CN213028699U - Printed PCB (printed circuit board) capable of quickly radiating - Google Patents
Printed PCB (printed circuit board) capable of quickly radiating Download PDFInfo
- Publication number
- CN213028699U CN213028699U CN202022413050.6U CN202022413050U CN213028699U CN 213028699 U CN213028699 U CN 213028699U CN 202022413050 U CN202022413050 U CN 202022413050U CN 213028699 U CN213028699 U CN 213028699U
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- China
- Prior art keywords
- circuit board
- heat
- fixedly connected
- printed pcb
- printed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 230000017525 heat dissipation Effects 0.000 claims abstract description 30
- 238000010521 absorption reaction Methods 0.000 claims abstract description 24
- 238000010438 heat treatment Methods 0.000 claims abstract description 14
- 238000009413 insulation Methods 0.000 claims description 8
- 239000003365 glass fiber Substances 0.000 claims description 3
- 230000000694 effects Effects 0.000 abstract description 8
- 238000004891 communication Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 238000010923 batch production Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Images
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses a but quick radiating printed PCB circuit board, including first circuit board, first interface has been seted up to the lower surface of first circuit board, the first heat absorption rod of inner wall fixedly connected with of first interface, the lower fixed surface of first circuit board is connected with the heat pipe. This printed PCB circuit board that can dispel heat fast, heat in having reached through first heat absorption pole and second heat absorption pole with first circuit board and second circuit board inhales in the heat pipe, the heat pipe conducts the heat to the heating panel in, the heating panel dispels the heat to the heat, and simultaneously, the fin increases the radiating efficiency's of heating panel effect, thereby solved current in printed PCB circuit board use, the inside heat of printed PCB circuit board can't in time spill, after a period of time's use, printed PCB circuit board can be owing to can not obtain effectual heat dissipation and the problem of damage, thereby have high-efficient radiating characteristics.
Description
Technical Field
The utility model relates to a circuit board technical field, more specifically say, it relates to a but quick radiating printed PCB circuit board.
Background
The circuit board is named as a ceramic circuit board, an alumina ceramic circuit board, an aluminum nitride ceramic circuit board, a PCB board, an aluminum substrate, a high-frequency board, a thick copper board, an impedance board, a PCB, an ultra-thin circuit board, a printed (copper etching technology) circuit board and the like. The circuit board enables the circuit to be miniaturized and visualized, and plays an important role in batch production of fixed circuits and optimization of electric appliance layout. The circuit board can be called as a printed circuit board or a printed circuit board, and the birth and development of the FPC and the PCB of the rigid-flex printed circuit board, and the new product of the rigid-flex printed circuit board is promoted. Therefore, the flexible-rigid combined board is a circuit board with FPC (flexible printed circuit) and PCB (printed circuit board) characteristics formed by combining a flexible circuit board and a rigid circuit board according to relevant process requirements through processes such as pressing and the like, and the circuit board is divided into three large categories of a single panel, a double-sided board and a circuit board according to the number of layers;
in the use process of the printed PCB, the heat inside the printed PCB cannot be dissipated in time, and after a period of use, the printed PCB can be damaged due to the fact that effective heat dissipation cannot be achieved.
SUMMERY OF THE UTILITY MODEL
Not enough to prior art exists, the utility model aims to provide a but quick radiating printed PCB circuit board, it has high-efficient radiating characteristics.
In order to achieve the above purpose, the utility model provides a following technical scheme:
the utility model provides a but quick radiating printed PCB circuit board, includes first circuit board, first interface has been seted up to the lower surface of first circuit board, the first heat absorption pole of the inner wall fixedly connected with of first interface, the lower fixed surface of first circuit board is connected with the heat pipe, first opening has been seted up to the upper surface of heat pipe, the lower extreme surface of first heat absorption pole and the inner wall fixed connection of first opening, the outer fixed surface of heat pipe is connected with the layer board, the below of first circuit board is provided with the second circuit board, the below of second circuit board is provided with the third circuit board, the below of third circuit board is provided with the heat dissipation part, the heat dissipation part includes the mounting panel.
Furthermore, the outer surface of the heat conduction pipe is fixedly connected with a heat insulation layer, and glass fibers are arranged inside the heat insulation layer;
through above-mentioned technical scheme, reached through the insulating layer prevent that the heat conduction of heat pipe inside with the heat conduction to the second circuit board or in the third circuit board, cause the effect of damage to second circuit board or third circuit board.
Furthermore, the upper surfaces of the second circuit board and the third circuit board are both provided with second connectors, and the second circuit board and the third circuit board are both fixedly sleeved with the outer surface of the heat conducting pipe through the second connectors;
through above-mentioned technical scheme, reached and made the effect that second circuit board and third circuit board cup jointed with the surface mounting of heat pipe through the second connector.
Furthermore, the upper surfaces of the supporting plates are respectively and fixedly connected with the lower surfaces of the first circuit board, the second circuit board and the third circuit board, and the inner walls of the two second connectors are provided with third connectors;
through above-mentioned technical scheme, reached and carried out the effect that supports first circuit board, second circuit board and third circuit board through the layer board.
Furthermore, the outer surfaces of the inner walls of the two second connectors of the heat conduction pipe are respectively provided with a second communication port, the inner walls of the plurality of third connectors are respectively and fixedly connected with a second heat absorption rod, and the outer surface of one end of each second heat absorption rod is fixedly connected with the inner wall of each second communication port;
through above-mentioned technical scheme, reached through the second heat absorption pole with the inside heat intake effect in the heat-conducting pipe of second circuit board and third circuit board.
Furthermore, the lower surface of the mounting plate is provided with a heat dissipation groove, the inner top wall of the heat dissipation groove is fixedly connected with a heat dissipation plate, and the lower surface of the heat dissipation plate is fixedly connected with fins;
through above-mentioned technical scheme, reached and dispel the heat through the heating panel to the heat, simultaneously, the fin increases the radiating efficiency's of heating panel effect.
Furthermore, a fourth connecting port is formed in the upper surface of the mounting plate, the outer surface of the lower end of the heat conduction pipe is fixedly connected with the inner wall of the fourth connecting port, and the lower surface of the heat conduction pipe is fixedly connected with the upper surface of the heat dissipation plate;
through above-mentioned technical scheme, reached through the heat pipe with heat conduction in first circuit board, second circuit board and the third circuit board to the effect in the heating panel.
To sum up, the utility model discloses following beneficial effect has:
1. the radiating groove has been seted up through the lower surface that sets up the mounting panel, the interior roof fixedly connected with heating panel of radiating groove, the lower fixed surface of heating panel is connected with the fin, heat in first circuit board and the second circuit board is inhaled in the heat pipe through first heat absorption pole and second heat absorption pole, the heat pipe conducts the heat to the heating panel in, the heating panel dispels the heat to the heat, and simultaneously, the fin increases the radiating efficiency's of heating panel effect, thereby solved current in printed PCB circuit board use, the inside heat of printed PCB circuit board can't in time spill, after a period of use, the printed PCB circuit board can be owing to can not obtain effectual heat dissipation and the problem of damage, thereby have high-efficient radiating characteristics.
Drawings
FIG. 1 is a schematic structural view of the present invention;
fig. 2 is a cross-sectional view of a first circuit board structure of the present invention;
fig. 3 is a sectional view of a second circuit board structure of the present invention;
FIG. 4 is an enlarged view of the structure A in FIG. 2 according to the present invention;
FIG. 5 is an enlarged view of the structure B in FIG. 2 according to the present invention;
fig. 6 is an enlarged view of the structure at C in fig. 2 according to the present invention.
In the figure: 1. a first circuit board; 2. a first connection port; 3. a first heat absorption rod; 4. a heat conducting pipe; 5. a first communication port; 6. a support plate; 7. a second circuit board; 8. a third circuit board; 9. mounting a plate; 10. a thermal insulation layer; 11. a second connection port; 12. a third connection port; 13. a second communication port; 14. a second heat absorption rod; 15. a heat sink; 16. a heat dissipation plate; 17. a fin; 18. and a fourth connection port.
Detailed Description
Example (b):
the present invention will be described in further detail with reference to the accompanying fig. 1 to 6.
A printed PCB (printed Circuit Board) capable of quickly dissipating heat comprises a first circuit board 1, wherein a first connecting port 2 is formed in the lower surface of the first circuit board 1, a first heat absorption rod 3 is fixedly connected to the inner wall of the first connecting port 2, a heat conduction pipe 4 is fixedly connected to the lower surface of the first circuit board 1, a heat insulation layer 10 is fixedly connected to the outer surface of the heat conduction pipe 4, glass fibers are arranged inside the heat insulation layer 10, a first communicating port 5 is formed in the upper surface of the heat conduction pipe 4, the outer surface of the lower end of the first heat absorption rod 3 is fixedly connected with the inner wall of the first communicating port 5, a supporting plate 6 is fixedly connected to the outer surface of the heat conduction pipe 4, a second circuit board 7 is arranged below the first circuit board 1, a third circuit board 8 is arranged below the second circuit board 7, second connecting ports 11 are formed in the upper surfaces of the second circuit board 7 and the third circuit board 8, the second circuit board, the upper surfaces of the supporting plates 6 are fixedly connected with the lower surfaces of the first circuit board 1, the second circuit board 7 and the third circuit board 8 respectively, the inner walls of the two second connectors 11 are provided with third connectors 12, the outer surfaces of the heat conduction pipes 4, which are positioned on the inner walls of the two second connectors 11, are provided with second communicating ports 13, the inner walls of the third connectors 12 are fixedly connected with second heat absorption rods 14, and the outer surface of one end of each second heat absorption rod 14 is fixedly connected with the inner wall of each second communicating port 13;
the heat dissipation part is arranged below the third circuit board 8, the heat dissipation part comprises a mounting plate 9, the lower surface of the mounting plate 9 is provided with a heat dissipation groove 15, the inner top wall of the heat dissipation groove 15 is fixedly connected with a heat dissipation plate 16, the lower surface of the heat dissipation plate 16 is fixedly connected with fins 17, the upper surface of the mounting plate 9 is provided with a fourth connecting port 18, the outer surface of the lower end of the heat pipe 4 is fixedly connected with the inner wall of the fourth connecting port 18, the lower surface of the heat pipe 4 is fixedly connected with the upper surface of the heat dissipation plate 16, the heat in the first circuit board 1 and the second circuit board 7 is absorbed into the heat pipe 4 through the first heat absorption rod 3 and the second heat absorption rod 14, the heat pipe 4 conducts the heat into the heat dissipation plate 16, the heat dissipation plate 16 dissipates the heat, and the fins 17 increase the heat dissipation efficiency of the heat, the heat inside the printed PCB circuit board can not be dissipated in time, and after a period of use, the printed PCB circuit board can be damaged due to the fact that effective heat dissipation can not be achieved, so that the printed PCB circuit board has the characteristic of efficient heat dissipation.
The working principle is as follows: when the heat dissipation plate is used, the first heat absorption rod 3 absorbs heat in the first circuit board 1 into the heat conduction pipe 4, the second heat absorption rod 14 absorbs heat in the second circuit board 7 and the third circuit board 8 into the heat conduction pipe 4, the heat insulation layer 10 prevents the heat conduction pipe 4 from conducting the heat in the heat conduction pipe 4 to the second circuit board 7 or the third circuit board 8, the second circuit board 7 or the third circuit board 8 is damaged, the heat conduction pipe 4 conducts the heat to the heat dissipation plate 16, the heat dissipation plate 16 dissipates the heat, and meanwhile the fins 17 increase the heat dissipation efficiency of the heat dissipation plate 16.
The present embodiment is only for explaining the present invention, and it is not limited to the present invention, and those skilled in the art can make modifications to the present embodiment without inventive contribution as required after reading the present specification, but all of them are protected by patent laws within the scope of the claims of the present invention.
Claims (7)
1. The utility model provides a but quick radiating printed PCB circuit board, includes first circuit board (1), its characterized in that: first interface (2) have been seted up to the lower surface of first circuit board (1), first heat absorption pole (3) of the inner wall fixedly connected with of first interface (2), the lower surface fixedly connected with heat pipe (4) of first circuit board (1), first opening (5) have been seted up to the upper surface of heat pipe (4), the lower extreme surface of first heat absorption pole (3) and the inner wall fixed connection of first opening (5), the outer fixed surface of heat pipe (4) is connected with layer board (6), the below of first circuit board (1) is provided with second circuit board (7), the below of second circuit board (7) is provided with third circuit board (8), the below of third circuit board (8) is provided with the heat dissipation part, the heat dissipation part includes mounting panel (9).
2. The printed PCB board capable of rapidly dissipating heat of claim 1, wherein: the outer surface of the heat conduction pipe (4) is fixedly connected with a heat insulation layer (10), and glass fibers are arranged in the heat insulation layer (10).
3. The printed PCB board capable of rapidly dissipating heat of claim 1, wherein: second connector (11) have all been seted up to the upper surface of second circuit board (7) and third circuit board (8), second circuit board (7) and third circuit board (8) all cup joint through the outer fixed surface of second connector (11) with heat pipe (4).
4. A printed PCB circuit board capable of dissipating heat rapidly as recited in claim 3, wherein: the upper surfaces of the supporting plates (6) are fixedly connected with the lower surfaces of the first circuit board (1), the second circuit board (7) and the third circuit board (8) respectively, and third connectors (12) are formed in the inner walls of the second connectors (11).
5. The printed PCB capable of dissipating heat quickly of claim 4, wherein: the heat conducting pipes (4) are located on the outer surfaces of the inner walls of the two second connecting ports (11) and are provided with second communicating ports (13), the inner walls of the third connecting ports (12) are fixedly connected with second heat absorption rods (14), and the outer surface of one end of each second heat absorption rod (14) is fixedly connected with the inner wall of each second communicating port (13).
6. The printed PCB board capable of rapidly dissipating heat of claim 1, wherein: radiating groove (15) have been seted up to the lower surface of mounting panel (9), the interior roof fixedly connected with heating panel (16) of radiating groove (15), the lower fixed surface of heating panel (16) is connected with fin (17).
7. The printed PCB capable of dissipating heat quickly of claim 6, wherein: the upper surface of mounting panel (9) has seted up fourth connector (18), the lower extreme surface of heat pipe (4) and the inner wall fixed connection of fourth connector (18), the lower surface of heat pipe (4) and the upper surface fixed connection of heating panel (16).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022413050.6U CN213028699U (en) | 2020-10-27 | 2020-10-27 | Printed PCB (printed circuit board) capable of quickly radiating |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022413050.6U CN213028699U (en) | 2020-10-27 | 2020-10-27 | Printed PCB (printed circuit board) capable of quickly radiating |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN213028699U true CN213028699U (en) | 2021-04-20 |
Family
ID=75482556
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202022413050.6U Expired - Fee Related CN213028699U (en) | 2020-10-27 | 2020-10-27 | Printed PCB (printed circuit board) capable of quickly radiating |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN213028699U (en) |
-
2020
- 2020-10-27 CN CN202022413050.6U patent/CN213028699U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20230512 Address after: Zone 1-3, 3rd Floor, Building 8, No. 738 Changliu Road, Machikou Town, Changping District, Beijing, 102206 Patentee after: Beijing longdingxiaojie Technology Co.,Ltd. Address before: 223600 Qian Ji town industrial concentration area, Shuyang County, Suqian, Jiangsu Patentee before: SHUYANG XINHAI ELECTRONIC TECHNOLOGY Co.,Ltd. |
|
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20210420 |