been adorned greatly in the cooling chamber, the upper end in cooling chamber extends there is the installation department, be provided with the IGBT module on the installation department, the IGBT module bonds on the side in cooling chamber and is provided with the fin.
The IGBT module cooling device is characterized in that cooling pins are uniformly distributed on one side surface, facing the cooling cavity, of the cooling fin.
The IGBT module cooling device is characterized in that the mounting part is a bending part formed by upwards extending and bending the side wall of the cooling cavity by 90 degrees.
IGBT module cooling device, its characterized in that be provided with insulating sealing glue layer between IGBT module and the installation department, the IGBT module passes insulating sealing glue layer and installation department in proper order through the screw and realizes being connected of IGBT module and installation department.
The IGBT module cooling device is characterized in that at least one cooling fin is arranged.
The utility model discloses simple structure, reasonable in design uses through the fin of setting and the cooperation of cooling pin, can effectively increase the area of contact of IGBT module and insulating coolant liquid, further improves the radiating efficiency.
Drawings
FIG. 1 is a schematic view of the overall structure of the present invention;
in the figure, 1-shell, 2-cooling cavity, 3-mounting part, 4-IGBT module, 5-heat sink, 6-cooling pin, 7-insulating sealant layer and 8-screw.
Detailed Description
The present invention will be described in further detail with reference to the accompanying drawings, and specific embodiments will be given.
As shown in fig. 1, the utility model discloses IGBT module cooling device, this cooling device are located machine controller's casing, including the cooling chamber, the splendid attire has insulating coolant liquid in the cooling chamber, and insulating coolant liquid can be silicon oil, mineral oil etc.. The upper end in cooling chamber extends there is the installation department, is provided with the IGBT module on the installation department, and the IGBT module bonds on the side towards the cooling chamber and is provided with at least one fin, and wherein the fin passes through the tin cream layer and realizes bonding with the IGBT module.
Furthermore, the installation department is the portion of bending that the cooling chamber lateral wall upwards extended and buckled 90 degrees formation again, and the fin is provided with the cooling needle towards the equipartition on the side of cooling chamber, is provided with insulating sealing glue film between IGBT module and the installation department, and the IGBT module passes insulating sealing glue film and installation department in proper order through the screw and realizes being connected of IGBT module and installation department.
The above-mentioned embodiments only represent some embodiments of the present invention, and the description thereof is specific and detailed, but not to be construed as limiting the scope of the present invention. It should be noted that, for those skilled in the art, without departing from the spirit of the present invention, several variations and modifications can be made, which are within the scope of the present invention. Therefore, the protection scope of the present invention should be subject to the appended claims.
Claims (5)
- The utility model provides a IGBT module cooling device, this cooling device is located casing (1) of motor controller, its characterized in that includes cooling chamber (2), insulating coolant liquid has been adorned greatly in cooling chamber (2), the upper end of cooling chamber (2) is extended there is installation department (3), be provided with IGBT module (4) on installation department (3), IGBT module (4) bond on the side towards cooling chamber (2) and are provided with fin (5).
- 2. The IGBT module cooling device according to claim 1, characterized in that cooling pins (6) are arranged uniformly on a side of the cooling fins (5) facing the cooling chamber (2).
- 3. The IGBT module cooling device according to claim 1, wherein the mounting portion (3) is a bent portion formed by extending the side wall of the cooling chamber (2) upward and bending it by 90 degrees.
- 4. The IGBT module cooling device according to claim 1, characterized in that an insulating sealant layer (7) is disposed between the IGBT module (4) and the mounting portion (3), and the IGBT module (4) sequentially penetrates through the insulating sealant layer (7) and the mounting portion (3) through screws (8) to realize connection between the IGBT module (4) and the mounting portion (3).
- 5. IGBT module cooling arrangement according to claim 1, characterized in that the heat sink (5) is provided with at least one.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921205199.6U CN210224009U (en) | 2019-07-29 | 2019-07-29 | IGBT module cooling device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921205199.6U CN210224009U (en) | 2019-07-29 | 2019-07-29 | IGBT module cooling device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210224009U true CN210224009U (en) | 2020-03-31 |
Family
ID=69919542
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921205199.6U Active CN210224009U (en) | 2019-07-29 | 2019-07-29 | IGBT module cooling device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210224009U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113161311A (en) * | 2021-04-25 | 2021-07-23 | 立酷新能源技术(上海)有限公司 | Immersion liquid cooling type IGBT module |
-
2019
- 2019-07-29 CN CN201921205199.6U patent/CN210224009U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113161311A (en) * | 2021-04-25 | 2021-07-23 | 立酷新能源技术(上海)有限公司 | Immersion liquid cooling type IGBT module |
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