CN213462437U

CN213462437U - Circuit board with good heat dissipation effect

Info

Publication number: CN213462437U
Application number: CN202022310595.4U
Authority: CN
Inventors: 黄家崇; 林裕圳
Original assignee: Individual
Current assignee: Individual
Priority date: 2020-10-16
Filing date: 2020-10-16
Publication date: 2021-06-15
Anticipated expiration: 2030-10-16

Abstract

The utility model discloses a circuit board that radiating effect is good, including the circuit board body, the circuit board body includes main part layer, heat dissipation through-hole and insulating backing plate, the main part layer includes protective coating, sandwich layer, heat-conducting layer and heat conduction coating, the main part level is in the top of insulating backing plate, the heat dissipation through-hole is located the inner chamber of insulating backing plate. The utility model discloses accessible installation piece and mounting hole install the circuit board body in appointed position, insulating backing plate makes the bottom and the air area of contact on main part layer bigger, the heat dissipation through-hole is used for the heat extraction, protective coating can protect circuit board body surface not to corrode, the sandwich layer has the heat conductivity, heat conduction with higher speed, the heat-conducting layer has high heat conductivity, and chemical property is stable, further increase the heat conductivility of circuit board body, the heat-conducting coating can effectively improve the radiating efficiency, it is not high to have solved current circuit board radiating effect, the easy problem of damaging after the live time has been of a specified duration.

Description

Circuit board with good heat dissipation effect

Technical Field

The utility model relates to a circuit board technical field specifically is a circuit board that radiating effect is good.

Background

The circuit board is characterized by comprising an aluminum oxide ceramic circuit board, an aluminum nitride ceramic circuit board, a PCB board, an aluminum substrate, a high-frequency board, a thick copper plate, an impedance board, an ultrathin circuit board and the like, wherein the circuit board enables the circuit to be miniaturized and visualized, plays an important role in batch production of fixed circuits and optimization of electrical appliance layout, and can be called a printed circuit board or a printed circuit board.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a circuit board that radiating effect is good possesses the good advantage of radiating effect, and it is not high to have solved current circuit board radiating effect, problem that easy damage after the live time has been of a specified duration.

In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a circuit board that radiating effect is good, includes the circuit board body, the circuit board body includes main part layer, heat dissipation through-hole and insulating backing plate, the main part layer includes protective coating, sandwich layer, heat-conducting layer and heat conduction coating.

Preferably, the main body layer is located at the top of the insulating pad plate, and the heat dissipation through hole is located in the inner cavity of the insulating pad plate.

Preferably, the protective coating is located at the top of the core layer, the heat conduction layer is located at the bottom of the core layer, and the heat conduction coating is located at the bottom of the heat conduction layer.

Preferably, the left side and the right side of the circuit board body are fixedly provided with mounting blocks, and mounting holes are formed in inner cavities of the mounting blocks.

Preferably, the protective coating is a glaze layer, the core layer is a ceramic plate layer, and the heat conduction layer is a graphene layer.

Compared with the prior art, the beneficial effects of the utility model are as follows:

the utility model discloses accessible installation piece and mounting hole install the circuit board body in appointed position, insulating backing plate makes the bottom and the air area of contact on main part layer bigger, the heat dissipation through-hole is used for the heat extraction, protective coating can protect circuit board body surface not to corrode, the sandwich layer has the heat conductivity, heat conduction with higher speed, the heat-conducting layer has high heat conductivity, and chemical property is stable, further increase the heat conductivility of circuit board body, the heat-conducting coating can effectively improve the radiating efficiency, it is not high to have solved current circuit board radiating effect, the easy problem of damaging after the live time has been of a specified duration.

Drawings

FIG. 1 is a schematic structural view of the present invention;

FIG. 2 is an enlarged cross-sectional view of the circuit board body of the present invention;

fig. 3 is a schematic view of the enlarged structure of the section of the main body layer part of the present invention.

In the figure: 1. a circuit board body; 101. a body layer; 1011. a protective coating; 1012. a core layer; 1013. a heat conductive layer; 1014. a thermally conductive coating; 102. a heat dissipating through hole; 103. an insulating base plate; 2. mounting blocks; 3. and (7) installing holes.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

In the description of the present invention, it should be noted that the terms "upper", "lower", "inner", "outer", "front end", "rear end", "both ends", "one end", "the other end", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element to be referred must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted", "provided", "connected", and the like are to be construed broadly, such as "connected", which may be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.

The utility model discloses a circuit board body 1, main part layer 101, protective coating 1011, sandwich layer 1012, heat-conducting layer 1013, heat-conducting coating 1014, heat dissipation through-hole 102, insulating backing plate 103,

installation piece

2 and 3 parts of mounting hole are the parts that general standard spare or field technician know, and its structure and principle all are that this technical staff all can learn through the technical manual or learn through conventional experimental method.

Referring to fig. 1-3, a circuit board with good heat dissipation effect includes a circuit board body 1, mounting blocks 2 are fixedly mounted on both left and right sides of the circuit board body 1, mounting holes 3 are formed in an inner cavity of the mounting blocks 2, the circuit board body 1 includes a main body layer 101, a heat dissipation through hole 102 and an insulating pad 103, the main body layer 101 is located on top of the insulating pad 103, the heat dissipation through hole 102 is located in the inner cavity of the insulating pad 103, the main body layer 101 includes a protective coating 1011, a core layer 1012, a heat conduction layer 1013 and a heat conduction coating 1014, the protective coating 1011 is located on top of the core layer 1012, the 1013 is located on bottom of the core layer 1012, the heat conduction coating 1014 is located on bottom of the heat conduction layer 1013, the protective coating 1011 is a glaze layer, the core layer 1012 is a ceramic plate layer, the heat conduction layer 1013 is a graphene layer, the circuit board body 1 can be mounted at a designated position, the heat dissipation through hole 102 is used for heat dissipation, the protective coating 1011 can protect the surface of the circuit board body 1 from corrosion, the core layer 1012 has thermal conductivity and can accelerate heat conduction, the thermal conduction layer 1013 has high thermal conductivity and stable chemical properties, the thermal conductivity of the circuit board body 1 is further increased, the thermal conduction coating 1014 can effectively improve the heat dissipation efficiency, and the problems that the existing circuit board is low in heat dissipation effect and easy to damage after being used for a long time are solved.

During the use, accessible mounting block 2 and mounting hole 3 install circuit board body 1 in appointed position, insulating backing plate 103 makes the bottom and the air area of contact of main part layer 101 bigger, heat dissipation through-hole 102 is used for the heat extraction, protection coating 1011 can protect circuit board body 1 surface not corroded, core layer 1012 has the heat conductivity, heat conduction can accelerate, heat conduction layer 1013 has the high heat conductivity, and the chemical property is stable, further increase circuit board body 1's heat conductivility, heat conduction coating 1014 can effectively improve the radiating efficiency, it is not high to have solved current circuit board radiating effect, the easy problem of damaging after the live time has been of a specified duration.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides a circuit board that radiating effect is good, includes circuit board body (1), its characterized in that: the circuit board body (1) comprises a main body layer (101), a heat dissipation through hole (102) and an insulating base plate (103), wherein the main body layer (101) comprises a protective coating (1011), a core layer (1012), a heat conduction layer (1013) and a heat conduction coating (1014).

2. The circuit board with good heat dissipation effect according to claim 1, characterized in that: the main body layer (101) is located on the top of the insulating pad (103), and the heat dissipation through hole (102) is located in the inner cavity of the insulating pad (103).

3. The circuit board with good heat dissipation effect according to claim 1, characterized in that: the protective coating (1011) is located on top of the core layer (1012), the thermally conductive layer (1013) is located on the bottom of the core layer (1012), and the thermally conductive coating (1014) is located on the bottom of the thermally conductive layer (1013).

4. The circuit board with good heat dissipation effect according to claim 1, characterized in that: the circuit board is characterized in that mounting blocks (2) are fixedly mounted on the left side and the right side of the circuit board body (1), and mounting holes (3) are formed in the inner cavity of each mounting block (2).

5. The circuit board with good heat dissipation effect according to claim 1, characterized in that: the protective coating (1011) is a glaze layer, the core layer (1012) is a ceramic plate layer, and the heat conduction layer (1013) is a graphene layer.