CN219476670U - Power chip module - Google Patents

Abstract

The utility model discloses a power chip module. The power chip module of the embodiment comprises a packaging body and a power chip, wherein the packaging body and the power chip are arranged between two circuit substrates, and the power chip is packaged in the packaging body; the circuit substrate comprises an insulating substrate, a conductive line and a heat conduction assembly arranged in the insulating substrate; the heat conduction assembly comprises an insulating heat conduction component and a metal heat conduction component, the electric conduction circuit comprises a first electric conduction circuit and a second electric conduction circuit, the first electric conduction circuit and the second electric conduction circuit are arranged on one side of the circuit substrate facing the power chip, the first electric conduction circuit is arranged on the insulating substrate, the second electric conduction circuit is arranged on the insulating heat conduction component and connected with the power chip, and the thickness of the second electric conduction circuit is larger than that of the first electric conduction circuit. The power chip module of the embodiment has the advantages of simple structure and good heat dissipation performance.

Description

Power chip module

Technical Field

The utility model relates to the field of power chip packaging; and more particularly, to a power chip package structure capable of implementing bidirectional heat dissipation.

Background

Power chip modules including power chips such as IGBTs (insulated gate bipolar transistors) and/or MOSFETs (metal-oxide semiconductor field effect transistors) are widely used in various electronic/power devices.

The power chip generates a large amount of heat during the operation, so that the power module is required to have better heat dissipation performance. Chinese patent application CN101136396a discloses a power electronics package comprising: first and second high thermal conductivity insulating non-planar substrates; a plurality of semiconductor chips and a plurality of electronic components are mounted between the substrates. Each substrate includes a plurality of electrical insulator layers and a patterned electrical conductor layer that is connected to the electronic component; and a plurality of raised areas or posts bonded together to mechanically and electrically connect the substrates.

In some cases, power chip modules need to be provided with circuit structures having different thicknesses or current carrying capabilities, where thicker or higher current carrying capability circuits are used to carry large currents and thinner or lower current carrying capability circuits are used to carry small currents (e.g., control signals). In the prior art, the substrate comprises an insulated ceramic substrate and a high-conductivity metal electrode, which are bonded by directly bonding copper, directly bonding aluminum or active metal brazing material, but in a packaging structure using the ceramic substrate, not only is it difficult to integrate two conductive circuits with different thicknesses, but also the ceramic substrate has the problem of easy breakage.

Disclosure of Invention

In view of the shortcomings of the prior art, a main object of the present utility model is to provide a power chip module with excellent heat dissipation performance, which integrates a plurality of conductive traces with different thicknesses.

In order to achieve the above main object, the present utility model discloses a power chip module, which includes a package body disposed between two circuit substrates and a power chip, wherein the power chip is packaged inside the package body; the circuit substrate comprises an insulating substrate, a conductive circuit and a heat conduction assembly arranged in the insulating substrate; the heat conduction assembly comprises an insulating heat conduction component and a metal heat conduction component, the electric conduction circuit comprises a first electric conduction circuit and a second electric conduction circuit, the first electric conduction circuit and the second electric conduction circuit are arranged on one side of the circuit substrate facing the power chip, the first electric conduction circuit is arranged on the insulating substrate, the second electric conduction circuit is arranged on the insulating heat conduction component and connected with the power chip, and the thickness of the second electric conduction circuit is larger than that of the first electric conduction circuit.

According to one embodiment of the utility model, the two opposite surfaces of the power chip are provided with electrodes, and the electrodes on the two opposite surfaces are respectively and electrically connected with the second conductive lines of the two circuit substrates.

According to one embodiment of the utility model, the two circuit substrates are a first circuit substrate and a second circuit substrate, respectively; the side of the first circuit board, which is opposite to the power chip, forms a third conductive circuit, and the side of the second circuit board, which is opposite to the power chip, is provided with a metal foil for connecting to a radiator, and the metal foil is connected with a metal heat conduction component.

According to another embodiment of the utility model, the sides of the two circuit substrates facing away from the power chip are each provided with a metal foil for connection to a heat sink, said metal foil being connected to a metal heat conducting member.

According to one specific embodiment of the utility model, the insulating substrate comprises at least two layers of insulating core boards, and adjacent insulating core boards are bonded and connected through insulating bonding sheets; a portion of the insulating adhesive sheet fills a gap between the thermally conductive assembly and the insulating core sheet to secure the thermally conductive assembly within the insulating substrate.

Further, one or more inner conductive lines are arranged in the insulating substrate.

According to one embodiment of the present utility model, the insulating and heat conducting member is a ceramic sheet, and the metal heat conducting member is a copper foil provided on the metal heat conducting member.

According to one embodiment of the present utility model, the thickness of the first conductive line is 0.03mm to 0.12mm, and the thickness of the second conductive line is 0.15mm to 1.5mm.

According to one embodiment of the present utility model, the conductive traces of the two circuit substrates are electrically connected by a conductive member, and the conductive member is disposed inside the package.

According to one embodiment of the utility model, the package body completely fills the gap between the two circuit substrates.

In the utility model, a power chip is packaged between two circuit substrates, a heat conduction assembly comprising an insulating heat conduction part and a metal heat conduction part is arranged in the circuit substrates, a first electric conduction circuit for loading smaller current is arranged on the insulating substrate, and a second electric conduction circuit for loading larger current is arranged on the insulating heat conduction part, so that the integration of two electric conduction circuits with different thicknesses is realized in a simple structure; meanwhile, heat generated by the power chip can be rapidly diffused outwards through the heat conducting components at the two sides of the power chip, and the power chip has the advantage of good heat dissipation performance. Further, the heat conduction assembly adopts a combination of an insulating heat conduction component and a metal heat conduction component, so that the requirement on the voltage resistance of the module can be well met.

The objects, technical solutions and advantages of the present utility model will be more clearly described below, and the present utility model will be further described in detail with reference to the accompanying drawings and the detailed description.

Drawings

FIG. 1 is a schematic sectional structure of embodiment 1;

fig. 2 is an exploded structural schematic view of embodiment 1;

FIG. 3 is a schematic cross-sectional structure of embodiment 2;

fig. 4 is a schematic cross-sectional structure of embodiment 3.

Detailed Description

In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present utility model, but the present utility model may be practiced in other ways than those described herein, and therefore the scope of the present utility model is not limited to the specific embodiments disclosed below.

Example 1

As shown in fig. 1 and 2, the power chip module of embodiment 1 includes a package 30 disposed between two circuit substrates 10 and a power chip 20, the power chip 20 being disposed within the package 30; the number of the power chips 20 may be one or more, and may be specifically set according to requirements. In an embodiment, as shown in fig. 1-2, the number of the power chips 20 is two, namely, the first power chip 20a and the second power chip 20b, and the first power chip 20a and the second power chip 20b may form a half-bridge circuit. The power chip 20 may be an IGBT chip or a MOSFET chip, but is not limited thereto.

The two circuit substrates 10 are a first circuit substrate 10a and a second circuit substrate 10b, respectively, each including an insulating substrate 11, an electrically conductive line, and a heat conductive member 12 disposed within the insulating substrate 11, the heat conductive member 12 including an insulating heat conductive member 121 and a metal heat conductive member 122. Among them, the insulating and heat conducting member 121 is preferably a ceramic sheet such as aluminum nitride, silicon nitride, or aluminum oxide; the metal heat conductive member 122 is preferably a copper foil provided on a ceramic sheet. The heat conducting assembly 12 adopts a combination of the insulating heat conducting component 121 and the metal heat conducting component 122, so that the requirement on the voltage resistance of the module can be well met.

The insulating substrate 11 comprises at least two layers of insulating core plates 111, and adjacent insulating core plates 111 are bonded and connected through insulating bonding sheets 112; a portion of the insulating adhesive sheet 112 fills a gap between the heat conductive member 12 and the insulating core sheet 11 to fix the heat conductive member 12 within the insulating substrate 11. Wherein, the insulating core board 111 can be FR-4 core board, and the insulating bonding sheet 112 can be prepreg. One or more inner conductive lines 14 are disposed inside the insulating substrate 11, and the inner conductive lines 14 are disposed on the surface of the insulating core 111. The insulating substrate 11 adopts a multi-layer core plate structure so as to facilitate the manufacture of multi-layer circuits, and has the advantage of flexible circuit design.

The conductive traces include a first conductive trace 131 and a second conductive trace 132 disposed on a side of the circuit substrate 10 facing the power chip 20, the first conductive trace 131 being disposed on the insulating substrate 11, and the second conductive trace 132 being disposed on the insulating heat conductive member 121. An electrical connection is formed between the first conductive trace 131 and the second conductive trace 132, for example, the first conductive trace 131 and the second conductive trace 132 each include a trace copper foil 133 covered on a surface thereof, and are electrically connected by the trace copper foil 133.

The thickness of the second conductive line 132 is greater than that of the first conductive line 131, the second conductive line 132 is used for loading larger current, and the first conductive line 131 is used for loading smaller current. The specific thicknesses of the first conductive line 121 and the second conductive line 122 may be set as required; preferably, the thickness of the first conductive trace 121 may be 0.03mm to 0.12mm, and the thickness of the second conductive trace 122 may be 0.15mm to 1.5mm.

In an embodiment, the power chip 20 has a G pole, an S pole, and a D pole, the G pole and the S pole being located on a first surface side of the power chip 20, the D pole being located on a second surface side of the power chip 20, the first surface side and the second surface side of the power chip 20 being disposed opposite to each other. The G-pole and the S-pole are electrically connected to the second conductive trace 132 of one circuit substrate 10, and the d-pole is electrically connected to the second conductive trace 132 of the other circuit substrate 10. The heat generated by the power chip 20 can be rapidly diffused outwards through the second conductive lines 132 and the heat conducting component 12 on two sides of the power chip, so that the heat dissipation on two sides is performed, and the heat dissipation performance is good.

In embodiment 1, the sides of the two circuit substrates 10 facing away from the power chip 20 are each provided with a metal foil 15 for connection to a heat sink, and the metal foil 15 is connected to a metal heat conductive member 122. Specifically, the metal foil 15 may include a first copper foil layer 151 and a second copper foil layer 152, the first copper foil layer 151 being disposed on the insulating substrate 11, the second copper foil layer 152 covering and connecting the first copper foil layer 151 and the metal heat conductive member 122. The metal foil 15 may conduct heat within the module to an external heat sink.

Further, the power chip module of embodiment 1 may further have electronic components (not shown in the figure) such as a capacitor and/or a resistor disposed in the package body 30, and these electronic components may be electrically connected to the first circuit substrate 10a and/or the second circuit substrate 10 b. The package 30 may be made of a resin material, and is filled between the two circuit substrates 10 by injection molding or glue injection.

Example 2

As shown in fig. 3, embodiment 2 differs from embodiment 1 in that: in embodiment 2, the first conductive traces 131 of the first circuit substrate 10a and the first conductive traces 131 of the second circuit substrate 10b are electrically connected by the conductive members 40, and the conductive members 40 may be copper blocks, but not limited thereto.

The conductive member 40 and the power chip 20 are both packaged in the package body 30. Further, in embodiment 2, the package body 30 can completely fill the gap between the first circuit substrate 10a and the second circuit substrate 10b to better support both, improving the reliability of the module structure.

Example 3

As shown in fig. 4, embodiment 3 differs from embodiment 1 in that: in embodiment 3, the side of the first circuit substrate 10a facing away from the power chip 20 forms the third conductive trace 16, and the side of the second circuit substrate 10b facing away from the power chip 20 is provided with the metal foil 15 for connection to the heat sink; wherein the third conductive trace 16 may be electrically connected to the first conductive trace 131 of the first circuit substrate 10a through a conductive via (not shown), and the metal foil 15 is connected to the metal heat conductive member 122 in the second circuit substrate 10 b.

In some cases, the thickness of the electronic components (e.g., capacitors, resistors, etc.) used by the module may be greater than the thickness of the power chip 20, and packaging such electronic devices between two circuit substrates 10 presents significant technical difficulties. In embodiment 3, electronic devices (e.g., capacitors, resistors, etc.) that cannot be disposed between two circuit substrates 10 may be disposed on the side of the first circuit substrate 10a facing away from the power chip 20, so as to simplify the packaging difficulty.

Other descriptions of embodiments 2 and 3 can be found in embodiment 1, and will not be repeated.

While the utility model has been described in terms of preferred embodiments, it is not intended to limit the scope of the utility model. It is intended that all such modifications and variations as would be included within the scope of the utility model are within the scope of the utility model, as they may be within the spirit and scope of the utility model.

Claims (10)

1. The power chip module comprises a packaging body and a power chip, wherein the packaging body and the power chip are arranged between two circuit substrates, and the power chip is packaged in the packaging body; the method is characterized in that:

the circuit substrate comprises an insulating substrate, a conductive circuit and a heat conduction assembly arranged in the insulating substrate; the heat conduction assembly comprises an insulating heat conduction component and a metal heat conduction component, the electric conduction circuit comprises a first electric conduction circuit and a second electric conduction circuit, the first electric conduction circuit and the second electric conduction circuit are arranged on one side of the circuit substrate facing the power chip, the first electric conduction circuit is arranged on the insulating substrate, the second electric conduction circuit is arranged on the insulating heat conduction component and connected with the power chip, and the thickness of the second electric conduction circuit is larger than that of the first electric conduction circuit.

2. The power chip module of claim 1, wherein: the two opposite surfaces of the power chip are respectively provided with an electrode, and the electrodes on the two opposite surfaces are respectively and electrically connected with the second conductive lines of the two circuit substrates.

3. The power chip module of claim 1, wherein: the two circuit substrates are respectively a first circuit substrate and a second circuit substrate, a third conductive circuit is formed on one side of the first circuit substrate, which faces away from the power chip, and a metal foil used for being connected to the radiator is arranged on one side of the second circuit substrate, which faces away from the power chip, and is connected with the metal heat conduction component.

4. The power chip module of claim 1, wherein: and the sides of the two circuit substrates, which are opposite to the power chips, are respectively provided with a metal foil used for being connected to the radiator, and the metal foils are connected with the metal heat conduction component.

5. The power chip module of claim 1, wherein: the insulating substrate comprises at least two layers of insulating core plates, and adjacent insulating core plates are bonded and connected through insulating bonding sheets; a portion of the insulating adhesive sheet fills a gap between the thermally conductive assembly and the insulating core sheet to secure the thermally conductive assembly within the insulating substrate.

6. The power chip module of claim 5, wherein: one or more layers of inner conductive circuits are arranged in the insulating substrate.

7. The power chip module of claim 1, wherein: the insulating heat conduction component is a ceramic plate, and the metal heat conduction component is copper foil arranged on the ceramic plate.

8. The power chip module of claim 1, wherein: the thickness of the first conductive circuit is 0.03-0.12 mm, and the thickness of the second conductive circuit is 0.15-1.5 mm.

9. The power chip module of claim 1, wherein: the conductive circuits of the two circuit substrates are electrically connected through a conductive component, and the conductive component is arranged inside the packaging body.

10. The power chip module of claim 1, wherein: the package body completely fills a gap between the two circuit substrates.