CN217721595U - Multilayer printed circuit board with good heat dissipation effect - Google Patents
Multilayer printed circuit board with good heat dissipation effect Download PDFInfo
- Publication number
- CN217721595U CN217721595U CN202221303073.4U CN202221303073U CN217721595U CN 217721595 U CN217721595 U CN 217721595U CN 202221303073 U CN202221303073 U CN 202221303073U CN 217721595 U CN217721595 U CN 217721595U
- Authority
- CN
- China
- Prior art keywords
- circuit board
- heat dissipation
- connecting pipe
- multilayer printed
- fixing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model provides a multilayer printed circuit board with good heat dissipation effect, belonging to the technical field of circuit boards and solving the problem that when the multilayer printed circuit board is in use, the heat generated by the bottom circuit board is not easy to release, which easily causes the temperature of the circuit board at the lower end to be overhigh, thereby affecting the normal operation of the device, and the multilayer printed circuit board comprises a first circuit board; six through holes are formed in the surface of the first circuit board, the upper end and the lower end of the first circuit board are respectively provided with a bonding layer, six through holes are also formed in the surface of the bonding layer, and the outer end face of the first circuit board is provided with a continuous arc-shaped groove. The utility model discloses in, the inside of connecting pipe joint at whole circuit board can promote the circulation of air, and the produced heat of the third circuit board of bottom can discharge the top of second circuit board through the connecting pipe, and simultaneously, the cold air of upper end also can enter into the lower extreme of third circuit board from the connecting pipe, can reduce the temperature of third circuit board.
Description
Technical Field
The utility model belongs to the technical field of the circuit board, more specifically says, in particular to multilayer printed circuit board that radiating effect is good.
Background
Circuit boards are widely used in various industries, and multilayer circuit boards have at least three conductive layers, two of which are on the outer surface and the remaining one is integrated into an insulating board, and generate a large amount of heat during operation, which affects the normal operation of the circuit board.
Based on the aforesaid, current multilayer circuit board in use, the produced heat of bottom circuit board is difficult to be released, leads to the circuit board high temperature of lower extreme easily to influence the normal operating of device, workman when installing the circuit board moreover, there is the deviation in the screw hole on circuit board surface and the inside screw hole of machine, and the workman's of being not convenient for installation.
Therefore, in view of the above, research and improvement are made on the existing structure and defects, and a multilayer printed circuit board with good heat dissipation effect is provided, so as to achieve the purpose of having more practical value.
SUMMERY OF THE UTILITY MODEL
In order to solve the technical problem, the utility model provides a multilayer printed circuit board that radiating effect is good to solve current multilayer circuit board in use, the produced heat of bottom circuit board is difficult to be released, leads to the circuit board high temperature of lower extreme easily, thereby influences the problem of the normal operating of device.
The utility model relates to a purpose and efficiency of multilayer printed circuit board that radiating effect is good is reached by following concrete technological means: a multilayer printed circuit board with good heat dissipation effect comprises a first circuit board;
the surface of the first circuit board is provided with six through holes, the upper end and the lower end of the first circuit board are respectively provided with an adhesive layer, the surface of the adhesive layer is also provided with six through holes, and the outer end surface of the first circuit board is provided with a continuous arc-shaped groove;
the lower end of the second circuit board is fixedly connected with the bonding layer at the upper end of the first circuit board, and six through holes are formed in the surface of the second circuit board;
the surface of the third circuit board is provided with six through holes, and two ends of the third circuit board are respectively provided with two fixing mechanisms;
the connecting pipe, the inside through hole of having seted up of connecting pipe, the connecting pipe is equipped with six, and the upper and lower both ends externally mounted of connecting pipe has the dog, and the dog lower extreme and the laminating of second circuit board up end of connecting pipe upper end, the dog of connecting pipe lower extreme and the laminating of the lower terminal surface of third circuit board.
Furthermore, fin blocks are arranged on the periphery of the second circuit board, the fin blocks are of cuboid structures, and the distance between every two adjacent fin blocks is the same.
Furthermore, the upper end of the third circuit board is fixedly connected with the bonding layer of the lower end face of the first circuit board, and the third circuit board and the second circuit board are arranged in a symmetrical structure.
Furthermore, a heat dissipation copper pipe is arranged inside the bonding layer, the heat dissipation copper pipe is arranged in a # -shaped structure, and the diameter of the heat dissipation copper pipe is half of the thickness of the bonding layer.
Further, the fixing mechanism includes:
the fixed block, the fixed block main part be for falling the spill structure, the fixed block with third circuit board fixed connection, the spout has been seted up on the both ends riser surface of fixed block, the both ends of spout are semi-circular structure.
Further, the fixing mechanism further includes: the outer end face of the fixing plate is of an arc-shaped structure, the surfaces of two ends of the fixing plate are attached to the inner wall of the fixing block, and a fixing threaded hole is formed in the middle of the fixing plate;
two groups of locking screw rods are symmetrically arranged, the locking screw rods are fixedly connected with the fixed plate, and the locking screw rods are slidably clamped in the sliding grooves in the surfaces of the vertical plates at the two ends of the fixed plate and are fastened through nuts.
Compared with the prior art, the utility model discloses following beneficial effect has:
the utility model discloses in, continuous arc type groove has been seted up to the outer terminal surface of first circuit board, can increase first circuit board and external area of contact, improves the radiating effect of first circuit board.
In addition, the inside of connecting pipe joint at whole circuit board can promote the circulation of air, and the produced heat of the third circuit board of bottommost can discharge the top of second circuit board through the connecting pipe, and simultaneously, the cold air of upper end also can enter into the lower extreme of third circuit board from the connecting pipe, can reduce the temperature of third circuit board.
In addition, the internally mounted who glues the layer has the heat dissipation copper pipe, and the heat dissipation copper pipe is the setting of groined type structure for during the produced heat can transmit the heat dissipation copper pipe in the circuit board operation, the heat transfer efficiency of copper is very high, and copper can carry out quick absorption to the produced heat in the circuit board operation, then releases the outside, can improve the radiating effect of this device.
In addition, through the arrangement that the locking screw rods at the two ends of the fixing plate are slidably clamped inside the sliding groove, workers can adjust the positions of the fixing threaded holes in the surface of the fixing plate by moving the front and rear positions of the locking screw rods inside the sliding groove, so that the fixing threaded holes can be aligned with the threaded holes in the machine, and the circuit board of the workers can be conveniently installed.
Drawings
Fig. 1 is a schematic view of the overall structure of the device of the present invention.
Fig. 2 is an exploded schematic view of the whole device of the present invention.
Fig. 3 is a schematic sectional structure diagram of the integrated device of the present invention.
Fig. 4 is a schematic structural diagram of the third connecting plate and the connecting pipe of the present invention.
Fig. 5 is a schematic structural view of the third connecting plate, the fixing block and the fixing plate of the present invention.
Fig. 6 is a schematic structural diagram of the fixing mechanism of the present invention.
Fig. 7 is a schematic view of the structure of the adhesion layer and the heat dissipation copper pipe of the present invention.
Fig. 8 is a schematic view of a part of an enlarged structure at a in fig. 7 according to the present invention.
In the drawings, the corresponding relationship between the component names and the reference numbers is as follows:
1. a first circuit board; 2. a second circuit board; 201. a fin block; 3. a third circuit board; 4. a bonding layer; 401. a heat dissipation copper pipe; 5. a connecting pipe; 6. a fixed block; 601. a chute; 7. a fixing plate; 701. fixing the threaded hole; 702. and locking the screw rod.
Detailed Description
The following describes embodiments of the present invention in further detail with reference to the accompanying drawings and examples. The following examples are provided to illustrate the invention but are not intended to limit the scope of the invention.
Example (b):
as shown in figures 1 to 8:
the utility model provides a multilayer printed circuit board with good heat dissipation effect, which comprises a first circuit board 1;
the surface of the first circuit board 1 is provided with six through holes, the upper end and the lower end of the first circuit board 1 are respectively provided with an adhesive layer 4, the surface of the adhesive layer 4 is also provided with six through holes, and the outer end surface of the first circuit board 1 is provided with continuous arc-shaped grooves, so that the contact area of the first circuit board 1 and the outside can be increased, and the heat dissipation effect of the first circuit board 1 is improved;
the lower end of the second circuit board 2 is fixedly connected with the bonding layer 4 at the upper end of the first circuit board 1, six through holes are formed in the surface of the second circuit board 2, fin blocks 201 are formed in the periphery of the second circuit board 2, the fin blocks 201 are of cuboid structures, and the distances between every two adjacent fin blocks 201 are the same;
the surface of the third circuit board 3 is provided with six through holes, two ends of the third circuit board 3 are respectively provided with two fixing mechanisms, the upper end of the third circuit board 3 is fixedly connected with the bonding layer 4 on the lower end surface of the first circuit board 1, and the third circuit board 3 and the second circuit board 2 are arranged in a symmetrical structure;
connecting pipe 5, the inside through hole of having seted up of connecting pipe 5, connecting pipe 5 is equipped with six, and the upper and lower both ends externally mounted of connecting pipe 5 has the dog, and the dog lower extreme of connecting pipe 5 upper end and the laminating of 2 up end of second circuit board, the dog of connecting pipe 5 lower extreme and the laminating of the lower terminal surface of third circuit board 3.
Through adopting above-mentioned scheme, the technological effect who brings is: connecting pipe 5 joint can promote the circulation of air in the inside of whole circuit board, and the produced heat of third circuit board 3 of bottommost can discharge the top of second circuit board 2 through connecting pipe 5, and simultaneously, the cold air of upper end also can enter into the lower extreme of third circuit board 3 from connecting pipe 5, can reduce the temperature of third circuit board 3.
Wherein, the internally mounted who glues and layer 4 has heat dissipation copper pipe 401, heat dissipation copper pipe 401 is the setting of well style of calligraphy structure, and heat dissipation copper pipe 401's diameter is the half of gluing and layer 4 thickness, in use, two glue and layer 4 can be to first circuit board 1, second circuit board 2 and third circuit board 3 are fixed, and first circuit board 1, the produced heat of second circuit board 2 and third circuit board 3 just transmits heat dissipation copper pipe 401 at first in, the heat transfer efficiency of copper is very high, copper can carry out quick absorption to the produced heat of circuit board operation, then release the outside, can improve the radiating effect of this device.
Wherein, fixed establishment includes: the fixing block 6 is provided with a main body of the fixing block 6 in an inverted concave structure, the fixing block 6 is fixedly connected with the third circuit board 3, the surfaces of vertical plates at two ends of the fixing block 6 are provided with sliding grooves 601, two ends of each sliding groove 601 are in a semicircular structure, the fixing plate 7 is provided with an outer end face of the fixing plate 7 in an arc-shaped structure, the surfaces of two ends of the fixing plate 7 are attached to the inner wall of the fixing block 6, and a fixing threaded hole 701 is formed in the middle of the fixing plate 7;
two groups of locking screws 702 are symmetrically arranged, the locking screws 702 are fixedly connected with the fixing plate 7, the locking screws 702 are slidably clamped in sliding grooves 601 on the surfaces of vertical plates at two ends of the fixing block 6 and are fastened through nuts, in use, when a worker installs a circuit board, the circuit board is generally installed in a threaded hole in a machine through screws, a fixing threaded hole 701 is formed in the middle of the fixing plate 7 at two ends of the third circuit board 3, the worker can fix the fixing plate 7 in a threaded hole in the machine body through the screws, in actual operation, a certain deviation exists between the threaded hole in the machine and the fixing threaded hole 701 on the surface of the fixing plate 7, so that the worker has inconvenience in installing the circuit board, through the arrangement that the locking screws 702 at two ends of the fixing plate 7 slide in the sliding grooves 601, the worker can adjust the positions 701 of the fixing threaded holes on the surface of the fixing plate 7 by moving the locking screws 702 to clamp in the front and back positions in the sliding grooves 601, and accordingly the fixing threaded holes 701 can be aligned with the threaded holes in the machine, and installation of the worker is facilitated.
The specific use mode and function of the embodiment are as follows:
in the utility model, the outer end face of the first circuit board 1 is provided with continuous arc-shaped grooves, which can increase the contact area between the first circuit board 1 and the outside, improve the heat dissipation effect of the first circuit board 1, the connecting pipe 5 is clamped inside the whole circuit board, which can promote the air circulation, the heat generated by the bottommost third circuit board 3 can be discharged to the top end of the second circuit board 2 through the connecting pipe 5, meanwhile, the cold air at the upper end can also enter the lower end of the third circuit board 3 from the connecting pipe 5, which can reduce the temperature of the third circuit board 3, two bonding layers 4 can fix the first circuit board 1, the second circuit board 2 and the third circuit board 3, and the heat generated by the first circuit board 1, the second circuit board 2 and the third circuit board 3 is firstly transferred to the heat dissipation copper pipe 401, the heat transfer efficiency of copper is very high, copper can quickly absorb heat generated by the circuit board in operation and then release the heat to the outside, so that the heat dissipation effect of the device can be improved, when a worker installs the circuit board, the circuit board is generally installed in a threaded hole in a machine through screws, a fixing threaded hole 701 is formed in the middle of the fixing plate 7 at two ends of the third circuit board 3, the worker can fix the fixing plate 7 in the threaded hole in the machine body through the screws, in actual operation, a certain deviation exists between the threaded hole in the machine and the fixing threaded hole 701 on the surface of the fixing plate 7, so that the worker is inconvenient to install the circuit board, the locking screws 702 at two ends of the fixing plate 7 are slidably clamped in the sliding groove 601, and the worker can adjust the position of the fixing threaded hole 701 on the surface of the fixing plate 7 by moving the front and back positions of the locking screws 702 in the sliding groove 601, so that the fixing screw hole 701 can be aligned with the screw hole in the interior of the machine, thereby facilitating the installation by a worker.
The embodiments of the present invention have been presented for purposes of illustration and description, and are not intended to be exhaustive or limited to the invention in the form disclosed. Many modifications and variations will be apparent to those of ordinary skill in the art. The embodiment was chosen and described in order to best explain the principles of the invention and the practical application, and to enable others of ordinary skill in the art to understand the invention for various embodiments with various modifications as are suited to the particular use contemplated.
Claims (6)
1. The utility model provides a multilayer printed circuit board that radiating effect is good which characterized in that: comprising a first circuit board (1); the surface of the first circuit board (1) is provided with six through holes, the upper end and the lower end of the first circuit board (1) are respectively provided with a bonding layer (4), the surface of the bonding layer (4) is also provided with six through holes, and the outer end surface of the first circuit board (1) is provided with a continuous arc-shaped groove; the lower end of the second circuit board (2) is fixedly connected with the bonding layer (4) at the upper end of the first circuit board (1), and six through holes are formed in the surface of the second circuit board (2); the surface of the third circuit board (3) is provided with six through holes, and two ends of the third circuit board (3) are respectively provided with two fixing mechanisms; connecting pipe (5), the through hole has been seted up to connecting pipe (5) inside, and connecting pipe (5) are equipped with six, and the upper and lower both ends externally mounted of connecting pipe (5) has the dog, and the dog lower extreme of connecting pipe (5) upper end and the laminating of second circuit board (2) up end, the dog of connecting pipe (5) lower extreme and the laminating of the lower terminal surface of third circuit board (3).
2. The multilayer printed circuit board with good heat dissipation effect as claimed in claim 1, wherein: the fin blocks (201) are arranged on the periphery of the second circuit board (2), the fin blocks (201) are of cuboid structures, and the distance between every two adjacent fin blocks (201) is the same.
3. The multilayer printed circuit board with good heat dissipation effect as claimed in claim 1, wherein: the upper end of the third circuit board (3) is fixedly connected with the bonding layer (4) on the lower end face of the first circuit board (1), and the third circuit board (3) and the second circuit board (2) are arranged in a symmetrical structure.
4. The multilayer printed circuit board with good heat dissipation effect as claimed in claim 1, wherein: the inside of gluing layer (4) is installed heat dissipation copper pipe (401), and heat dissipation copper pipe (401) are the setting of # -shaped structure, and the diameter of heat dissipation copper pipe (401) is half of gluing layer (4) thickness.
5. The multilayer printed circuit board with good heat dissipation effect as claimed in claim 1, wherein: the fixing mechanism includes:
fixed block (6), fixed block (6) main part be the structure of falling the spill, fixed block (6) with third circuit board (3) fixed connection, spout (601) have been seted up on the both ends riser surface of fixed block (6), the both ends of spout (601) are semi-circular structure.
6. The multilayer printed circuit board with good heat dissipation effect as claimed in claim 5, wherein: the fixing mechanism further includes:
the outer end face of the fixing plate (7) is of an arc-shaped structure, the two end faces of the fixing plate (7) are attached to the inner wall of the fixing block (6), and a fixing threaded hole (701) is formed in the middle of the fixing plate (7);
two groups of locking screw rods (702) are symmetrically arranged on the locking screw rods (702), the locking screw rods (702) are fixedly connected with the fixing plate (7), and the locking screw rods (702) are slidably clamped in sliding grooves (601) on the surfaces of vertical plates at two ends of the fixing block (6) and are fastened through nuts.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221303073.4U CN217721595U (en) | 2022-05-27 | 2022-05-27 | Multilayer printed circuit board with good heat dissipation effect |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221303073.4U CN217721595U (en) | 2022-05-27 | 2022-05-27 | Multilayer printed circuit board with good heat dissipation effect |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217721595U true CN217721595U (en) | 2022-11-01 |
Family
ID=83794841
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202221303073.4U Active CN217721595U (en) | 2022-05-27 | 2022-05-27 | Multilayer printed circuit board with good heat dissipation effect |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN217721595U (en) |
-
2022
- 2022-05-27 CN CN202221303073.4U patent/CN217721595U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN100456461C (en) | Heat sink of heat pipe | |
| CN217721595U (en) | Multilayer printed circuit board with good heat dissipation effect | |
| CN101749975B (en) | Radiating device | |
| CN117423662A (en) | SiC power device heat dissipation packaging structure and packaging method | |
| CN212034642U (en) | Circuit board heat abstractor that radiating effect is good | |
| CN212413692U (en) | Ceramic radiating fin convenient to install | |
| CN214851998U (en) | High-impedance multilayer insulation metal-based circuit board | |
| CN206674291U (en) | A kind of super-thick copper PCB multilayer board | |
| CN210610093U (en) | High-efficient heat dissipation type PCB circuit board | |
| CN217334060U (en) | Aluminum nitride substrate with good heat conduction performance | |
| CN113192911A (en) | Micro-channel radiator | |
| CN218634381U (en) | High temperature resistant thing allies oneself with intercommunication and uses multilayer circuit board | |
| CN217336001U (en) | Composite high-thermal-conductivity insulating substrate | |
| CN213403634U (en) | Multilayer circuit board | |
| CN209435531U (en) | A kind of multi-layer H DI wiring board of internal layer interconnection | |
| CN218450682U (en) | Anti short circuit board | |
| CN2930226Y (en) | Combined heat sink | |
| CN221807280U (en) | Novel high heat dissipation type metal substrate FPC | |
| CN211047718U (en) | Aluminum foil composite heat-conducting silica gel sheet | |
| CN205331141U (en) | Ceramic substrate anchor clamps | |
| CN216217742U (en) | Low-impedance multilayer circuit board structure | |
| CN210405780U (en) | Improved low-impedance multilayer circuit board | |
| CN213585488U (en) | Brushless motor control switch | |
| CN215871986U (en) | Aluminum substrate with flame retardant property | |
| CN210328331U (en) | Double-sided circuit board convenient to weld |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |