CN219780740U - Heat radiation structure of patch power device - Google Patents
Heat radiation structure of patch power device Download PDFInfo
- Publication number
- CN219780740U CN219780740U CN202223490853.7U CN202223490853U CN219780740U CN 219780740 U CN219780740 U CN 219780740U CN 202223490853 U CN202223490853 U CN 202223490853U CN 219780740 U CN219780740 U CN 219780740U
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- China
- Prior art keywords
- power device
- heat
- printed circuit
- circuit board
- chip power
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- 230000005855 radiation Effects 0.000 title claims description 4
- 239000002184 metal Substances 0.000 claims abstract description 31
- 230000017525 heat dissipation Effects 0.000 claims abstract description 22
- 230000000149 penetrating effect Effects 0.000 claims abstract description 5
- 239000003292 glue Substances 0.000 claims description 42
- 238000003466 welding Methods 0.000 claims description 5
- 238000010276 construction Methods 0.000 claims description 4
- 230000000694 effects Effects 0.000 abstract description 11
- 238000010438 heat treatment Methods 0.000 abstract description 4
- 239000000853 adhesive Substances 0.000 description 10
- 230000001070 adhesive effect Effects 0.000 description 10
- 238000000034 method Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
Abstract
The utility model provides a heat dissipation structure of a patch power device, which relates to the technical field of electronic devices and comprises a printed circuit board, a heat conduction structure and a radiator, wherein a bonding pad is arranged on one side of the printed circuit board, the radiator is arranged on the other side of the printed circuit board, the bonding pad is used for being welded with a metal shell on one side of the patch power device, the printed circuit board is provided with a hollowed-out structure penetrating through the bonding pad, the heat conduction structure is arranged at the hollowed-out structure, one end of the heat conduction structure is abutted with the metal shell on one side of the patch power device, and the other end of the heat conduction structure is abutted with the radiator. Because the heat conduction structure directly contacts the metal shell of the patch power device, when the patch power device works, heat generated by the heating component inside the patch power device can be transferred to the radiator only by sequentially passing through the metal shell and the heat conduction structure, the heat transfer effect is higher, and the heat dissipation effect of the patch power device is improved.
Description
Technical Field
The utility model relates to the technical field of electronic devices, in particular to a heat dissipation structure of a patch power device.
Background
The patch power device is widely applied due to the advantages of small volume, low production and processing cost and the like, but the patch power device has higher heating power and needs to transfer the generated heat to the radiator for radiating, so that the high power and high performance of the patch power device can be ensured. There are two common heat dissipation modes of patch power devices: the method (1) is that the patch power device is firstly welded on a bonding pad of a PCB (Printed circuit boards, printed circuit board), and then the heat generated by an internal wafer is conducted to a radiator through a plastic shell of the patch power device; and (2) welding the patch power device on a bonding pad of the PCB, and then conducting heat generated by the internal wafer to the radiator through the PCB. The main problem of the mode (1) is that the junction-plastic shell thermal resistance of the chip power device (the thermal resistance from the wafer inside the chip power device to the plastic shell) is large, the actual heat dissipation effect is poor, and the main problem of the mode (2) is that the thermal resistance of the PCB is also large, and the heat dissipation effect is also affected.
Disclosure of Invention
The utility model aims to solve the problem that the existing patch power device is poor in heat dissipation effect.
In order to achieve the above purpose, the technical scheme of the utility model is as follows:
the utility model provides a paster power device heat radiation structure, includes printed circuit board, heat conduction structure and radiator, one side of printed circuit board is provided with the pad, the opposite side of printed circuit board is provided with the radiator, the pad be used for with the metal casing welding of paster power device one side, printed circuit board is provided with and runs through the hollow out construction of pad, heat conduction structure set up in hollow out construction department, just heat conduction structure's one end and the metal casing butt of paster power device one side, heat conduction structure's the other end with radiator butt.
Compared with the prior art, the heat dissipation structure of the patch power device has the following beneficial effects:
when the patch power device is installed, the metal shell on one side of the patch power device and the bonding pad on one side of the printed circuit board can be welded and fixed, and meanwhile, electric conduction between the metal shell and the bonding pad on one side of the patch power device is achieved, and due to the fact that the hollow structure is further arranged on the printed circuit board, the bonding pad is penetrated through by the hollow structure, the heat conducting structure can be arranged at the hollow structure, one end of the heat conducting structure is abutted to the metal shell of the patch power device, then the radiator can be fixed on one side, far away from the bonding pad, of the printed circuit board, the radiator is abutted to one end, far away from the metal shell of the patch power device, of the heat conducting structure, and therefore, heat generated by the heating component (mainly a wafer) inside the patch power device can be transferred to the radiator only through the metal shell and the heat conducting structure in sequence, the heat transfer effect is better, and the heat dissipation effect of the patch power device is improved.
Further, the heat conducting structure is heat conducting glue.
Further, the heat-conducting glue comprises a first part glue and a second part glue, the first part glue is arranged between the radiator and the printed circuit board, the second part glue is arranged at the hollow structure, and one end, away from the first part glue, of the second part glue is used for penetrating through the bonding pad and abutting against the metal shell on one side of the patch power device.
Further, the projection area of the metal shell at one side of the patch power device on the printed circuit board is a superposition area;
the hollow structure comprises a main hollow structure and an auxiliary hollow structure, the main hollow structure is located in the overlapping area, one end of the auxiliary hollow structure is located outside the overlapping area, and the other end of the auxiliary hollow structure is communicated with the main hollow structure.
Further, the bonding pad is of a frame structure matched with the cross section of the main hollow structure in shape.
Further, the auxiliary hollow structures are respectively arranged at the edge positions or/and the corner positions of the cross section shape of the main hollow structure.
Further, a plurality of auxiliary hollow structures are arranged, and the auxiliary hollow structures are arranged at equal intervals around the main hollow structure.
Further, the cross section of the auxiliary hollow structure is round or rectangular.
Further, the projection area of the metal shell on one side of the patch power device on the printed circuit board is a superposition area, and the outer ring of the bonding pad is positioned outside the superposition area.
Further, a heat conducting insulating pad is arranged between the heat conducting structure and the radiator.
Drawings
Fig. 1 is a top view of a printed circuit board according to an embodiment of the utility model;
fig. 2 is a side cross-sectional view of a heat dissipation structure for a chip power device according to an embodiment of the present utility model;
fig. 3 is a second side cross-sectional view of a heat dissipation structure of a patch power device according to an embodiment of the present utility model;
fig. 4 is a second plan view of a printed circuit board according to an embodiment of the utility model;
fig. 5 is a top view of a printed circuit board according to an embodiment of the present utility model;
fig. 6 is a top view of a printed circuit board according to an embodiment of the present utility model;
fig. 7 is a top view of a printed circuit board according to an embodiment of the present utility model.
Reference numerals illustrate:
1. a printed circuit board; 11. a bonding pad; 12. a hollow structure; 121. a main hollow structure; 122. auxiliary hollowed-out structures; 2. a heat sink; 3. a patch power device; 4. a thermally conductive structure; 41. a first portion of glue; 42. a second portion of glue; 5. a heat conductive insulating pad.
Detailed Description
In order that the above objects, features and advantages of the utility model will be readily understood, a more particular description of the utility model will be rendered by reference to specific embodiments thereof which are illustrated in the appended drawings.
In the description of the present utility model, it should be understood that the orientation or positional relationship indicated by the terms "upper", "lower", etc. are based on the orientation or positional relationship shown in the drawings, are merely for convenience of describing the present utility model and simplifying the description, and do not indicate or imply that the device or element in question must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as limiting the present utility model.
Moreover, in the drawings, the Z axis represents vertical, i.e., up and down, and the positive direction of the Z axis (i.e., the arrow of the Z axis points) represents up, and the negative direction of the Z axis (i.e., the direction opposite to the positive direction of the Z axis) represents down; the Y-axis in the drawing represents the longitudinal direction, i.e., the front-to-back position, and the positive direction of the Y-axis (i.e., the arrow pointing in the Y-axis) represents the front, and the negative direction of the Y-axis (i.e., the direction opposite to the positive direction of the Y-axis) represents the rear; the X-axis in the drawing represents the lateral direction, i.e., the left-right position, and the positive direction of the X-axis (i.e., the arrow of the X-axis points) represents the left, and the negative direction of the X-axis (i.e., the direction opposite to the positive direction of the X-axis) represents the right.
It should also be noted that the foregoing Z-axis, Y-axis, and X-axis are meant to be illustrative only and not indicative or implying that the apparatus or component in question must be oriented or configured in a particular orientation and operation and therefore should not be construed as limiting the present utility model.
As shown in fig. 1-3, the heat dissipation structure of the patch power device in the embodiment of the utility model comprises a printed circuit board 1, a heat conduction structure 4 and a radiator 2, wherein a bonding pad 11 is arranged on one side of the printed circuit board 1, the radiator 2 is arranged on the other side of the printed circuit board 1, the bonding pad 11 is used for being welded with a metal shell on one side of the patch power device 3, the printed circuit board 1 is provided with a hollow structure 12 penetrating through the bonding pad 11, the heat conduction structure 4 is arranged at the hollow structure 12, one end of the heat conduction structure 4 is abutted with the metal shell on one side of the patch power device 3, and the other end of the heat conduction structure 4 is abutted with the radiator 2.
In this embodiment, when the patch power device 3 is mounted, the metal shell at the bottom side of the patch power device 3 and the bonding pad 11 at the top side of the printed circuit board 1 may be welded and fixed, and both are conductive, because the printed circuit board 1 is further provided with the hollow structure 12, the hollow structure 12 also penetrates through the bonding pad 11, the heat conducting structure 4 may be disposed at the hollow structure 12, and the top end of the heat conducting structure 4 is abutted with the metal shell of the patch power device 3, and then the radiator 2 may be fixed at the bottom side of the printed circuit board 1, and the radiator 2 is abutted with the bottom end of the heat conducting structure 4, so, when the patch power device 3 works, the heat generated by the internal heating component (mainly the wafer) only needs to pass through the metal shell and the heat conducting structure 4 in sequence, so that the heat transfer effect is better, and the heat dissipation effect of the patch power device 3 is further improved.
Optionally, the heat conducting structure 4 is a heat conducting glue.
In this embodiment, the heat conducting structure 4 is a heat conducting adhesive, specifically, when the patch power device 3 is installed, the metal shell at the bottom side of the patch power device 3 and the bonding pad 11 at the top side of the printed circuit board 1 may be welded and fixed, then the heat conducting adhesive may be extruded onto the radiator 2, then the radiator 2 with the heat conducting adhesive is moved toward the printed circuit board 1 (or the printed circuit board 1 is moved toward the radiator 2 and pressed onto the radiator 2), so that the heat conducting adhesive on the radiator 2 is filled into the hollow structure 12 and fills the hollow structure 12, and finally the top end of the heat conducting adhesive is abutted against the metal shell of the patch power device 3, so that the heat transfer effect of the heat conducting adhesive is good, the space of the hollow structure 12 is utilized as much as possible, the heat conducting cross-sectional area is increased, no additional structure is required for alignment and fixation, and the cost is low.
Referring to fig. 2 and 3, optionally, the heat-conducting glue includes a first portion of glue 41 and a second portion of glue 42, where the first portion of glue 41 is disposed between the heat spreader 2 and the printed circuit board 1, the second portion of glue 42 is disposed at the hollow structure 12, and one end of the second portion of glue 42 away from the first portion of glue 41 is used for penetrating through the bonding pad 11 and abutting against the metal shell on one side of the chip power device 3.
In this embodiment, when the heat-conducting glue is filled, a layer of first part glue 41 may be first extruded on the surface of the radiator 2, then a layer of second part glue 42 may be extruded on the first part glue 41, then the printed circuit board 1 may be moved towards the radiator 2 and pressed on the radiator 2, so that the second part glue 42 is filled in the hollow structure 12 and is used for being connected with the metal shell of the chip power device 3, and meanwhile, the first part glue 41 also isolates the radiator 2 from the printed circuit board 1.
In this embodiment, referring to fig. 3, the thickness of the first part of the adhesive 41 may be thicker than half the thickness of the printed circuit board 1, so that the first part of the adhesive 41 with a thicker thickness can insulate the printed circuit board 1 from the heat sink 2, and prevent the two from causing potential safety hazards due to conductive short circuit.
Optionally, referring to fig. 2, a heat conducting insulating pad 5 is disposed between the heat conducting structure 4 and the heat sink 2. Thus, if the thickness of the first portion of the adhesive 41 is small, a thermal conductive insulating pad 5 may be disposed between the first portion of the adhesive 41 and the heat sink 2 to ensure insulation between the printed circuit board 1 and the heat sink 2.
Of course, even if the thickness of the first partial glue 41 is thick, the heat conductive insulating pad 5 may be provided between the first partial glue 41 and the heat sink 2.
Referring to fig. 6 and fig. 7, alternatively, the projection area of the metal shell on one side of the patch power device 3 on the printed circuit board 1 is made to be a overlapping area;
the hollow structure 12 includes a main hollow structure 121 and an auxiliary hollow structure 122, the main hollow structure 121 is located in the overlapping area, one end of the auxiliary hollow structure 122 is located outside the overlapping area (i.e., at least part of the auxiliary hollow structure 122 is not covered by the patch power device 3), and the other end of the auxiliary hollow structure 122 is communicated with the main hollow structure 121.
In this embodiment, the area of the main hollow structure 121 is larger than that of the auxiliary hollow structure 122, and the heat transfer is realized by filling heat conducting glue in the main hollow structure 121. Specifically, when the patch power device 3 is installed, the metal shell at the bottom side of the patch power device 3 and the bonding pad 11 at the top side of the printed circuit board 1 may be welded and fixed, then the heat-conducting glue may be extruded onto the radiator 2 first, then the printed circuit board 1 is moved to the radiator 2 and pressed onto the radiator 2, since the patch power device 3 is already welded and fixed at the upper side of the printed circuit board 1, the patch power device 3 further completely blocks the upper side port of the main hollow structure 121 in the hollow structure 12, therefore, in the process that the printed circuit board 1 moves to the radiator 2 with the heat-conducting glue, the heat-conducting glue gradually fills into the hollow structure 12, and since part of the area of the auxiliary hollow structure 122 is not blocked by the patch power device 3, the heat-conducting glue filled into the main hollow structure 121 can remove air in the main hollow structure 121 from the auxiliary hollow structure 122, so that the main hollow structure 121 can be filled with the heat-conducting glue, and no air bubbles can be generated inside, firstly, the heat-conducting glue is conveniently filled into the main hollow structure 121, and secondly, the heat-conducting effect is improved.
Referring to fig. 1, 6 and 7, optionally, the bonding pad 11 is a frame structure matching the cross-sectional shape of the main hollow structure 121.
In this embodiment, the frame structure may have a "back" shape, and the cross section of the main hollow structure 121 corresponding to the back shape is a rectangle.
Referring to fig. 6 and 7, optionally, the auxiliary hollowed structures 122 are respectively disposed at side positions or/and angular positions of the cross-sectional shape of the main hollowed structure 121.
In fig. 6 and fig. 7, optionally, a plurality of auxiliary hollow structures 122 are provided, and a plurality of auxiliary hollow structures 122 are disposed around the main hollow structure 121 at equal intervals.
In this embodiment, along with the gradual filling of the heat-conducting glue into the main hollow structure 121, the gas in the main hollow structure 121 gradually moves to the edge and the corner of the main hollow structure 121, so that the gas can be exhausted from all directions through the arrangement of the plurality of auxiliary hollow structures 122 around the main hollow structure 121.
Referring to fig. 6 and 7, optionally, the cross-sectional shape of the auxiliary hollowed-out structure 122 is circular or rectangular.
Alternatively, the aforementioned frame structure is not limited to the "back" type structure, but may be a frame structure as described in fig. 4 and 5.
Optionally, a projection area of the metal shell on one side of the patch power device 3 on the printed circuit board 1 is a superposition area, and an outer ring of the bonding pad 11 is located outside the superposition area.
In this embodiment, the size of the outer ring of the bonding pad 11 is related to the current size of the chip power device 3, the welding reliability, etc., in order to ensure a larger current of the chip power device 3, or/and in order to ensure the welding reliability, the outer ring of the bonding pad 11 may be larger, for example, the outer ring of the bonding pad 11 is located outside the overlapping area.
The terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" and "a second" may explicitly or implicitly include at least one such feature.
Although the present disclosure is described above, the scope of protection of the present disclosure is not limited thereto. Various changes and modifications may be made by one skilled in the art without departing from the spirit and scope of the disclosure, and these changes and modifications will fall within the scope of the utility model.
Claims (10)
1. The utility model provides a paster power device heat radiation structure, its characterized in that, including printed circuit board (1), heat conduction structure (4) and radiator (2), one side of printed circuit board (1) is provided with pad (11), the opposite side of printed circuit board (1) is provided with radiator (2), pad (11) are used for with the metal casing welding of paster power device (3) one side, printed circuit board (1) are provided with run through hollow out construction (12) of pad (11), heat conduction structure (4) set up in hollow out construction (12) department, just the one end of heat conduction structure (4) and the metal casing butt of paster power device (3) one side, the other end of heat conduction structure (4) with radiator (2) butt.
2. The heat dissipation structure of a chip power device according to claim 1, wherein the heat conducting structure (4) is a heat conducting glue.
3. The heat dissipation structure of a chip power device according to claim 2, wherein the heat-conducting glue comprises a first part glue (41) and a second part glue (42), the first part glue (41) is disposed between the heat sink (2) and the printed circuit board (1), the second part glue (42) is disposed at the hollow structure (12), and one end of the second part glue (42) away from the first part glue (41) is used for penetrating through the bonding pad (11) and abutting against a metal shell on one side of the chip power device (3).
4. The heat dissipation structure of a chip power device according to claim 1, wherein a projection area of a metal shell on one side of the chip power device (3) on the printed circuit board (1) is a merging area;
the hollow structure (12) comprises a main hollow structure (121) and an auxiliary hollow structure (122), the main hollow structure (121) is located in the overlapping area, one end of the auxiliary hollow structure (122) is located outside the overlapping area, and the other end of the auxiliary hollow structure (122) is communicated with the main hollow structure (121).
5. The heat dissipation structure of a chip power device according to claim 4, wherein the bonding pad (11) is a frame structure having a shape matching a cross-section of the main hollowed-out structure (121).
6. The heat dissipation structure of a chip power device according to claim 5, wherein the auxiliary hollowed-out structures (122) are respectively disposed at edge positions or/and angular positions of the cross-sectional shape of the main hollowed-out structure (121).
7. The heat dissipation structure of a chip power device according to claim 5, wherein a plurality of auxiliary hollow structures (122) are provided, and a plurality of the auxiliary hollow structures (122) are arranged around the main hollow structure (121) at equal intervals.
8. The heat dissipation structure of a chip power device according to claim 6 or 7, wherein the cross-sectional shape of the auxiliary hollowed-out structure (122) is circular or rectangular.
9. The heat dissipation structure of a chip power device according to claim 1, wherein a projection area of a metal shell on one side of the chip power device (3) on the printed circuit board (1) is a superposition area, and an outer ring of the bonding pad (11) is located outside the superposition area.
10. The heat dissipation structure of a chip power device according to claim 1, characterized in that a heat conducting and insulating pad (5) is arranged between the heat conducting structure (4) and the heat sink (2).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223490853.7U CN219780740U (en) | 2022-12-27 | 2022-12-27 | Heat radiation structure of patch power device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223490853.7U CN219780740U (en) | 2022-12-27 | 2022-12-27 | Heat radiation structure of patch power device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219780740U true CN219780740U (en) | 2023-09-29 |
Family
ID=88107713
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202223490853.7U Active CN219780740U (en) | 2022-12-27 | 2022-12-27 | Heat radiation structure of patch power device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219780740U (en) |
-
2022
- 2022-12-27 CN CN202223490853.7U patent/CN219780740U/en active Active
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