CN220156712U - Heat dissipation type multilayer HDI circuit board - Google Patents
Heat dissipation type multilayer HDI circuit board Download PDFInfo
- Publication number
- CN220156712U CN220156712U CN202321400664.8U CN202321400664U CN220156712U CN 220156712 U CN220156712 U CN 220156712U CN 202321400664 U CN202321400664 U CN 202321400664U CN 220156712 U CN220156712 U CN 220156712U
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- CN
- China
- Prior art keywords
- heat
- circuit board
- silica gel
- hdi circuit
- heat conduction
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- 230000017525 heat dissipation Effects 0.000 title claims abstract description 46
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 59
- 239000000741 silica gel Substances 0.000 claims abstract description 59
- 229910002027 silica gel Inorganic materials 0.000 claims abstract description 59
- 239000000919 ceramic Substances 0.000 claims abstract description 25
- 239000000498 cooling water Substances 0.000 claims abstract description 15
- 239000002826 coolant Substances 0.000 claims description 6
- 238000007789 sealing Methods 0.000 claims description 6
- 239000003292 glue Substances 0.000 claims description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 229920001296 polysiloxane Polymers 0.000 claims description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 13
- 230000009286 beneficial effect Effects 0.000 abstract description 3
- 238000009825 accumulation Methods 0.000 abstract 1
- 230000000694 effects Effects 0.000 description 10
- 238000010521 absorption reaction Methods 0.000 description 4
- 238000009423 ventilation Methods 0.000 description 4
- 239000011810 insulating material Substances 0.000 description 3
- 238000001816 cooling Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 230000002776 aggregation Effects 0.000 description 1
- 238000004220 aggregation Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 210000001503 joint Anatomy 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
Abstract
The utility model discloses a heat dissipation type multilayer HDI circuit board which comprises a multilayer HDI circuit board main body and a heat conduction silica gel sheet. The beneficial effects are that: the heat conducting silica gel piece and the heat conducting ceramic short column are adopted, the heat conducting silica gel piece is in a strip shape and clamped between the multi-layer HDI circuit board main bodies, the heat conducting ceramic short column transfers heat in the multi-layer HDI circuit board main bodies to the heat conducting silica gel piece, and the heat conducting silica gel piece transfers heat out of the multi-layer HDI circuit board main bodies, so that heat conduction and heat dissipation are completed, the problem that heat accumulation is caused by the fact that heat in the multi-layer HDI circuit board main bodies cannot be conducted out is avoided, heat dissipation efficiency is improved, meanwhile, heat poured out through the heat conducting silica gel piece contacts with circulating water in a cooling water tank arranged on one side of the multi-layer HDI circuit board main bodies for heat exchange, and therefore the heat dissipation efficiency is further improved.
Description
Technical Field
The utility model relates to the technical field of multilayer HDI circuit boards, in particular to a heat dissipation type multilayer HDI circuit board.
Background
The HDI circuit board is a high-density interconnection circuit board, and the high-density interconnection (HDI) manufacturing is one of the fastest growing fields in the printed circuit board industry, and the high-density interconnection technology stacks and laminates multiple layers of circuits to manufacture a thin, multiple layers and stable high-density interconnection circuit board, and the circuit boards of all layers are electrically connected through holes.
Because multilayer HDI circuit board possesses multilayer structure, and every layer all possesses the circular telegram operational capability, consequently, every layer all can produce heat at the during operation, owing to be connected through the lamination between each layer, there is not the gap in the centre, consequently, the unable flow of air between each layer, it is unable to derive to lead to inside heat, the radiating effect is not good, find after retrieving, the publication number is CN207460585U, the name is a quick radiating multilayer HDI circuit board, this application has adopted heat conduction glue film and heat dissipation layer, the heat that multilayer HDI circuit board during operation gives off passes through the heat conduction glue film and passes to the heat dissipation layer, owing to be connected with the heat absorption layer on the heat dissipation layer, therefore the heat of heat dissipation layer can be quick by the heat absorption layer, thereby reach quick radiating effect, the heat absorption layer does not have the complex structure of heat radiation structure among the prior art, only need some heat absorption layers of thinness just can reach quick radiating effect, moreover need not carry out too much heat exchange with air, consequently, even can also carry out quick at the inner space of electronic equipment that the air flowability, this application is even can accomplish, but heat dissipation inside the heat dissipation is difficult, the inside can not lead to the heat dissipation efficiency is still low, the work is improved, can still normally be improved, the problem is accomplished.
For the problems in the related art, no effective solution has been proposed at present.
Disclosure of Invention
(one) solving the technical problems
Aiming at the defects of the prior art, the utility model provides a heat dissipation type multi-layer HDI circuit board which has the advantages of good heat dissipation effect and convenient selection and use, thereby solving the problems in the prior art.
(II) technical scheme
In order to achieve the advantages of good heat dissipation effect and convenient selection and use, the utility model adopts the following specific technical scheme:
the utility model provides a heat dissipation formula multilayer HDI circuit board, includes multilayer HDI circuit board main part and heat conduction silica gel piece, it is equipped with heat conduction silica gel piece to press from both sides between each layer inside the multilayer HDI circuit board main part, and heat conduction silica gel piece both ends extend multilayer HDI circuit board main part both ends to each layer surface of multilayer HDI circuit board main part all runs through and peg graft and have heat conduction ceramic short column, heat conduction ceramic short column and heat conduction silica gel piece butt, coolant tank is installed to multilayer HDI circuit board main part one side, and the coolant tank both ends link up respectively and are connected with inlet tube and outlet pipe, heat conduction silica gel piece one end inserts in the coolant tank.
Further, the other end of the heat conduction silica gel piece is folded to form a folding end, a heat conduction plate is adhered to the surface of the folding end, and a radiating fin is welded to the surface of the other side of the heat conduction plate.
Further, the heat conduction silica gel piece is connected with the outer wall of the cooling water tank in a sealing way through sealing glue, and the length of the heat conduction silica gel piece extending into the cooling water tank is not less than one tenth of the length of the heat conduction silica gel piece.
Further, the heat conduction silica gel piece is long strip-shaped structure, and the heat conduction silica gel piece is provided with a plurality of.
Furthermore, the heat-conducting ceramic short columns are densely arranged in a plurality of ways, and the heat-conducting ceramic short columns avoid the circuits and the electric elements of the multi-layer HDI circuit board main body.
Furthermore, the radiating fins and the heat conducting plate are both made of thin copper sheets.
(III) beneficial effects
Compared with the prior art, the utility model provides a heat dissipation type multi-layer HDI circuit board, which has the following beneficial effects:
(1) According to the utility model, the heat-conducting silica gel piece and the heat-conducting ceramic short column are adopted, the heat-conducting silica gel piece is in a strip shape and clamped between the multi-layer HDI circuit board main bodies, the heat-conducting ceramic short column is inserted into the surface of the multi-layer HDI circuit board main bodies in a penetrating way, the heat-conducting ceramic short column is abutted with the heat-conducting silica gel piece, the heat in the multi-layer HDI circuit board main bodies is transferred to the heat-conducting silica gel piece, the heat is transferred out of the multi-layer HDI circuit board main bodies by the heat-conducting silica gel piece, so that heat dissipation efficiency is improved, meanwhile, heat poured out by the heat-conducting silica gel piece is in contact with circulating water in a cooling water tank arranged on one side of the multi-layer HDI circuit board main bodies, heat dissipation efficiency is further improved, and the heat-conducting silica gel piece and the heat-conducting ceramic short column are all insulating materials and do not influence the work of the multi-layer HDI circuit board main bodies.
(2) The utility model adopts the heat conducting plate and the radiating fin, the other end of the heat conducting silica gel piece is folded to form the folding end which is attached and fixed with the heat conducting plate, the heat conducting plate and the radiating fin can be arranged at the position with good ventilation effect, the heat transferred to the heat conducting plate and the radiating fin is taken away through air flow, the utility model also has good heat dissipation effect, the working personnel can select circulating water to dissipate heat and air to dissipate heat according to the situation, the use selectivity is various, and the use convenience is improved.
Drawings
In order to more clearly illustrate the embodiments of the present utility model or the technical solutions in the prior art, the drawings that are needed in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present utility model, and other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic top view of a heat dissipating multi-layered HDI circuit board according to the present utility model;
FIG. 2 is a schematic diagram of the internal structure of a multi-layered HDI circuit board according to the present utility model;
FIG. 3 is a schematic view of the external structure of the multi-layered HDI circuit board according to the present utility model;
fig. 4 is a schematic structural view of a heat conducting fin and a heat dissipating fin according to the present utility model.
In the figure:
1. a multi-layered HDI circuit board body; 2. a thermally conductive silicone sheet; 3. a thermally conductive ceramic stub; 4. a cooling water tank; 5. a water inlet pipe; 6. a water outlet pipe; 7. a heat conductive plate; 8. a heat sink; 9. and (5) folding the end.
Detailed Description
For the purpose of further illustrating the various embodiments, the present utility model provides the accompanying drawings, which are a part of the disclosure of the present utility model, and which are mainly used to illustrate the embodiments and, together with the description, serve to explain the principles of the embodiments, and with reference to these descriptions, one skilled in the art will recognize other possible implementations and advantages of the present utility model, wherein elements are not drawn to scale, and like reference numerals are generally used to designate like elements.
According to an embodiment of the utility model, a heat dissipation type multi-layer HDI circuit board is provided.
Referring to the drawings and the detailed description, as shown in fig. 1-4, a heat dissipation type multi-layer HDI circuit board according to an embodiment of the present utility model includes a multi-layer HDI circuit board main body 1 and a heat conduction silica gel sheet 2, wherein the heat conduction silica gel sheet 2 is sandwiched between layers in the multi-layer HDI circuit board main body 1, and is a common material, the heat conduction silica gel sheet 2 is in a strip structure, the heat conduction silica gel sheet 2 is provided with a plurality of heat conduction silica gel sheets, two ends of the heat conduction silica gel sheet 2 extend out of two ends of the multi-layer HDI circuit board main body 1, and each layer surface of the multi-layer HDI circuit board main body 1 is penetrated and inserted with a plurality of heat conduction ceramic studs 3, wherein the heat conduction ceramic studs 3 are densely arranged to avoid circuits and electrical elements of the multi-layer HDI circuit board main body 1, so as to avoid affecting the work, the heat conduction ceramic studs 3 are abutted with the heat conduction silica gel sheet 2, the cooling water tank 4 is arranged on one side of the multi-layer HDI circuit board main body 1, the two ends of the cooling water tank 4 are respectively and fixedly connected with the water inlet pipe 5 and the water outlet pipe 6, one end of the heat conduction silica gel sheet 2 is inserted into the cooling water tank 4, the water inlet pipe 5 and the water outlet pipe 6 are communicated with external circulating cooling water, the heat conduction ceramic short column 3 is in butt joint with the heat conduction silica gel sheet 2, the heat conduction ceramic short column 3 transfers the heat inside the multi-layer HDI circuit board main body 1 to the heat conduction silica gel sheet 2, the heat conduction silica gel sheet 2 transfers the heat out of the multi-layer HDI circuit board main body 1, thereby completing heat conduction and dissipation, avoiding the problem of heat aggregation caused by the incapability of the heat inside the multi-layer HDI circuit board main body 1, improving the heat dissipation efficiency, simultaneously, the heat poured out through the heat conduction silica gel sheet 2 contacts and the circulating water in the cooling water tank 4 arranged on one side of the multi-layer HDI circuit board main body 1, thereby accomplish the heat and derived and the process of cooling, further improved radiating efficiency, and heat conduction silica gel piece 2 and heat conduction ceramic short column 3 are insulating material, do not influence the work of multilayer HDI circuit board main part 1.
In one embodiment, the other end of the heat conduction silica gel sheet 2 is folded to form a folded end 9, the surface of the folded end 9 is stuck with a heat conduction plate 7, the other side surface of the heat conduction plate 7 is welded with a plurality of radiating fins 8, the radiating fins 8 are densely distributed, the heat conduction efficiency is high, the heat conduction fins 8 and the heat conduction plate 7 are all thin copper sheets, the other end of the heat conduction silica gel sheet 2 is folded to form the folded end 9 to be attached and fixed with the heat conduction plate 7, the heat conduction plate 7 and the radiating fins 8 can be installed at a position with good ventilation effect, heat transferred to the heat conduction plate 7 and the heat dissipation fins 8 is taken away through air flow, good heat dissipation effect can be achieved, and workers can select circulating water heat dissipation and air heat dissipation according to conditions, so that the use selectivity is various, and the use convenience is improved.
In one embodiment, the heat-conducting silica gel sheet 2 is in sealing connection with the outer wall of the cooling water tank 4 through sealing glue, so that water leakage is avoided, and the length of the heat-conducting silica gel sheet 2 extending into the cooling water tank 4 is not less than one tenth of the length of the heat-conducting silica gel sheet 2.
Working principle:
the heat conduction silica gel piece 2 is rectangular form, press from both sides between multilayer HDI circuit board main part 1, the surface of multilayer HDI circuit board main part 1 runs through grafting heat conduction ceramic short column 3, heat conduction ceramic short column 3 and heat conduction silica gel piece 2 butt, heat conduction ceramic short column 3 gives heat transfer in multilayer HDI circuit board main part 1 heat conduction silica gel piece 2, heat conduction silica gel piece 2 gives out multilayer HDI circuit board main part 1 with heat transfer, thereby accomplish heat conduction heat dissipation, avoid the problem that multilayer HDI circuit board main part 1 inside heat can't lead out and lead to the heat gathering, and high heat dissipation efficiency, simultaneously, the heat that pours out through heat conduction silica gel piece 2 and the circulating water contact heat transfer of installing in the cooling water tank 4 of multilayer HDI circuit board main part 1 side, thereby accomplish the heat conduction and the process of cooling, further improved heat dissipation efficiency, and heat conduction silica gel piece 2 and heat conduction ceramic short column 3 are insulating material, do not influence multilayer HDI circuit board main part 1 work, simultaneously, heat conduction silica gel piece 2 other end formation end 9 is fixed with heat conduction plate 7, plate 7 and fin 8 mountable are in the effect good position, take away heat conduction plate 7 and heat dissipation performance is also carried away through the air flow and heat dissipation performance is good, the heat dissipation performance is played according to the heat dissipation performance is good, the heat dissipation performance is used to the heat dissipation performance is good to the air-selective, the ventilation condition is used to the ventilation and is convenient.
In the present utility model, unless explicitly specified and limited otherwise, the terms "mounted," "configured," "connected," "secured," "screwed," and the like are to be construed broadly and may be, for example, fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; either directly or indirectly through intermediaries, or in communication with each other or in interaction with each other, unless explicitly defined otherwise, the meaning of the terms described above in this application will be understood by those of ordinary skill in the art in view of the specific circumstances.
The foregoing description of the preferred embodiments of the utility model is not intended to be limiting, but rather is intended to cover all modifications, equivalents, alternatives, and improvements that fall within the spirit and scope of the utility model.
Claims (6)
1. The utility model provides a heat dissipation formula multilayer HDI circuit board, its characterized in that, including multilayer HDI circuit board main part (1) and heat conduction silica gel piece (2), double-layered heat conduction silica gel piece (2) are equipped with between each inside layer of multilayer HDI circuit board main part (1), and heat conduction silica gel piece (2) both ends extend multilayer HDI circuit board main part (1) both ends to each layer surface of multilayer HDI circuit board main part (1) all runs through and peg graft there is heat conduction ceramic short column (3), heat conduction ceramic short column (3) and heat conduction silica gel piece (2) butt, coolant tank (4) are installed to multilayer HDI circuit board main part (1) one side, and coolant tank (4) both ends through-connection respectively have inlet tube (5) and outlet pipe (6), coolant tank (4) are inserted to heat conduction silica gel piece (2) one end.
2. The heat dissipation type multi-layer HDI circuit board according to claim 1, wherein the other end of the heat conduction silica gel sheet (2) is folded to form a folded end (9), a heat conduction plate (7) is adhered to the surface of the folded end (9), and a heat dissipation sheet (8) is welded to the surface of the other side of the heat conduction plate (7).
3. The heat dissipation type multi-layer HDI circuit board according to claim 1, wherein the heat conduction silica gel sheet (2) is connected with the outer wall of the cooling water tank (4) in a sealing manner through sealing glue, and the length of the heat conduction silica gel sheet (2) extending into the cooling water tank (4) is not less than one tenth of the length of the heat conduction silica gel sheet (2).
4. The heat dissipation type multi-layer HDI circuit board according to claim 1, wherein the heat conducting silicone sheets (2) are of a strip structure, and a plurality of heat conducting silicone sheets (2) are provided.
5. The heat dissipation type multi-layer HDI circuit board according to claim 1, wherein a plurality of the heat conductive ceramic studs (3) are densely arranged, and the heat conductive ceramic studs (3) avoid the circuit and the electrical components of the multi-layer HDI circuit board body (1).
6. The heat dissipation type multi-layer HDI circuit board according to claim 2, wherein the heat dissipation sheet (8) and the heat conduction plate (7) are both made of thin copper sheets.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321400664.8U CN220156712U (en) | 2023-06-05 | 2023-06-05 | Heat dissipation type multilayer HDI circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321400664.8U CN220156712U (en) | 2023-06-05 | 2023-06-05 | Heat dissipation type multilayer HDI circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220156712U true CN220156712U (en) | 2023-12-08 |
Family
ID=89020057
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321400664.8U Active CN220156712U (en) | 2023-06-05 | 2023-06-05 | Heat dissipation type multilayer HDI circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220156712U (en) |
-
2023
- 2023-06-05 CN CN202321400664.8U patent/CN220156712U/en active Active
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