CN214851998U - High-impedance multilayer insulation metal-based circuit board - Google Patents
High-impedance multilayer insulation metal-based circuit board Download PDFInfo
- Publication number
- CN214851998U CN214851998U CN202121451113.5U CN202121451113U CN214851998U CN 214851998 U CN214851998 U CN 214851998U CN 202121451113 U CN202121451113 U CN 202121451113U CN 214851998 U CN214851998 U CN 214851998U
- Authority
- CN
- China
- Prior art keywords
- mounting
- circuit board
- heat dissipation
- groove
- dug
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 229910052751 metal Inorganic materials 0.000 title claims abstract description 19
- 239000002184 metal Substances 0.000 title claims abstract description 19
- 238000009413 insulation Methods 0.000 title claims abstract description 6
- 230000007246 mechanism Effects 0.000 claims abstract description 29
- 230000017525 heat dissipation Effects 0.000 claims abstract description 21
- 238000010521 absorption reaction Methods 0.000 claims description 4
- 239000004519 grease Substances 0.000 claims description 3
- 229920001296 polysiloxane Polymers 0.000 claims description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 229910001374 Invar Inorganic materials 0.000 description 1
- 229910001182 Mo alloy Inorganic materials 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- MGRWKWACZDFZJT-UHFFFAOYSA-N molybdenum tungsten Chemical compound [Mo].[W] MGRWKWACZDFZJT-UHFFFAOYSA-N 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920013636 polyphenyl ether polymer Polymers 0.000 description 1
- 238000010079 rubber tapping Methods 0.000 description 1
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses a high-impedance multilayer insulation metal-based circuit board, which comprises a plurality of mounting plates, wherein two adjacent mounting plates are connected with a circuit board body through a strip port, the strip port is dug at one side of the mounting plates, one side of the strip port is provided with a heat dissipation mechanism, the input end of the heat dissipation mechanism is attached to one side of the circuit board body, one side of the mounting plates is dug with a groove, the inner cavity of the groove is connected with an external connection plate through a sliding mechanism, the sliding mechanism is symmetrically arranged at two sides of the inner cavity of the groove, the mounting groove is dug at one side of the strip port, the size of the mounting groove is smaller than that of the strip port, so that heat is effectively discharged, and meanwhile, the heat dissipation mechanism is arranged in the mounting part, is convenient for mounting and dismounting, does not occupy larger space, is convenient for large-scale use and popularization, so that the external connection plate can be clamped with the outside or connected through the external connection port on the external connection plate, the mode of connection is various, is convenient for accomodate simultaneously for the installed part has the multifunctionality.
Description
Technical Field
The utility model relates to a high impedance multilayer insulation metal-based circuit board belongs to metal-based circuit board technical field.
Background
The metal-based circuit board is a composite printed circuit board which is manufactured by integrating a metal substrate, an insulating medium layer and a circuit copper layer, wherein the metal substrate is usually aluminum, iron, copper, invar copper, tungsten-molybdenum alloy and other insulating medium layers which are usually modified epoxy resin, polyphenyl ether, polyimide and the like, and the circuit layer is composed of copper layers and other parts.
SUMMERY OF THE UTILITY MODEL
The to-be-solved technical problem of the utility model overcomes current defect, provides a high impedance multilayer insulation metal based circuit board, can effectively solve the problem in the background art.
In order to achieve the above object, the utility model provides a following technical scheme: including a plurality of mounting panels, adjacent two be connected with the circuit board body through rectangular mouthful between the mounting panel, just rectangular mouthful is dug and is located mounting panel one side, rectangular mouthful one side is provided with heat dissipation mechanism, heat dissipation mechanism input and circuit board body one side are laminated mutually, mounting panel one side is dug and is equipped with the recess, recess inner chamber is connected with outer fishplate bar through slide mechanism, just slide mechanism symmetry sets up in recess inner chamber both sides.
Further, heat dissipation mechanism includes mounting groove, heat absorption piece, installing port and radiating fin, the mounting groove is dug and is located rectangular mouthful one side, and the size is less than rectangular mouthful, the mounting groove inner chamber is provided with the heat absorption piece, the installing port evenly digs and locates mounting panel one side to extend to in the mounting groove, installing port inner chamber block is connected with radiating fin.
Furthermore, the input end of the radiating fin is attached to the output end of the heat absorbing sheet, and the outer wall of the heat absorbing sheet is coated with a heat-conducting silicone grease layer.
Further, slide mechanism includes sliding tray and sliding block, the sliding tray digs and locates the recess both sides, it is provided with the sliding block to slide in the sliding tray.
Further, the external connecting plate sets up in adjacent two between the sliding block, just the external connecting plate top surface is evenly dug and is equipped with the external tapping.
Further, be connected through stop gear between sliding tray and the sliding block, just stop gear includes stopper and spacing groove, the stopper symmetry sets up in the sliding block both sides, the spacing groove symmetry is dug and is located the sliding tray both sides to be connected with stopper looks block.
The utility model has the advantages that:
1. the heat dissipation mechanism that sets up and the part that its inside includes adopt the heat absorbing sheet as the maincenter of output to and regard as radiating part through radiating fin, make the effectual discharge of heat, heat dissipation mechanism sets up in the installed part simultaneously, when being convenient for install and remove, does not occupy great space, the use and the popularization on a large scale of being convenient for.
2. The slide mechanism who sets up and the inside part that includes thereof assist the cooperation with stop gear, external board and the recess that sets up mutually, adopt gliding drive mode to and the spacing mode of adoption block, make external board and outside through the block, perhaps all can be connected through the outer joint on it, the mode of connection is various, is convenient for accomodate simultaneously, makes the installed part have the multifunctionality.
Drawings
The accompanying drawings are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention, and together with the description serve to explain the invention and not to limit the invention.
Fig. 1 is a schematic view of the overall structure of a high-impedance multilayer insulated metal-based circuit board according to the present invention;
fig. 2 is a split view of a high impedance multilayer insulated metal-based circuit board of the present invention;
fig. 3 is an enlarged view of the high-impedance multilayer insulated metal-based wiring board of the present invention at a position a;
fig. 4 is an internal view of a groove of a high-impedance multilayer insulated metal-based circuit board according to the present invention;
reference numbers in the figures: 1. mounting a plate; 2. a strip opening; 3. a circuit board body; 4. a heat dissipation mechanism; 5. a groove; 6. a sliding mechanism; 7. an outer connecting plate; 8. mounting grooves; 9. a heat absorbing sheet; 10. an installation port; 11. a heat dissipating fin; 12. a sliding groove; 13. a slider; 14. an external interface; 15. a limiting mechanism; 16. a limiting block; 17. a limiting groove.
Detailed Description
The preferred embodiments of the present invention will be described in conjunction with the accompanying drawings, and it will be understood that they are presented herein only to illustrate and explain the present invention, and not to limit the present invention. In the description of the present invention, it should be noted that the terms "upper", "lower", "inner", "outer", "front end", "rear end", "both ends", "one end", "the other end" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element to which the reference is made must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
As shown in fig. 1-4, including a plurality of mounting panels 1, adjacent two be connected with circuit board body 3 through rectangular mouth 2 between the mounting panel 1, just rectangular mouth 2 digs and locates mounting panel 1 one side, rectangular mouth 2 one side is provided with heat dissipation mechanism 4, heat dissipation mechanism 4 input and circuit board body 3 one side are laminated mutually, mounting panel 1 one side is dug and is equipped with recess 5, the 5 inner chambers of recess are connected with outer fishplate bar 7 through slide mechanism 6, just slide mechanism 6 symmetry sets up in the 5 inner chamber both sides of recess.
As shown in fig. 2, the heat dissipation mechanism 4 includes a mounting groove 8, a heat absorbing sheet 9, a mounting opening 10 and a heat dissipation fin 11, the mounting groove 8 is dug on one side of the elongated opening 2, and the size of the mounting groove is smaller than that of the elongated opening 2, the heat absorbing sheet 9 is arranged in an inner cavity of the mounting groove 8, the mounting opening 10 is uniformly dug on one side of the mounting plate 1 and extends into the mounting groove 8, the heat dissipation fin 11 is connected to the inner cavity of the mounting opening 10 in a clamping manner, an input end of the heat dissipation fin 11 is attached to an output end of the heat absorbing sheet 9, and a heat conductive silicone grease layer is coated on an outer wall of the heat absorbing sheet 9, so that when the circuit board body 3 generates heat, the heat is absorbed by the heat absorbing sheet 9 and conveyed into the heat dissipation fin 11, and the heat is conveyed to the outside.
As shown in fig. 3 and 4, the sliding mechanism 6 includes a sliding groove 12 and a sliding block 13, the sliding groove 12 is dug at two sides of the groove 5, the sliding block 13 is slidably disposed in the sliding groove 12, the outer joint plate 7 is disposed between two adjacent sliding blocks 13, the sliding block 13 drives the outer joint plate 7 to move and extend out of the groove 5, and the top surface of the outer joint plate 7 is uniformly dug to be provided with an outer interface 14, which is connected with the outside through the outer joint plate 7 in a snap-fit manner, or connected with the outside through the outer interface 14 on the outer joint plate 7.
Be connected through stop gear 15 between sliding tray 12 and the sliding block 13, just stop gear 15 includes stopper 16 and spacing groove 17, stopper 16 symmetry sets up in sliding block 13 both sides, spacing groove 17 symmetry is dug and is located sliding tray 12 both sides to be connected with stopper 16 looks block, stopper 16 and spacing groove 17 looks block for sliding block 13 and sliding tray 12 looks block make sliding block 13 spacing.
The utility model discloses the theory of operation: mounting panel 1 is through 2 block to 3 both sides of circuit board body of rectangular opening, make heat absorbing sheet 9 in the mounting groove 8 laminate mutually with 3 one side of circuit board body, with radiating fin 11 block to the mounting opening 10 in, when circuit board body 3 produced heat, be absorb by heat absorbing sheet 9, and carry to in the radiating fin 11, carry the heat to the outside, sliding block 13 takes outer fishplate bar 7 displacement, and extend recess 5, stopper 16 and spacing groove 17 looks block, make sliding block 13 and sliding groove 12 looks block, make sliding block 13 spacing, be connected with outside looks block through outer fishplate bar 7, perhaps through outer mouthful 14 and external connection on the outer fishplate bar 7.
The above is the preferred embodiment of the present invention, and the technical personnel in the field of the present invention can also change and modify the above embodiment, therefore, the present invention is not limited to the above specific embodiment, and any obvious improvement, replacement or modification made by the technical personnel in the field on the basis of the present invention all belong to the protection scope of the present invention.
Claims (6)
1. The utility model provides a high impedance multilayer insulation metal-based circuit board, includes a plurality of mounting panels (1), its characterized in that: two adjacent be connected with circuit board body (3) through rectangular mouth (2) between mounting panel (1), just rectangular mouth (2) dig and locate mounting panel (1) one side, rectangular mouth (2) one side is provided with heat dissipation mechanism (4), heat dissipation mechanism (4) input is laminated with circuit board body (3) one side mutually, mounting panel (1) one side is dug and is equipped with recess (5), recess (5) inner chamber is connected with outer fishplate bar (7) through slide mechanism (6), just slide mechanism (6) symmetry sets up in recess (5) inner chamber both sides.
2. The high-impedance multilayer insulated metal-based wiring board according to claim 1, wherein: the heat dissipation mechanism (4) comprises a mounting groove (8), heat absorption sheets (9), a mounting opening (10) and heat dissipation fins (11), wherein the mounting groove (8) is dug to be arranged on one side of the strip opening (2), the size of the mounting groove is smaller than that of the strip opening (2), the inner cavity of the mounting groove (8) is provided with the heat absorption sheets (9), the mounting opening (10) is uniformly dug to be arranged on one side of the mounting plate (1) and extends into the mounting groove (8), and the inner cavity of the mounting opening (10) is clamped and connected with the heat dissipation fins (11).
3. The high-impedance multilayer insulated metal-based wiring board according to claim 2, wherein: the input end of the radiating fin (11) is attached to the output end of the heat absorbing sheet (9), and the outer wall of the heat absorbing sheet (9) is coated with a heat-conducting silicone grease layer.
4. The high-impedance multilayer insulated metal-based wiring board according to claim 3, wherein: slide mechanism (6) include sliding tray (12) and sliding block (13), sliding tray (12) dig and locate recess (5) both sides, it is provided with sliding block (13) to slide in sliding tray (12).
5. The high-impedance multilayer insulated metal-based wiring board according to claim 4, wherein: outer fishplate bar (7) set up in adjacent two between sliding block (13), just outer fishplate bar (7) top surface evenly digs and is equipped with external joint (14).
6. The high-impedance multilayer insulated metal-based wiring board according to claim 5, wherein: be connected through stop gear (15) between sliding tray (12) and sliding block (13), just stop gear (15) include stopper (16) and spacing groove (17), stopper (16) symmetry sets up in sliding block (13) both sides, spacing groove (17) symmetry is dug and is located sliding tray (12) both sides to be connected with stopper (16) looks block.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121451113.5U CN214851998U (en) | 2021-06-29 | 2021-06-29 | High-impedance multilayer insulation metal-based circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121451113.5U CN214851998U (en) | 2021-06-29 | 2021-06-29 | High-impedance multilayer insulation metal-based circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214851998U true CN214851998U (en) | 2021-11-23 |
Family
ID=78811083
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202121451113.5U Expired - Fee Related CN214851998U (en) | 2021-06-29 | 2021-06-29 | High-impedance multilayer insulation metal-based circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN214851998U (en) |
-
2021
- 2021-06-29 CN CN202121451113.5U patent/CN214851998U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20211123 |